ANSYS Icepak平臺新功能介紹

1、ANSYS Icepak R17.0 平臺新功能介紹ANSYS Icepak R17.0 UpdateReduced Order Modeling模型降階技術(shù)Krylov-Projection based ROM克雷洛夫模型降階技術(shù)LTI ROM automation線性非時變系統(tǒng)降階技術(shù)ECAD importIDX Import capability IDX導(dǎo)入能力Solver Enhancements求解器增強Support for Remote Simulation Manager (RSM) 支持使用RSM求解Icepak項目NC Interface creation speedup

2、(50X) 建立NC界面速度加快50倍HPC performance improvements (6X) HPC并行改進6倍Data Exchange數(shù)據(jù)交換Metadata and results export for EKM可以將元數(shù)據(jù)和結(jié)果輸出EKMTrace Conductivity Modeling Enhancements布線導(dǎo)熱率計算增強Improved algorithm to capture serial and parallel physics 改進了布線導(dǎo)熱率的算法Post Processing Enhancements后處理增強Macros Enhancements宏增

3、強Automated Setup and ROM Construction自動設(shè)置及降階構(gòu)造Select inputs using UIRun steady-state solutionROM creation in Icepak在Icepak里建立降階模型Transient setup and ROM Evaluation瞬態(tài)設(shè)置及ROM評估Input transient loads and evaluation timesIcepak results data enables post-processing in Icepak26X speedup加速26倍ROM: 克雷洛夫模型降階技術(shù)4

4、th order ROM, t = 100 sec4th order ROM, t = 200 sec4th order ROM, t = 400 secCFD, t = 100 secCFD, t = 200 secCFD, t = 400LTI State-space Characterization線性非時變狀態(tài)空間方法Automated model setup 模型自動設(shè)置Run steady-state solution 運行穩(wěn)態(tài)計算Automated transient parametric analysis based on inputs 基于輸入?yún)?shù)自動進行瞬態(tài)參數(shù)分析LTI

5、ROM creation in ANSYS Simplorer可以與Simplorer耦合ROM: 自動線性非時變降階技術(shù)Import all electrical and mechanical components導(dǎo)入所有電子機械器件Support for component placement/selection支持器件位置重置Support for thermal properties支持熱屬性導(dǎo)入Grouping of components可以對器件規(guī)組ECAD: 支持導(dǎo)入IDX格式Solver: 使用RSM管理器 Support all configuration scenarios

6、支持所有配置腳本RSM Client, Manager and Compute Server can be deployed on 1, 2 or 3+ machines RSM客戶端、管理端及服務(wù)器可以布置在1、2、3個甚至更多的機器上Configuration setup using RSM UI on WB可以在WB之下 配置RSM的設(shè)置Component update through RSM通過RSM更新器件Update Icepak design points through RSM更新Icepak設(shè)計點Customize Solver Execution Controller 定制

7、求解控制器Serial or Parallel executionNC interface creation improvements result in up to 50X speedup建立NC界面的速度提升50倍Advanced controls for linear solver 先進的線性求解器Shell conduction zones and solid zones parallel optimization同時對殼單元傳導(dǎo)區(qū)域及固體區(qū)域進行優(yōu)化Fluid/Solid load balancing improvements for scalability 穩(wěn)定性更好Solver:

8、 HPC并行能力提升服務(wù)器模型 HPC 并行能力Icepak Model highlights: MCAD, ECAD, Non-conformal Assemblies, 734 objects734個器件Icepak Mesh highlights: 10.75 M cells using unstructured, non-conformal, multi-level, hex-dominant meshing scheme劃分了1075萬網(wǎng)格Icepak Solution highlights: Steady state, Turbulent Flow, Conjugate Heat

9、Transfer, Double Precision.System Information系統(tǒng)信息Intel Xeon CPU E5-2690 2.9 GHz processors, 128 GB RAM2 processorsRunning Windows 8.1 Enterprise (2013) Window8.1企業(yè)版HPC Test Summary HPC測試總結(jié)Trials were run in batch mode.批處理模型運行Each trial was run for 250 iterations.每個實驗計算250步Overall run times used for

10、measuring performance.使用總的計算時間測量HPC能力Overall run time includes file i/o, case setup and computations.服務(wù)器模型 HPC 能力 Test 1Overall Run Time vs Number of Cores 總時間VS核數(shù)服務(wù)器模型 HPC 能力 Test 1加速 vs 核數(shù)Overall run time for 1 core taken as reference while quantifying speed-up服務(wù)器模型 HPC 能力 Test 1Cluster Informatio

11、n集群信息Ivy Bridge Processors, 2687 v2, 128 GB RAM per. Dual 10 core processors per node (20 per node) Running Windows 2012 R2 SP3, Infiniband Interconnect.HPC Test SummaryHPC測試總結(jié)Job Scheduler utility in Icepak used to submit the runs to the cluster.將Icepak項目提交到集群。Trials were run in batch mode.批處理模型計算。

12、Each trial was run for 250 iterations.Overall run times used for measuring performance.Overall run time includes file i/o, case setup and computations.服務(wù)器模型 HPC 能力 Test 2Overall Run Time vs Number of Cores總時間VS核數(shù)服務(wù)器模型 HPC 能力 Test 2加速 vs 核數(shù)Overall run time for 1 core taken as reference while quantify

13、ing speed-up服務(wù)器模型 HPC 能力 Test 2Icepak in EKM: 基于xml的數(shù)據(jù)Export EKM metadata輸出EKM元數(shù)據(jù)Model information 模型信息Flow and Thermal boundary conditions邊界條件Solver configuration求解設(shè)置Parametrics & optimization參數(shù)及優(yōu)化Export Solution Reports & Image輸出報告及圖片Solution Overview Reports整體報告PNG image exportPNG圖片Utility to cre

14、ate XML files for legacy projects可以建立XML文件布線導(dǎo)熱率計算的增強改進了計算布線導(dǎo)熱率的算法 使用一種順序/并行的熱網(wǎng)絡(luò)方法粗網(wǎng)格細網(wǎng)格2D and 3D (Manhattan) plotting of powermaps2D/3D的熱耗分布云圖Heatflux, Power and Temperature variables supported支持熱流、熱耗及溫度Results can be viewed pre and post-solution可以在求解前后進行查看Postprocessing: Powermaps后處理熱耗分布云圖ANSYS Ice

15、pak v17.0 Macros Update宏更新Menu Structure Overhaul菜單修正Macro Documentation Enhancements宏文檔增強Die Characterization模擬封裝Die的方法Compare Mesh Settings網(wǎng)格設(shè)置的比較Minimum Gap Detection最小間隙的檢查Power Dependent Power熱耗與熱耗相關(guān)Delete Unused Materials刪除無用材料TEC Parallel SolveTEC并行計算Debug Divergence改正離散的求解Copy Mesh Settings拷

16、貝網(wǎng)格設(shè)置Export Geometry to ANSYS SpaceClaim將模型輸出到ScdmMenu Structure Overhaul菜單修正For ease-of-use, the macro menu has been alphabetized and reorganized:宏菜單被重置，以方便使用Geometry幾何Modeling模型Post Processing后處理Productivity高效Macro Documentation Enhancements文檔的增強The documentation for macros has seen substantial im

17、provements.改進了宏的文檔The following macros now have detailed instructions on usage:Power Dependent Power 熱耗與熱耗相關(guān)Transient Temperature Dependent Power熱耗與時間、溫度相關(guān)Debug Divergence改正離散的求解Updated screenshots and menu paths to reflect the new macro menu structure.All macros have a brief description that cover

18、main functionality. 所有宏的 功能有簡單描述。The documentation for TEC macros was updated to reflect recent enhancements.TEC的文檔被更新。Die Characterization Die的方法Creates an array of source objects on a die block在一個Die上建立多個SourceDeletes current parameters and generates new parametric trials for the source objects (b

19、y column option) and solves the trials 刪除當(dāng)前的參數(shù)，建立新參數(shù)工況，并進行參數(shù)化計算。Compare Mesh Settings網(wǎng)格設(shè)置比較Compares mesh settings in the Global Mesh panel and Local Assembly panels, before and after making changes 對整體網(wǎng)格和局部網(wǎng)格的設(shè)置進行比較。Outputs the mesh setting changes in a separate file對 網(wǎng)格設(shè)置單獨輸出Output InformationMacro

20、 PanelPrimitive Misalignment Check檢查模型不對齊Misalignments are a significant cause of bad meshes and divergence.模型不對齊是導(dǎo)致Bad網(wǎng)格及求解發(fā)散的重要原因。 Macro detects and reports object misalignments to usercustom misalignment tolerance specification allowed“Full Model” or “Selected Assembly” search options availableAf

21、ter running macro, user can either 運行后可以fix misalignments, or修復(fù)不對齊select appropriate Mesh “Minimum Gap” values選擇合適的最小間隙Power Dependent Power熱耗與熱耗相關(guān)Target Source #1Remote Source #1Remote Source #2Remote Source nRemote Source #2Target Source #2Target Source #20Delete Unused Materials刪除無用材料When users m

22、erge many models, old materials that are no longer used can accumulate in the model tree.當(dāng)用戶合并模型時，舊的材料會在模型樹下累積。This macro searches for all materials used in the model both in the active and inactive nodes. 宏命令可以尋找模型里所有的材料。Materials are deleted only when they are not used anywhere in the model, and t

23、hey are not library materials. 將會刪除模型中不使用的材料。Output is written to the message window:輸出窗口顯示如下：TEC Parallel Solve TEC并行計算On Windows machines, the Run TEC can now use parallel solving.在Window系統(tǒng)下，TEC可以并行計算求解。Other functionalities remains same.其他功能相同。Debug Divergence改正離散的求解This new feature in Debug Dive

24、rgence allows users to debug the manually terminated diverged solutions.允許用戶追蹤引起發(fā)散的錯誤網(wǎng)格。The macro takes solution ID as an input. If the solution is not loaded, the macro prompts user to load solution using “Load Solution ID” function.將求解的ID作為輸入。如果求解沒有加載，宏將使用Load Solution ID加載計算結(jié)果。If the user-specified solution ID has residuals more than the specified val