ACF材料簡要介紹.ppt

周驊 JI工程2課,ACF材料介紹,目錄,What is ACF ACF之應(yīng)用 ACF材料介紹 ACF與COG製程參數(shù)之關(guān)係 ACF與COG製程品質(zhì)之關(guān)係,What is ACF,一.異方性導(dǎo)電膠 Anisotropic Conductive Film 二.佈滿導(dǎo)電粒子之熱硬化樹脂膠帶 三.提供特定方向之導(dǎo)電功能 四.具有良好之接著效果,ACF之應(yīng)用,PCB,Panel,PCB,Panel,ACF材料介紹 (for FPC),AC-7106U-25,ACF材料介紹 (for FPC:7106),五.厚度:25m(取決於FPC導(dǎo)線之高度,請見續(xù)頁詳述) 六.長度:50M 七.寬度:2.5mm(取決於FPC壓著區(qū)域之寬度) 八.粒子大小:10m 九.粒子密度:800pcs/mm2 十.接著劑:熱硬化樹脂 十一.Separater:防靜電PET,Au,Ni,Plastic Particle,ACF材料介紹 (for FPC:7106),十二.ACF厚度與FPC的關(guān)係,W: conductor width S: conductor space H: conductor height T0: ACF thickness before bonding T1: ACF thickness after bonding : correction value (0.15H),ACF材料介紹 (for COG:8304),一.厚度:23m(取決於IC Bump之高度,請見續(xù)頁詳述) 二.長度:50M 三.寬度:2.5mm(取決於IC之寬度) 四.粒子大小:5m 五.粒子密度:20000pcs/mm2 六.接著劑:熱硬化樹脂 七.Separater:防靜電PET 八.Double layer,ACF與COG製程參數(shù)之關(guān)係,8 6 4 2 0,0 250 500 750 1000,Time (hr),Connection resistance (),10sec Bonding,8 6 4 2 0,0 250 500 750 1000,Time (hr),Connection resistance (),一.製程溫度時(shí)間 接觸阻抗,5sec Bonding,85 C,85%RH,ACF與COG製程參數(shù)之關(guān)係,Connection resistance (),8 6 4 2 0,0 250 500 750 1000,Time (hr),二.製程壓力 接觸阻抗,85 C,85%RH,ACF與COG製程品質(zhì)之關(guān)係,Connection resistance (),8 6 4 2 0,0 5 10 15,Number of particle (per Bump),一.導(dǎo)電粒子數(shù) 接觸阻抗,8 6 4 2 0,0 5 10 15,t = 0 hr,t = 500 hrs -40C 100 C,ACF與COG製程品質(zhì)之關(guān)係,二.導(dǎo)電粒子變形量 接觸阻抗,Connection resistance (),Deformation (%),8 6 4 2 0,0 20 40 60 80,t0=5m,t,Bump,Bump,Glass,Glass,Deformation=,t0-t,t0,100%,ACF與COG製程品質(zhì)之關(guān)係,三.導(dǎo)電粒子變形量 判別標(biāo)準(zhǔn),ACF與COG製程品質(zhì)之關(guān)係,四.ACF厚度 接觸阻抗,Connection resistance (),8 6 4 2 0,ACF Thickness (m),8 6 4 2 0,15 20 25 30,t = 0 hr,t = 500 hrs -40C 100 C,15 20 25 30,Bump height : 15m,ACF與COG製程品質(zhì)之關(guān)係,五.Bump hardness 接觸阻抗,Connection resistance (),Time (hr),8 6 4 2 0,0 250 500 750 1000,85 C,85%RH,100110 Hv,4050 Hv,1525 Hv,導(dǎo)電粒子 未壓破變形,導(dǎo)電粒子 變形量20%,導(dǎo)電粒子 變形量50%,ACF與COG製程品質(zhì)之關(guān)係,六.Bump pad導(dǎo)電粒子數(shù) 導(dǎo)電粒子密度,Number of conducting particles on a bump,30 20 10 0,0 5 10 15 20,Double layer Single layer,Bump size:70um*70um particle size:5um,Particle density (1000 pcs/mm2),ACF與COG製程品質(zhì)之關(guān)係,七. Layer structure insulation,100 80 60 40 20 0,0 5 10 15 20 25 30,Probability of short circuit (%),Conductor spacing (um),Conductor spacing,ACF與COG製程品質(zhì)之關(guān)係,八. Layer structure insulation resistance,1012 1011 1010 109 108 104