SM生產(chǎn)能力評估審計workshee

SMTMANUFACTURINGCAPABILITYASSESSMENTSCOREBOOKCategory1:DesignforManufacturabilityCriteria1.1ConceptandPracticeElementsDesignersorresponsiblestaffcanexplaintheconceptofDFMManagementandhowcompanydeploythem.Designguidelinesareavailable,crossreferencetoproductionlinecapability,processrequirementsandQualitystandards.GreenRedTherearereportsandmeetingsbetweenProcess&DesigndepartmentonDFMYieldforeveryproduct.Evidenceofusingallfindings.Checklistand/orsoftwareareusedforDFMassurance.Systemavailabletoensureimplementation.StrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreDesignersandProcessEngineercanexplaintheimportanceofDFMwithexamples.Awareness1)2)AwarethattherearevariousDFMrulesintheindustry,eachofthemhastheirspecificconditions.3)4)Thereisain-houseDFMtrainingandcontrolsystem.5)6)7)BothprocessanddesignengrsaretrainedonDFM(withcontrolrecords).8)9)50%50%50%3333DesignandProcessEngineerscandemonstrateunderstandingofdesignrules.10)TheresponsibilitytoensuregoodDFMisclearineveryone'smind.Category1:DesignforManufacturabilityCriteria1.2ProcessknowledgeElements1)DesignersawaretheimportanceofthemknowingSMTprocessandthedesignrulessholdnotbedeterminedwithoutknowingtheinhouseprocess.GreenRedStrengthsImprovementOpportunitiesRemarks-placementalignmentmethodvsSMDs.-feederefficiency.-IRvsHotairreflow.-paste/glueprintingvsdispensing.ApproachImplementationTotalElementScoreAwareness2)Designerscanclearlyexplainthevarioustypesofprocessusedintheirproduction.(types,maincharacteristicsandapplication).3)Therearein-houseProcesstrainingcoursedesignfordesigners.Systemisavailabletoensureimplementation.4)ProcessreleasedocumentsareavailableintheDesigndepartmentandcrosslinktotheirdesignrules.5)SupportingdocumentsforDFMrulesfromtheprocesspointofviewiswellorganizedandmaintained.6)Designersareabletoexplainkeyprocessparameters:7)Designersknowwhatisprocesswindowandhowtheirdesignrulesrelatetotheprocesswindow.8)Designerswhoresponsiblefordesignrelease(orDFMcheck)aretrainedinProcessknowledge(controlandrecords).012390%80%40%Category1:DesignforManufacturabilityCriteria1.3DesignKnow-how(substrateselection)Elements1)Designersawarethattherearemanydifferentsubstratetypesandeachhavedifferentconsiderationinprocessandproductreliability.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness2)Designersbelievethattheyareareencouragedandhavemadeallnecessaryconsiderationstoselecttheirexistingrangeofsubstrates.3)Therearedocumentsspecifiedthetypesofsubstrateandconsideration.Inhouserequirementsaredefined.4)Substrateselectionisoneofthekeydesignflowwithcontrol,toensuresuchconsiderationismadeduringthedesign.Checklistaredesignandprovided.5)Designercannamecommontypesofsubstrates,explainedkeydifferencesandtheimpacttoproductiononthePCBfinishingtypes(HAL,NiAu,OSP).6)DesignersknowhowtodefinePCBwarpagetoensuregoodDFM.7)DesignersknowthesourcesofdimensionalerrorinPCBandtheirtypicalmagnitudes.Welldefinedindesignruleswithprocesscapabilityandqualitystandards.012390%80%40%Category1:DesignforManufacturabilityCriteria1.4DesignKnow-how(SMDselection)Elements1)DesignersawarethatInternationalstds(EIAJ,EIA,JEDECetc.)havesomeGreenRedStrengthsImprovementOpportunitiesRemarksdifferences.AlsomatrixandImperialsystem.ApproachImplementationTotalElementScoreAwarenessDesignersawarethatdifferentSMDshavedifferentimpacttoqualityandrequiredifferentdesignconsideration.2)3)Informationaboutpackagetypesandtheirfailuremechanismareavailable.EverySMDhasgonethroughaDFMverificationprocessduringdesign.4)Designersknowthatpackagetypesalsoaffectproductivity(abletogiveexamples).Informationaboutproductioncapabilityrelatedtopackagetypessuchasnozzletype,alignmentcapabilityandspeedetc.areavailable.5)DesignerabletoexplaineffectofdifferentstandoffheightofSOIC:-highstandoffforglueorcleaningprocess.-lowstandoffforPCBAprofileandbetterthermalconductivity.6)Designersknowtheeffectsofdifferentleadtypes:-GullWing(long/short),-Jlead,-LeadlessSMD,-Ballgrid.7)Designersknowtheconsiderationoflargechipsascomparetosmallchips:-onthermalmismatch,-onboardwarpage,-onorientation.8)012390%80%40%Category1:DesignforManufacturabilityCriteria1.5DesignKnow-how(Thermalmanagement)Elements1)DesignersawarethatThermalmismatchisamajorprobleminSMTandrequireddifferentconsiderationasTHT.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness2)DesignersawarethatThermaldesignaffectsnotonlyproductperformanceandlife,butalsoproductionyield.3)DocumentsforbothproductperformanceandasssemblyconsiderationrelatedtothermalcharacteristicsofSMDareavailable.4)TherearetestrecordsforallcommonSMDpackagesusedintermsofthermalfatiguelife(fromin-house,externalsourcesorsuppliers).5)Designersabletoexplainwhichofthefollowingaremoresuspectivetothermalproblemandwhy:-1206vs0805,-LCCvsPLCC,-QFPvsPLCC.6)DesignerscanexplaindifferentbetweenTHTandSMTintheaspectofthermalconsideration.7)Designersknowsomemethodofeliminatingthermalmismatchproblems:-compliantlayerPCB,-standoffjoints,-leadedSMDs,-matchingmaterials,-useCucladInvarcord.012390%80%40%Category1:DesignforManufacturabilityCriteria1.6DesignKnow-how(Solderland)Elements1)Designersawarethatsolderlanddesignareimportantformanufactureabilityandarespecifictocomponents,productioncapabilityandqualitystandards.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness3)Designrulesincludescrossreferencessuchasproductioncapability,PCB&componentspecification,processtypeandqaulitystandards.4)Designersaretrainedonhowtodetermineowninhousesolderlandspecificationandalwaysworktogetherwiththeprocessengineeringstaff.5)Designersabletoexplaintheuseofdifferentsolderlandsizefor0805Cand0805R,orwhyitisnotbeinguseinhouse.6)DesignersabletoshowcalculationofsoldelanddimensionswhichconsideredSMD&PCBtolerances,processtype/capabilityandQstd.7)Solderlanddefinitionincludes:-SMD&PCBtolerances,-Processdefinition,-Process/Equip.Cpk,-SMDSpacing,-Dummytracks,-Solderresist.8)Designersabletoexplainhowsolderlandaffectprocessproblemssuchas:-Tombstone,-Solderballing,-Shorts,-Shadowing,-WickingorWelling.9)Arespecialshapeofsolderlandeverbeingconsideredforsmallchips,smallICcornerpads,SOT23orotherexampleetc.Why?2)Designerscangiveexamplesofprocessfailureduetosolderlanddesignproblems,bycomparingdifferencebetweenwaveandreflowprocess.012390%80%40%Category1:DesignforManufacturabilityCriteria1.7DesignKnow-how(PCBlayout)Elements1)DesignersawarethatthelayoutofSMDsandPCBalsoaffectsproductsmanufacturabilityandlongtermproductreliability(examples).RedStrengthsImprovementOpportunitiesRemarksDesignersknowwhyspecialAnnularRingshape(filleting,cornerentry,keyhole)areusedornotused.ApproachImplementationTotalElementScoreAwareness3)ComprehensivePCBlayoutrequirementdocumentsareavailable.Supportedbytechnicalevaluationreports/marketstandards.5)Designoffiducial:-shape,-no.,-Global/local/circuit,-contrast,-asymmetricallocation,-clearance.6)DesignofVia:-fillet,-aspectratio<3,-diameter>0.4mm,-keepoutzone.7)SMDsnearbreakawayedges,hingeandconnectorforcein,haskeepoutzoneandorientationwelldefined.8)Green4)DFMchecklistincludesorientationandlayoutchecks.Itisastandardcheckingprocessintheproductdevelopment.2)Designersknowtheeffectoflayoutw.r.t.tothefollowingprocesses:-Reflowoven,-StencilPrinting,-Placement012390%80%40%Category1:DesignforManufacturabilityCriteria1.8DesignKnow-how(Stencil)Elements1)Designersknowthatstencildesignshouldbepartofthetotaldesignresponsibilityandrelatedtosolderland&printingprocess.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness3)Designrulesshownthatstencildesigniscloselyrelatedtosolderland.Cpkofallprintingprocessarerecordedandusedasadesignguide.5)Designersabletoexplaintheeffectsof:-toolargeaperture,-toosmallaperture,-wrongaspectratio,-differentapertureshape.6)Designersknowhowtodefinetheclearanceofaperturetopadsize.RelatedtoCpkofprintingandPCBstability.7)Aperturedesignissmallerthanpadandpadtoleranceis-0.0+0.Xtoensurenosolderballingetc.8)Differentapertureshapesareusedforlargechips>1206.2)Designersabletomentionthekeyparametersofstencilandhowtheyrelatetotheassemblyprocess.4)AllkeystencilparametersareclearlydefinedinthePurchasingspecification(suchasstencilfabricatingprocess,materials,thicknessetc.)012390%80%40%Category2:ProcessCapabilityCriteria2.1ProcessconceptElements1)Engineersknowwhyprocesscontrolisneededwhentest&QCareavailable.RedThereisevidenceforusingprocesscontrol.e.g.useofCpkmeasurementfromtimetotime,controlchartetc.StrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness3)ThereareevidencethatthemanagementstressonprocesscontrolmorethanInspection,testandrework.5)6)Engineerscanexplainwhataretheprocesswindowsfortheircurrentprocesses.7)EngineerscanexplainwhatisCpandCpk.2)EngineersknowProcesscontrolstartsfromstabilizingtheprocess,andissurethattheirprocessisalreadystabilizedatthismoment.Green4)The4stepsofProcesscontrol(design,installation,tuning,control)arebeingusedintheorganizationinsomeways.012390%80%40%Category2:ProcessCapabilityCriteria2.2Processknow-howElements1)Engineerscandescribeinconfidence,thetypesofProcessusedin-houseandtheirProcessstandardsw.r.t.totheindustry.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness2)Engineersknowthateveryprocess(includingrework)hasitswayandcapability.Abletodescribewhatistheprocessparametersofcertainprocess.3)Thereisin-houseprocesscoursesdesignfordifferentlevelofstaff.Systemavailablefortrainingcontrol.Backupbyfrequentlyexternaltraining.4)TheProcessCpkorsimilarmeasurementareusedwheneverpossible,closelyrelatedtothedesignrules.Examplecanbegiven.6)EngineersabletodemonstrategoodprocesscontrolinthePrintingprocess.-settingofparameters,-printintervalcontrol,-monitoringorprintresults.7)UnderstandeffectofCoplanarityandhowtodefineitsspecification.8)AbletodefineSolderBallproblemandknowthepossiblecausesofit.9)AbletoexplainwhatcontributetoTombstoningproblemandhowtoeliminateit.10)AbletoexplainwhybakingofbarePCBsandSMDswereusedornotused.5)Processrelatedhandbook(problems&solutions),researchreportsetc.areavailableandmaintained.11)Abletoexplainthedetailsofareflowprofile(e.g.Max&Minpeaktemp.,soakingrequirementetc.).012390%80%40%Category2:ProcessCapabilityCriteria2.3ProcessToolsElements1)Awarethatuseofprocesscontroltoolsisimportant,abletotellwhatareneededandabletodescribethereadinessofin-housetooling.RedStrengthsImprovementOpportunitiesRemarksFollowingtoolsareavailable:-MeasuringMicroscope,-Cameraoption,-airspeedmeter-Thermometer,-profiler,-XYtable,-weightingm/c-torquemeter-pastestirrer-viscositymeter-heightmeasurementApproachImplementationTotalElementScoreAwareness3)ResponsibilityofMaintenanceandCalibrationoftoolsareassigned,properlydoneandrecorded.4)Thereareevidenceofin-housedesignedtoolsforeaseofprocessmeasurementandcontrol.5)Operatorshaveproperknowledgeofusingthetools.e.g.Humanerrorelimination,righttestconditionsandapproach.7)Methodsareavailableformostprocessesinmeasurementandcontrol.HardandsoftToolsareusedextensivelyinthesemethods.8)Green2)Awarethattoolsforprocessmeasurementarenotalwaysavailableandshouldbedesignedandfabricatedtofitin-houserequirements.Thereareevidenceofusingtheabovetoolsforprocesscontrol.6)012390%80%40%Category2:ProcessCapabilityCriteria2.4ProcessStandardsElements1)EngineersknowthatProcessCharacteristicsarespecificineachlineandeachfactory,andshouldbecharacterizedanddocumented.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness3)ProcessStandardsareavailable,documentationconsistsofProcessdescription,Processwindows,CpandCpk,dppmlevelandmaintenancemethodsetc.4)ProcessStandardsweredevelopedbaseontrueexperienceandscientificwaysratherthancopyingorjudgement.ReferencetoDFM,Equip.&Qualitystds..5)SpecialProcessStandardsaredevelopedduringeachproductprocesstuning.Andsubsequentlyreviewedandfeedbackfromproductiontoimprovestd.7)Engineerscanexplainwhytheprocessstandardarewritteninthenumberofdifferentlevelasitisnow.e.g.1classor2classes.8)Engineersabletoexplain1or2standardsclearlyfromthedocument.9)Processstdisusedinproductdesign,ordeviationfromthisprocessstdwillhaveadditionalverificationorremarksforactionduringprocesstuning.2)EngineerscanexplaintheuseofProcessstandards,inrelationtoDFM,Quality,andEquipmentstandards.6)Standardsaredesignintodifferentlevelsforeaseofuse(checklist,specification,andexplanation).012390%80%40%Category2:ProcessCapabilityCriteria2.5ProcessInstallationandTuningElements1)EngineersawarethateverynewproductwillneedaProcessInstallationandTuning(abletoexplainwhatisprocessinstallationandtuning).GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness2)Engineerscanexplainthebenefitsofprocesstuningandrelationtoprocessdesignandprocesscontrol.Alsowhataretheoutputsfromtuning.3)Processinstallation&tuningisclearlydefineasaproceduresinpre-production.Withallinputs(fromprocessdesignphase)andoutputs.5)ProcessInstallationincludes:-materialcheck,-m/cparameterssetting,-m/cstatus,-processdesignoutcomedocumentation.6)MaterialCheckingincludesatleast:-Stencil,-SolderPaste,-Adhesive,-PCBs,-SMDs.7)Processtuningrecordsareavailableforeachandeveryproduct.8)Productionprocesscontroliscloselybasedontheoutputoftuning.4)PCBsuppliertestdataaresufficientandcomparedwithincomingtestresults.(abletoexplainwhyisnotuseifnotused).9)Demonstratetherightwayofovenprofilesettingandovencontrol.012390%80%40%Category2:ProcessCapabilityCriteria2.6ProcessControlElements1)Engineersawareproductionprocesscontrolisnotjustbestonproductinspection.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness2)Specificprocesscontroldocumentisdevelopedforeachandeveryproduct.Fromdevelopmenttoprocesstuningandcontrol.3)QCdepartmentisresponsibletocarryoutandreviewtheproductionprocesscontrolplan,reviewcriteriaisjoindevelopedbyQC,ProcessandDesigndept.4)Properreportsandmeetingbetweendesign,processandtheproductionQCarecarriedoutregularlyforimprovement.5)Thereareevidenceofdynamicprocesscontrolpractices.6)Engineerscanexplaintheweakestlinkoftheirprocessingeneralandabletogiveanexampleofitsprocesscontrol.Controlisscientificandappropriate.2)Engineersunderstandthatproductionprocesscontrolshouldbedynamicandderivefromthedevelopmentandoutcomeofprocesstuning.012390%80%40%Category2:ProcessCapabilityCriteria2.7ProcessEquipmentElements1)Engineersawarethatforbestcontrol,Cpkorsimilarmethodsshouldbeusedforallmachinesandtheirkeyparameters.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness3)EquipmentstandardsdocumentationisavailableandcrossreferencetoProcessrequirement.4)CpandCpklikemeasurementforallkeyprocessequipmentaremeasuredandrecorded,theirtrendsarebeingstudyregularly.5)EngineersknowhowtomeasurePerformanceofManualprinter,Semiautoprinter,andAutomaticPrinter.6)EngineersknowhowtodetermineCpkofOven:-DeltaT,-Tslope,-Deltatime,-loadvariation.,-exhaustvariation.7)Therearesupportingtechnicaldocumentsforequipmentstandards,includingthetestandmaintenancemethods.2)Engineersawardthatprocessrequirementisdifferentfrommachinespec.andtheflowlinehasdifferentspec.thanindividualm/c,controlisbaseonflowline.012390%80%40%ThispageintentionallyleftblankCategory3:ProductivityCriteria3.1ConceptandApproachElements1)Engineersawarethattheyareresponsiblefortheproductivitywhichisaintegrationof:-Manpower,-Supplies&Consumables,-Downtime,-Equipmentoptimization,-WasteduetopoorYield.RedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwarenessGreen2)CurrentProductivityhasbeenmonitoredandrecorded,roomforimprovementisknown.Productivitydataareavailable.4)EngineersknowthatProductivityshouldnotbemaintainedattheexpenseofquality,andbelievethatmanagementsupporttheminthisdirection.5)Operatorsknowtheirdailydeliverabletarget.Realtimeinformationabouttheperformanceisavailableintheworkplace.6)Targetsarespecific,measurableandagreedbyatleasttheEngineers.7)Targetareknownbyoperators,Real-timeindicatorsweremakeavailabletotheoperators.8)Thereareexamplesonimprovementofproductivitythroughsomeorganizedworks.DefinitionofProductivityanditselementsarewellunderstandandconsistentineveryengineerandresponsibleworker’smind.3)012390%80%40%Category3:ProductivityCriteria3.2ManpowerElements1)Staffcantelltheextendofmeaningfulworktheyperforminthetotalcontext.Manpowerproductivityisundermeasureandbenchmarked.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness2)Companyisdefiningandmonitoringdegreeofautomationandcomparetothemanpowerproductivity.3)Staffareempoweredwithsufficientknowledge,theresponsibility,targetanddirectionarecleartothem.4)Staffgenerallythinkthatthereisrecognitionforachievementandinitiative.Someevidencesorexamplesofrecognitioncanbeshown.6)Productionfirstpassyieldishighandwellcontrolled.Operatorsarekeepingtrackoftheirownstationyield.Nofull-timereworkoperatorneeded.7)Manpowerperproductionlineisatareasonablelevel.5)Stafftimemanagementsystemisbeingusedincompany.Suchastimetableplanningetc.012390%80%40%Category3:ProductivityCriteria3.3SuppliesandConsumableElements1)Engineerscanexplainhowtodefineandcalculatethesuppliesproductivity.Knowhowtodeterminetheidealtargetsandachievabletargets.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness3)Operatorsweretoughhowtoconservematerialsandnotjustreceivedinstructiontoconservethem.4)DataonSuppliesandConsumableEfficiencyareavailable.Itispartoftheroutineproductionreporttothemanagement.5)ProductionYieldarestableandatareasonablygoodlevel.Nostraightforwardproblemsontheline.7)Machinerecoveryratearebeingmonitoredandactiontakentoreducethem.8)Materialsareproperlystoredunderrecommendedconditions.Staffweretrainedonhowtohandlethemcorrectly,suchassolderpastemanagementandmoistureabsorptionofICsetc.2)SuppliesProductivityisbeingmonitoredandsomekindofcontrolisinplace.Reasonscanbegivenfornotdoingsuchmonitoringandcontrol.6)TypicalMaterialconsumptionrateisspecificineachdevelopmentandprocesstuning.012390%80%40%Cate濕gory梁3:票Pro根duct戚ivit彩yCrit侍eria新3.4堵Ma售chin船e/Li驢neO奸ptim硬izat苦ionEle帽men售ts1)IE鍬is粗tak成ing擊ca漿re察of逃bot美hM恩anu魄al腐and授Au弄tom電ati茄cs棄tat蟲ion恭s.狡The姻de哨gre戶eo刊fo唯pti鑒miz茫ati瞧on褲is合kno雹wn貸in毀eve執(zhí)ry床par強t.Gre且enRedStr憑eng柳thsImp泄rov惹eme圍nt烘Opp典ort曉uni景tie戴sRem巴ark藥sApp繩roa飯chImpl鵝emen傭tati澡onTota籌lEl史emen臉tSc陵oreAwar優(yōu)enes占s3)OEE賄iso附neo縣fth蒜eP.磚I.a貧ndw可ere漁repo捐rtf繡requ半entl謹y.A俘lli貿(mào)dle白time皆are鋤cat桂egor帥ized迫cle問arly綁and食rep速orte針d.4)Syst繭emi茄npl秤ace恢toa扛larm射bef疑ore墨mate怨rial謙sru到nou貸tto攏ens崇ure衡suff勾icie華ntt魔ime院tor違eact壘and謝kee焦ppr趨oduc他tion分run般ning僻smo泛othl蜓y.6)Engi漠neer傲kno酒wwh哀ati符sth膠eli純mit麥that估eac海hma迅chin鑄eca俯ngo跑wit謊hout秤sac塞rifi你cing仗qua尤lity黃.7)Engi玩neer份und希erst手and使Push圾/Pul在lsy粒stem建and炒opt溪imiz醉eda啞ccor壤ding衣to史it.8)Manu固alt植ime紡(e.g祖.ch撒ange雅-ove饅rtu炒ning森)we澤ret供rack鉗to理comp脫are顛with炎ful挺lya僻utom膛ated輸eff塑icie橫ncy.模Rev霸iew眉ofd郵egre免eof屋aut斜omat豈ion階isa及l(fā)so標done凍fro乓mti夸met校oti甘me.2)Cha宰rac疤ter滴ist泉ics像of精ea助ch槳pro萄duc根tio準nl征ine繡co梨nfi訪gur施ati郊on瓶is丟und蚊ers脅too類d.殿A(yù)ll蠶in倚teg當rat本ion驢lo角sse箏sh移as淹bee隱nd傻efi允ned貝an艙dw醫(yī)ell歇ma灰tch埋wi弟th蓮the火pr總odu痕cti蘇on怖pat嬸ter從n.5)Cha大nge招ove姥re訪ffi污cie絕ncy站is碑be異ing翻mo耳nit太ore靜d,召num款ber免of極al豪low喂abl繪ec辣han澡geo真ver潤pe風rd憲ay習is侵kno榴wn縣and氣ma斑tch艱wi帆th擊the顧pr煮odu棄cti肯on賊pat扛ter匹nn謹eed愉ed.012390%80%40%Cate房誠gory賓3:總Pro著duct寺ivit斗yCrit絡(luò)eria帖3.5及Ma銜inte隨nanc政e&攤Stor臨ageEle爐men準ts1)Ther腳eis疲ful落lMa成inte宇nanc住epr暖ogra械mwh己ich扇tie燥inw蛇ith權(quán)the滅prod珍ucti稱vity口tar埋get.Gre苦enRedStr截eng偏thsImp嚇rov展eme寬nt緞Opp扭ort浪uni探tie讓sRem帶ark截sApp品roa席chImp梳lem警ent適ati店onTot淚al踢Ele耐men拐tS訴cor惹eAwa迎ren摸ess3)Ther慨eis橫pro川per芽plan忙ning劇wit乖hsu輔ppli鋪ers貧ont原h(huán)et巧otal佩mai傻nten店ance撓pro邪gram殘.Le扮vel者ofp淹reve餓ntiv葡ean黃dco背rrec滿tive套sup匯port克wer拍ewe磚lld荷efin狼ed.4)Com斗pre脫hen割siv若ea缸nd零cle嫁ar香Mai緊nte擱nan箏ce木sch青edu練le織are苗av飄ail綁abl纏e,中wit迫ho馳wne咳rsh貴ip,嫩ch庭eck本lis冰t,耀app托rov詞al申and求ne幸xt就rev勞iew仙da糠te.裂Di尸ff.爽St然rat教egi峰es惜&l噸eve驚la優(yōu)re某use約d.6)Main中tena秧nce若hist南ory鳴reco短rds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