pcb板制作工藝流程介紹課件

HDIManufacturingProcessFlowHDIManufacturingProcessFlowPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingPre-engineeringPatternimagingPre-engineeringPatternimagingEtchingLaminatingDrillingPre-engineeringPatternimagingDesmearCuplatingHolepluggingCuplatingBeltSandingDesmearCuplatingHolepluggingLaminationLaserAblationMechanicaldrillingCuplatingPatternimagingLaminationLaserAblationMechanSolderMaskGoldplatingRoutingElectricaltestPatternimagingSolderMaskGoldplatingRoutingHolecounterShippingVisualinspectionHolecounterShippingVisualins*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheetsize:36”*48”,40”*48”,42”*48CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2113,2116,1506,7628,7630*Rawmaterial(ThinCore,Copp1.內(nèi)層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)

COPPERFOILEpoxyGlass1.內(nèi)層基板(THINCORE)LaminateCoppPhotoResist2.內(nèi)層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)PhotoResist2.內(nèi)層線路製作(壓膜)(DryPhotoResist3.內(nèi)層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExposePhotoResist3.內(nèi)層線路製作(曝光)(Expo4.內(nèi)層線路製作(顯影)(Develop)PhotoResist4.內(nèi)層線路製作(顯影)(Develop)PhotoRe5.內(nèi)層線路製作(蝕刻)(Etch)PhotoResist5.內(nèi)層線路製作(蝕刻)(Etch)PhotoResis6.內(nèi)層線路製作(去膜)(StripResist)6.內(nèi)層線路製作(去膜)(StripResist)7.黑氧化(OxideCoating)7.黑氧化(OxideCoating)8.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)8.疊板(Lay-up)LAYER2LAYER3LA9.壓合(Lamination)9.壓合(Lamination)典型之多層板疊板及壓合結(jié)構(gòu)...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機(jī)之熱板壓合機(jī)之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板典型之多層板疊板及壓合結(jié)構(gòu).COPPERFOIL0.5墊木板鋁板10.鑽孔

(Drilling)墊木板鋁板10.鑽孔(Drilling)11.電鍍Desmear&CopperDeposition11.電鍍Desmear&CopperDeposit12.塞孔(HolePlugging)13.去溢膠(BeltSanding)12.塞孔(HolePlugging)13.去溢膠(14.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→Option14.減銅(CopperReduction)→Op16.外層壓膜DryFilmLamination(Outerlayer)PhotoResist16.外層壓膜DryFilmLamination(17.外層曝光ExposeUV光源17.外層曝光ExposeUV光源18.AfterExposed18.AfterExposed19.外層顯影Develop19.外層顯影Develop20.蝕刻Etch20.蝕刻Etch20.去乾膜StripResist20.去乾膜StripResist21.壓合(Build-upLayerLamination)RCC(ResinCoatedCopperfoil)21.壓合(Build-upLayerLaminati21.護(hù)形層製作(壓膜)(ConformalMask)DryFilm(乾膜)DryFilm(乾膜)21.護(hù)形層製作(壓膜)(ConformalMaskArtwork(底片)Artwork(底片)22.護(hù)形層製作(曝光)(ConformalMask)BeforeExposureAfterExposureArtworkArtwork22.護(hù)形層製作(曝光)(23.護(hù)形層製作(顯像)(ConformalMask)23.護(hù)形層製作(顯像)(ConformalMask)24.護(hù)形層製作(蝕銅)(ConformalMask)24.護(hù)形層製作(蝕銅)(ConformalMas25.護(hù)形層製作(去膜)(ConformalMask)25.護(hù)形層製作(去膜)(ConformalMask)26.雷射鑽孔(LaserAblation)及機(jī)械鑽孔26.雷射鑽孔(LaserAblation)及機(jī)械鑽MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.機(jī)械鑽孔(MechanicalDrill)MechanicalDrillLaserMicrovia28.電鍍(Desmear&CopperDeposition)28.電鍍(Desmear&CopperDeposi29.外層線路製作(Patternimaging)壓膜(D/FLamination)

29.外層線路製作(Patternimaging)壓膜曝光(Exposure)顯像(D/FDeveloping)

曝光(Exposure)顯像(D/FDeveloping)蝕銅(Etching)去膜(D/FStripping)

蝕銅(Etching)去膜(D/FStripping) 30.防焊(綠漆)製作(SolderMask)30.防焊(綠漆)製作(SolderMask)WWEI94V-0R10531.S/M顯像(S/MDeveloping)32.印文字(LegendPrinting)WWEIR10531.S/M顯像(S/MDevelo33.浸金(噴錫……)製作(ElectrolessNi/Au,HAL……)WWEI94V-0R10533.浸金(噴錫……)製作(ElectrolessNi/WWEI94V-0R105DedicateoruniversalTesterFlyingProbeTester34.成型(Profile)35.測試(ElectricalTesting)WWEIR105DedicateoruniversalWWEI94V-0R105WWEI94V-0R10536.終檢(FinalInspection)37.O.S.P.(entekplusCu_106A….)→OptionWWEIR105WWEIR10536.終檢(FinalLASERBLIND&BURIEDVIALAY-UPA=THROUGHVIAHOLE(導(dǎo)通孔)

B=BURIEDVIAHOLE(埋孔)C=OneLevelLaserBlindVia(雷射盲孔)LASERBLIND&BURIEDVIALAY-UPBURIEDVIA

ANDLASERBLINDVIAOPTION(雷射盲埋孔之選擇)DCCD=TwoLevelLaserVia(雷射盲孔)CDCB-STAGEFR-4CoreRCCFR-4CoreB-STAGERCCABBALASERBLIND&BURIEDVIALAY-UBURIEDVIALAY-UPA=THROUGHVIAHOLE(導(dǎo)通孔)

B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)

D=BLINDHOLEMLBVIA(多層盲孔)BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBARESINB-STAGE

BLINDANDBURIEDVIAOPTION(盲埋孔之選擇)DACC

E=VIAINPAD(VIP)(導(dǎo)通孔在pad裡面)EBURIEDVIALAY-UPA=THROUGHVConventionalPCBFR-4Build-upLayerBuild-upLayerPhoto-viaPhoto-ImageableDielectric(PID)FR-4ConventionalPTHConventionalPTHConventionalPCBFR-4Build-upBuConventionalPCBBlindViaPCBPTH3millineSVHIVHChip-on-SVHFR-4ConventionalPTHConventionalPTHConventionalPCBBlindViaPCBPQ&AENDQ&AEND1、有時候讀書是一種巧妙地避開思考的方法。1月-231月-23Thursday,January5,20232、閱讀一切好書如同和過去最杰出的人談話。02:40:5602:40:5602:401/5/20232:40:56AM3、越是沒有本領(lǐng)的就越加自命不凡。1月-2302:40:5602:40Jan-2305-Jan-234、越是無能的人，越喜歡挑剔別人的錯兒。02:40:5602:40:5602:40Thursday,January5,20235、知人者智，自知者明。勝人者有力，自勝者強(qiáng)。1月-231月-2302:40:5602:40:56January5,20236、意志堅強(qiáng)的人能把世界放在手中像泥塊一樣任意揉捏。05一月20232:40:56上午02:40:561月-237、最具挑戰(zhàn)性的挑戰(zhàn)莫過于提升自我。。一月232:40上午1月-2302:40January5,20238、業(yè)余生活要有意義，不要越軌。2023/1/52:40:5602:40:5605January20239、一個人即使已登上頂峰，也仍要自強(qiáng)不息。2:40:56上午2:40上午02:40:561月-2310、你要做多大的事情，就該承受多大的壓力。1/5/20232:40:56AM02:40:5605-1月-2311、自己要先看得起自己，別人才會看得起你。1/5/20232:40AM1/5/20232:40AM1月-231月-2312、這一秒不放棄，下一秒就會有希望。05-Jan-2305January20231月-2313、無論才能知識多么卓著，如果缺乏熱情，則無異紙上畫餅充饑，無補(bǔ)于事。Thursday,January5,202305-Jan-231月-2314、我只是自己不放過自己而已，現(xiàn)在我不會再逼自己眷戀了。1月-2302:40:5605January202302:40謝謝大家1、有時候讀書是一種巧妙地避開思考的方法。12月-2212月50HDIManufacturingProcessFlowHDIManufacturingProcessFlowPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingPre-engineeringPatternimagingPre-engineeringPatternimagingEtchingLaminatingDrillingPre-engineeringPatternimagingDesmearCuplatingHolepluggingCuplatingBeltSandingDesmearCuplatingHolepluggingLaminationLaserAblationMechanicaldrillingCuplatingPatternimagingLaminationLaserAblationMechanSolderMaskGoldplatingRoutingElectricaltestPatternimagingSolderMaskGoldplatingRoutingHolecounterShippingVisualinspectionHolecounterShippingVisualins*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheetsize:36”*48”,40”*48”,42”*48CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2113,2116,1506,7628,7630*Rawmaterial(ThinCore,Copp1.內(nèi)層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)

COPPERFOILEpoxyGlass1.內(nèi)層基板(THINCORE)LaminateCoppPhotoResist2.內(nèi)層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)PhotoResist2.內(nèi)層線路製作(壓膜)(DryPhotoResist3.內(nèi)層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExposePhotoResist3.內(nèi)層線路製作(曝光)(Expo4.內(nèi)層線路製作(顯影)(Develop)PhotoResist4.內(nèi)層線路製作(顯影)(Develop)PhotoRe5.內(nèi)層線路製作(蝕刻)(Etch)PhotoResist5.內(nèi)層線路製作(蝕刻)(Etch)PhotoResis6.內(nèi)層線路製作(去膜)(StripResist)6.內(nèi)層線路製作(去膜)(StripResist)7.黑氧化(OxideCoating)7.黑氧化(OxideCoating)8.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)8.疊板(Lay-up)LAYER2LAYER3LA9.壓合(Lamination)9.壓合(Lamination)典型之多層板疊板及壓合結(jié)構(gòu)...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機(jī)之熱板壓合機(jī)之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板典型之多層板疊板及壓合結(jié)構(gòu).COPPERFOIL0.5墊木板鋁板10.鑽孔

(Drilling)墊木板鋁板10.鑽孔(Drilling)11.電鍍Desmear&CopperDeposition11.電鍍Desmear&CopperDeposit12.塞孔(HolePlugging)13.去溢膠(BeltSanding)12.塞孔(HolePlugging)13.去溢膠(14.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→Option14.減銅(CopperReduction)→Op16.外層壓膜DryFilmLamination(Outerlayer)PhotoResist16.外層壓膜DryFilmLamination(17.外層曝光ExposeUV光源17.外層曝光ExposeUV光源18.AfterExposed18.AfterExposed19.外層顯影Develop19.外層顯影Develop20.蝕刻Etch20.蝕刻Etch20.去乾膜StripResist20.去乾膜StripResist21.壓合(Build-upLayerLamination)RCC(ResinCoatedCopperfoil)21.壓合(Build-upLayerLaminati21.護(hù)形層製作(壓膜)(ConformalMask)DryFilm(乾膜)DryFilm(乾膜)21.護(hù)形層製作(壓膜)(ConformalMaskArtwork(底片)Artwork(底片)22.護(hù)形層製作(曝光)(ConformalMask)BeforeExposureAfterExposureArtworkArtwork22.護(hù)形層製作(曝光)(23.護(hù)形層製作(顯像)(ConformalMask)23.護(hù)形層製作(顯像)(ConformalMask)24.護(hù)形層製作(蝕銅)(ConformalMask)24.護(hù)形層製作(蝕銅)(ConformalMas25.護(hù)形層製作(去膜)(ConformalMask)25.護(hù)形層製作(去膜)(ConformalMask)26.雷射鑽孔(LaserAblation)及機(jī)械鑽孔26.雷射鑽孔(LaserAblation)及機(jī)械鑽MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.機(jī)械鑽孔(MechanicalDrill)MechanicalDrillLaserMicrovia28.電鍍(Desmear&CopperDeposition)28.電鍍(Desmear&CopperDeposi29.外層線路製作(Patternimaging)壓膜(D/FLamination)

29.外層線路製作(Patternimaging)壓膜曝光(Exposure)顯像(D/FDeveloping)

曝光(Exposure)顯像(D/FDeveloping)蝕銅(Etching)去膜(D/FStripping)

蝕銅(Etching)去膜(D/FStripping) 30.防焊(綠漆)製作(SolderMask)30.防焊(綠漆)製作(SolderMask)WWEI94V-0R10531.S/M顯像(S/MDeveloping)32.印文字(LegendPrinting)WWEIR10531.S/M顯像(S/MDevelo33.浸金(噴錫……)製作(ElectrolessNi/Au,HAL……)WWEI94V-0R10533.浸金(噴錫……)製作(ElectrolessNi/WWEI94V-0R105DedicateoruniversalTesterFlyingProbeTester34.成型(Profile)35.測試(ElectricalTesting)WWEIR105DedicateoruniversalWWEI94V-0R105WWEI94V-0R10536.終檢(FinalInspection)37.O.S.P.(entekplusCu_106A….)→OptionWWEIR105WWEIR10536.終檢(FinalLASERBLIND&BURIEDVIALAY-UPA=THROUGHVIAHOLE(導(dǎo)通孔)

B=BURIEDVIAHOLE(埋孔)C=OneLevelLaserBlindVia(雷射盲孔)LASERBLIND&BURIEDVIALAY-UPBURIEDVIA

ANDLASERBLINDVIAOPTION(雷射盲埋孔之選擇)DCCD=TwoLevelLaserVia(雷射盲孔)CDCB-STAGEFR-4CoreRCCFR-4CoreB-STAGERCCABBALASERBLIND&BURIEDVIALAY-UBURIEDVIALAY-UPA=THROUGHVIAHOLE(導(dǎo)通孔)

B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)

D=BLINDHOLEMLBVIA(多層盲孔)BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBARESINB-STAGE

BLINDANDBURIEDVIAOPTION(盲埋孔之選擇)DACC

E=VIAINPAD(VIP)(導(dǎo)通孔在pad裡面)EBURIEDVIALAY-UPA=THROU