SMT相關(guān)知識(shí)培訓(xùn)課件

1、生產(chǎn)力促進(jìn)組Created By:luckfang1SMT Training Material 生產(chǎn)力促進(jìn)組Created By:luckfang2內(nèi)容簡(jiǎn)介WHATS SMT?常用術(shù)語(yǔ)電子元件知識(shí)工藝流程介紹 焊錫膏基礎(chǔ)知識(shí) 助焊劑介質(zhì)(Flux medium) 金屬顆粒 印刷 回流溫度曲線 故障分析 使用注意事項(xiàng)生產(chǎn)力促進(jìn)組Created By:luckfang3WHATS S.M.T?Whats S.M.T.? Surface Mounting Technology S.M.Devices S.M.Assembly S.M.Machine 生產(chǎn)力促進(jìn)組Created By:luckfang

2、4電子元件知識(shí)片式電阻-Chip Resistor片式電容-Chip CapacitorSOT.: Small Outline TransistorSOD.: Small outline Diode鉭電容-Solid tantalum capacitors chips 圓柱體二級(jí)管-MELF排阻-Chip Array Resistor鋁電容-Aluminium electrolytic SMD capacitors 電感- chips Inductors 電源TR-Power Transistor生產(chǎn)力促進(jìn)組Created By:luckfang5電子元件知識(shí)微調(diào)器SOP.: Small Ou

3、tline packageQFP.: Quad Flat PackageTQFP.:Thin Small Outline PackagePLCC.: Plastic leaded Chip CarrierTSOP. : Thin Small Outline PackageCSP. :Chip Scale PackageBGA. : Ball Grid ArrayCONNECTOR生產(chǎn)力促進(jìn)組Created By:luckfang6Chip outline description-元件尺寸Size L*W (inch) Size L*W(mm)0201 0.02*0.01 0503 0.5*0.

4、250402 0.04*0.02 1005 1.0*0.50603 0.06*0.03 1608 1.5*0.760805 0.08*0.05 2012 2.0*1.251206 0.12*0. 06 3216 3.2*1.61210 0.12*0.1 3225 3.2*2.5生產(chǎn)力促進(jìn)組Created By:luckfang7SMD Components Shape-元件外形Chip 0603Solid tantalum capacitors chipsAluminium electrolytic SMD capacitorsSOT23SOT143SOT223SO ICsSOJ ICsPLC

5、C ICsQFP ICsBGA ICs生產(chǎn)力促進(jìn)組Created By:luckfang8Humidity control level-濕度控制等級(jí)(LEVEL defined by IPC/JEDEC J-STD-020)Level Temp./Humidity Exposure time 1 =30 degree/85% Unlimited 2 =30 degree/60% 1Year 2a =30 degree/60% 4Weeks 3 =30 degree/60% 1Week 4 =30 degree/60% 72Hrs.(3d.) 5 =30 degree/60% 48Hrs. 5a

6、=30 degree/60% 24Hrs. 6 Devices required baking before use,once baked,must be reflowed within 6 Hrs.生產(chǎn)力促進(jìn)組Created By:luckfang9SMT process flowchart-工藝流程生產(chǎn)力促進(jìn)組Created By:luckfang10SMT 常用術(shù)語(yǔ)PCB-Print Circuit Board 印刷電路板ESD-Electrostatic Sensitive Devices靜電放電PPM-Defects per Million 每百萬(wàn)的壞點(diǎn)SPC-Statistic P

7、rocess Control-過(guò)程統(tǒng)計(jì)分析Iron-電烙鐵Hot Air Reflowing Noozle-熱風(fēng)嘴Tin Extractor-吸錫器Soldering Wick-吸錫帶Post-Soldering Inspection-焊后檢驗(yàn)Visual Inspection-目視檢驗(yàn)生產(chǎn)力促進(jìn)組Created By:luckfang11SMT 常用術(shù)語(yǔ)AOI-Automated Optical Inspection自動(dòng)光學(xué)檢查AXI,Automated X-ray Inspection-自動(dòng)X射線檢查Soldering Joint Quality-焊點(diǎn)質(zhì)量Soldering Joint D

8、efect-焊點(diǎn)缺陷Solder Wrong-錯(cuò)焊Solder Skips-漏焊Pseudo Soldering-虛焊Cold Soldering-冷焊Solder Bridge-橋焊Open soldering-脫焊生產(chǎn)力促進(jìn)組Created By:luckfang12SMT 常用術(shù)語(yǔ)Solder-Off-焊點(diǎn)剝離Solder Nonwetting-不濕潤(rùn)焊點(diǎn)Soldering Balls-錫珠Icicle/Solder Projection-拉尖Void-孔洞Solder Wicking-焊料爬越Overheated Solder Connection-過(guò)熱焊點(diǎn)生產(chǎn)力促進(jìn)組Created

9、By:luckfang13SMT 常用術(shù)語(yǔ)Insufficient Solder Connection-不飽和焊點(diǎn)Excess Solder Connection-過(guò)量焊點(diǎn)Flux Residue-助焊劑剩余Solder Crazeing(Tearing)-焊料裂紋Fillet-Lifting,Lift-Off-焊角翹離Loader-上板機(jī)Unloader-下板機(jī)Dispenser-滴涂器,點(diǎn)膠機(jī)生產(chǎn)力促進(jìn)組Created By:luckfang14SMT 常用術(shù)語(yǔ)Vacuum Pick & Place Tool-真空吸筆Place Machine,Pick & Place Machine,C

10、hip Mounter,Chip Shooter-貼片機(jī)Wave Soldering Systems-波峰焊機(jī)Reflow Soldering Systems,Reflow Oven-再流焊爐Self-Alignment-自定位Skewing-位移生產(chǎn)力促進(jìn)組Created By:luckfang15SMT 常用術(shù)語(yǔ)Tomb Stone-立碑Flying-掉片ICT,In Circuit Testing-在線測(cè)試FT,Functional Testing-功能測(cè)試Rework Station-返工工作臺(tái)Cleaning Systems-清洗機(jī)生產(chǎn)力促進(jìn)組Created By:luckfang1

11、6焊錫基本知識(shí)助焊劑介質(zhì)(Flux medium) 金屬顆粒生產(chǎn)力促進(jìn)組Created By:luckfang17 合金: 合金是兩種或兩種以上的金屬形成的化合物,焊錫膏技術(shù)中所含的金屬成份通常為: 錫(Sn),鉛(Pb),銀(Ag),銅(Cu)生產(chǎn)力促進(jìn)組Created By:luckfang18軟焊接 無(wú)金屬熔融結(jié)合 金屬鍵化合物(intermetallic layer) Cu3SnTin/lead 63/37 alloyCu3Sn and Cu6Sn5 IntermetallicFlux layer生產(chǎn)力促進(jìn)組Created By:luckfang19普通的焊盤材料銅及其合金電鍍銅,黃銅

12、,青銅有機(jī)鍍膜焊盤(OSP)鎳及其合金鐵鎳鈷合金銀和金生產(chǎn)力促進(jìn)組Created By:luckfang20CU 焊盤Gold over nickle pads阻焊膜典型多層FR4 PCBSn or Ag pads生產(chǎn)力促進(jìn)組Created By:luckfang21PCB raw material-PCB原材料MaterialBrand referencePCB technologyUtilizationThickness(mm)Phenolic paper laminateFR1, FR2 *Standard(Single or double sided)TV chassisSimple

13、modules1.6 0.14 1.5 0.141.2 0.1Polyester glass laminateCEM3 T Standard(Single or double sided)Tuners1.2 0.11.0 0.1Epoxy paper/glass laminateCEM1StandardSingle or double sidedSPTHHigh end TV chassisModules1.6 0.14 1.5 0.14Epoxy glass laminateFR4DSPTHMultilayers (4 to 6)TunerHigh end modules & TV chas

14、sis, chassis for digital productsChassis & modulesfor digital products1.0 10%1.5 10%1.6 10%1.6 10%生產(chǎn)力促進(jìn)組Created By:luckfang22 基材 金屬鍵化合物Cu Cu6Sn5 Ag Ag3SnAu AuSn4 Ni Ni3Sn4 焊接:生產(chǎn)力促進(jìn)組Created By:luckfang23焊點(diǎn)的截面圖(Sn63/Pb37 錫膏與銅)生產(chǎn)力促進(jìn)組Created By:luckfang24錫膏是將錫粉顆粒與介質(zhì)(Flux medium)充分混合所形成的一種膏狀物質(zhì),這種膏狀物質(zhì)具有可印

15、刷或點(diǎn)滴的能力.什么是錫膏?生產(chǎn)力促進(jìn)組Created By:luckfang25 錫膏主要成分 錫粉顆粒金屬(合金) 助焊劑介質(zhì)(Flux Medium) 活性劑 松香,樹(shù)脂 粘度調(diào)整劑 溶劑生產(chǎn)力促進(jìn)組Created By:luckfang26合金選擇指南PCBA常用錫膏合金 合金 代號(hào) 熔點(diǎn) 備注Sn/PbSn63183* 通 用 型Sn/Pb/AgSn62179* 通 用 型 含 銀 錫 膏Sn/Pb/Ag63S4179-183防 立 碑 特 色 錫 膏Sn/AgSn96221* 無(wú) 鉛, Lead FreeSn/Ag/Cu99C227* 無(wú) 鉛, Lead FreeSn/Ag/Cu9

16、6Sc217* 無(wú) 鉛, Lead Free* 最 低 共 熔 點(diǎn) (eutectic)生產(chǎn)力促進(jìn)組Created By:luckfang27液相圖共熔點(diǎn)生產(chǎn)力促進(jìn)組Created By:luckfang28助焊劑生產(chǎn)力促進(jìn)組Created By:luckfang29 介質(zhì)選擇指南介質(zhì)系列 特性描述CR系列:標(biāo)準(zhǔn)通用型,殘留物透明,高活性,印刷速度100mm/secRP系列:高速印刷,高活性,印刷速度150-200mm/secMP系列:高速印刷,可飛針測(cè)試,可用于封閉式印刷,免清洗RM系列:標(biāo)準(zhǔn)通用型,已被逐步替代RMA系列:中度天然樹(shù)脂,活性極高,殘留較嚴(yán)重生產(chǎn)力促進(jìn)組Created By:

17、luckfang30介質(zhì)類型合金類型顆粒尺寸金屬含量CR32Sn62,Sn63,63S4AGS,Type389.5%96SC,96S,97SC (Pb-free)AGS,Type388%,88.5%CR37Sn62,Sn63AGS,Type390%,89.5%63S4 (Anti-tombstone)DAD,Type489.5%MP100Sn62,Sn63AGS,Type389.5%,90%63S4 (Anti-tombstone)ACS,Type489.5%90%MP200Sn62,Sn63,63S4AGS,Type390%RP11Sn60,Sn62,Sn63AGS,Type389%,89.

18、5%,90%RP15Sn60,Sn62,Sn63AGS,Type389%,90%63S4 (Anti-tombstone)ACS,Type489.5% 介質(zhì)選擇指南生產(chǎn)力促進(jìn)組Created By:luckfang31助焊劑介質(zhì)的功能錫粉顆粒的載體. 提供合適的流變性和濕強(qiáng)度. 有利于熱量傳遞到焊接區(qū).降低焊料的表面張力.防止焊接時(shí)焊料和焊接表面的再氧化.去處焊接表面及錫粉顆粒的氧化層.在焊接點(diǎn)表面形成保護(hù)層和安全的殘留物層.生產(chǎn)力促進(jìn)組Created By:luckfang32助焊劑決定的焊錫膏特性活性流變性印刷和濕強(qiáng)度的特性殘留的特性生產(chǎn)力促進(jìn)組Created By:luckfang33助

19、焊劑介質(zhì)的組成天然樹(shù)脂(Rosin) /合成松香(Resin)溶劑(Solvents)活性劑(Activators)增稠劑(Rheology modifiers)生產(chǎn)力促進(jìn)組Created By:luckfang34助焊劑（Flux medium）通常松香含量 - 50-70%活性劑（通常是鹵素） 1-5%溶劑 2030%增稠劑 3-6%生產(chǎn)力促進(jìn)組Created By:luckfang35 錫粉顆粒生產(chǎn)力促進(jìn)組Created By:luckfang36錫粉顆粒直徑代碼:代碼 直徑BAS75-53umAAS53-38umABS53-25umAGS (AGD)45-20um (Type 3)DA

20、S 38-25umDAD38-20um (Type 4)ACS45-10um-20-10um (Type 5)生產(chǎn)力促進(jìn)組Created By:luckfang37 錫粉的生產(chǎn)（舊技術(shù)）溶融的合金N2N2過(guò)大的尺寸過(guò)小的尺寸有用的錫粉噴霧頭篩網(wǎng) （渦輪絲網(wǎng)）生產(chǎn)力促進(jìn)組Created By:luckfang38錫粉的生產(chǎn)（新技術(shù)）溶解的合金N2N2過(guò)大的尺寸過(guò)小的尺寸有用的錫粉篩網(wǎng) （超聲波型）超聲波噴霧器生產(chǎn)力促進(jìn)組Created By:luckfang39錫粉尺寸分布(AGS)45-20 microns= AGS生產(chǎn)力促進(jìn)組Created By:luckfang40球形錫粉顆粒WidthL

21、ength球形長(zhǎng)/寬比 1.5 Multicore規(guī)格:球形顆粒=95% minimum生產(chǎn)力促進(jìn)組Created By:luckfang41非球形錫粉顆粒Distorted Spheres“Dog bones” or irregular生產(chǎn)力促進(jìn)組Created By:luckfang42stencilPCB baseSolder PowderIrregular Shape Powder生產(chǎn)力促進(jìn)組Created By:luckfang43小顆粒錫粉優(yōu)點(diǎn)提高細(xì)間距焊盤的印刷性能提高耐坍塌性能提高濕強(qiáng)度增加潤(rùn)濕/活化面積局限錫粉顆粒被氧化的幾率增加錫珠缺陷的發(fā)生幾率增加生產(chǎn)力促進(jìn)組Create

22、d By:luckfang44顆粒的大小與印刷間距生產(chǎn)力促進(jìn)組Created By:luckfang45顆粒的大小與印刷間距Metal maskSolder Powder7553m / 0.625mm3853m / 0.40.5mm2045m / 0.3mm1038m / 0.3mm生產(chǎn)力促進(jìn)組Created By:luckfang46金屬含量選指南金屬含量增高錫珠濺出可能性降低粘度增加,印刷性能降低方式 金屬含量刮板印刷88%-90%針筒式點(diǎn)膏83%-86%移針印83%-85%生產(chǎn)力促進(jìn)組Created By:luckfang47錫膏測(cè)試每個(gè)批號(hào)的錫膏和其組成部分，在供給客戶前都經(jīng)過(guò)20至3

23、0次的測(cè)試可以確保任何一種錫膏的每個(gè)批號(hào)的所有組成部分都可追述性錫膏，錫粉和助焊劑媒體的留樣期為兩年生產(chǎn)力促進(jìn)組Created By:luckfang48 焊錫膏印刷工藝生產(chǎn)力促進(jìn)組Created By:luckfang49DEK260 半自動(dòng)印刷機(jī)生產(chǎn)力促進(jìn)組Created By:luckfang50PressureSpeedPrint-gap (on contact)印刷生產(chǎn)力促進(jìn)組Created By:luckfang51SpeedRoll印刷生產(chǎn)力促進(jìn)組Created By:luckfang52Separation SpeedDrop-off印刷生產(chǎn)力促進(jìn)組Created By:luc

24、kfang53印刷時(shí)錫膏形成滾動(dòng)印刷生產(chǎn)力促進(jìn)組Created By:luckfang54刮刀聚氨脂,橡膠不銹鋼二者有什么不同?生產(chǎn)力促進(jìn)組Created By:luckfang55刮刀生產(chǎn)力促進(jìn)組Created By:luckfang56不同的刮刀效果不同生產(chǎn)力促進(jìn)組Created By:luckfang57 材料黃銅不銹鋼鎳塑料材料 網(wǎng)孔化學(xué)蝕刻激光切割電鍍縮小10%網(wǎng)板生產(chǎn)力促進(jìn)組Created By:luckfang58蝕刻后凹凸不平上下開(kāi)口不一致有唇的錐形開(kāi)口,表面光滑錐形開(kāi)口網(wǎng)板開(kāi)孔化學(xué)腐蝕法激光切割激光切割并電鍍生產(chǎn)力促進(jìn)組Created By:luckfang59激光切割并電鍍

25、化學(xué)蝕刻激光切割不同網(wǎng)板的效果不同生產(chǎn)力促進(jìn)組Created By:luckfang60使用環(huán)境溫度：22C28C濕度：4060 Why?溫度過(guò)高,過(guò)早失去活性溫度過(guò)低,粘度過(guò)大,不利于印刷濕度過(guò)高,吸潮,濺錫濕度過(guò)低,溶劑揮發(fā) 環(huán)境生產(chǎn)力促進(jìn)組Created By:luckfang61添加錫膏的方法生產(chǎn)力促進(jìn)組Created By:luckfang62添加錫膏的方法錫漿開(kāi)蓋手工攪拌30秒,每秒2圈,方向一致每次添加量以半小時(shí)生產(chǎn)用量為準(zhǔn)生產(chǎn)力促進(jìn)組Created By:luckfang63印刷參數(shù)控制速度（Speed）壓力（Pressure）印刷間隙（Print gap）分離速度（Separ

26、ation speed）網(wǎng)板底部的清潔頻率溫度和濕度生產(chǎn)力促進(jìn)組Created By:luckfang64平行度(Parallel)PCB與網(wǎng)板接觸(contact)將網(wǎng)板刮干凈的最小壓力即可，取決于刮刀速度焊錫膏流變性和新鮮度刮刀類型,角度和鋒利程度刮刀速度優(yōu)化設(shè)置參數(shù)設(shè)置生產(chǎn)力促進(jìn)組Created By:luckfang65使用注意事項(xiàng)冷藏儲(chǔ)存于5-10Why?保持助焊劑活性-低溫避免錫膏結(jié)晶-不可冷凍 生產(chǎn)力促進(jìn)組Created By:luckfang66使用注意事項(xiàng)錫膏從冰箱取出后回溫5-8小時(shí)至室溫才可使用Why?低溫時(shí)粘度過(guò)高,印刷性能差錫膏內(nèi)部吸潮生產(chǎn)力促進(jìn)組Created By

27、:luckfang67使用注意事項(xiàng)用塑料器具,手工攪拌30秒,每秒2圈,方向一致Why?防止助焊劑分層避免刮傷塑料儲(chǔ)存罐避免劃傷錫粉顆粒降低粘度生產(chǎn)力促進(jìn)組Created By:luckfang68使用注意事項(xiàng)及時(shí)清除殘留錫膏,不可將新舊錫膏放在同一儲(chǔ)存罐中why?錫膏中溶劑會(huì)揮發(fā),導(dǎo)致粘度過(guò)高印刷質(zhì)量下降表面氧化可能性增加生產(chǎn)力促進(jìn)組Created By:luckfang69回流焊工藝生產(chǎn)力促進(jìn)組Created By:luckfang70SEHO 6440 3.6 熱風(fēng)對(duì)流式回流爐Machine located in MSM Ipoh Tech. Centre生產(chǎn)力促進(jìn)組Created By

28、:luckfang71貼片生產(chǎn)力促進(jìn)組Created By:luckfang72回流焊生產(chǎn)力促進(jìn)組Created By:luckfang73回流焊生產(chǎn)力促進(jìn)組Created By:luckfang74回流焊生產(chǎn)力促進(jìn)組Created By:luckfang75回流焊生產(chǎn)力促進(jìn)組Created By:luckfang76錫膏的回流焊是實(shí)際的焊接過(guò)程通常使用爐子來(lái)完成回流爐一般是紅外型或者對(duì)流型回流爐環(huán)境有空氣和氮?dú)猸h(huán)境此外，溫度可編程的方法也可以使用生產(chǎn)力促進(jìn)組Created By:luckfang77理想化的回流曲線生產(chǎn)力促進(jìn)組Created By:luckfang78什么是理想的曲線？在大多

29、數(shù)情況下回流曲線受限于PCB板和器件以及回流爐的能力現(xiàn)在的錫膏都能在不同的曲線下工作無(wú)論如何，確定一個(gè)理想的曲線可以便于分析錫膏的應(yīng)用生產(chǎn)力促進(jìn)組Created By:luckfang79為什么要使用回流曲線?焊接是一個(gè)化學(xué)反應(yīng)過(guò)程為了得到一致的結(jié)果，過(guò)程必須被監(jiān)督不同的PCB類型有不同的導(dǎo)熱需求不同的回流爐的表現(xiàn)各不相同，并且可能時(shí)時(shí)刻刻都有所變化生產(chǎn)力促進(jìn)組Created By:luckfang80為什么要使用回流曲線?分析過(guò)程實(shí)現(xiàn)過(guò)程控制確保一致發(fā)現(xiàn)變化趨勢(shì)適當(dāng)?shù)恼{(diào)整可用的最大和最小曲線生產(chǎn)力促進(jìn)組Created By:luckfang81操作窗口（舉例）生產(chǎn)力促進(jìn)組Created By

30、:luckfang82如何做回流曲線？生產(chǎn)力促進(jìn)組Created By:luckfang83如何做回流曲線？使用專用的設(shè)備類似SoldaPro，Slimline SoldaPro Oracle，ECD-SuperMOLE，DATApaq，KIC使用熱點(diǎn)偶測(cè)試不同器件和不同區(qū)域的溫度高密度或大器件低密度或小器件溫度敏感器件被測(cè)板和測(cè)試設(shè)備一起通過(guò)回流爐后，下載數(shù)據(jù)至計(jì)算機(jī)或者打印機(jī)上生產(chǎn)力促進(jìn)組Created By:luckfang84SoldaPro小器件區(qū)域大器件區(qū)域溫度敏感型器件用高溫焊錫絲固定器件和熱電偶生產(chǎn)力促進(jìn)組Created By:luckfang85經(jīng)過(guò)回流爐生產(chǎn)力促進(jìn)組Crea

31、ted By:luckfang86下載數(shù)據(jù)至計(jì)算機(jī)生產(chǎn)力促進(jìn)組Created By:luckfang87典型的回流曲線生產(chǎn)力促進(jìn)組Created By:luckfang88回流曲線手冊(cè)生產(chǎn)力促進(jìn)組Created By:luckfang89第一升溫區(qū)生產(chǎn)力促進(jìn)組Created By:luckfang90第一升溫區(qū)目的是加熱溫度至預(yù)熱區(qū)受限于PCB和器件 （熱沖擊）在區(qū)域的末端會(huì)有爆發(fā)性的氣體在錫膏內(nèi)產(chǎn)生（激光焊接）上升斜率一般為13oC/s生產(chǎn)力促進(jìn)組Created By:luckfang91預(yù)熱區(qū)生產(chǎn)力促進(jìn)組Created By:luckfang92預(yù)熱區(qū)預(yù)熱區(qū)的作用是使得板上所有的區(qū)域和器件

32、在回流前都達(dá)到相似的溫度。先進(jìn)的爐子可以做到降低或減少回流曲線的“平臺(tái)”。焊錫膏沒(méi)有特別的活化溫度，然而一旦活化劑在溶化的樹(shù)脂中融化或溶解，則其開(kāi)始發(fā)生作用生產(chǎn)力促進(jìn)組Created By:luckfang93預(yù)熱區(qū)松香在70- 120C 之間開(kāi)始變軟直到流體化學(xué)的一個(gè)簡(jiǎn)單的規(guī)律：溫度升高使得反應(yīng)速度加快在預(yù)熱區(qū)（有氧回流），氧化將發(fā)生在暴露的金屬表面生產(chǎn)力促進(jìn)組Created By:luckfang94回流區(qū)生產(chǎn)力促進(jìn)組Created By:luckfang95回流區(qū)焊點(diǎn)形成過(guò)程.焊接區(qū)溫度超過(guò)合金的熔點(diǎn).較高的溫度會(huì)降低焊點(diǎn)表面的張力.同時(shí)，較高的溫度也會(huì)增加表面氧化，使助焊劑變色。PCB

33、和器件也可能因此而損壞理想的回流最高點(diǎn)應(yīng)在液相線上加30-40C （無(wú)鉛錫膏的液相線在210-220C） 并超過(guò)熔點(diǎn)30-60秒生產(chǎn)力促進(jìn)組Created By:luckfang96冷卻區(qū)（焊料凝固）生產(chǎn)力促進(jìn)組Created By:luckfang97冷卻區(qū)快速的冷卻能得到光亮的焊點(diǎn)慢速冷卻，焊點(diǎn)表面會(huì)粗糙無(wú)光。極端情況則可能導(dǎo)致強(qiáng)度降低在健康和安全的前提下，PCB的冷卻應(yīng)盡可能的快。這樣可以確保熔化的同時(shí)沒(méi)有焊點(diǎn)被攪亂。生產(chǎn)力促進(jìn)組Created By:luckfang98焊膏回流時(shí)的狀態(tài)室溫刷膠點(diǎn)穩(wěn)定-助焊劑連接著焊錫顆粒。90oC樹(shù)脂變?nèi)彳浫軇┳饔糜跇?shù)脂膠裝結(jié)構(gòu)開(kāi)始分解生產(chǎn)力促進(jìn)組Cr

34、eated By:luckfang99常見(jiàn)故障分析生產(chǎn)力促進(jìn)組Created By:luckfang100印刷缺陷生產(chǎn)力促進(jìn)組Created By:luckfang101助焊劑外溢生產(chǎn)力促進(jìn)組Created By:luckfang102壓力過(guò)大的壓力可能會(huì)導(dǎo)致 助焊劑外溢 成型不良 錫珠 增加網(wǎng)板清洗頻率過(guò)低的壓力將導(dǎo)致 網(wǎng)板印刷不干凈 成型不良 少錫 漏印生產(chǎn)力促進(jìn)組Created By:luckfang103壓力過(guò)大Flux bleed“Scooping”生產(chǎn)力促進(jìn)組Created By:luckfang104壓力過(guò)小網(wǎng)板印刷不干凈“Dog ears”生產(chǎn)力促進(jìn)組Created By:lu

35、ckfang105底部支撐不足底部支撐不足不能通過(guò)加大壓力來(lái)改善這樣做的結(jié)果將是印刷質(zhì)量不合格和網(wǎng)板的損壞增加底部的支撐點(diǎn)以確保PCB和網(wǎng)板的緊密的接觸生產(chǎn)力促進(jìn)組Created By:luckfang106底部支撐不足網(wǎng)板留在網(wǎng)上的錫膏生產(chǎn)力促進(jìn)組Created By:luckfang107刮刀損壞造成的問(wèn)題生產(chǎn)力促進(jìn)組Created By:luckfang108印刷間隙問(wèn)題印刷通常是0間隙降低印刷污染和助焊劑的外溢厚阻焊層或者絲印層會(huì)阻礙無(wú)縫隙印刷如果絲網(wǎng)設(shè)備沒(méi)有正確校準(zhǔn)，印刷間隙可能大于0，這會(huì)導(dǎo)致印刷不好和網(wǎng)板的損害生產(chǎn)力促進(jìn)組Created By:luckfang109阻焊膜層過(guò)厚Print gap 4小時(shí))控制操作環(huán)境(20-30 C and 40-60 RH)使用塑料器具及時(shí)報(bào)廢不得混用生產(chǎn)力促進(jìn)組Created By:luckfang137問(wèn)題？樹(shù)立質(zhì)量法制觀念、提高全員質(zhì)量意識(shí)。7月-227月-22Saturday, July 23, 2022人生得意須盡歡，莫使金樽空對(duì)月。01:11:1601:11:1601:117/23/2022 1:11:16 AM安全象只弓，不拉它就松，要想保安全，常把弓弦繃。7月-2201:11:1601:11Jul-2223-Jul-22加強(qiáng)交通建設(shè)管理，確保工程建設(shè)質(zhì)量。01:1