CCM產(chǎn)品工藝知識(shí)培知識(shí)（課堂PPT）

1、Prepare by: civvy chenPrepare by: civvy chen2o 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用o 產(chǎn)品的類型產(chǎn)品的類型o 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造o 產(chǎn)品的制作工藝產(chǎn)品的制作工藝o 問與答問與答o 附錄附錄:專業(yè)名詞介紹專業(yè)名詞介紹Prepare by: civvy chen3Part I 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用Prepare by: civvy chen4Part I 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用拆解拆解Prepare by: civvy chen5Part II 產(chǎn)品的類型產(chǎn)品的類型 軟板定焦模式(FF) 1. B-To-B 2.Gold FingerPrepare by: civv

2、y chen6Part II 產(chǎn)品的類型產(chǎn)品的類型 軟板變焦模式 1.手動(dòng)變焦(MF) 2.自動(dòng)變焦(AF)Prepare by: civvy chen7Part II 產(chǎn)品的類型產(chǎn)品的類型 插槽模式(Socket)Prepare by: civvy chen8Part II 產(chǎn)品的類型產(chǎn)品的類型 像素分類 CIF (352*288) 10萬像素 (0.1M) VGA (640*480) 30萬像素 (0.3M) SXGA (1280*1024) 130萬像素 (1.3M) UXGA (1600*1200) 200萬像素 (2.0M)Prepare by: civvy chen9Part II

3、I 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 CSP (Chip Scale Package)ChipLensBarrelHolderIR FilterstiffenerFPCSolder BallGlassPrepare by: civvy chen10Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 COB (Chip On Board)ChipLensBarrelHolderIR FilterFingerGold WireFPCPCBPrepare by: civvy chen11Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造鏡頭鏡頭(Lens)鏡座鏡座(Holder)芯片芯片(Chip)電路板電路板(PCB)連接器連接器(

4、Con.)Prepare by: civvy chen12Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造CMOS CHIPLENS HOLDERLENS BARRELThese 3 items come as an assembly1st LENS ELEMENT2nd LENS ELEMENTIR GLASSSUBSTRATEFPCPrepare by: civvy chen13Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 材料 1. 晶圓(Wafer) 主要是由硅和鍺組成,是攝像頭模組的核心部分,稱之為影像傳感器。Prepare by: civvy chen14Part IV 產(chǎn)品的制作工藝產(chǎn)品的

5、制作工藝 2. 線路板 Printed Circuit Board印刷電路板,是電子元器件的支撐體,是電子元器件電氣連接的提供者,簡(jiǎn)稱PCB.Prepare by: civvy chen15Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 3. 鏡座(Holder) Prepare by: civvy chen16Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 4. 鏡頭(Lens)Prepare by: civvy chen17Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 5. 軟板(FPC) Flexible Circuit Board軟性印制電路是以聚酰亞胺或聚酯薄膜為基材制成的一種具有高度可

6、靠性絕佳的可撓性印刷電路。Prepare by: civvy chen18Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 工藝流程 Wafer清洗Plasma清洗固晶固晶烘烤邦線金線檢查DAM邦定DAM烘烤二流體清洗CCD檢查Glass貼附CCD檢查固化半成品測(cè)試Prepare by: civvy chen19ProcessSupply WaferTrayOKOKOKOKN/AOKN/AOKIR Glass Attach ProcessCM800Barrel Insert ProcessCM800dispenseCMOS ChipdispenseIR Glassdispense+Lens Bar

7、relDie Attach ProcessCM800Holder Attach ProcessCM800Prepare by: civvy chen20Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝Die Bonding:使芯片 與PCB粘合。注意點(diǎn)：1.芯片方向 2.膠量 3.頂針和吸嘴印 4.芯片角度 5.芯片位置 6.芯片傾斜 Prepare by: civvy chen21Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝Wire Bonding: 通過金線焊接使芯片與PCB線路導(dǎo)通。注意點(diǎn)：1.接線是否正確 2. 線弧 3.金球大小 4.金球厚度 5.金線拉力 6.金球推力 Prepare

8、by: civvy chen22Solder PasteScreen PrintPassive PlacementForDie AttachPassiveSolder PastePassiveSubstratePrepare by: civvy chen23Die AttachWire BondingWet CleanChipSensorAreaAu WireChipSensorAreaAu WirePrepare by: civvy chen24IR Glass MountIR Glass SAWWaferRingIRGlassIRGlassPrepare by: civvy chen25G

9、lue DispenseIR Glass AttachHolderHolderGlueGlueIR cut GlassIRGlassPrepare by: civvy chen26Glue DispenseHolder AttachGlueGlueBarrel InsertBarrelHolderPrepare by: civvy chen27SinglationcutcutPrepare by: civvy chen28Focus adjustBarrelBarrel FixationMotorLighting（Percolation Method)chartAchromatic LensN

10、D4（Adjustment of Light Quantity）LaserPrepare by: civvy chen29Part V 問與答問與答Prepare by: civvy chen30Part VI 專業(yè)名詞介紹專業(yè)名詞介紹Prepare by: civvy chen31Prepare by: civvy chen32Bonding ProcessPrepare by: civvy chen33Free air ball is captured in the chamferPrepare by: civvy chen34Free air ball is captured in th

11、e chamferSEARCH HEIGHTPrepare by: civvy chen35Free air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 1Prepare by: civvy chen36Free air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 1Prepare by: civvy chen37Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1Prepare by:

12、 civvy chen38Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1Prepare by: civvy chen39Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1Prepare by: civvy chen40Formation of a first bondSEARCH SPEED1SEARCH TOL 1Prepare by: civvy chen41Formation of a first bondSEARCH SPE

13、ED1SEARCH TOL 1IMPACT FORCEPrepare by: civvy chen42Formation of a first bondContact Prepare by: civvy chen43Formation of a first bondBase Prepare by: civvy chen44Capillary rises to loop height positionPrepare by: civvy chen45Capillary rises to loop height positionPrepare by: civvy chen46Capillary ri

14、ses to loop height positionPrepare by: civvy chen47Capillary rises to loop height positionPrepare by: civvy chen48Capillary rises to loop height positionPrepare by: civvy chen49Capillary rises to loop height positionPrepare by: civvy chen50Formation of a loopRD (Reverse Distance)Prepare by: civvy ch

15、en51Formation of a loopPrepare by: civvy chen52Prepare by: civvy chen53Calculated Wire LengthWIRE CLAMP CLOSEPrepare by: civvy chen54Calculated Wire LengthPrepare by: civvy chen55SEARCH DELAYPrepare by: civvy chen56TRAJECTORYPrepare by: civvy chen57TRAJECTORYPrepare by: civvy chen58TRAJECTORYPrepare

16、 by: civvy chen59TRAJECTORYPrepare by: civvy chen60TRAJECTORYPrepare by: civvy chen61TRAJECTORYPrepare by: civvy chen62TRAJECTORYPrepare by: civvy chen63TRAJECTORYPrepare by: civvy chen64TRAJECTORYPrepare by: civvy chen65TRAJECTORYPrepare by: civvy chen662nd Search HeightSearch Speed 2Search Tol 2Prepare by: civvy chen67Search Speed 2Search Tol 2Prepare by: civvy chen68Search Speed 2Search Tol 2Prepare by: civvy chen69Formation of a second bondPrepare by: civvy chen70Formation of a second bondContactPrepare by: civvy chen71Prepare by: civvy chen72Prepare by: civvy c