中英對(duì)照PCB專業(yè)術(shù)語(yǔ).doc

中英對(duì)照PCB專業(yè)術(shù)語(yǔ)azoic preflux偶氮類預(yù)焊劑 azeotropic mixture共沸混合物，恒沸物 azeotrope共沸混合液 xial pin package軸向引針?lè)庋b axial part軸向零件 axiallead軸向引線(腳) AWG equivalent等效AWG AVL認(rèn)可的供貨商，合格供貨方 availability factor可用率 availability供應(yīng)能力，供貨能力 auxiliary cathode輔助陰極 auxiliary anode輔助陽(yáng)極 autotest program自動(dòng)檢測(cè)程序 autotest program自動(dòng)檢測(cè)程序 autoregistration自對(duì)準(zhǔn) autoregistered channel contact自對(duì)準(zhǔn)溝道接觸 autoplotter自動(dòng)繪圖儀 automatic X-ray inspection自動(dòng)X射線檢查 automatic testing equipment ( ATE)自動(dòng)電測(cè)設(shè)備 automatic plotting自動(dòng)繪圖 automatic optical inspection( AOI)自動(dòng)光學(xué)檢測(cè) automatic laser test自動(dòng)激光測(cè)試 automatic data-processing system自動(dòng)數(shù)據(jù)處理系統(tǒng) automatic control system自動(dòng)控制系統(tǒng) automatic conduction routing自動(dòng)布線 automatic component placement自動(dòng)配置元件 automated test generation測(cè)試自動(dòng)生成 automated test equipment自動(dòng)測(cè)試設(shè)備 automated quality solutions (AQS)自動(dòng)化質(zhì)量解決器 automated dimensioning自動(dòng)標(biāo)注尺寸 automated conductor routing自動(dòng)導(dǎo)體布設(shè) automated component placement自動(dòng)元件布局 automated component insertion自動(dòng)元件插裝 autoclave type vacuum press高壓釜型真空壓機(jī) autoclave壓力鍋 autocalytic plating化學(xué)鍍(自催化鍍) Au-Pt paste金鉑導(dǎo)電膏 auger electron spectroscopy(AES)俄歇電子光譜法 aueptance允收 attributes data計(jì)數(shù)數(shù)據(jù) attenuation信號(hào)衰減 attachment by low melting alloy低熔點(diǎn)合金焊接法 atmosphere corrosion大氣腐蝕 ATE自動(dòng)電測(cè)設(shè)備 asymetric stripline不對(duì)稱帶狀線 A-stage resinA 階樹(shù)脂 A-stageA 階段 assembly drawing裝配圖 assembly aided architectural design(AAAD)組裝設(shè)計(jì)自動(dòng)化 assembly組裝 assembled drawing組裝圖 assembled組裝件 as received到貨，收貨 aspect ratio縱橫比 ASIC專用集成電路 as-fired燒結(jié)態(tài) artwork master照相原版 artwork照相底圖 arrow diagram矢量圖 array splice陣列熔接 array陣列 aromatic polyamide paper聚芳酰胺纖維紙 argon arc welding氫弧焊 area opening開(kāi)孔面積 arer array tape automated bonding面陣帶式自動(dòng)接合 area array package (AAP)面積陣列封裝(元件) arc resistance耐電弧性 arc discharge電弧放電 aramid fiber聚散膠纖維 aramid聚酰胺樹(shù)脂 aquus flux水溶性助焊劑 aqueous cleaning水清洗 AQS自動(dòng)化質(zhì)量解決器 AQL可接收質(zhì)量等級(jí) approved vendor list ( AVL)認(rèn)可的供貨商，合格供貨方 application specific integrated circuit(ASIC)專用集成電路 application specific integrated circuit(ASIC)專用集成電路 aperture turret同心圓 apertures開(kāi)口，鋼版開(kāi)口，光束出口 AOM激光光路開(kāi)關(guān) AOI自動(dòng)光學(xué)檢測(cè) any layer inner via hole ( ALIVH)任意層內(nèi)導(dǎo)通孔 anti-tracking coating保護(hù)涂層 antistatic paint防靜電涂料 anti-pit agent抗凹劑 anti-pad隔離環(huán) antioxidant抗氧化劑 antimutagen抗誘變劑 antimony free脫銷素 anti-foapting agent消泡劑 antennaANSI美國(guó)標(biāo)準(zhǔn)協(xié)會(huì) anodizing陽(yáng)極氧化 anodized dielectric film陽(yáng)極氧化介質(zhì)膜 anodization陽(yáng)極處理 anodic polarization陽(yáng)極極化 anodic oxidization or anodization陽(yáng)極氧化 anodic coating陽(yáng)極鍍層 anodic cleaning陽(yáng)極清洗 anodically-grown tantalum-oxide film陽(yáng)極生長(zhǎng)鈕氧化物膜 anode sludge陽(yáng)極泥 anode slime陽(yáng)極殘?jiān)?anode sintering陽(yáng)極燒結(jié) anode coating陽(yáng)極鍍層 anode陽(yáng)極 annular width連接盤(pán)寬度 annular ring孔環(huán) annular pad環(huán)形盤(pán) annotation注解，標(biāo)記，注釋 annealing退火 annealed copper foil退火銅結(jié) anneal韌化 anisotropic etching單向蝕刻，各向異性蝕刻 anisotropic conductive film connection(ACFC)單向?qū)щ娔ぐ惭b，各向異性導(dǎo)電膜連接 anisotropic conductive contact單向?qū)щ娊佑|，各向異性導(dǎo)電接觸 anisotropic conductive adhesives單向?qū)щ婐そY(jié)劑，各向異性導(dǎo)電黏結(jié)劑 angstrom unit埃單位 angle rotor角轉(zhuǎn)頭 angle of contact接觸角 angle of attack刮印角 angled bond角形連接 anchoring spurs著力盤(pán)趾 anchoring spur盤(pán)趾 anchoring spur盤(pán)趾 analyzer分析器，分析儀，檢偏振器 analytical ultracentrifuge分析超離心機(jī) analysis of covariance協(xié)方差分析 analog circuit模擬電路 amplitude電壓幅度 amp-hour安培小時(shí) amperometric titration電流滴定 ampere安培) amorphous thin film非晶薄膜 amorphous thin film非晶薄膜 amorphous semiconductor material非晶半導(dǎo)體材料 amorphous polymer無(wú)定形聚合物 amorphous metal mesh非晶金屬網(wǎng) (ANSI)美國(guó)標(biāo)準(zhǔn)協(xié)會(huì) amberlite合成樹(shù)脂 amalgam gold plating柔齊鍍金 amalgamation汞齊化 AM感音成像顯微鏡 aluminum nitride substrate氮化鋁基板 aluminum nitride ceramics氮化鋁瓷 aluminium thin film鋁薄膜 aluminium oxide passivation三氧化二鋁鈍化法 alumina substrate氧化鋁基板 alternative solvent替代溶劑 alternative solvent替代溶劑 alternatives flon cleaner代用氟利昂清洗劑 alternative laminar technology ( ALT )交錯(cuò)加層技術(shù) alternative hypothesis備擇假設(shè) alternating current( AC)交流電 ALT交錯(cuò)加層技術(shù) alphanumeric code字母數(shù)字代碼 alpha error第一類錯(cuò)誤 alloy plating合金電鍍 alloy junction合金結(jié) alloy film 合金膜合金膜 alloy diffusion technology合金擴(kuò)散工藝 allomerism異質(zhì)同晶 all drilled hole全部鉆孔 a1kyI-imidazol烷基咪唑 alkaline permanganate solution堿性高錳酸鹽溶液 alkaline etchant堿性蝕刻液 alkaline degreasing化學(xué)除油 alkaline cleaner破性清洗液 alkaline ammonia etchant氨堿蝕刻液 ALIVH任意層內(nèi)導(dǎo)通孔 aliphatic solvent脂肪族溶劑 alignment mark對(duì)準(zhǔn)標(biāo)記 air sparger空氣攪拌 air knife氣刀 air inclusion氣泡夾雜 air flow impulse沖擊式氣流 air bearing空氣軸承 air agitation空氣攪拌 air agitation空氣攪拌 agglomeration凝絮 ageing老化 affinity elution親和洗脫 AES俄歇電子光譜法 adsorption dry吸附干燥 adsorption coefficient吸附系數(shù) adsorption chromatography吸附層析 adsorption吸附 adsorbed contaminant吸附污染物 adhesive strength of thick film conductor厚膜導(dǎo)體附著力 adhesive sheet黏結(jié)片，半固化片 adhesive face膠秸劑面 adhesive energy蒸鍍膜附著能量 adhesive-coated uncatalyzed laminate涂膠無(wú)催化層壓板 adhesive coated surface涂膠面 adhesive coated foil涂膠銅箱 adhesive coated dielectric film涂膠黏劑絕緣薄膜 adhesive-coated catalyzed laminate涂膠催化層壓板 adhesive膠黠劑，黠結(jié)膠，貼片膠 adhesion strength附著力，附著強(qiáng)度 adhesion promotor附著力促進(jìn)劑 adhesion promotion增教處理，附著力增強(qiáng) by-product副產(chǎn)品，副產(chǎn)物 butt lead搭接引線，對(duì)接引線 butting connector對(duì)接引腳 butter coat厚涂層，外表樹(shù)脂層 burst并發(fā)加工 bursh plating刷鍍 burr毛刺，毛頭 burnt deposit燒焦鍍層 burn-out zone燒除氣體區(qū) burn-out gas燒除氣體 burn in static靜態(tài)老化 burning燒焦 burn in dynamic動(dòng)態(tài)老化 burn in老化 buried via hole埋導(dǎo)孔，埋孔 buried via埋孔 buried resistance board埋入電阻板 buried resistance埋入電阻 buried microvias微埋孔 buried hole埋通孔 buried bump interconnection technology(Bit)嵌入凸塊互連技術(shù)，埋入凸塊互連技術(shù) buried and blinded via hole multiplayerboard埋盲孔多層板 bumping process凸塊工藝 bumping凸塊封裝技術(shù) bumped wafer帶凸塊晶片 bumped tape automated bonding(BTAB)有凸塊的帶載自動(dòng)焊接，凸點(diǎn)帶載自動(dòng)焊 bumped tape帶凸塊載帶 bumped die帶凸塊芯片，帶凸塊的裸芯片 bumped ball grid array (BBGA)凸塊球柵陣列 bump突塊，凸塊 BUM積層多層印制板 bulls eye靶心，定位標(biāo)識(shí) bullet pad子彈形盤(pán) bulk feeder散裝供料器 bulge test鼓凸試驗(yàn) bulge凸起，凸出，鼓起，隆起 built-in內(nèi)建 build-up process積層工藝，積層法 build-up multilayer printed board(BUM)積層多層印制板 build up method積層法 build-up flexible printed board積層撓性印制板 build-up增厚;堆積，積層 bugle hole喇叭孔 bugging height障礙高度 buffing拋光研磨 buffer material緩沖材料 buffer material緩沖材料 buffer緩沖劑 bubble effect氣泡效應(yīng) BTAB有凸塊的帶載自動(dòng)焊接 BT雙馬來(lái)酰亞胺三嗦樹(shù)脂 B-stage resinB 階樹(shù)脂 B-stage prepregB 階教結(jié)片 B-stage materialB 階材料 B-stage LotB 階批量 B-stage LotB 階批量 B-stageB 階段 BS基礎(chǔ)規(guī)范 brush plating刷鍍，電刷鍍 brushing磨刷 brown streak棕色條紋 brown oxide棕色氧化處理，棕色氧化 brown oxidation棕氧化 brittleness脆性 Brinell hardness布氏硬度 bright plating光亮電鍍 bright pickling光亮浸蝕 brightness nickel plating光亮鍍鎳 brightening agent光亮劑 brightener光澤劑 bright dip光澤浸漬處理，浸亮 bridging跨接 bridge錫橋 break point出像點(diǎn)，顯像點(diǎn)，露銅點(diǎn) break-out破環(huán) break-out破環(huán) breaking length斷裂長(zhǎng) breakdown voltage崩潰電壓，擊穿電壓 bleakaway panel可斷開(kāi)板，可斷拼版 brazing纖焊，硬焊 brazability纖焊性 braid編線 BQFP帶防沖擋四邊扇平封裝器件 box diffusion箱法擴(kuò)散 bow of weave弓緯 bow彎曲，扭曲，板翹 boundary scan test邊界掃描測(cè)試 boundary邊界，界面，界線 bounce pad反射盤(pán) bottom言孔底部 bottle neck瓶頸工序 boss凸臺(tái) bornb sight對(duì)準(zhǔn)靶標(biāo) bornb sight對(duì)準(zhǔn)靶標(biāo) border data外框數(shù)據(jù)，板框數(shù)據(jù)，邊沿?cái)?shù)據(jù) border conveyor邊框傳送器，筋條傳送器 border area邊沿區(qū)，外框 bond-to-die distance芯片接合距離 bond-to-bond distance接合間距離，連(焊)接距離 bond surface接合面 bond strength黏合強(qiáng)度，黏結(jié)強(qiáng)度 bond site接合位置，連(焊)接位置 bond site接合位置，連(焊)接位置 bond separation接合間隔 bond lift-off接合脫離 bond land連(焊)接盤(pán) bond interface接合界面，接合連接盤(pán) bond interface接合界面，接合連接盤(pán) bond interface接合界面，接合連接盤(pán) bonding wire連(焊)接金屬絲，接合金屬線 bonding tool接合工具 bonding time接合時(shí)間 bonding tester黏結(jié)測(cè)試器 bonding tester黏結(jié)測(cè)試器 bonding technology of integrated circuit集成電路焊接工藝 bonding strength黏結(jié)強(qiáng)度 bonding sheet黏結(jié)片 bonding pad鍵合點(diǎn) bonding layer黏結(jié)層，結(jié)合層 bonding island接合島，連焊)接島 bonding die接合芯片 booding area(焊)接面積，接合區(qū)域 bonding鍵合，連(焊)接 bond envelope接合包封 bond enhancement treatment黏結(jié)增強(qiáng)處理 bonded-contact board焊接板 bond deformation接合變形 bondability可鍵合性，可接合性 bond接合，連(焊)接 bomb sight彈標(biāo) BOM物料清單 boiling water absorption rate煮沸吸水率 boiling point沸點(diǎn) body land clearance刃帶間隙 BOD生化需氧量 board thickness板厚度，板厚 board-mounted connector板裝引腳 board板 blur edge模糊邊帶，模糊邊圈 blue-ribbon connector矩形插頭座 blue plaque藍(lán)紋 blow hole吹孔，氣孔 blotting paper吸墨紙 blotting干印，吸墨 blockout封網(wǎng) blocking variables變量隔離 blocking contact阻擋接觸 blocking band curvature阻擋層能帶彎曲 block diagram方框圖 blister起泡 blind via hole盲導(dǎo)通孔，盲孔 blind test雙盲試驗(yàn) blind surface microvias表面微盲孔 blind conductor非功能性導(dǎo)線 blends配料 bleeding滲出，滲漏 bleach漂洗 blanking沖切加工 blanking沖切加工 blanket gas保護(hù)氣體 blank坯料，空白料 blade-fork contact刀刃音叉式簧片 black oxide黑氧化，黑化 blackening涂黑 bits頭，針尖 B it printed board埋入式凸塊互連印制板 bismaleimide triazine resin(BT)雙馬來(lái)酰亞胺三嗦樹(shù)脂 bismaleimide triazine epoxide wovenglass fabric coppe.-c1ad雙馬來(lái)酰亞胺三嗦環(huán)氧玻璃布覆銅箔板 bismaleimide雙馬來(lái)酰亞胺 birdcage籠狀缺陷 biochemical oxygen demand ( BOD)生化需氧量 binder黏合劑，黏結(jié)劑 bill of material (BOM)物料清單 bi-level stencil雙階式鋼版 bifurcated solder terminal分叉焊端，分叉焊接端子 bifurcated contact雙叉式簧片，雙叉接點(diǎn)，雙叉接觸件 bifunctional catalyst雙功能催化劑 bidirectional characteristic雙向特性 bidirectional characteristic雙向特性 bias sputtering偏壓陰極濺鍍 bias expansion斜張法 bias緯斜 BGA球柵陣列 beveling倒斜邊，切斜邊 beta error第二類錯(cuò)誤 BeO substrate氧化鍍基板 bend test彎曲試驗(yàn) bendability耐彎曲性 benchmark testing測(cè)試基準(zhǔn) belt furnace帶式爐 bellows contact折疊式簧片，扁簧式接觸件 bed-of-nails testing針床測(cè)試 bed-of-nails fixture針床夾具 beam reflow soldering光束回流焊 beam lead isolation梁式引線隔離 beam lead-isolated integrated circuit梁式引線隔離集成電路 beam lead device梁式引線器件 beam lead bonding technology梁式引線載帶自動(dòng)焊接芯片工藝 beam lead bonder梁式引線鍵合機(jī) beam lead梁式引線，梁式引腳 cyclone jet旋風(fēng)式噴氣流 cyclic voltametric stripping (CVS)循環(huán)伏安測(cè)量法，循環(huán)伏安電子溶蝕測(cè)量 cycle rate循環(huán)速率 cycle mode逐次打擊式 cycle循環(huán)加工 CVS循環(huán)伏安測(cè)量法 CVD化學(xué)氣相沉積 cut to size panel剪切板 cut sheet頁(yè)裝 cut-off割除，切割 cut-and-strip刻圖與剝圖 cut and peel切割剝離 cusum chart累積和圖 customer relationshipmanagement(CRM)客戶關(guān)系管理 customer detail specification ( CDS)用戶詳細(xì)規(guī)范 cushion壓墊(緩沖)材料 curtain coating簾涂，簾幕涂布法 current efficiency電流效率 current density range電流密度范圍 current density of junction結(jié)電流密度 current density電流密度 current-carrying capacity載流能力，載流量 current電流 curing temperature固化溫度 curing agent困化劑 cure time固化時(shí)間 cure percent固化百分率 cure固化 cup solder terminal杯型焊端 cupric chloride etchant氯化銅蝕刻液 cumulative tolerance積累誤差 cubic components立方體元件，立方體器件 CTS能力試驗(yàn)塊 CTP綜合測(cè)試圖形 CTE熱膨脹系數(shù) CTB能力試驗(yàn)板 C-staged resinC 階樹(shù)脂 C-stageC 階段 CSP芯片尺寸封裝，芯片級(jí)封裝 crush zone磨碎區(qū) cross wise direction橫向 crossunder穿交 crosstalk串?dāng)_ cross section area截面積 cross-over跨交 cross linking交鏈 crosslink交聯(lián) crossing count交叉數(shù) crosshatch testing十字割痕試驗(yàn) crosshatching十字交叉線 cross flow blower貫流式風(fēng)機(jī) cropping切尾 crop mark剪切標(biāo)記 CRM客戶關(guān)系管理 critical process關(guān)鍵過(guò)程，關(guān)鍵工序 critical path method (CPM)要徑法 critical path關(guān)鍵路徑 critical operation關(guān)鍵操作 critical defect致命缺陷，關(guān)鍵缺陷 crimped connection壓接 crimp contact壓扁接觸片 crevice corrosion裂隙腐蝕 creep潛變，蠕變 creel經(jīng)軸架 crease皺褶 cream electrolyte導(dǎo)電膏 creak礎(chǔ)裂痕 crazing( conformal coating)(敷形涂層)微裂紋 crazing (base material)(基板)微裂紋 crazing微裂紋 cratering陷坑 crater彈坑，凹坑 crack of plating鍍層裂縫 crack of foil金屬第裂縫 CQFP陶瓷四邊扁平封裝 CPM要徑法 CPM客戶抱怨比 Cpk index(Cpk)Cpk 指數(shù) CP-I etchCP-I 腐蝕 CPGA陶瓷針式網(wǎng)格陣列，陶瓷封裝 CP6 etchCP6腐蝕 CP4 etchCP4 腐蝕 Cp能力性能指數(shù) coverlayer保護(hù)層，外膜 cover lay覆蓋層 covering power覆蓋能力 cover coat覆蓋涂層 coupon板邊試樣，附連板 coupling agent偶聯(lián)劑 counter sinking錐形孔 counter flow上下翻流，上下回流 counter current rinsing逆流漂洗 counter boring垂直向下擴(kuò)孔，埋頭孔，沉頭孔 cost of quality質(zhì)量成本 cost metrix費(fèi)用矩陣 corrosive flux腐蝕性焊劑 corrosion protection防腐蝕 corrosion of metals金屬腐蝕 corrosion腐蝕 corrode paste test倒腐蝕膏試驗(yàn) corner mark板角標(biāo)記，角標(biāo) corner crack孔角斷裂 core material內(nèi)層板材，芯材 core board via filling芯板導(dǎo)通孔堵塞 core board芯板 cordwood module積木式微型組件 cordwood arrangement積木式排列 copper thick film printed wiring board銅厚膜印制板 copper side銅箔面 copper plating adhesion test銅鍍層附著力測(cè)試 copper plating電鍍銅 copper plated-through hole鑲銅導(dǎo)通孔 copper plated-through hole鑲銅導(dǎo)通孔 copper plated-through hole鑲銅導(dǎo)通孔 copper paste銅膏 copper-mirror test銅鏡試驗(yàn) copper invar copper core (CICC)因瓦合金 copper-invar-copper board因瓦銅夾心板 copper foil surface treatment銅箔表面處理 copper foil laminate 覆銅箔板覆銅箔板 copper foil銅箔 copper cyanide plating氟化銅鍍 copper clad laminate board (CCL )覆銅箔層壓板，覆箔板 copper clad industrial laminate (CCIL)憑申請(qǐng)認(rèn)證制度，CCll 制度 copper accelerated salt spray test銅加速鹽霧試驗(yàn)，CASS 試驗(yàn) coplanar leads共面引腳，共面引線 coplanarity共面性(度) cooler冷卻器 convectionIR reflow soldering熱對(duì)流紅外輻射回流焊 control strip光尺 control limits控制限 controlled depth drilling定深鉆孔，鉆孔深度控制 controlled collapse chip connectionC4晶片焊接，控制熔化高度芯 controlled collapse bonding (CCB )控壓連(焊)接 controlled collapse bonding (CCB )控壓連(焊)接 controlled collapse定高坍塌 control collapse soldering控制崩塌焊接 control chart控制圖 contract service外包廠，分包商，外協(xié)加工 contract electronic manufacturer(CEM)電子品合同式制造商 contour length伸展長(zhǎng)度 continuous lamination連續(xù)壓合，連續(xù)層壓 continuity inspection連通檢查 continuity連通性 contact tenting light frame- work接觸式蔽光框架法 contact spring接觸彈簧 contact spacing接觸間距 contact size接觸尺寸 contact retention force接觸阻力 contact resistance接觸電阻 contact printing接觸印刷，接觸曝光 contact plating插頭電鍍 contact photo-printing接觸式感光印制 contact length接觸長(zhǎng)度 contact hole接觸孔，引線孔 contact hardening接觸硬化 contact force接觸壓力 contact exposure imaging底片接觸曝光成像 contact corrosion接觸腐蝕 contact bonding adhesive接觸黏合劑 contact area接觸區(qū)，接觸面積)(焊接)接觸角(焊接)接觸角 contact aluminium鋁接觸 contact alloying接觸合金 contact接觸件 constraining core加強(qiáng)芯板，夾芯 conner mark角標(biāo)志 connector with mixed contacts混裝式引腳 connector two-part printed board印制板雙件引腳 connector two-part雙件引腳 connector one-part單件引腳 connector housing引腳座 connector contact引腳接觸件 connector area引腳區(qū)域 connector引腳 connectivity連接度 conformal mask敷形掩模 conformal coating敷形涂層，保護(hù)形 confirmation run確認(rèn)試驗(yàn) confidence interval置信區(qū)間 cone type sprayer圓錐型噴嘴 cone-formation錐形缺陷 conductor widthspace線寬間距 conductor width導(dǎo)線寬度 conductor track導(dǎo)電帶 conductor trace line導(dǎo)線 conductor to land spacing導(dǎo)線與連接盤(pán)間距 conductor to hole spacing導(dǎo)線與孔間距 conductor thickness導(dǎo)線厚度 conductor spacing導(dǎo)線間距 conductor side導(dǎo)線面 conductor resistanceconductor pitch中心線距，導(dǎo)體節(jié)距 conductor pattern導(dǎo)線圖形 conductor line導(dǎo)體線 conductor layer導(dǎo)線層，導(dǎo)體層 conductor exposure露線 conductor base width基板導(dǎo)線寬度 conductor base spacing基板導(dǎo)線間距 conductor導(dǎo)電帶，導(dǎo)線 dynamic mechanical analysis ( DMA )動(dòng)態(tài)秸彈性分析，動(dòng)態(tài)熱機(jī)分析 dynamic flexible printed board撓性印制板 dynamic flex board動(dòng)態(tài)撓性板 dusting method噴粉法 durability耐久性 dummy substrate模仿基飯，偽基板 dummy plating假電鍍 dummy pattern虛擬圖形 dummy假鍍片(板).假陰極 dumet杜美絲 ductility延展性 dual wave soldering雙波蜂焊接 dual transistor雙晶體管 dual-strip line雙帶狀線 dual inline package ( DIP )雙列直插式封裝 dual inline memory雙列直插式存儲(chǔ)器模塊 dual-ground connection雙地線連接 dual fixture雙重夾具，雙組夾具 dual coated fiber雙涂覆層光纖 dual beam laser interferometer雙束激光干涉儀 DSW直接分步重復(fù)曝光 DSS決策支持系統(tǒng) DSA尺度穩(wěn)定式陽(yáng)極 DS詳細(xì)規(guī)范 dry process干法工藝 dry plate干版 dry photoetching technology干法刻蝕工藝 drying干燥 dry film resist干膜抗蝕劑 dry film photo resist干膜光致抗蝕劑 dry film imaging干膜法圖形轉(zhuǎn)移 dry film干膜 dryetching干刻 dry box干燥箱 drum side銅第光面，光陰面 drum scan type plotter鼓形掃描繪圖機(jī) drum scan type plotter鼓形掃描繪圖機(jī) drum-buffer- rope( DBR)限制驅(qū)導(dǎo)式排程法 dross浮渣，焊渣，殘?jiān)?dropping corrosion test點(diǎn)滴腐蝕試驗(yàn) dropping點(diǎn)滴(膠)法 drive file驅(qū)動(dòng)文件 drill pointer磨尖機(jī)，磨鉆頭機(jī) drill point concentricity鉆尖同心度 drilling鉆孔 drill facet鉆頭切削面 drilled bare board己鉆孔裸板 drill drawing鉆孔圖 drill diameter鉆頭直徑 drill body length鉆體長(zhǎng)度 drill axis長(zhǎng)刃 drawbridging吊橋效應(yīng) drawbridged component吊橋元件 drag soldering拖焊 drag out帶出 drag indrag out帶進(jìn)帶出 drag in帶進(jìn) drafting image繪制圖像 DPA破壞性物理分析 DP交貨拼板 downtime停機(jī)時(shí)間 double wet pass兩次濕印法 double treated foil雙面處理銅箔 double sided treated copper foil雙面粗糙銅箔，雙面粗化金屬箔 double-sided printed wiring board雙面印制線路板 double-sided printed board雙面印制板 double-sided flexible printed wiring board雙面撓性印制線路板 double-sided copper-clad laminate雙面覆銅箔層壓板 double sided board雙面板 double sided board雙面板 double-sided assembly雙面組裝件 double sided abrasive machine雙面研磨機(jī) double resist exposure二次抗蝕劑曝光 doubl-plug diode雙插頭二極管 double level routing雙層布線 double layer雙電層 double density雙密度 double access雙面露出，雙余隙 doping technique摻雜工藝 doping accuracy摻雜精度 doping摻雜 doped epitaxial layer摻雜外延層 doped dielectric摻雜電介質(zhì) dopant redistribution摻雜劑再分布 dopant material摻雜劑材料 dont-care area忽略區(qū) dog ear狗耳 dog bone design啞鈴式互連設(shè)計(jì)，狗骨式互連設(shè)計(jì) dog bone狗骨結(jié)構(gòu) doctor blade method刮板法 doctor blade修平刀，刮平刀 DO溶氧量，溶解氧 DNC分布式數(shù)控 3D-MCM (three dimension multi-chip module)三維多芯片模塊封裝 DMA動(dòng)態(tài)熱機(jī)分析 disturbed soldered connection紊流焊料連