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熱烈法玻璃激光切割技術(shù)綜述Contents1234IntroductionTypicalExperiments&ResultsComparison&ProspectReferencesIntroductionThe

traditionalmethodsofglasscuttingarebasedonscoringandsnappinginwhichadiamondbladetoolisusedforscribing,whichweakenstheglasssurfaceandthenbreakingisdonebyapplyingthemechanicalforce.Althoughthemethodisrelativelysimple,itresultsintheweakeningofglassedgesbyupto60%duetotheformationofmicrocracksandgenerationofresidualstresses.Toreducethesedefects,glasscanbegrounded,polished,andheattreatedbutthesetechniquescanonlyrecoveronlyupto30%oftheglassstrength.IntroductionDifferent

techniquesofcuttingglassusinglaserexistssuchaslaserscribeandbreak,lasermeltingandevaporation,andthecontrolledfracturetechniquefromwhichsomearebeingusedinindustriesandsomearestillintheirdevelopmentalstages.Laser

scribeandbreakisatwostageprocessandisquitesimilartotraditionalmechanicalscribeandbreakmethod.Inthefirststage,partiallypenetratingholesordeepventsatdepthsofonethirdtoone-halfofthematerialthicknessareproducedusingalaser.Inthesecondstage,breakingbyapplyingamechanicalforcetakesplacenormallywiththehelpofvacuumchucksorbycrackrollers.Severalstudieshavebeendonetoimprovethismethodandthecuttingquality.However,thescribingandbreakingprocessincursdamagetothecutedgeandcausesdamagetotheglasssurface.Therefore,finishingprocessesarerequired,whichaddextracosttothemanufacturer.IntroductionIn

lasermeltingandevaporationmethod,cuttingisdoneabove

glasstransitiontemperatureTg,whichresultsinpoorsurfacefinishandheataffectedzones.Duetomeltingandvaporizationof

theglassmaterialduringcutting,microcracksandburrsaregeneratedalongthecuttingprofileandtherequirementofgrinding

andpolishingattheendoftheprocessbecomesinevitable.Ascomparedwithlaserscribeandbreakandlasermeltingandevaporationmethod,thecontrolledfracturetechniqueisasinglestageprocessinwhichcuttingisperformedbelowtheglasstransitiontemperatureTg,whichresultsinsmoothedgesandhencerequiresnofurthercleaningorgrinding.Unliketheconventionalcuttingtechnique,itisacleanprocesswithoutchipsandcoolantanditispossibletofixtheworkpieceonatablebyasimplemethodbecausenoexternalforcesactuponit.IntroductionInthecontrolledfracturetechnique,thecracksareinitiatedduetoabsorbedphotonsheatingupthematerial.Thestressesnearthelaserspotarecompressiveduetohightemperature.Afterthepassageofthelaserbeam,thesecompressivestressesrelaxandinducelocalresidualtensilestresses.IfthesestressesexceedthefailurestressσfgivenbythecriticalstrainenergyreleaserateσGcforglass,crackpropagates.TypicalExperiments&ResultsIn2008KojiYamamotoet.al.conductathree-dementationalthermalanalysisonlaserscribingofglass.TheyshapeaCO2laserbeamanelliptical(橢圓)profilewhichhasanominalpowerof250Wandawavelengthof10.6μmtoirradiateonthesurfaceoftheglassplate.ExperimentsTypicalExperiments&ResultsResultsTheDcmax

takesitsmaximumat

d=14–16mm.Above18mm,Dcmaxtends

to

decreaseproportionallytod.Thiscanbeinterpretedaswith

increasingd,theheatdiffusionreducestheglasssurfacetemperatureimmediatelybeforethecooling,sothatthedifference

decreasesbetweenthesurfacetemperatureand

theinside

temperatureinthecoolingarea.ParametersLaserPowercoolingmediumTherearemanyparameterswillinfluencethelasercuttingwithcontroledfracture.Suchasthepoweroflaserandthethermalexpansioncoefficient,heattransfercoefficientandsoon.ScanningVelociycoolingpointdistancethermalexpansioncoefficientTypicalExperiments&ResultsThenKojiYamamotoet.al.choosetostudytheinfluenceofglasssubstratethicknessandthermalexpansioncoefficientinlaserscribingofglass.GlassSubstrateThicknessThermalExpansinCoefficientTypicalExperiments&ResultsSalmanNisaret.al.studiedtheinfluenceoflaserbeamgeometryindiodelaserchip-freecuttiingofglass.TypicalExperiments&ResultsResultsComparison&ProspectStressTypicalExperiments&ResultsAverageRoughnessTypicalExperiments&ResultsTemperatureComparison&ProspectInthesecondpart,manyexperimentsareconductedbylotsofresearchers.Wecanconcludetheirresearchesthatlasercuttingqualitywillmainlydependonthemaximumtemperatureinthesurfaceofglassandthemaximumtensilestressinthecoolingarea.Sowhichparameterwillaffectthetwofactors.Thethicknessofglasswillaffectthemaximumtensilestressinthecoolingarea,andhollowswillforminthebacksideofthelowerthicknesssubstrate.Thetensilestressgeneratedinthecoolingareadecreasesasthethermalexpansioncoefficientdecreases.Itisconcludedthatbecauseoflowermagnitudesoftensilestressesσxx,thetri-fbeamgivesminimumcutpathdeviationattheleadingedgeandtri-randcircularbeamsgiveminimumcutdeviationatthetrailingedgeoftheglasssheet.Comparison&ProspectTheresultspresentedinthesepapersareimportantfortheoptimizationofthelasercuttingprocessofglass.However,moreworkisneededtostudytheoptimumbeamshapealongwithotherlaserparametersi.e.,laserpower,cuttingspeed,andbeamspotsizetofurtherminimizecutpathdeviationattheleadingandtrailingedgesoftheglasssheet.Sointhenextfuture,wemaytryevenmorelaserparameterstofindheoptimumbeam.Butitmustbeinareasonableway.Suchas"Orthogonalexperimentaldesign".Wecanchoosethemainfactorstodoaorthogonalexperimentaldesign,thencompletetheexperimentandcomparetheresultsofittillwefindtheoptimumparametersandcuttingpath.Refe

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