POP 層疊包裝上的環(huán)氧助焊劑

深圳市福英達(dá)工業(yè)技術(shù)有限公司/一站式錫膏解決方案供應(yīng)商EpoxyFluxonPOPLaminatedPackagesFormobiledevicessuchasmobilephones,areaarraypackagessuchasBGAs,CSPsorPOPsarepronetodropfailuresandneedtobereinforcedwhentheyareassembledontoprintedcircuitboards.Whileunderfillisanalternativesolution,itincreasesmanufacturingcostsandreducestemperaturecyclingreliabilityduetotheadditionalcuringstepsinvolved.Asaresult,anepoxyfluxmethodispreferred,whicheliminatestheneedforacuringstep.Theepoxyfluxisusedasafluxwhenencapsulatingthereflowedarrayontotheprintedcircuitboardandthenself-curesafterreflow,providingtherequiredreinforcementwithouttheneedforanadditionalcuringstep.Sincepadcollapseisamajorfailuremodeinmanyportabledevices,epoxyfluxeshavebecomethepreferredchoiceforcost-effectiveandreliableSMTassemblyamongallpolymer-basedreinforcementsolutions.Figure1.EpoxyFluxSprayandDipProcesses.Epoxyfluxesareself-assemblingandself-correcting.Theepoxycuredaftersolderingprovidesinsulation,corrosionprotectionandreliabilityenhancement,anditiscompatiblewithunderfilladhesives,bondingadhesives,etc.,providingadditionaldeviceprotectionandmechanicalstrength.Theepoxyfluxcanbeappliedtothetopcomponentsbydippingorprinting,andthentheyaremountedontothebottomcomponentsandreflowsoldered.Figure2.POPlaminatedpackage.EpoxyfluxinthePOPlaminatedpackageapplicationhasthefollowingadvantages:1.High-precisionpositioning:iteffectivelypreventsthetopcomponentfromshiftingandtiltingintheplacementprocess,ensuringtheaccuratepositioningofcomponents.2.Reducedefects:epoxyfluxeffectivelyresistthewarpinganddeformationofthetopcomponentintheprocessofreflowsoldering,thusreducingthegenerationofdefectssuchasfalsesoldering,opencircuit,ballandsocket.3.Improveconnectionstrengthandreliability:Itenhancestheconnectionstrengthandreliabilitybetweenthetopcomponentandthebottomcomponent,andenhancestheperformanceofanti-shear,anti-stretchandanti-impact.4.Componentprotection:epoxyfluxeffectivelysealindividualbumpstopreventmoisture,dust,impuritiesandotherintrusion,toextendtheservicelifeofcomponents.Inshort,theapplicationofepoxyfluxinPOPlaminatedpackagehassignificantadvantages,canimproveproductperformanceandquality,reducemanufacturingcostsandrisks.Epoxyfluxisanewtypeofmaterialsystemthatdeservestobewidelyusedinsemiconductorpackaging,printedcircuitboardassemblyandevensomeemergingcomponentprocessessuchasstackedpackages(POP).FitechEpoxyFluxThefinepitchfluxproducedbyShenzhenFitechissuitableforhighprecisionandhighreliabilitypackaginginthefieldofwaferbump