SMT專業(yè)英語翻譯

1、SMT專業(yè)英語翻譯SMT 專業(yè)英語翻譯(Surface Mount Technology)IC：集成電路(INTEREGRATED CIRCUIT)resistor：電阻capacitor：電容inductor：電感diode：二極管transistor：三極管TANT：但質(zhì)電容switch：開關(guān)FRONTLIGHT：前燈backlight：后燈ri zisteka paesitain dAktedaiaudtraen sistaswitjbaeklaitSOP：小外形封裝(SMALL OUTLINE PACKAGE)SO J：小外形的“J”形腳封裝(SMALL OUTLINE J-LEADE

2、D PACKAGE)SOT：小外形三極管(SMALL OUTLINE TRANSISTOR)SIP：單列直托型封裝(SINGLE IN-LINE PACKAGE)DIP：雙列直桿型封裝(DUAL IN-LINE PACKAGE)SVP：表面垂直封裝(SURFACE VERTICAL PACKAGE) sa:fis va:tikaI paBkid3QFP：四邊扁平引線封裝(QUAD FLAT PACKAGE)PQFP：塑膠四邊扁平引線封裝(PLASTIC QUAD FLAT PACKAGE)COB：板載芯片(CHIP ON BOARD)LCC：無引線芯片載體(LEADLESS CHIP CARR

3、IER)LCCC：無引線陶瓷芯片教體(LEADLESS CERAMIC CHIP CARRIER)PLCC:四邊內(nèi)彎腳PGA：針柵列陣封裝(PIN GRID ARRAY)BGA：球柵列陣封裝(BALL GRID ARRAY)PBGA： PLASTIC BGA 塑料封裝 BGACBGA： CERAMIC BGA 陶瓷封裝 BGACCGA： CERAMIC COLUMN BGA 陶瓷柱狀封裝 BGATBGA： TAPE BGA載帶狀封裝BGACSP： CHIP SCALE PACKAGE 或 MBGATAB:金手指I.C SOCKET:集成電路插座POTRNTIOMETER：電位器ELEC：電解電

4、容LED：發(fā)光二極管chip component： 片狀元件 tjip kem peunent薄膜開關(guān)：membrane switch membrein switjinsulation resistance:絕緣電阻 insju leifanzistanscontrol ：控制 production:產(chǎn)品 changeover:轉(zhuǎn)換 program :程序Device check:驅(qū)動檢查kan treulpre dAkJantfeinds euvepraugraemdi vais t/ekmaudope reijenMode:模式 operation 操作board skip data 基板

5、跳掉數(shù)據(jù)bo:d skip deitenozzle skip :吸嘴跳掉nozl skipsetup :安裝panel loader:基板載入器paenal leudaposition ：位置pa zijennozzle check :吸嘴檢查 nozltfekpart supdty 零件廢棄pa：t part rejection :零件檢測 pa：tpaenalpaenalchgscheduled panels 優(yōu)化基板Je可u:ldscheduled panels :完成基板Jedju:ld clear comple led pamelscompleted panels 完成基板 paen

6、al paenel tabe mode: device change 驅(qū)動選擇stagerspare (completion)stage productionoperation mode 操作模式ope reifen maud schedcle 計(jì)i!|Jedju:ldcompleted 結(jié)束kam pli:tRecovery mode 恢復(fù)模式ri kAveri maudRecovery tims恢復(fù)時(shí)間Board( skip marks根據(jù)基板標(biāo)識點(diǎn)跳躍Loader載入器 leudeNozzle data 吸嘴數(shù)據(jù) nozl delta Production info 產(chǎn)品信息 pre dAkJen infeuChange pallet轉(zhuǎn)換裝置(應(yīng)該是指吸嘴轉(zhuǎn)換裝置)tjeinds auveFi