IGBT導(dǎo)熱硅脂的涂抹及表面粗糙度要求

1、Thermal grease for Infineon modulesWhat should be the behavior and how a grease has to look likeBaginskiIFAG AIM PMD ID AE2007-06-01ConsiderationsInfineon modules with baseplate: Roughness of baseplateRZmax. = 16m;RZtyp. = 4 6 mInfineon modules without baseplate: Roughness of ceramicRZmax. = 9 m; RZ

2、typ. = 3 4 mHeatsink: Specification of roughness regarding Application NoteModules with and without baseplate: RZmax. = 10mThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of

3、 warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmen

4、tal factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual propert

5、y rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 2ConsiderationsExample of roughness of baseplate and heatsinkBaseplateRZtyp.= 6 mRZmax. = 10 mHeatsinkThe information given

6、 in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communicat

7、ion, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technolog

8、ies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologie

9、s 2006. All rights reserved.Page 3ConsiderationsThermal conductivity:Copper: 390 W / mKAluminium: 237 W / mKThermal compound: 1 W / mKCopperTIM=> Thermal barrierAluminiumThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components on

10、ly and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before impl

11、ementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warr

12、anties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 4ConsiderationsDiagram with thermal greaseRth JCRth CHthermalgreaseRth HA

13、R>> Rth greaseDiagram with thermal greaseRth JCRRth CHth CHmetallthermalgreaseth HAR| Rmetallth greaseRth CH metall << R th CH thermal grease<< Rth CH airmK/W << 1 mK/W<< 42 mK/W=> Metal to Metal contact essential=> Thermal grease that fills only the gapes is pref

14、eredThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements con

15、tained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real applic

16、ation. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyrig

17、ht ? Infineon Technologies 2006. All rights reserved.Page 5ConsiderationsThermal grease consists of different componentsOily partsOnly needed to adjust the viscosity of the greaseThermal conducting partsNecessary to conduct baseplate and heatsink togetherBaseplateRZtyp.= 6 mRZmax. = 10 mHeatsinkThe

18、information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained i

19、n this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. I

20、nfineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Inf

21、ineon Technologies 2006. All rights reserved.Page 6ConsiderationsThermal interface material: Example for better understandingGrain size: Up to 70mThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarde

22、d as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating co

23、nditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement

24、of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 7ConsiderationsExample: Thermal grease with 40m size in applicationTemperaturedrop390 W/mK Smalltemp

25、. drop1 W/mKBigtemp. drop237 W/mKSmalltemp. dropBaseplateNo chance to moveOilypartHeat conductingpartHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a

26、 certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors ma

27、y differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of an

28、y third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 8ConsiderationsExample of grains of 40m sizeGrease workslike distance Baseplate spacersHeatsink=> RthCH = badThe information given in

29、this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication,

30、 including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies

31、hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 20

32、06. All rights reserved.Page 9ConsiderationsExample: Thermal grease with 5m size in applicationTemperaturedropBaseplateHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any descriptio

33、n of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and enviro

34、nmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual pro

35、perty rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 10ConsiderationsExample of grains of 5m sizeHole to fix module with the heatsinkBaseplateHeatsinkMetal to metal contact

36、 possible=> RthCH = goodThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies compone

37、nts. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described he

38、rein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.

39、6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 11ConsiderationsViscosity of thermal grease: High viscosity (hard)BaseplateDots of greaseHeatsinkBaseplateHeatsinkPermanentBaseplategapThe information given in this presentation is given as a hint for the implementation

40、 of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication,Heatsinkincludingany recommendation or suggestion or method

41、ology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabiliti

42、es of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 12ConsiderationsViscosit

43、y of thermal grease: Low viscosity (fluid)BaseplateDots of greaseHeatsinkBaseplateHeatsinkGreaseBaseplatecomesoutThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies componentsHeatsinkonlyandshall not be regarded as any description of warr

44、anty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental fa

45、ctors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property righ

46、ts of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 13ConsiderationsRoughness of heatsinkBaseplateRZtyp.= 6 mRZmax. = 1 mHeatsinkPermanent distanceThe information given in this pres

47、entation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, includin

48、g any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby di

49、sclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All r

50、ights reserved.Page 14ConsiderationsRoughness of heatsinkBaseplateRZtyp.= 6 mRZmax. = 10 mHeatsinkCrossover possibleThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warran

51、ty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental fac

52、tors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property right

53、s of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright ? Infineon Technologies 2006. All rights reserved.Page 15Considerations of thermal foilFoil workslike distance Baseplate keeperHeatsinkPermanent air-> bad RthThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description