J-STD-033D處理包裝運(yùn)輸和使用濕度回流和過程敏感設(shè)備

DownloadedbyHarlanJack(txsjd666@163.com)onOct20,2023,12:42amPDT

JOINTINDUSTRYSTANDARD

IPC/JEDECJ-STD-033D

April2018

SupersedesIPC/JEDECJ-STD-033C-1August2014

Handling,Packing,ShippingandUseofMoisture,

Reflow,andProcessSensitiveDevices

Notice

JEDECandIPCStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneed.ExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmemberofJEDECorIPCfrommanufacturingorsellingproductsnotconforming

tosuchStandardsandPublications,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanJEDECandIPCmembers,whetherthestandardistobeusedeitherdomestically

orinternationally.

RecommendedStandardsandPublicationsareadoptedbyJEDECand

IPCwithoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,materials,orprocesses.Bysuchaction,JEDECandIPCdonotassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhatever

topartiesadoptingtheRecommendedStandardorPublication.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsofliabilitiesforpatentinfringement.

ThematerialinthisjointstandardwasdevelopedbytheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesandtheIPCPlasticChipCarrierCrackingTaskGroup(B-10a)

ForTechnicalInformationContact:

JEDEC

SolidStateTechnologyAssociation3103North10thStreet,Suite240-SArlington,VA22201-2107

Tel703907.0026

Fax703907.7501

IPC

3000LakesideDrive,Suite105NBannockburn,Illinois

60015-1249

Tel847615.7100

Fax847615.7105

PleaseusetheStandardImprovementFormshownattheendofthisdocument.

?Copyright2018.JEDECSolidStateTechnologyAssociation,Arlington,Virginia,andIPC,Bannockburn,Illinois,USA.AllrightsreservedunderbothinternationalandPan-Americancopyrightconventions.Anycopying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyrightholderisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStates.

IPC/JEDECJ-STD-033D

Handling,Packing,ShippingandUseofMoisture,Reflow,andProcessSensitiveDevices

AjointstandarddevelopedbytheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesandtheB-10aPlasticChipCarrierCrackingTaskGroupofIPC

Supersedes:

IPC/JEDECJ-STD-033C-1-

August2014

IPC/JEDECJ-STD-033C-

February2012IPC/JEDECJ-STD-033B.1

includesAmendment1-January2007

IPC/JEDECJ-STD-033B-

October2005

Usersofthispublicationareencouragedtoparticipateinthedevelopmentoffuturerevisions.

Contact:

IPC/JEDECJ-STD-033A-

July2002

IPC/JEDECJ-STD-033-

April1999JEDECJEP124

IPC-SM-786A-January1995

IPC-SM-786-December1990

JEDEC

SolidStateTechnologyAssociation3103North10thStreet,Suite240-SArlington,VA22201-2107

Tel703907.0026

Fax703907.7501

IPC

3000LakesideDrive,Suite105NBannockburn,Illinois

60015-1249

Tel847615.7100

Fax847615.7105

ThisPageIntentionallyLeftBlank

April2018 IPC/JEDECJ-STD-033D

Acknowledgment

Anydocumentinvolvingacomplextechnologydrawsmaterialfromavastnumberofsourcesacrossmanycontinents.WhiletheprincipalmembersofthePlasticChipCarrierCrackingTaskGroup(B-10a)ofthePackagedElectronicComponentsCommittee(B-10)areshownbelow,itisnotpossibletoincludeallofthosewhoassistedintheevolutionofthisstandard.Toeachofthem,themembersoftheIPCextendtheirgratitude.

PlasticChipCarrierCrackingTaskGroup

Chairman

StevenR.MartellNordsonSonoscan

JEDECJC14.1Committee

ChairmanIfeHsu

IntelCorporation

JointMoistureClassificationWorkingGroupMembers

JosephKane,BAESystemsPlatformSolutions

MudasirAhmad,CiscoRobertDiMaggio,ClariantMarkReese,ClariantFrancisClasse,Cypress

ChrisBrigham,EvansAnalyticalGroupMarkBurns,GlobalFoundries

ShiDanBing,HuaweiGuoFujan,HuaweiJiaoHuifang,Huawei

RussLewis,Hewlett-PackardCurtisGrosskopf,IBMCorporationAndreasPreussger,Infineon

DennisCerney,InfineonIfeHsu,IntelCorporationAlanLucero,IntelGautamVerma,Intel

KenMcGhee,JEDECPerryKeller,KeysightAshKumar,MicrochipDongieXie,Nvidia

BobKnoell,NXPSemiconductorsNicholasLycoudes,NXP

Semiconductors

StevanHunter,OnSemiMumtazBora,Peregrine

Semiconductor

RichardIodice,RaytheonCompanyJinhwanKim,Samsung

HeonSangLim,SamsungMianQuddus,Samsung

MichelleOgihara,SeikaMachineryInc.StevenMartell,SonoscanInc.

JamesBerry,TexasInstrumentsLarryTing,TexasInstruments

StephenTisdale,TisdaleEnvironmentalConsulting

BruceHughes,USArmy

Additionally,wewouldliketoexpressourappreciationtotheJEITAmembersfortheirsupportinimprovingJ-STD-033revD.

InMemorium

TheJointCommitteewouldliketoespeciallyacknowledgeJackT.McCullenandRichardL.ShookfortheiroutstandingcontributionsandleadershipinthedevelopmentofJ-STD-033.

iii

ThisPageIntentionallyLeftBlank

April2018 IPC/JEDECJ-STD-033D

TableofContents

FOREWORD 1

Purpose 1

Scope 1

AssemblyProcesses 1

MassReflow 1

LocalizedHeating 1

SocketedDevices 1

Point-to-PointSoldering 1

AqueousCleaning 1

Reliability 2

TermsandDefinitions 2

ActiveDesiccant 2

BarCodeLabel 2

BulkReflow 2

Carrier 2

Desiccant 2

FloorLife 2

HumidityIndicatorCard(HIC) 2

Manufacturer’sExposureTime(MET) 2

Moisture-BarrierBag(MBB) 2

Moisture-SensitiveIdentification(MSID) 2

Moisture-SensitivityLevel(MSL) 2

Rework 2

Process-SensitivityLevel(PSL) 2

ShelfLife(ofadeviceinasealedMBB) 2

SMD 3

SolderReflow 3

WaterVaporTransmissionRate(WVTR) 3

APPLICABLEDOCUMENTS(Normative) 3

AmericanSocietyforTestingandMaterials(ASTM) 3

ElectronicIndustriesAlliance(ECIA,JEDEC) 3

IPCStandards 3

JointIndustryStandards 3

DepartmentofDefense 3

DRYPACKING 3

Requirements 3

DryingofSMDPackagesandCarrierMaterialsBeforeBeingSealedinMBBs 4

DryingRequirements-Levels2a-5a 4

DryingRequirementsforCarrierMaterials 4

DryingRequirements 4

ExcessTimeBetweenBakeandBag 4

DryPack 4

Description 4

Materials 4

Labels 6

MoistureBarrierBagSealing 7

Dry-PackPrecautions 7

ShelfLife 8

DRYING 8

PostExposuretoFactoryAmbient 10

AnyDurationExposure 10

ShortDurationExposure 10

GeneralConsiderationsforBaking 11

HighTemperatureCarriers 11

LowTemperatureCarriers 11

PaperandPlasticContainerItems 11

BakeoutTimes 11

ESDProtection 11

ReuseofCarriers 11

SolderabilityLimitations 11

USE 11

IncomingBagInspection 11

UponReceipt 11

DeviceInspection 12

FloorLife 12

SafeStorage 12

DryPack 12

ShelfLife 12

DryAtmosphereCabinet 12

Reflow 12

OpenedMBB 12

ReflowTemperatureExtremes 12

AdditionalThermalProfileParameters 13

MultipleReflow 13

MaximumReflowPasses 13

DryingIndicators 13

ExcessHumidityinDryPack 13

FloorLifeorAmbientTemperature/HumidityExceeded.135.5.3 Level6SMDPackages 13

BOARDREWORK 13

DeviceRemoval,ReworkandRemount 13

RemovalforFailureAnalysis 14

RemovalandRemount 14

BakingofPopulatedBoards 14

v

IPC/JEDECJ-STD-033D April2018

DERATINGDUETOFACTORY

ENVIRONMENTALCONDITIONS 14

APPENDIXA TestMethodforReversible(Type1)

RHSpotsonaHumidityIndictorCard(HIC)usedwithElectronicDevicePackaging 16

APPENDIXB DerivationofBakeTables 17

APPENDIXC DesiccantUnitAbsorptionCapacity

TestMethodforVerification 18

APPENDIXD ChangesinJ-STD-033D 19

Figures

Figure3-1 TypicalDry-PackConfigurationforMoisture-

SensitiveSMDPackagesinShippingTubes 4

Figure3-2AHumidityIndicatorCard(HIC)–Type1 5

Figure3-2BHumidityIndicatorCard(HIC)–Type2 5

Figure3-3 Moisture-SensitiveIdentificationLabel

(Examples) 6

Figure3-4ACautionLabel(ExampleswithMSLonly) 7

Figure3-4BCautionLabel(ExampleswithMSLandPSL) 7

Figure3-5 MBBwithNoEvacuation(Example) 8

Figure3-6 MBBwithRecommendedLightAirEvacuation(Example) 8

Figure3-7 MBBwithTooMuch(Full)Evacuation

(Example) 8

FigureA-1 PhotoofTestingApparatus 16

Tables

Table3-1 Dry-PackingRequirements 4

Table3-2 TypicalReversible(Type1)HICSpot

Compliance 6

Table4-1 ReferenceConditionsforDryingMountedorUnmountedSMDPackages 9

Table4-2 SupplierBake:DefaultBakingTimesUsed

PriortoDryPack 10

Table4-3 ResettingorPausingtheFloor-LifeClock

atUserSite 10

Table5-1 MoistureClassificationLevel(MSL)and

FloorLifeperJ-STD-020 12

Table7-1 RecommendedEquivalentTotalFloor

Life(days)@20°C,25°C&30°C,35°CForICswithNovolac,Biphenyland

MultifunctionalEpoxies(Reflowatsametemperatureatwhichthedevicewasclassified)

MaximumPercentRelativeHumidity 15

vi

April2018 IPC/JEDECJ-STD-033D

Handling,Packing,ShippingandUseofMoisture,Reflow,

andProcessSensitiveDevices

FOREWORD

Theadventofsurfacemountdevices(SMDs)introducedanewclassofqualityandreliabilityconcernsregardingdamagesuchas‘‘cracksanddelamination’’fromthesolderreflowprocess.Thisdocumentdescribesthestandardizedlevelsoffloor-lifeexposureformoisture/reflowsensitiveSMDsalongwiththehandling,packingandshippingrequirementsnecessarytoavoidmoisture/reflowrelatedfailures.CompaniondocumentsJ-STD-020,J-STD-075andJEP113definetheclassificationprocedureandthelabelingrequirements,respectively.

Formoisturesensitivity,moisturefromatmospherichumidityenterspermeablepackagingmaterialsbydiffusion.AssemblyprocessesusedtosolderSMDstoprintedcircuitboards(PCBs)exposetheentirepackagebodytotemperatureshigherthan200°C.Duringsolderreflow,thecombinationofrapidmoistureexpansion,materialsmismatch,andmaterialinterfacedegradationcanresultincrackingand/ordelaminationofcriticalinterfaceswithinthedevice.

Typicalsolderreflowprocessesofconcernforalldevicesareconvection,convection/IR,infrared(IR),vaporphase(VPR),hotair

reworktools,andwavesolder,includingfullimmersion.

Non-semiconductordevicesmayexhibitadditionalprocesssensitivitiesbeyondmoisturesensitivitysuchasthermalsensitivity,

fluxsensitivityorcleaningprocesssensitivity.

PurposeThepurposeofthisdocumentistoprovidemanufacturersanduserswithstandardizedmethodsforhandling,packing,shipping,anduseofmoisture/reflowandprocesssensitivedevicesthathavebeenclassifiedtothelevelsdefinedinJ-STD-020orJ-STD-075.Thesemethodsareprovidedtoavoiddamagefrommoistureabsorptionandexposuretosolderreflowtemperaturesthatcanresultinyieldandreliabilitydegradation.Byusingtheseprocedures,safeanddamage-freereflowcanbeachieved.Thedry-packingprocessdefinedhereinprovidesaminimumshelflifeof12monthsfromthesealdate.

ScopeThisstandardappliestoalldevicessubjectedtobulksolderreflowprocessesduringPCBassembly,includingplasticencapsulatedpackages,processsensitivedevicesandothermoisturesensitivedevicesmadewithmoisture-permeablematerials(epoxies,silicones,etc.)thatareexposedtotheambientair.

AssemblyProcesses

MassReflowThisstandardappliestobulksolderreflowassemblybyconvection,convection/IR,infrared(IR),andvaporphase(VPR)processes.Itdoesnotapplytobulksolderreflowprocessesthatimmersethedevicebodiesinmoltensolder(e.g.,wavesolderingbottommounteddevices).SuchprocessesarenotallowedformanySMDsandarenotcoveredbythedevicequalificationsstandardsusedasabasisforthisdocument.

LocalizedHeatingThisstandardalsoappliestomoisture/reflowsensitiveSMDpackagesthatareremovedorattached

singlybylocalambientheating,i.e.,‘‘hotairrework.’’SeeClause6.

SocketedDevices

ThisstandarddoesnotapplytoSMDpackagesthataresocketedandnotexposedtosolderreflowtemperaturesduringeitherbulkrefloworreworkofadjacentdevices.SuchSMDpackagesarenotatriskanddonotrequiremoistureprecautionaryhandling.

Point-to-PointSolderingThisstandarddoesnotapplytoSMDpackagesinwhichonlytheleadsareheatedtoreflowthesolder,e.g.,hand-soldering,hotbarattachofgullwingleads,andthroughholebywavesoldering.Theheatabsorbedbythepackagebodyfromsuchoperationsistypicallymuchlowerthanforbulksurfacemountrefloworhotairreworkandmoistureprecautionarymeasuresaretypicallynotneeded.

AqueousCleaningFornon-cavitySMDstypicalshorttermaqueouscleaningprocesseswillnotimpactthefloorlife

(internalmoisturecontent).Specialconsiderationshouldbegiventonon-hermeticcavitypackages.

1

IPC/JEDECJ-STD-033D April2018

ReliabilityThemethodssetforthinthisspecificationensurethatanadequateSMDpackagereliabilitycanbeachievedduringandafterthePCBassemblyoperation,whentheSMDpackagesareevaluatedandverifiedbyJ-STD-020,J-STD-075,and/orbyJESD22-A113plusenvironmentalreliabilitytesting.

Note:Thisspecificationdoesnotaddressorensuresolderjointreliabilityofexternalinterconnectsforattacheddevices.

TermsandDefinitions

ActiveDesiccantDesiccantthatiseitherfresh(new)orhasbeenbakedaccordingtothemanufacturer’srecommendations

torenewittooriginalspecifications.

BarCodeLabelAlabelthatincludesinformationinacodeconsistingofparallelbarsandspacesora2-Dmatrixformat.

Note:Forthepurposeofthisstandard,thebarcodelabelisonthelowest-levelshippingcontainerandincludesinformationthat

describestheproduct,e.g.,partnumber,quantity,lotinformation,supplieridentification,andmoisture-sensitivitylevel.

BulkReflowReflowofmultipledeviceswithsimultaneousattachmentbyaninfrared(IR),convection/IR,convection,orvaporphasereflow(VPR)process.

Carrier Apockettape,tray,tube,orothercontainerusedtostoreandtransportpackageddevices.

DesiccantAnabsorbentmaterialusedtomaintainalowrelativehumidity.

FloorLifeTheallowabletimeperiodafterremovalofmoisture-sensitivedevicesfromamoisture-barrierbag,drystorage,ordrybakeandbeforethesolderprocess.

HumidityIndicatorCard(HIC)Acardonwhichamoisture-sensitivechemicalisappliedasaspotthatwillmakeasignificant,

perceptiblechangewhentheindicatedrelativehumidityisexceeded.

Note1:TwotypesofHICshavebeendefined.

Type1HIC(reversible)Forreversiblespotsthechangeistemporaryandoccursasachangeincolor(hue),typicallyfromblue(dry)topink(wet).Aperceptiblechangewillbeseenifthehumiditythresholdisonlymomentarilysurpassed.

Type2HIC(nonreversible)Fornonreversiblespotsthechangeisnottemporaryandcanbeaspotcolormigrationoutsideofthespotborderorsomeothernonreversibleindicator.AnonreversibleHICincludesatleasta60%RHindicatorspot,butcanhaveothernonreversibleRH%indicatorsthatdonotrevertafterexposuretoahumiditythreshold.

Note2:TheHICispackedinsidethemoisture-barrierbag,alongwithadesiccant,toaidindeterminingthelevelofmoisturetowhichthemoisture-sensitivedeviceshavebeensubjected.Type1andType2HICsthathavebeenexposedto60%orgreaterRHwillnolongerbeconsideredaccurate.

Manufacturer’sExposureTime(MET)Themaximumcumulativetimeafterbakethatdevicesmaybeexposedtoambientconditionspriortoshipmenttoenduser.

Moisture-BarrierBag(MBB)Abagdesignedtorestrictthetransmissionofwatervaporandusedtopackmoisture-sensitivedevices.

Moisture-SensitiveIdentification(MSID) Asymbolindicatingthatthecontentsaremoisture-sensitive.

Moisture-SensitivityLevel(MSL) Aratingindicatingadevice’ssusceptibilitytodamageduetoabsorbedmoisturewhen

subjectedtoreflowsolderingasdefinedinJ-STD-020.

ReworkTheremovalofadeviceforscrap,reuse,orfailureanalysis;thereplacementofanattacheddevice;ortheheatingandrepositioningofapreviouslyattacheddevice.

Process-SensitivityLevel(PSL)Aratingusedtoidentifyadevicethatissolder-process-sensitivebecausethedevice

cannotbeusedinoneormoreofthebasesolderprocessconditionsdefinedinJ-STD-075.

ShelfLife(ofadeviceinasealedMBB)Theallowabletimethatadry-packedmoistureorreflow-sensitivedevicecanbe

storedinanunopenedmoisture-barrierbag(MBB).

2

April2018 IPC/JEDECJ-STD-033D

SMDSurfacemountdevice.

Note:Forthepurposeofthisstandard,SMDisrestrictedtoincludeonlyplastic-encapsulatedSMDsandotherpackagesmadewithmoisture-permeablematerials.

SolderReflowAsolderattachmentprocessinwhichpreviouslyappliedsolderorsolderpasteismeltedtoattachadevicetoaprintedcircuitboard.

WaterVaporTransmissionRate(WVTR)Ameasureofthepermeabilityofplasticfilmormetallizedplasticfilmmaterial

tomoisture.

APPLICABLEDOCUMENTS(Normative)

AmericanSocietyforTestingandMaterials(ASTM)1

ASTMF1249StandardTestMethodforWaterVaporTransmissionRateThroughPlasticFilmandSheetingUsingaModulatedInfraredSensor.

ASTMF392StandardTestMethodforFlexDurabilityofFlexibleBarrierMaterials

ElectronicIndustriesAlliance(ECIA,ESDA,JEDEC)ANSI/ESDS541PackagingMaterialforESDSensitiveItems2

ANSI/ESDS541PackagingMaterialStandardsforESDSensitiveItems

JESD625RequirementsforHandlingElectrostaticDischargeSensitive(ESD)Devices

JEP160LongTermStorageGuidelinesforElectronicSolidStateWafers,Dice,andDevices

JESD22-A113PreconditioningofNon-hermeticSurfaceMountDevicesPriortoReliabilityTesting

JESD22-A120TestMethodfortheMeasurementofMoistureDiffusivityandWaterSolubilityinOrganicMaterialsUsedinIntegratedCircuits

IPCStandards3

IPC-7711/21Rework,ModificationandRepairofElectronicAssemblies

JointIndustryStandards4

J-STD-020Moisture/ReflowSensitivityClassificationforNon-hermeticSolidStateSurfaceMountDevicesJ-STD-075ClassificationofNon-ICElectronicComponentsforAssemblyProcesses

DepartmentofDefense5

MIL-PRF-81705TypeI-BarrierMaterialsFlexible.Electrostatic-free.HeatSealable

MIL-D-3464TypeII-Desiccant,Activated,Bagged,PackagingUseandStaticDehumidification

DRYPACKING

RequirementsDry-packingrequirementsforthevariousmoisturesensitivitylevelsareshowninTable3-1.ThelevelsaredeterminedperJ-STD-020,J-STD-075,and/orperJESD22-A113plusreliabilitytesting.AsaminimumallmaterialsusedindrypackingshouldconformtoANSI/ESDS541.

\h

;;

\h

\h

;;

\h

\h

/qsSearch.aspx

3

IPC/JEDECJ-STD-033D April2018

Table3-1Dry-PackingRequirements

Level

DryBeforeBag

MBBWithHIC

Desiccant

MSIDLabel

CautionLabel

1

Optional

Optional

Optional

NotRequired

NotRequiredifclassifiedat220oC–225oCRequired*ifclassifiedatotherthan220oC–225oC

2

Optional

Required

Required

Required

Required

2a-5a

Required

Required

Required

Required

Required

6

Optional

Optional

Optional

Required

Required

SocketOnly

NotApplicable

NotApplicable

NotApplicable

NotRequired

NotRequired

Note:*A‘‘Caution’’labelisnotrequirediflevelandreflowtemperaturearegiven,inhumanreadableform,onthebarcodelabelattachedtothelowestlevel

shippingcontainer.

DryingofSMDPackagesandCarrierMaterialsBeforeBeingSealedinMBBs

DryingRequirements-Levels2a-5aSMDpackagesclassifiedatLevels2athrough5amustbedried(seeClause4.)priortobeingsealedinMBBs.TheperiodbetweendryingandsealingmustnotexceedtheMETlessthetimeallowedfordistributorstoopenthebagsandrepackparts.Ifthesupplier’sactualMETismorethanthedefault24hours,thentheactualMETmustbeused.IfthedistributorpracticeistorepacktheMBBswithactivedesiccant,thenthistimedoesnotneedtobesubtractedfromtheMET.

DryingRequirementsforCarrierMaterialsCarriermaterials,suchastrays,tubes,reels,etc.,thatareplacedintheMBBcanaffectthemoisturelevelwithintheMBB.Therefore,theeffectofthesematerialsmustbecompensatedforbybakingor,ifrequired,addingadditionaldesiccantintheMBBtoensurethecalculatedshelflifeoftheSMDpackages.

DryingRequirementsSuppliersmayusethedryingeffectofnormalin-lineprocessessuchaspostmoldcure,markingcure,andburn-intoreducethebaketime.Anequivalencyevaluationisrecommendedtoensurethathightemperatureprocessingmaintainsmoistureweightgaintoanacceptablelevel.ThetotalweightgainfortheSMDpackageatthetimeitissealedintheMBBmustnotexceedthemoisturegainofthatpackagestartingdryandthenbeingexposedto30°C/60%RHforMEThours(lessthetimefordistributors).

ExcessTimeBetweenBakeandBagIftheallowabletimebetweenbakeandbagisexceeded,theSMDpackagesmustbedriedagainperClause4.

DryPack

J-STD-033D-3-1

MBB

DesiccantPouches

HIC

FoamEndCap

4

3

2

1

DescriptionDrypackconsistsofdesiccantmaterialandaHumidityIndicatorCard(HIC)sealedwiththeSMDpackagesinsideaMoistureBarrierBag(MBB).Arepresentativedry-packconfigurationisshowninFigure3-1.

Materials

MoistureBarrierBag(MBB)ThemoisturebarrierbagshallmeetMIL-PRF-81705,TYPEIrequirementsforflexibility,ESDprotection,mechanicalstrength,andpunctureresistance.Thebagsshallbeheatsealable.TheWaterVaporTransmissionRate(WVTR)shallbe

≤0.0310g/m2[0.002g/100in2]in24hoursat40°Cafterflextestingper

condition‘‘E’’ASTMF392.TheWVTRismeasuredusingASTMF1249.

DesiccantThedesiccantmaterialshallmeetMIL-D-3464,TYPEII.Desiccantshallbedustless,non-corrosive,andabsorbenttoamountsspecifiedinthestandard.Desiccanthasaverylimitedfloorlifeandshouldbestoredandhandledperthemanufacturer’srecommendation

priortoinsertionintheMBB.Thedesiccantmaterialshallbepackagedinmoisturepermeablebagsorpouches.Theamountofdesiccantused,permoisturebarrierbag,shallbebasedonthebagsurfaceareaandWVTRinordertolimittheinteriorrelativehumidityintheMBB,attheendofthecalculatedshelflife,tolessthan10%at25°C.

Figure3-1TypicalDry-PackConfigurationforMoisture-SensitiveSMDPackagesinShippingTubes

4

April2018 IPC/JEDECJ-STD-033D

Forcomparisonbetweenvariousdesiccanttypes,militaryspecificationsadoptedthe‘‘UNIT’’asthebasicunitofmeasureofquantityfordesiccantmaterial.AUNITofdesiccantisdefinedastheamountthatwillabsorbaminimumof2.85gofwatervaporat20%RHand25°C.

DesiccantQuantityCalculation

Whenthedesiccantcapacityat10%RHand25°Cisknown,thefollowingequationshouldbeused:

U=(0.304*M*WVTR*A)/D

Where:

U=AmountofdesiccantinUNITS

0.304=Averagenumberofdayspermonth/100in2(30.4/100)M=Shelflifedesiredinmonths(see3.3.6forshelflife)

WVTR=Watervaportransmissionrateingrams/m2[grams/100in2]in24hrsA=TotalexposedsurfaceareaoftheMBBinsquaredecimeters(squareinches)

D=Theamountofwateringrams,thataUNITofdesiccantwillabsorbat10%RHand25°C

Whenthedesiccantcapacityat10%RHand25°CisnotknownaconservativevalueofD=1.40canbeused.

Note1:Ifitisdesiredtominimizetheamountofdesiccantusedfordry-packinglevel2devicesavalueofDbasedontheamountofwateringrams,thataUNITofdesiccantwillabsorbat60%RHand25°Cmustbeusedintheformula.Thisvalueshouldtobeobtainedfromthedesiccantmanufacturer.WhenthisoptionisuseditmustbeverifiedthatwhenthedevicewasclassifiedperJ-STD-020itmusthaveachievedfullsaturationduringmoisturesoak.

Note2:Nomoisture-absorbingmaterial(e.g.,trays,tubes,reels,foamendcaps)shouldbeplacedinthedrybagwithoutlowtemperaturebaking.Anysuchmaterialthatisincludedincreasestheamountofdesiccantneededtomeetthecalculatedshelflife(see5.3.1)byanamountbasedonthemoisturecontentofthematerial.Thiscanbedeterminedbyweighingarepresentativequantityofmaterialknowntobeatequilibriumwiththemanufacturingenvironment,bakingtoanewconstantweight,andsubtractingthefinalfromtheinitialweight.

J-STD-033D-3-2B

J-STD-033D-3-2A

Donotputthiscardintoabagif60%isoverrun

5%

10%

PARTS

Bakepartsif10%isNOT

blueand5%ispink

Bakeparts

if60%overrunborder

REVERSIBLESPOTS

LEVEL2A-5A

60%

2PARTS

HUMIDITYINDICATOR

ComplieswithIPC/JEDECJ-STD-033

TYPE2NONREVERSIBLESPOT

LEVEL

Donotputthiscardintoabagif60%ispink

5%

10%

PARTS

Bakepartsif10%isNOT

blueand5%ispink

Bakeparts

if60%NOTblue

REVERSIBLESPOTS

LEVEL2A-5A

60%

2PARTS

HUMIDITYINDICATOR

ComplieswithIPC/JEDECJ-STD-033

TYPE1REVERSIBLESPOTS

LEVEL

LotNumber

LotNumber

AdditionalUNIT(s)ofdesiccant,basedon10%RH@25°C,mustbeaddedtoabsorbtheamountofwater,ingrams,egressedfromthepackingmaterials(dunnage)afterbaking.

ManufacturerIdentification

ManufacturerIdentification

Figure3-2AHumidityIndicatorCard(HIC)–Type1 Figure3-2BHumidityIndicatorCard(HIC)–Type2

5

IPC/JEDECJ-STD-033D April2018

DesiccantHandlingandStorageDesiccantcapacitydecreasesrapidlywhenexposedto30°C/60%RH.Thereforethedesiccantshouldremaininthemanufacturer’scontainerorstoredinadrycabinetat<5%RHuntiluse.Whendrypacking,thedesiccantshallberemovedfromthestoragecontainerjustpriortoplacingitintotheMBBandsealingtheMBB.AppendixCprovidesamethodtovalidatethedesiccantunitabsorptioncapacity.

HumidityIndicatorCards(HIC)Type1(Reversible)andType2(Nonreversible)Ataminimum,theHICshallhavethree

(3)colorspotswithsensitivityvaluesof5%,10%RHand60%RH.AnexampleType1HICiss