PCB印制電路板以及HDI生產(chǎn)流程詳細(xì)介紹.英文版

1PCB以及HDI生產(chǎn)流程詳細(xì)介紹.2AGENDA1.DetailManufacturing4-65ProcessFlow(Photo)HDIProducts2.TechnologyRoadmapforPCB&HDI66-70TechnologyRoadmapProcessCapabilityDeltonCONFIDENTIALNONDISCLOSUREDeltonCONFIDENTIALNONDISCLOSUREProcessFlow(PCB&HDI)BACK4Pre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingProcessFlowChart(1)5Pre-engineeringPatternimagingEtchingLaminatingDrillingProcessFlowChart(2)6DesmearCuplatingHolepluggingCuplatingBeltSandingProcessFlowChart(3)7LaminationLaserAblationMechanicaldrillingCuplatingPatternimagingProcessFlowChart(4)8SolderMaskGoldplatingRoutingElectricaltestPatternimagingProcessFlowChart(5)9HolecounterShippingVisualinspectionProcessFlowChart(6)10*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:Nan-Ya,Grace,EMCSheetsize:36.5”*48.8”,40.5”*48.8”,42.5”*48.8”CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2112,2116,1506,7628,7630,RCC111.內(nèi)層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)

COPPERFOILEpoxyGlass12PhotoResist2.內(nèi)層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)13PhotoResist3.內(nèi)層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExpose144.內(nèi)層線路製作(顯影)(Develop)PhotoResist155.內(nèi)層線路製作(蝕刻)(Etch)PhotoResist166.內(nèi)層線路製作(去膜)(StripResist)177.黑氧化(OxideCoating)188.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)199.壓合(Lamination)20典型之多層板疊板及壓合結(jié)構(gòu)...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板21墊木板鋁板10.鑽孔

(Drilling)2211.電鍍Desmear&CopperDeposition2312.塞孔(HolePlugging)13.去溢膠(BeltSanding)2414.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→Option2516.外層壓膜DryFilmLamination(Outerlayer)PhotoResist2617.外層曝光ExposeUV光源2718.AfterExposed2819.外層顯影Develop2920.蝕刻Etch3020.去乾膜StripResist3121.壓合(Build-upLayerLamination)RCC(ResinCoatedCopperfoil)3221.護(hù)形層製作(壓膜)(ConformalMask)DryFilm(乾膜)DryFilm(乾膜)33Artwork(底片)Artwork(底片)22.護(hù)形層製作(曝光)(ConformalMask)BeforeExposureAfterExposure3423.護(hù)形層製作(顯像)(ConformalMask)3524.護(hù)形層製作(蝕銅)(ConformalMask)3625.護(hù)形層製作(去膜)(ConformalMask)3726.雷射鑽孔(LaserAblation)及機械鑽孔38MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.機械鑽孔(MechanicalDrill)3928.電鍍(Desmear&CopperDeposition)4029.外層線路製作(Patternimaging)壓膜(D/FLamination)

41曝光(Exposure)顯像(D/FDeveloping)

42蝕銅(Etching)去膜(D/FStripping)

4330.防焊(綠漆)製作(SolderMask)44DTI94V-0R10531.S/M顯像(S/MDeveloping)32.印文字(LegendPrinting)4533.浸金(噴錫……)製作(ElectrolessNi/Au,HAL……)DTI94V-0R10546DTI94V-0R105DedicateoruniversalTesterFlyingProbeTester34.成型(Profile)35.測試(ElectricalTesting)47DTI94V-0R105DTI94V-0R10536.終檢(FinalInspection)37.O.S.P.(entekplusCu_106A….)→OptionDeltonCONFIDENTIALNONDISCLOSUREDeltonCONFIDENTIALNONDISCLOSUREEquipmentPhotoBACK49EquipmentPhotoExposureＡＯＩ50EquipmentPhotoLaserDrillingM/Drilling51EquipmentPhotoX-RayDrillingCuPlatting52EquipmentPhotoCNCRoutingSEC/EDS53EquipmentPhotoIRThermalShockBACKDeltonCONFIDENTIALNONDISCLOSUREDeltonCONFIDENTIALNONDISCLOSUREHDI

ProductsBACK55LASERBLIND&BURIEDVIALAY-UPA=THROUGHViaHole(導(dǎo)通孔)

B=BURIEDViaHole(埋孔)C=STAGGERBlindVia(雷射盲孔)DCCD=TWOLEVELLaserVia(雷射盲孔)CDCPrepregFR-4CoreRCCFR-4CorePrepregRCCABBABuriedViaandLaserBlindVia564LsMLBwithBlindViaProcess

BVLAYER1B-STAGEPTHLAYER2LAYER3LAYER4SHEARINGD/FPHOTOIMAGE(L2,L3)LAMINATIONCNCDRILLPANELPLATINGD/FPHOTOIMAGE(OUTERLAYER)LIQUIDSOLDERMASKHOTAIRLEVELINGLASERDRILL578LsMLBwithBlindViaProcessDRILLINGLAMINATIONPTHDRILLINGINNERLAYERIMAGEPTHINNERLAYERIMAGE(L2)INNERLAYERIMAGE(L7)D/SPROCESSL1-L2L3-L4L7-L8L5-L6BVPTHLAYER1LAYER2LAYER3LAYER4LAYER5LAYER6LAYER7LAYER8586LsMLBwithBlind&BuriedViaProcessINNERLAYERIMAGE(L3,L4)D/SPROCESSL3-L4LAMINATIONDRILLINGPTHINNERLAYERIMAGE(L2,L5)LAMINATIONLASERDRILLING(L1-L2,L5-L6)DRILLING(MECHANICAL)PTHOUTERLAYERIMAGE(L1,L6)BVPTHL1L2L3L4L5L6596LsMLBwithBlind&BuriedViaProcessINNERLAYERIMAGE(L3,L4)D/SPROCESSL3-L4LAMINATIONDRILLINGPTHINNERLAYERIMAGE(L2,L5)LAMINATIONLASERDRILLING(L1-L2,L5-L6)DRILLING(MECHANICAL)PTHBVPTHL1L2L3L4L5L6OUTERLAYERIMAGE(L1,L6)PLUGGINGPANELPLATIING608LsMLBwithLaserBlindViaProcessINNERLAYERIMAGE(L2-L7)AOIInspectionL4-L5L6-L7BVPTHL1L2L3L4L5L6L7L8L2-L3LAMINATION(L1-l8)LASERDRILLING(L1-L2,L7-L8)DRILLING(L1-L8)(MECHANICALDRILL)PTHOUTERLAYERIMAGE(L1,L8)DoubleSidePROCESS618LsMLBwithLaserBlindViaProcessBVLAYER1LAYER2LAYER3LAYER4LAYER5LAYER6LAYER7LAYER8PTHLASERABLATION(L1-L2,L7-L8)INNERLAYERIMAGE(L3)D/SPROCESSL3-L4LAMINATION(L2-L4)DRILLING(L2-L4)INNERLAYERIMAGE(L6)OUTERLAYERIMAGE(L1,L8)L5-L6LAMINATION(L5-L7)DRILLING(L5-L7)PTHPTHLAMINATION(L2-L7)INNERLAYERIMAGE(L4)INNERLAYERIMAGE(L5)DRILLING(L2-L7)PTHINNERLAYERIMAGE(L2,L7)LAMINATION(L1-L8)628LsMLBwithLaserBlindViaProcessBVPTHLAYER1LAYER2LAYER3LAYER4LAYER5LAYER6LAYER7LAYER88LayersMLBwithLaserBlindViasPTHLASERABLATION(L1-L2,L7-L8)INNERLAYERIMAGE(L3)D/SPROCESSL3-L4LAMINATION(L2-L4)DRILLING(L2-L4)INNERLAYERIMAGE(L6)OUTERLAYERIMAGE(L1,L8)L5-L6LAMINATION(L5-L7)DRILLING(L5-L7)PTHPTHLAMINATION(L2-L7)DRILLING(L1-L8)INNERLAYERIMAGE(L4)INNERLAYERIMAGE(L5)DRILLING(L2-L7)PTHINNERLAYERIMAGE(L2,L7)LAMINATION(L1-L8)636LsMLBwithLaserBlindViaProcessBVLAYER1LAYER2LAYER3LAYER4LAYER5LAYER6PTHLASERABLATION(L1-L2,L5-L6)D/SPROCESSL3-L4OUTERLAYERIMAGE(L1,L6)LAMINATION(L2-L5)DRILLING(L1-L6)PTHDRILLING(L3-L4)PTHINNERLAYERIMAGE(L3,L4)LASERABLATION(L2-L3,L4-L5)INNERLAYERIMAGE(L2,L5)LAMINATION(L1-L6)646LsMLBwithLaserBlindViaProcessBVLAYER1LAYER2LAYER3LAYER4LAYER5LAYER6PTHLASERABLATION(L1-L2,L5-L6)(L1-L3,L4-L6)D/SPROCESSL3-L4OUTERLAYERIMAGE(L1,L6)LAMINATION(L2-L5)DRILLING(L1-L6)PTHDRILLING(L3-L4)PTHINNERLAYERIMAGE(L3,L4)LASERABLATION(L2-L3,L4-L5)INNERLAYERIMAGE(L2,L5)LAMINATION(L1-L6)656LsMLBwithLaserBlindViaProcessBVLAYER1LAYER2LAYER3LAYER4LAYER5LAYER6PTHLASERABLATION(L1-L2,L5-L6)D/SPROCESSL3-L4OUTERLAYERIMAGE(L1,L6)LAMINATION(L2-L5)DRILLING(L1-L6)CuFilledPlating/PTHDRILLING(L3-L4)PTHINNERLAYERIMAGE(L3,L4)LASERABLATION(L2-L3,L4-L5)INNERLAYERIMAGE(L2,L5)LAMINATION(L1-L6)DevelopedBACKDeltonCONFIDENTIALNONDISCLOSUREDeltonCONFIDENTIALNONDISCLOSURETechnologyRoadmapLinkingBACK67TechnologyRoadmapGZPlantLayerReg.Line/Spacing.20082007200520064/4mil3.5/3.5milImmersionNi/AuPCMCIA14LayersBlindViaLine/SpaceHDI5milBuriedC.R.SurfaceFinishEntekMicroVia(D)3/3mil3/3mil4milSelectiveNi/AuImmersionSilver&Tin2.5milLayerReg.2.5/2.5milHalogenFreeLeadFree4mil3.5mil3milGreenMaterial2.5mil3milGoldPlatingHASL68StackViaViaonViaCuFilledPlatingPluggingViaonPTHStaggerVia2008200720052006PCMCIA14LayersBlindViaHDIPlusOneBuriedC.R.ViaStructureMicroVia(D)PlusTwoViaonPTHStaggerViaViaonViaStackViaPlusThree5mil4mil2.5mil3milTechnologyRoadmapGZPlant69CapabilityGZPlant(HDI)2006200720082009DeltonCONFIDENTIALNONDISCLOSUREDeltonCONFIDENTIALNONDISCLOSUREMax.build-uplayercountpersideMin.build-updielectricthickness

Min.microvi