PCB專業(yè)英語和層定義

1.PCB=PrintedCircuitBoard電路板2.CAM=Computeraidedmanufacture計算機輔助1.PCB=PrintedCircuitBoard電路板2.CAM=Computeraidedmanufacture計算機輔助PCB專業(yè)英語(PCBSPECIALENGLISH)3.Pad3.Pad焊盤4.Annularring4.Annularring焊環(huán)5.AOI=automaticopticalinspection5.AOI=automaticopticalinspection自動光學(xué)檢測6.Chargeoffree免費6.Chargeoffree免費7.WIP=workinprocess在線板8.DCC=documentcontrolcenter8.DCC=documentcontrolcenter文控中心9.Legend9.Legend字符10.CS=ComponentSide=TopSide10.CS=ComponentSide=TopSide（頂層）元件面11.SS=SolderSide=BottomSide（底層）焊錫面11.SS=SolderSide=BottomSide（底層）焊錫面12.GoldPlated電金，鍍金13.NickelPlated13.NickelPlated電鎳，鍍鎳14.ImmersionGold14.ImmersionGold沉金=沉鎳金15.CarbonInkPrint15.CarbonInkPrint印碳油16.MicrosectionReport切片報告，橫切面報告16.MicrosectionReport切片報告，橫切面報告17.X-out=Cross-out打“X”報告18.Panel（客戶稱）拼板，（生產(chǎn)線稱）工作板18.Panel（客戶稱）拼板，（生產(chǎn)線稱）工作板19.Marking標記，UL標記19.Marking標記，UL標記20.Datecode20.Datecode生產(chǎn)周期21.Unit21.Unit單元，單位23.ProfileByRouting鑼(銑)外形24.WetFilm濕菲林,濕綠油,濕膜23.ProfileByRouting鑼(銑)外形24.WetFilm濕菲林,濕綠油,濕膜22.Profile外形，輪廓<outline>25.Slot25.Slot槽,方坑26.BaseMaterial=BaseLaminate26.BaseMaterial=BaseLaminate基材,板料27.V-out=V-score27.V-out=V-scoreV28.Finished成品28.Finished成品29.Marketing市場部30.GerberFile30.GerberFileGERBER31.ULLOGO31.ULLOGOUL32.E-Test=ElectricOpen/ShortTest32.E-Test=ElectricOpen/ShortTest電子測試33.PO=PurchaseOrder訂單33.PO=PurchaseOrder訂單34.Tolerance公差35.Rigid,FlexibleBoard35.Rigid,FlexibleBoard剛性,軟性板36.Boardcut36.Boardcut開料37.Boardbaking37.Boardbaking焗板38.Drill鉆孔38.Drill鉆孔39.PTH=PlatedThroughHole鍍通孔,沉銅40.Panelplating40.Panelplating板面電鍍,全板電鍍41.PhotoImage41.PhotoImage圖象,線路圖形42.Patternplating42.Patternplating線路電鍍43.Etching43.Etching蝕板,蝕刻45.SR=SolderResist防焊,阻焊,綠油46.Goldfinger45.SR=SolderResist防焊,阻焊,綠油46.Goldfinger金手指44.SM=SolderMask防焊,阻焊,綠油47.Silkscreen47.Silkscreen絲印字符48.HAL=HASL=Hotair(Solder)leveling48.HAL=HASL=Hotair(Solder)leveling熱風(fēng)整平噴錫49.Routing49.Routing鑼板,銑板50.Punching沖板,啤板50.Punching沖板,啤板51.FOC=finalqualitychecking終檢,最后檢查52.FOA=finalqualityaudit最后稽查(抽查)52.FOA=finalqualityaudit最后稽查(抽查)53.Shippment53.Shippment出貨54.Flux54.Flux松香55.Au55.Au,Cu,Ni,Pb,Tn,Tin-lead56.Leadfree無鉛57.COC=complianceofcertificate57.COC=complianceofcertificate材料證明書58.Microsection=crosssection58.Microsection=crosssection微切片,橫切片59.Chamicalgold59.Chamicalgold沉鎳金60.Mould=punchdie模具,啤模60.Mould=punchdie模具,啤模61.MI=manufactureinstruction制作批示62.QA=qualityassurance62.QA=qualityassurance品質(zhì)保證63.CAD=computeraideddesign63.CAD=computeraideddesign計算機輔助設(shè)計64.Drillbitsize鉆咀直徑<diameter>64.Drillbitsize鉆咀直徑<diameter>65.Bowandtwist65.Bowandtwist板彎和板曲67.Bonding邦定,點焊68.Testcoupon67.Bonding邦定,點焊68.Testcoupon測試模塊(科邦)66.Hit擊打,孔數(shù)69.Thievingcopper搶電流銅皮69.Thievingcopper搶電流銅皮70.Rail-web70.Rail-web71.Break-uptab工藝邊71.Break-uptab工藝邊72.Breakawaytab工藝邊73.GND=ground地線,大銅皮72.Breakawaytab工藝邊73.GND=ground地線,大銅皮74.Holeedge74.Holeedge孔邊,孔內(nèi)75.Stamphole75.Stamphole郵票孔76.Template76.Template天坯,型板,鉆孔樣板(首板)77.Dryfilm干菲林,干膜77.Dryfilm干菲林,干膜78.LPI=liquidphotoimage液態(tài)感光=濕綠油79.Multilayer79.Multilayer多層板80.SMD=surfacemouteddevice80.SMD=surfacemouteddevice貼片,表面貼裝器件81.SMT=surfacemoutedtechnology81.SMT=surfacemoutedtechnology表面貼裝技術(shù)82.Peelablemask=bluegel藍膠83.Toolinghole82.Peelablemask=bluegel藍膠83.Toolinghole工藝孔,管位,定位孔,工具孔84.Fiducialmask84.Fiducialmask測光點,光學(xué)對位點,對光點,電眼85.Copperfoil銅箔85.Copperfoil銅箔86.Dimension86.Dimension尺寸87.Nagative負的,positive正的87.Nagative負的,positive正的88.Flashgold88.Flashgold閃鍍金,鍍薄金89.Engineeringdepartment工程部89.Engineeringdepartment工程部90.Deliverydate90.Deliverydate交貨期91.Bevelling91.Bevelling斜邊92.Spacing=gap間隙,氣隙,線隙PCB的各層定義及描述PCBPCBPCB的各層定義及描述：1、TOPLAYER（頂層布線層）：設(shè)計為頂層銅箔走線。如為單面板則沒有該層。2、BOMTTOM底層布線層3、TOP/BOTTOMSOLDER（頂層/底層阻焊綠油層）：頂層/及本層非電氣走線處阻焊綠油開窗。l 焊盤在設(shè)計中默認會開窗（OVERRIDE：0.1016mm），0.1016mm建議不做設(shè)計變動，以保證可焊性；l 過孔在設(shè)計中默認會開窗（OVERRIDE：0.1016mm），0.1016mm阻焊開窗）中的PENTING過孔開窗。l 另外本層也可單獨進行非電氣走線，則阻用于做標識和特殊字符絲印，可省掉制作字符絲印層。4、TOP/BOTTOMPASTE（頂層/底層錫膏層）：該層一般用于貼片元件的SMT關(guān)系，導(dǎo)出GERBER，PCB5、TOP/BOTTOMOVERLAY（頂層/底層絲印層）：設(shè)計為各種絲印標識，如元件位號、字符、商標等。6、 MECHANICAL機械層）：設(shè)計為PCB機械外形默認LAYER1為外形層其它LAYER2/3/4等可作為機械尺寸標注或者特殊用途，如某些板子需要制作導(dǎo)電碳油時可以使用LAYER2/3/4等，但是必須在同層標識清楚該層的用途。7、KEEPOUTLAYER（禁止布線層）：設(shè)計為禁止布線層，PCBPCBKEEPOUT和MECHANICALLAYER1，則主要看這兩層的外形完整度，一般以M