IC代工生產(chǎn)管理培訓(xùn)

MPC教育資料1：什么是PC2：什么是MPC3：MPC需要關(guān)注和解決那些問題4：MPC專業(yè)詞匯解釋什么是PCPC就是productioncontrolPC是著眼在公司層面，根據(jù)銷售訂單以及生產(chǎn)線產(chǎn)能進行制定生產(chǎn)投入產(chǎn)出計劃職責：產(chǎn)品的投入計劃確保產(chǎn)品交貨期，以及產(chǎn)出計劃。確認制品MOVE情況以及提醒交貨期會有延遲的產(chǎn)品執(zhí)行客戶需求的產(chǎn)品釋放以及停滯等等什么是MPCMPC的客戶是MPP,MPP客戶是PC。也就是說詳細的完成PC所下達的任務(wù)。按生產(chǎn)計劃檢查、跟蹤并準確及時報告生產(chǎn)流程中的問題。依據(jù)WIP、制品交期、設(shè)備負荷、制程時間限制以及在制品及設(shè)備的運行狀況等因素調(diào)整實時調(diào)度系統(tǒng)的運行

提高人員及設(shè)備利用率制品流通率的管理及有關(guān)數(shù)據(jù)的提供依據(jù)生產(chǎn)數(shù)據(jù)計算生產(chǎn)能力。MPC需要解決哪些問題Themissionofamanufacturingfab:TosatisfycustomerandmaximizethecapacityandwaferoutputWhatcustomerwants?OntimedeliveryGoodwaferqualityLowunitpriceMFGindicesindicatestheperformanceofaFabIndexnameShortdescCTCycleTimeTRTurnRatioMoveWafermovementWIPProductionwaferinprocessEngWIPEngineerwaferinprocessYieldFabYieldHoldHoldWIPTerminateEngineerwaferscrapScrapProductionwaferscrapReworkReworkwaferWSWaferstartWOWaferoutKEYC/T英文全名：Cycle/Time中文全名:運轉(zhuǎn)周期定義:theaverageleadtimewhichonewafermustpayforrunning,waiting,holding,andtimeonbankfromwaferstarttoQC-Inspection計算方式:∑Cycle_Time_Waferi/Wafer_Output

計算頻率/單位:天指標意義:1.考量FAB的硅片的運轉(zhuǎn)速度2.衡量FAB的run貨效率TR英文全名：TurnRatioT/R中文全名:在制品周轉(zhuǎn)率定義:Averagenumberofstageswhichonewafercanpenetrateinoneday 每片硅片平均每天跑過的Stage數(shù)計算方式:StageMove/WIPWIP=(BOH+EOH)/2計算頻率/單位:每日指標意義:1.由TurnRatio可知硅片處理速度是否正常2.此指標為StageMove與WIP的比值，因此由此可以得知目前的WIP量是否合理，在制品積壓成本是否過高，以及生產(chǎn)流程是否順暢Move英文全名：WaferMoves中文全名:硅片移動量定義:一片硅片完成一個Stage稱為一個StageMove;一片硅片完成一個Step稱為StepMove計算方式:由Fab中實際操作的硅片數(shù)加總得到計算頻率/單位:每日或每月指標意義:1.由各個移動量可以了解目前硅片之處理速度是否正常2.由移動量預(yù)估硅片是否趕上速度3.籍此衡量各區(qū)域之生產(chǎn)績效WIP英文全名：廣義上Workinprocess在半導(dǎo)體行業(yè):WaferInProcess中文全名:在制品定義:從硅片投入到硅片產(chǎn)出，F(xiàn)ab內(nèi)各站積壓了相當數(shù)量的硅片，統(tǒng)稱為Fab內(nèi)的WIP計算方式:堆積硅片求和計算頻率/單位:每日或每月/片指標意義:衡量一個FAB的生產(chǎn)能力的標志

PWIP:ProductionWIPEngWIP:EngineeringWIPYield英文全名：Yield中文全名:良率定義:產(chǎn)出硅片良品數(shù)量與投入生產(chǎn)之硅片數(shù)量的比率計算方式:硅片產(chǎn)出量/（硅片產(chǎn)出量+硅片報廢量）計算頻率/單位:每月%指標意義:由良率可以顯示所生產(chǎn)硅片之制造環(huán)境，制程，規(guī)格方面之綜合表現(xiàn)，故其為最重要的品質(zhì)指標英文全名名:Hold中文全名名:硅片片擱置定義:在在生產(chǎn)產(chǎn)過程中中因為控控制或者者工程原原因暫時時無法進進行生產(chǎn)產(chǎn)的硅片片數(shù)量計算方式式:所所有holdWIP數(shù)量相加加計算頻率率/單位位:每每日或每每月片片指標意義義:1.衡衡量工廠廠生產(chǎn)穩(wěn)穩(wěn)定度2.衡量量因工程程原因?qū)ιa(chǎn)周周期的影影響HoldTerminate/Scrap英文全名名：Scrap中文全名名:報廢廢硅片定義:totalwaferscrapquantityinFAB計算方式式:所所有Scrap求和計算頻率率/單位:每每日或或每月片片指標意義義:1.衡量量制程穩(wěn)穩(wěn)定度2.衡量量一個FAB的生產(chǎn)良良率3.EngWIPterminate用以衡量量工廠研研發(fā)或者者保持制制程穩(wěn)定定而用掉掉的costRework英文全名名:Rework中文全名名:返工工定義:TotalreworkcountinFablithoarea計算方式式:所所有rework數(shù)目累加加計算頻率率/單位位:每每日或每每月片片指標意義義:1.衡量量Litho制程穩(wěn)定定度2.衡量量litho無效movement數(shù)量WS英文全名名:Waferstart中文全名名:硅片片下線定義:Totalwaferstartcount計算方式式:所所有下線線數(shù)目累累加計算頻率率/單位位:每每日或每每月片片指標意義義:衡衡量工廠廠生產(chǎn)規(guī)規(guī)模WO英文全名名:Waferout中文全名名:硅片片出貨定義:Totalwaferoutcount計算方式式:所所有出貨貨數(shù)目累累加計算頻率率/單位位:每每日或每每月片片指標意義義:衡衡量工廠廠生產(chǎn)規(guī)規(guī)模MFGindicesintroductionWhatisa““Golden”FabMPC需要關(guān)注注哪些問問題WaferMovesWaferStepMoveLocationMoveWaferInProcess(WIP)EndOnHand&BeginOnHandTurnRatio(T/R)-DailyEquipmentUPTimeWaferPerHour(WPH)EquipmentEfficiencyUtilizationManufacturingEfficiencyCycleTimePerMaskLayer(C/T)WaferOutLineYieldWaferAcceptanceTest(WAT)FabYieldWaferMovesDefinitionWaferstepMove=1wafermovingfromoneSteptoanother.WaferstageMove=1wafermovingfromonestagetoanother.MethodofCalculationSumofactualfaborsectionwaferstagemovestogivefabwafersmove,andsectionwafersmoverespectively.PurposeofWaferMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateofthesectionorfabisnormal.UseasameasurementindextocompareshifttoshiftorfabtofabSampleCalculationsScenario1:Particularlotof25waferscompleted4stagesonthe1stofFebruary2000.Scenario2:Particularlotof25waferscompleted70stagesinthemonthofJanuary2000.Scenario1Moves:Onthe1stofFebruary2000,WaferMove=25X4=100Scenario2Moves:InthemonthofJanuary2000,WaferMove=25x70=1750WaferStepMoveDefinitionWaferSTEPMove-1wafermovingfromonesteptoanother.(Note:1Stepisequivalentto1equipmentmoveor1metrologystep.)MethodofCalculationSumofactualfab,sectionorequipmentwaferSTEPmovestogivefabwafersmove,sectionwafersmoveandequipmentwafermovesrespectively.PurposeofWaferStepMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateoftheequipmentorsectionisnormal.Useasameasurementindextocompareequipmenttoequipmentorperformanceofoperatortooperator.SampleCalculationsScenario1:Particularlotof25waferscompleted6stepsonthe1stofFebruary2000.Scenario1StepMoves:Onthe1stofFebruary2000,WaferMove=25X6=150StepMoves(Assumingtheaveragenumberofstepsperstages3steps/stage)StageMoveson1stofFebruary2000=150/3=50StageMovesLocationMoveDefinitionTotalnumberofWaferStageMove––1wafermovingfromonestagetoanother.MethodofCalculationSumofstagemoveswithinprocessarea(CVD,PVD,PHOTO,etc).PurposeofLocationMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateoftheprocessareaisnormal.Useasameasurementindextocomparedaytodayormonthtomonthperformanceofaprocessarea.SampleCalculationsScenario1: WaferMoveintheCVDareaforIMD=1200,PETEOS=800,SACVD=500,HDP=400andBPTEOS=400.Scenario1LocatonMoves:CVDLocationMoves=1,200+800+500+400+400=3,000MovesWaferInProcess(WIP)DefinitionNumberofwafersperstep,stage,section,shiftorfab.(ierunning,wait,hold,etc)MethodofCalculationSumofallwafersinthatstep,stage,section,shiftorfabrespectively.PurposeofWorkInProcessIndexFrompresentamountofwafermoves,wecandetermineifthepresentcapacityoftheequipment,sectionorfabissufficient.Useasanindicatortopossiblebottleneckinthefab.MovementoftheWIPindexwillreflectthestabilityoftheequipment/processandatthesametimethecapability(constraints)oftheequipment.EndOnHand&BeginOnHand(1)DefinitionEOH-WIPperstage,sectionorshiftorfabattheENDofashift.BOH-WIPperstage,sectionorshiftorfabattheSTARTofashift.MethodofCalculationSumofallwafersinthatstage,section,shiftorfabrespectivelyattheendorstartofashift.EndOnHand&BeginOnHand(2)PurposeofEOHandBOHIndexBycomparingtheEOHandtheBOHofashift,wecanhaveafeeloftheperformanceoftheequipmentandtheshift.AnincreaseinWIPfromtheBOHtoEOHmayindicatepoorequipmentstatusinthedifferentfabsorsectionsorshifts,orpoordispatchingskilloftheshiftiftheequipmentstatusisnormal.TurnRatio(T/R)-Daily(1)DefinitionNumberofstagescompletedbyeachwaferperday.MethodofCalculationT/R=TotalStageMovesPerDay/AverageWIP(Note:AverageWIPperday=[BOH+EOH]/2)TurnRatio(T/R)-Daily(2)PurposeofTurnRatioIndexFromtheT/Rwecandetermineifthecurrentwaferproductionrateisnormalortooslow.AsthisindicatortakestheratioofStagemovestoAverageWIP,thereforewecoulddetermineif:CurrentWIPisreasonablerelativetobenchmarkedquantity.IsthecostofWIP(inventory)relativetothecostofequipmentlosttimeproportional.CurrentproductionflowissmoothwithnobottleneckIsthestagetargetrealistic.SampleCalculationsScenario1: Onthe1stofFebruary2000,TotalStageMove(CVD)is10,000,theBOHWIPonthatdayis5,500andEOHWIPonthatdayis6,000.Scenario1T/R:Onthe1stofFebruary2000,T/R=10,000/[(5,500+6,000)/2]=1.74(Note:AnaverageT/Rof2.1to2.2isreasonableforafab)EquipmentUPTime(1)DefinitionTimewhenequipmentisfit-for-production.MethodofCalculationUPTime=RunTime+LostTime+TestTime+BackupTimePurposeofUPTimeIndexFromtheUPTimewecandeterminethetotalamountoftimeavailableforproduction.TheratioofLostTimetoAvailableTimeisusedtodeterminetheroomforimprovementintermsofutilizationforaparticularequipment.EquipmentUPTime(2)SampleCalculationsScenario1:InFebruary2000,RunTime=700hours,LostTime=100hours,TestTime=100hours,andBackupTime=50hoursforWCVDequipment.Scenario1WCVDAvailableTime:InFebruary2000,AvailTime =950hoursLostRate =100/950=10.5%WaferPerHour(WPH)(1)DefinitionNumberofwafersprocessedperhour.MethodofCalculationWPH=WaferMove/RunTimePurposeofWaferPerHour(WPH)Index(1)FromthepresentequipmentWPHwecandeterminewhetherthecurrentequipmentrateofproductiontotalisnormal.TheequipmentWPHcanbeusedtoderivetheequipmentcapacity,whichcanbeinturnusedtodetermineifthetotalcapacityforaparticularcapabilityissufficient.WaferPerHour(WPH)(2)PurposeofWaferPerHour(WPH)Index(2)TheratioofthecurrentequipmentWPHtotheTheoretical–WPH(T–WPH)canbeusedtodetermineiftheequipmentispresentlyoperatingintheoptimumconditions.WPHindexcanalsobeusedtomeasureindividualMAorshiftperformance,especiallysoinmanualoperations.RelativeWPHbetweenequipmentrunningthesamerecipecanbeusedtodeterminetheindividualequipmentSampleCalculations(1)Scenario1:On1stofFebruary2000,RunTime=20hoursandWaferMoves=1700wafersforWCVDequipment.Scenario2:ThesameequipmentforthemonthofFebruary2000,RunTime=600hoursandthetotalWaferMoves=54,000wafers.Scenario3:RunTime=12hours,WaferMovesbyOperatorA=500andOperatorB=400onthesameequipment.SampleCalculations(2)Scenario1WCVDWPH:On1stofFebruary2000,WPH=1,700/20=85wafers/hourScenario2WCVDWPH:InthemonthofFebruary2000,WPH=54,000/600=90wafers/hourTherefore,wecansaythatthecurrentequipmentrateofproductionislowerthantheaverageforthewholemonth.Scenario3:OperatorAhasaWPH=500/12=41.67wafers/hourOperatorBhasaWPH=400/12=33.33wafers/hourEquipmentEfficiency(1)DefinitionPercentageoftheactualwafermovesperhourtotheidealwafermovesperhour.MethodofCalculationEquipmentEfficiency=[(TotalActualWaferMoves/TotalRunTime)/(AverageIdealWPH)]X100%Note:Asthe““IdealWPH””isdependentontherecipeofthelotprocessed,the““AverageIdealWPH””isthesumofthe““IdealWPH””multiplebytheproportionofthenumberoflots(duringtheperiodoftime)withthatrecipedividedbytheTotalRunTime.EquipmentEfficiency(2)PurposeofEquipmentEfficiencyIndexTheequipmentefficiencyindexshowhowmuchdeviationfromtheoptimumperformanceistheequipmentbeingoperatedin.Determineifthereisanyweakness/abnormalitywithanequipmentcapabilities/fabWIPprofile/processcapability.Baseontheefficiencyoftheequipment,weareabletolookintomethodstooptimizetheequipmentandincreasethethroughputoftheequipment.ExamplesExampleofsomesituationsthatLOWERStheequipmentefficiency:Only1SMIFArmisinworkingcondition.Takesalongertimethanusualtoachieverequiredvacuumfortheloadlock––equipmentproblem.SMIFArmunabletounloadautomaticallythereforestatusremains““Run”(RunTimeincreaseswithoutincreaseinoutput)evenwhenwafersalreadycompleteditsprocess.Thebottleneckchamberoftheequipmentisdownandthereforetheimpactdeductedislessthantheactualimpact.Timerequireforachievingvacuumisthesameforalotwith25wafersandonewithonly1wafer.Thereforethetimeperwaferisincreasesignificantlywhenlotwithonly1waferisprocessed.SampleCalculationsScenario1:On1stofFebruary2000,shiftA,WCVDequipment,WaferMoves=375wafers,RunTime=12hours.Thelotsconsistof5lotsofrecipeAand10lotsofrecipeB.RecipeA:IdealWPH=30,RecipeB:IdealWPH=45.Scenario1Efficiency:AverageIdeaWPH=(5/15X30)+(10/15X45)=40waferperhourEquipmentEfficiency=(375/12)/(40)X100=78.13%Utilization(1)DefinitionTheamountoftimedemandedofanequipmentforproduction,versusthetotalamountoftimeavailable.Demand/CapacityMethodofCalculationUtilization=(RunTime+TestTime+BackUpTime)/TotalTimeX100Utilization(2)PurposeofUtilizationIndexForaUtilizationIndexgreaterthan100%forcertainequipment,wecansafelysaythatthepresentequipmentcapacityisnotsufficientforthepresentdemand.Iftheutilizationislowforcertainequipment,buttheWIPishigh,itcouldbeduetotheequipmentnothavingthecapabilitytoruntherecipesrequiredbytheWIP.SampleCalculationsScenario1:Inaday(24hours),WCVDequipmenthasRunTime=12hoursandBackUpTime=6hours.Scenario1Utilization:Utilization=(12+6)/24X100%=75%ManufacturingEfficiency(1)DefinitionPercentageoftheequipmentavailabletimeusedforproduction(RunTime,TestTimeandBackUpTime)overthetotalequipmentavailabletime(RunTime,TestTime,LostTimeandBackUpTime).MethodofCalculationManufacturingEfficiency=(Utilization/Availability)X100%ManufacturingEfficiency(2)PurposeofManufacturingEfficiencyIndexThemanufacturingefficiencyindexcomparestheperformanceoftheoperatorunderahighWIPsituation.Thehighertheefficiencyindexthebettertheperformance.OneoftheindicatorsforlowWIPforspecificequipment,sectionorfab.AhighWIPandlowmanufacturingefficiencyindexcouldbeduetoequipmentconstraintanditscapabilities.SampleCalculationsScenario1:OperatorA’sequipmenthasRunTime=8hours,TestTime=1hour,BackUpTime=0andLostTime=3hours.Scenario1OperatorA:ManufacturingEfficiency=(8+1+0)/(8+1+0+3)X100%=75%CycleTimePerMaskLayer(C/T)(1)DefinitionAveragenumberofdaysrequiredforprocessingbetweentwophotostages.(1layers.onephotostagetoanother)Aseachindividuallayerisdefinedbyaphotostage,thereforethenumberoflayersofaproductisequivalenttothenumberofphotostages.Note:For0.25microntechnology,thereisanaverageof25layers.MethodofCalculationC/T=(TimewhichwaferpassestheQCtest––Timeatwaferstart)/Numberofphotostages.CycleTimePerMaskLayer(C/T)(2)PurposeofWaferMoveIndexBaseonthenumberoflayersoftheproduct,andtheuseoftheaveragecycletimeofthefab,weareabletodeterminetheaveragetimerequiredfortheproductfromstarttocompletion.Thereby,enablingustodecideonthedatefortheproductwaferstartinordertomeetthedeliveryschedule.SampleCalculationsScenario1:Aparticularproducthas16layers,andthetimerequiredfromwaferstarttillQCtestingis40days.Scenario1C/Tperlayer:C/Tperlayer=40/16=2.5daysperlayerWaferOutDefinitionTotalquantityofwafersthatpassestheQCtest.MethodofCalculationProductionController(PC)willannouncedtheofficialWaferOutquantity.PurposeofWaferOutIndexTheWaferOutIndexwillindicatethefaboutputstatus.SampleCalculationsScenario1:InthemonthofFebruary2000,quantityofwafersthatpassesQCtest=15,000wafers.Scenario1WaferOut:InthemonthofFebruary2000WaferOut=15,000wafersLineYieldDefinitionPercentageofwafersproducedbythefabpriortoWAT.MethodofCalculationLineYield=(QuantityofWaferProduced)/[(QuantityofWaferProduced)+(QuantityofWaferScrappedintheProductionProcess)]=(QuantityofWaferProduced)/(QuantityofRawWaferUsedforProduction)PurposeofLineYieldIndexTheLineYieldreflectsthequalityofthemanufacturingsystemofafab.ThehighertheLineYieldthelessermisoperationswithinthefab.SampleCalculationsScenario1:InthemonthofFebruary2000,quantityofrawwafersused=15,500wafers.QuantityofwafersattheWAT=15,000wafers.Totalwaferscrapped=500wafers.Scenario1:LineYield=15,000/15,500=97%WaferAcceptanceTest(WAT)YieldDefinitionPercentageofwaferwhichpassesthecircuitelectricaltest.MethodofCalculationWAT-Yield =(QuantityofWaferPassestheWATTest)/(TotalWaferTested)PurposeofAvailableTimeIndexTheWAT-Yieldreflectsthequalityoftheoutputfromafabintermsoftheelectricalperformanceofthewaferproduced.SampleCalculationsScenario1:InthemonthofFebruary2000,quantityofwaferstestedbyWAT=15,500wafers.QuantityofwafersthatpassesWAT=15,000wafers.Totalwaferscrapped=500wafers.Scenario1:WAT-Yield=15,000/15,500=97%FabYieldDefinitionRatioofthequantityofthewafersthatpassestheIQCtesttothetotalamountofwaferusedfromthestartoftheprocess.Fab-Yield=(LineYield)X(WATYield)MethodofCalculationFab-Yield=WaferOut/(WaferOut+LineScrapped+WATScrapped)PurposeofAvailableTimeIndexTheFab-Yieldthemostimportantindextoafabasitreflectstheoverallperformance.Ittakesintoconsiderationofthemanufacturingenvironment,processstabilityandothercontributingfactorstothequalityoftheoutputfromafab.SampleCalculationsScenario1:InthemonthofFebruary2000,quantityofwafersthatpassesQCtest=15,000wafers.Totalwaferscrapped=1,500wafers.Scenario1:Fab-Yield=15,000/(15,000+1,500)=91%9、靜夜四四無鄰，，荒居舊舊業(yè)貧。。。12月-2212月-22Wednesday,December7,202210、雨中黃黃葉樹，，燈下白白頭人。。。22:10:4822:10:4822:1012/7/202210:10:48PM11、以我獨沈沈久，愧君君相見頻。。。12月-2222:10:4822:10Dec-2207-Dec-2212、故人江海別別，幾度隔山山川。。22:10:4822:10:4822:10Wednesday,December7,202213、乍見見翻疑疑夢，，相悲悲各問問年。。。12月月-2212月月-2222:10:4822:10:48December7,202214、他鄉(xiāng)生生白發(fā)，，舊國見見青山。。。07十十二月202210:10:48下下午22:10:4812月-2215、比比不不了了得得就就不不比比，，得得不不到到的的就就不不要要。。。。。十二二月月2210:10下下午午12月月-2222:10December7,202216、行動出成果果，工作出財財富。。2022/12/722:10:4822:10:4807December202217、做前前，能能夠環(huán)環(huán)視四四周；；做時時，你你只能能或者者最好好沿著