PCB常用詞匯匯編修改版(中英文翻譯)

1、AO（Automatic Optical Inspetion自動光學檢查acceptable quality level(AQL)可接受質量水平accuracy精確度active carbon treatment活性碳處理afterRressed Thickness壓板后之厚度alignment樣直、結盟annular ring錫圈anti-Static Bag靜電膠袋apparatus設備、儀器area面積arwork菲林artwork Drawing菲林圖形artwork Film原裝菲林artwork Modification菲林修改artwork NO.菲林編號assembly組裝、裝

2、配axis軸backplane背板back-up墊板baking烘板ball Grid Array(BGA)球柵陣列bare board裸板base Copper底銅base material基材beveling斜邊=black Oxide黑氧化bling iva hole盲孔blistering水泡board Cutting開料board Thickness板厚bottom side底層breakaway tab打斷點brushing磨刷build-up積層bullet pad子彈盤buried hole埋孔=C /M (component marking)元件字符carbon ink碳油第

3、1頁共11頁carrier帶板ceramic substrate 陶瓷certificate of Compliance 合格證書chamfer 倒角chemical cleaning化學清洗chemical corrosion化學腐蝕chip Scale Package(CSP)晶片比例包裝circuit線路clearance間距/間隙color顏色component Side(C/S)元件面composite layers復合層computer Aided Design(CAD)電腦輔助設計computer Aided Manufacturing(CAM)電腦輔助制作computer Nu

4、merial Control(CNC )數(shù)控conductor導體conductor width/space/線隙contact接點copper area銅面積copper clad銅箔copper foil銅箔copper plating電鍍銅corner角線corner mark板角記號corner REG.Hole角位對位孔cracking裂縫creasing皺折criteria規(guī)格、標準crossection area切面Cu /Sn Plating鍍銅錫current efficiency電流效率customer客戶customer Drilling File客戶鉆孔資料cusome

5、r P/N客戶產(chǎn)品編號D/F registration hole干菲林對位孔D /F (dry film)干膜date code日期代號datum hole基準參考孔daughter board子板deburring去毛刺defect缺陷definition定義delamination分層第2頁共11頁delay耽擱delivery交貨densitomdfer透光度計density密度department部門description說明design origin設計原點desmear去鉆污、除膠desicant防潮珠developer顯影液、顯影機diamond鉆石diazo film重氮片di

6、electric breakdown介電擊穿dielectric comstant介電常數(shù)dielectric thickness介電層厚度dielectric voltage test絕緣測試dimension尺寸Dimensional stability尺寸穩(wěn)定性Direct /indirect直接間接Distribution發(fā)放Document type文件類型Documentation control文件控制Double sided board雙面板Drill bit鉆咀Drilling鉆孔Drilling roughness鉆孔粗糙度Dry film干菲林Dry film-patte

7、rn干膜線路Dynamic動態(tài)ECN(engineering change notification)工程更改通知Effective date有效期Electrical test fixture電測試、針床Electro migration漏電Electroconductive paste導電膠Electroless無電沉Electroless copper無電沉銅Electroless Ni無電沉鎳Electroless Gold/Au無電沉金Engineering drawing工程圖紙Entek有機涂覆Epoxy glass substrate環(huán)氧玻璃基板Epoxy resin環(huán)氧基樹脂

8、Etch蝕刻第3頁共11頁Etchback凹蝕Etching蝕刻E-test mark電測試標記E-Test(electrical test)電測試Exposure曝光External layer外層Fuducial mark基準點Filling填充Film fabrication菲林制作Final QC最終檢查Finish overall board thickness成品總板厚度Fixture夾具Flammability可燃性Flash gold薄金Flexible易曲的、能變形的Flux助焊劑General information一般材料Ghost image重影Glass transi

9、tion temperature玻璃化濕度Gold finger (G/F)金手指Golden board金板Grid網(wǎng)格Ground plane地線層HAL(hot leveling)熱風整平Hand rout手鑼Hardness硬度Heat sealed熱密封Heat shrink-warp熱收縮Holding time停留時間Hole孔Hole breakout破環(huán)Hole density孔的密度Hole diamerter孔徑Hole location孔位Hole location chart孔位座標表Hole position tolerance孔位誤差Hole size孔尺寸Hot

10、 air leveling(HAL)熱風整平Humidity濕度Identification標識、指標Image影像Maging transfer圖形轉移Impedance阻抗第4頁共11頁Impedance test阻抗測試Inner copper foil內(nèi)層銅箔Imspection檢驗Insulation resistance test絕緣測試vsInterleave paper隔紙Internal layer內(nèi)層Internal stress內(nèi)應力Ionic cleanliness離子清潔度Isolation孤立Isolation resistance絕緣電阻Item項目KEY boa

11、rd按鍵盤Key slot槽孔Kraft paper牛皮紙Laminate板材Laminate thickness材料厚度Lamination void層間空洞Landless hole破孔Laser plotter激光繪圖機Laser plotting激光繪圖Laser via hole激光穿孔Layup層壓配本Lay-up instruction壓板指示Legend字符Legend width字符寬度Length長度Lifted lands殘銅Line width線寬Liquid液體Location位置Logic diagram邏輯圖形Logo嘜頭、標記Lot size批卡Mark標記Ma

12、ster drawing菲林圖形Material thickness材料厚度Material type材料類型Max.X-out壞板上限Max.board thickness after plating電鍍后總板厚度之上限Measling白斑Mech drawing no.圖紙編號Mechanical cleaning機械清洗第5頁共11頁Metal金屬Method方法MI(manufacturing instruction)生產(chǎn)制作指示Microstrip微條線Min conductor copper thickness最小線路銅厚Min hole wall copper thickness

13、最小孔壁銅厚Min.gold plating thickness最小金厚Min.nickel thickness最小鎳厚Min.tin-lead thickness(after HAL)（噴錫后）最小錫厚Min.annular ring最小環(huán)寬Min.spacing between line to line線與線之間的最小距Min.spacing between line to pad線與焊盤之間的最小距離Min.spacing between pad tp pad焊盤與焊盤之間的最小距離Minium最小Mirroring鏡像Missing缺少Model no.產(chǎn)品名稱Molded模塑Moth

14、er board主板Moulding模房Mounting hole安裝孔Multiplayer多層板Multilayer laminate多層板材料Negative反面的Net list網(wǎng)絡表Network網(wǎng)絡Nick缺口No.of holes孔數(shù)No.of array/panel每個拼板套板數(shù)No.ot panel per stack每疊板數(shù)No.of panel/sheet每張大料拼板數(shù)No.of pcs per bag每包數(shù)量No.of unit .array每套單元數(shù)Normal value標準值Oblong橢圓形的Offset偏移Open/short短路Optimization(de

15、sign)最佳化（設計Organic solerability preservatives(OSP)有機保護劑Originator原作者Outer copper foil外層銅箔Outline外形Packing包裝第6頁共11頁Pad焊盤Panel area拼板面積Panel plated crack板鍍?nèi)笨赑anel plating整板電鍍Panel size拼板尺寸Panel size after outer layer cutting外層切板后拼板尺寸Panel utilization拼板利用率Pass rate通過率Passivation鈍化Pattern線路Pattern inspe

16、ction線路檢查Pattern plating圖形電鍍PCB(printed circuit board)印制線路板Peck drilling啄鉆Peel strength剝離強度Peelable可剝性Peelable剝離強度Peelable mask可脫油Peeling剝離Permanent永久性Ph valuePH 值Photo plotting圖形輸出Photo via hole菲林過孔Photographers照片靶標Photoplotler光繪機Physical物理的Pin hole銷釘孔Pink ring粉紅環(huán)Pinning hole鉆孔管位Pitch間距Placement放置P

17、lated though hole (PTH)沉銅Plating電鍍Plating crack電鍍裂縫Plating line電鍍線Plating rack電鍍架Plating void電鍍針孔Plug hole塞孔Polymer聚合體Porosity孔隙率Positive絕對的Power plane電源層Prepreg半固化片第7頁共11頁Primary side首面Print印刷Probe point針床測點Process工序Process flow工序流程Product planning department生產(chǎn)計劃部Production生產(chǎn)板Profile外形Profiling外形加工

18、Profiling process外形加工Project no.產(chǎn)品編號PTH thermal seress testPTH 熱沖擊測試PTH(plating through hole)沉銅Pull away拉離Punch啤模Punching沖切Punching mould drawing啤模圖形QA audit品質審計QA(quanlity asssuance)品質部Quad palt pack(QFP)四邊扁平林整器件Quality質量Quantity數(shù)量Raw material utilization原材料利用率Recall回收Rectifier整流器Register mark對位點Re

19、gistration重合點Remark備注Resin樹脂Resin recession流膠Resist抗蝕刻Resolution分辨率Rigid精密的Roller coating涂覆Roughening粗化Round pad圓盤Routing外形加工、銑板S/M material綠油物料S/M(solder mask)阻焊Sales銷售Sample樣板Sampling imspection抽樣檢驗Scaling factor縮放比例因素第8頁共11頁Scope范圍Scoring刻槽Scratch劃痕Secongdary side第二面Section code組別代號Section code c

20、hange組別代號更改Segment部分、片段Separated分離Sequence順序Sets套Sheet size大料尺寸Shematic diagram原理圖Shiny有光澤的、發(fā)光的Silk screen絲印Silver film銀鹽片Single /double/雙面Slot槽、坑Smear污點Solder mask阻焊Solder mask on bare copper(smobc)裸銅覆蓋阻焊膜Solder side焊接面Solder side C/M阻焊面字符Solder side Cir.焊接面線路Solder side circuit焊接面Solder side S/M焊接

21、面阻焊Sokderaility可焊性Solvent test可溶性測試Spacing線距Special requirement特殊要求Apccification詳細說明、規(guī)范Spindle主軸Split裂片Square pad方塊Standard標準值Static靜態(tài)Stencil網(wǎng)版Step drilling分布鉆Step scale光梯尺Store貨倉Supplier供應商Supported hole支撐點Surface表面Surface mount technology表面組裝技術第9頁共11頁Swimming滑移Tack堆起Tape programming鉻帶制作Tape test膠帶

22、測試Target hole目標孔Teardrop淚珠Template天平Tenting封孔Test測試Test coupon圖樣Test parameter測試參數(shù)Test pattern測試孔Testing voltage電壓Thermal shock熱沖擊Thermal stress熱應力Thickness厚度Tin content錫含量Tin/lead stripping退鉛錫Tin /lead plating電鍍鉛錫Tolerance公差Top side板面Touch up修理（執(zhí)漏）Training訓練Transmission傳輸線Transmittance傳送Trim line修剪

23、Ultrasonic cleaning超聲波清洗Undercut側蝕Unit arrangement單元排版Unit layout per panel單元拼板圖Uv-blocking阻擋紫外線Vacunm pack真空包裝Vacuum lamination真空壓制V -cutV 坑View from觀察方向由Visual&warpage可視性和翹曲度Visual inspection目檢電壓W/F(wet film)濕膜Warp&twist翹曲和彎曲Wet film濕膜Width寬度Wiring線路第10頁共11頁Our standard form has two pages ,page one is mention P/N,qty,price,In house date and ship to address.Page two is mention the outside carton box label.Supplier has to stick or print it on each carton box on two short sides.Engineer