焊線原理介紹（最新）

1、什麼是 WIRE BOND L/FDIE鋁墊銲金線一. W/B 銲線基本理論 :二. BONDING (固態(tài)銲接)的四大基本要素 : 要如何才能得到最佳的銲接，主要要素如下 A. 壓力。(BOND FORCE) B. 振盪功率。(BOND POWER) C. 銲接時(shí)間。(BOND TIME) D. 銲接溫度。(TEMPERATURE)1. 目前我們電子產(chǎn)品銲接是採(cǎi)用固態(tài)銲接， 所謂固態(tài)銲接，就是金屬在未達(dá)熔解溫度 下之銲接。決定固態(tài)銲接的要素有那些？ 1. 鋁墊之構(gòu)造: a. 最上層為少量水氣與雜質(zhì) b. 第二層為氧化鋁 c. 第三層才是純鋁 d. 第四層是二氧化鋁 e. 最下層就是矽層 2.

2、 最佳之銲接，就是金球與純鋁密切結(jié)合。 故如何運(yùn)用四大基本要素，掌控最佳配合 時(shí)機(jī)為學(xué)習(xí)要旨。 如壓力、振盪過大會(huì)造成缺鋁或矽崩 過小昨則無(wú)法有效排除第一、二層與純鋁 層作密切接合銲接。三. 金球與鋁墊之最佳銲接 :溫度溫度金球二氧化矽層矽層純鋁玻璃層水氣及雜質(zhì)氧化鋁壓力(FORCE)振盪(POWER)金球與鋁墊的銲接模式鋁墊SEM側(cè)視圖BONDING 時(shí)銲針位置之時(shí)序圖RESET 位置LOOP HEIGHTTO RESET加速度 REVERSE LOOP留線尾燒一個(gè)金球等速度 逆打等速度1 ST BOND TIMEKINK HEIGHT2 ND BOND TIME銲針高度TIME時(shí)間L/FD

3、IE鋁墊銲金線* WIRE BOND *padleadFree air ball is captured in the chamferFree air ball is captured in the chamferpadleadFree air ball is captured in the chamferpadleadFree air ball is captured in the chamferpadleadFree air ball is captured in the chamferpadleadFormation of a first bondpadleadFormation of

4、a first bondpadleadFormation of a first bondpadleadheatPRESSUREUltrasonic VibrationFormation of a first bondpadleadUltra Sonic VibrationheatPRESSURECapillary rises to loop height positionpadleadCapillary rises to loop height positionpadleadCapillary rises to loop height positionpadleadCapillary rise

5、s to loop height positionpadleadCapillary rises to loop height positionpadleadFormation of a looppadleadFormation of a looppadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadFormation of a second bondpadleadheatFormation of a second bondpadleadheatheatpadleadheatheatpadleadheatheatpadleadpadleadpadleadpadleadpadleadpadleadpadleadDisconnection of the tailpadleadD