封裝專用英語詞匯修訂版

1、封裝專用英語詞匯集團(tuán)標(biāo)準(zhǔn)化小組：VVOPPT-JOPP28-JPPTL98-IM常見封裝形式簡介DIP =DualInlinePackage =雙列直插封裝HDIP =DualInlinePackage with Heat Sink=帶散熱片的雙列直插封裝SDIP =ShrinkDual Inline Package =緊縮型雙列直插封裝SIP =SingleInlinePackage =單列直插封裝HSIP =SingleInline Package with Heat Sink =帶散熱片的單列直插封裝SOP =SmallOutlinePackage =小外形封裝HSOP =SmallOu

2、tlinePackage with Heat Sink =帶散熱片的小外形封裝eSOP =Small Outline 1Package with exposed thermal pad = 載體夕卜露于塑封體的小外形封裝SSOP =TSSOP =Shrink SmallThin ShrinkOutline Package = 緊縮型小外形封裝Small Outline Package =薄體緊縮型小外形封裝TQPF =PQFP =Thin ProfilePlastic QuadQuad Flat Package =薄型四邊引腳扁平封裝Flat Package =方形扁平封裝LQPF =Low

3、Profile Quad Package =薄型方形扁平封裝eLQPF = Low Profile Quad Flat Package with exposed thermal pad =載體外露于塑封體的薄型方形扁平封裝DFN = Dual Flat Non-leaded Package =雙面無引腳扁平封裝QFN = Quad Flat Non-leaded Package = 雙面無引腳扁平封裝TO = Transistor package = 晶體管封裝SOT = Small Outline of Transistor = 小外形晶體管BGA = Ball Grid Array =球柵

4、陣列封裝BQFP = Quad Flat Package With Bumper =帶緩沖墊的四邊引腳扁平封裝CAD = Computer Aided Design =計(jì)算機(jī)輔助設(shè)計(jì)CBGA = Ceramic Ball Grid Array = 陶瓷焊球陣列CCGA = CSP = DFP = DSO = 3D = 2D = FCB = IC = I/O = LSI = MBGA = MCM =Ceramic Column Grid Chip Size Package Dual Flat Package Dual Small Outline Three-Dimensional Two-Dim

5、ensional Flip Chip Bonding Integrated Circuit Input/Output Large Scale Integrated Metal BGA = Multichip Module =Array =陶瓷焊柱陣列 芯片尺寸封裝 雙側(cè)引腳扁平封裝 雙側(cè)引腳小外形封裝 三維_維N裝焊集成電路 輸入/輸出Circuit =大規(guī)模集成電路 金屬基板BGA 多芯片組件p I B MFFMSOLPCPGASIPSOTSOPSOPWBMultichip Package =多芯片封裝Microelectro Mechanical System = 微電子機(jī)械系統(tǒng)Mini

6、Flat Package =微型扁平封裝Medium Scale Integration =中規(guī)模集成電路Outer Lead Bonding=外引腳焊接Plastic BGA=塑封 BGAPersonal Computer=個(gè)人計(jì)算機(jī)Pin Grid Array =針柵陣列System In a Package=系統(tǒng)級封裝Small Outline Integrated Circuit = 小外形封裝集成電路Small Outline J-Lead Package = 小外形 J 形引腳封裝Small Outline Package = 小外形封裝 System On a Package =

7、 系統(tǒng)級封裝 Wire Bonding=引線健合Wafer Level Package=晶圓片級封裝常用文件、表單.報(bào)表中英文名稱清除通知單 工程變更申請 持續(xù)改善計(jì)劃 戴爾專案 收據(jù) 數(shù)據(jù)表 核對表 文件清單 設(shè)備清單 調(diào)査表，問卷 報(bào)名表 追蹤記錄表 日報(bào)表 周報(bào)表 月報(bào)表 年報(bào)表 年度報(bào)表 財(cái)務(wù)報(bào)表 品質(zhì)報(bào)表 生產(chǎn)報(bào)表 不良分析報(bào)表 首件檢查報(bào)告 初步報(bào)告（或預(yù)備報(bào)告） 一份更新報(bào)告 一份總結(jié)報(bào)告糾正與改善措施報(bào)告（異常報(bào)告單） 出貨檢驗(yàn)報(bào)告Purge noticeECR(Engineering Change Request)CIP(continuous improvement plan

8、) Dell ProjectReceiptDatd sheetCheck listDocumentation checklistEquipment checklistQuestionnaireEntry formTracking logDaily reportWeekly reportMonthly reportYearly reportAnnual reportFinancial reportQuality reportProduction reportFAR(Failure analysis report)First article inspection report Preliminar

9、y report An undated reportA final reportCAR (Corrective Action Report)Outgoing Inspection Report符合性報(bào)告（材質(zhì)一致性證明） 稽核報(bào)告品質(zhì)稽核報(bào)告制程稽核報(bào)告5S稽核報(bào)告客戶稽核報(bào)告供應(yīng)商稽核報(bào)告年度稽核報(bào)告內(nèi)部稽核報(bào)告外部稽核報(bào)告SPC報(bào)表（統(tǒng)計(jì)制程管制）工序能力指數(shù)（Cpk）（規(guī)格）上限（規(guī)格）下限規(guī)格上限規(guī)格下限上控制限（或管制上限）下控制限（或管制下限）最大值平均值最小值臨界值MRB單（生產(chǎn)異常通知報(bào)告） 工藝流程圖TECN自主點(diǎn)檢表隨件單（流程卡） 壓焊圖 晶圓管制卡晶圓進(jìn)料品質(zhì)異常反饋單

10、Quality Problems 訂購單 出貨通知單 送貨單/交貨單 詢價(jià)單可靠性實(shí)驗(yàn)報(bào)告 產(chǎn)品報(bào)廢單 特釆控制表返工單異常處理行動(dòng)措施COC(Certificate of Compliance)Audit reportQuality audit reportProcess audit report5S audit reportCustomer audit reportSupplier audit reportAnnual audit reportInternal audit reportExternal audit reportStatistical process controlProce

11、ss capability indexUpper limitLower limitUpper Specification Limit(USL)Lower Specifiedtion Limit(LSL)Upper Control Limit(UCL)Lower Control Limit(LCL)Maximum valueAverage valueMinimum valueThreshold value / critical value Material Review Board Report Process Flow Diagram物料清單（產(chǎn)品結(jié)構(gòu)表/用料結(jié)構(gòu)表）BOM （Bill of

12、Materials ）合格供應(yīng)商名錄 異常報(bào)告單AVL (Approved Vendor List)CAR工程規(guī)范報(bào)告通知單（工程變更通知）ECNSelf Check ListTraveling Card (Run Card)Bonding diagramWafer inspection cardFeedback Report for Wafer IncomingPO (Purchase Order)Advanced Ship NoticeDO (Delivery Order)RFQ(Request for quotation)Reliability Monitor ReportPSBCRBP

13、RBOCAP減?。篧afer *weifm 威化餅干、電子晶片（晶圓薄片）GrindEgraind 1 vt. & vi.磨碎；嚼碎 n .磨，碾 Crack krkj vt. & vi.（使）開裂，破裂肚裂縫，縫隙InktikZ n.墨水，油墨Die dai vt. & vi. 死亡（芯片）Dotdtl n .點(diǎn)，小圓點(diǎn)Mounting *maunti n.裝備,襯托紙Tapeteip n.帶子；錄音磁帶；錄像帶SizeEsaizJ n.大小，尺寸，尺碼Thick0ik adj.厚的，厚重的 Thickness iknis n.厚（度），深（度）寬（度）Positionp 4zi?n n.方

14、位，位置Roughrfl adj .粗糙的；不平的Fine fain adj.美好的，優(yōu)秀的，優(yōu)良的，杰出的 Speed spi : d_ n.速度，速率Sparkspa:k_ n.火花；火星Out autl adv.離開某地，不在里面；（火或燈）熄滅 Grindstone graindstunZ n.磨石、砂輪Mount mauntZ vt. & vi.裝上、配有Mounter 裝配工;安裝工;鑲嵌工Mount ing *mauntij/2.裝備，襯托紙MagazineE, mgzi：n n.雜志，期刊，彈藥庫（傳遞料盒） Cassette k 4 setn.盒式錄音帶；盒式錄像帶Inspe

15、ctin spektvt.檢查，檢驗(yàn)，視察InspectionEin *spekn n.檢查，視察Cardka:d n.卡，卡片，名片劃片：Saws： n. 鋸 vt. & vi.鋸，往復(fù)運(yùn)動(dòng)Sawing s: iI n.鋸，鋸切，鋸開FilmEfilm n.影片，電影（薄膜,藍(lán)膜）Frame freim n.框架，骨架，構(gòu)架 Cleankli:nZ adj清潔的，干凈的；純凈的 Cleaner 4kli：n盡作清潔工作的人或物 Oven vn”.烤箱，爐Cassettek set： n.盒式錄音帶；盒式錄像帶 Handler h?ndl a.（物品、商品）的操作者 Scribe skraib

16、Z n .抄寫員，抄書吏Street? n.大街，街道BladeEbleidl n.刀口，刀刃，刀片Cut ktZ vt. & vi.切，剪，割，削Speed spi：d_ n.速度，速率Spindle *spindlj n.主軸，（機(jī)器的）軸SizeEsaiz n.大小，尺寸，尺碼CoolingE ku: liZ adj.冷卻（的）Kerfk：fl n.鋸痕，截口，切口WidthEwid 11 1 n .寬度，闊度，廣度Chip tip n.碎片、缺口Chippingt *t?ipil n.碎屑，破片Crackkr?k 吒.（使）開裂，破裂刀.裂縫，縫隙 MissingE *misil ad

17、j.失掉的，失蹤的，找不到的 Die dail vt. & vi.死亡（芯片）Saws: j n.鋸 vt. & vi.鋸，往復(fù)運(yùn)動(dòng) Street stri:tZ 刀.大街，街道FilmfilmL 刀.電影（薄膜，藍(lán)膜）影片，F(xiàn)rame freiml n. 框架，骨架，構(gòu)架 Tape teip 刀.帶子：錄音磁帶；錄像帶Bubble bblZ n.泡，水泡，氣泡 mount貼frame框架tape膜loader上料un-loader出料air空氣pressure壓力alignment校準(zhǔn)ink黑點(diǎn)limit限制cover蓋子saw切割water水sensor感應(yīng)器wheel輪子check檢查f

18、eed進(jìn)給cutter切割new新clean清洗？wafer晶圓blade刀片cassette盒子initial初始化failure失敗die芯片-device產(chǎn)品elevator升降機(jī)setup測高speed速度shift輪班completion完成open打開vacuum真空error錯(cuò)誤data數(shù)據(jù)spindle主軸rotary旋轉(zhuǎn)height高度pause暫停center中心chip崩邊change變換enter確認(rèn)alarm報(bào)警Off center偏離中心broken破的上芯：Attach tt vt. & vi.貼上；系；附上 BondEbndn.連接，接合，結(jié)合vt.使粘結(jié)，使結(jié)

19、合Bonder bud1 n.聯(lián)接器，接合器,粘合器Die attach material epoxy 粘片膠Epoxye pksin.環(huán)氧樹脂（導(dǎo)電膠）Haterialm 1tirilj n.材料，原料Non-conductive epoxy 絕緣膠Conductivekn dktiv adj. 傳導(dǎo)的Dispenser dis pens： n.配藥師，藥劑師 NozzleE *nzl n.管嘴，噴嘴Rubber *rb1 n（合成）橡膠，橡皮TipEtipj n. 尖端，末端Die pick-up tool 吸嘴Too lt u: 1 n.工具，用具Collect k *lektZ vt.

20、收集，釆集（吸嘴）Ejectori 4dekt1 n.驅(qū)逐者，放出器,排出器PinEpin n.針，大頭針，別針Lead Frame 引線框架LeadEli ：dj vt. & vi.帶路，領(lǐng)路，指引Frame freim. n.雜志，期刊（料盒）框架，骨架，構(gòu)架 Magazine , mg zi:n n.Curing kjurin.塑化，固化，硫化，硬化Oven * vnj n.烤箱，爐Scrapskrpj n.小片，碎片，碎屑Dent denta 凹痕，凹坑Die L辻t-off晶粒脫落（芯片脫落，掉芯）SkewEskju： J adj.歪，偏，斜Misorientation? mis,

21、:rien tein n.定向誤差，取向誤差Pre squeeze del寫膠前氣壓延時(shí)Post squeeze del寫膠后氣壓延時(shí)Squeezeskwi:zvt. 榨取，擠出n.擠，榨，捏Eject i dektvt. & vi .彈出，噴出，排出Delaytdi lei：n.延遲Heigh t hait jn.高度，身高Level levl_ n.水平線，水平面；水平高度HeadEhed刀.頭部，領(lǐng)導(dǎo)，首腦Eject up delay頂針延遲Eject up height頂針高度Bond level粘片高度Pick Level撿拾芯片高度Head pick delay粘接頭拾取延遲Hea

22、d bond delay粘接頭粘接延時(shí)Pick delay撿拾芯片延時(shí)Bond delay粘接芯片延時(shí)Crack krkj vt. &viCrack krkj vt. &viIndex indeksj n.索引；標(biāo)志，象征；量度Clamp klmplvt. & vi. 夾緊；夾住n.夾具Index clamp delay步進(jìn)夾轉(zhuǎn)換延時(shí)Index delay框架步進(jìn)延時(shí)Shear iJ吐剪羊毛，剪n大剪刀Test test刀.Die shear testThickness 0 iknis測驗(yàn)，化驗(yàn)，試驗(yàn)，檢驗(yàn) 推晶試驗(yàn)n.厚（度人粗Coverage kvridjn.覆蓋范圍Epoxy thick

23、ness & coverage 導(dǎo)電膠厚度和覆蓋率OrientationE, :rien 4teinj 刀.方向，目標(biāo)Die Orientation芯片方向Voidvidadj. 空的，空虛的刀.太空，宇宙空間;空隙,空處;空虛感,失落感Epoxy void導(dǎo)電膠空洞ChipEtipJ 碎片Damage 4dmid. vt. & 卩丄損害，毀壞，加害于 盡 損失，損害，損毀Chip damage芯片損傷Backside bksaidj 刀.臀部，屁股，背面Chip backside damage芯片背面損傷TiltEtilt（使）傾斜Tilted die芯片歪斜Epoxy on die芯片粘膠

24、（使）開裂，破裂裂縫，縫隙Crack dieLi.ft lift J vt. & vi.芯片裂縫/芯片裂痕舉起，抬起 抬，舉Lifted die Misplace , mis把放錯(cuò)位置 Misplaced die NO die on L/F Insufficient, ns 4fintj adj.不足的，不夠的Insufficient epoxy Epoxy crack Epoxy curing EdgetedZ刀.邊，棱，邊緣Partial wpa: 1Z adj 部分的，不完全的 Mirror *mirj刀.翹芯片4pleisvt.設(shè)置芯片空粘導(dǎo)電膠不足 導(dǎo)電膠多膠 銀漿烘烤鏡子Missi

25、ngE *misiZ adj.失掉的，失蹤的，找不到的Edge die / partial dieMirror dieMissing dieSplash splvt.Splatter * spItvt.（使某物）濺潑Diagram daigrmj刀.Ink splash / ink splatterDie bonding diagram邊緣片/邊沿芯片光片/鏡子芯片掉芯/漏芯/掉片使（液體）濺起Vi.（液體）濺落 & vi.圖解，簡圖，圖表墨濺上芯圖Die shesr testDie shear testerDie shesr tool推片實(shí)驗(yàn)/推晶試驗(yàn)推片試驗(yàn)機(jī) 推片頭Gold wire金絲

26、Pad pd給裝襯墊，vt.加墊子n.墊，護(hù)墊Bond pad焊點(diǎn)、鋁墊1st bond第一焊點(diǎn)Pad size焊點(diǎn)尺寸/鋁墊尺寸CapillaryEk P訂ri刀毛細(xì)管；毛細(xì)血管（劈刀）PitchEpitJ程度；強(qiáng)度；高度Pad pitch鋁墊間距/焊點(diǎn)間距Elongationti : 14gei?n刀延長；延長線；延伸率Breaking 4breiki 破壞，阻斷Load ludjn.負(fù)荷；負(fù)擔(dān);工作量，負(fù)荷量Breaking LoadPullpul破斷力吒& vi.拉，扯，拔Shearij吒剪羊毛，剪門.大剪刀Wire pull / ball pullWire shear / ball

27、shear（焊絲）拉力（焊絲）推力Ultrasonic , ltr * snikj adj.（聲波）超聲的Power 4pauJ功力，動(dòng)力，功率Forcef:sn.力；力量；力氣Ultrasonic power超聲功率Bonding force壓力Bonding time時(shí)間Temperature 4tempritj溫度，氣溫Bonding temperature溫度Ultrasonic wire bonding超聲波圧焊EFOLoop height孤高Wire pull test拉力試驗(yàn)Ball shear test金球推力試驗(yàn)打火燒球looplu：pj圈，環(huán)，環(huán)狀物PIN 1Ball he

28、ight球高Ball diameter球徑第一腳Cratering 4kreitri縮孔;陷穴（彈坑）KOH etching testKOH腐蝕試驗(yàn)Bond Cratering test汗焊腐蝕試驗(yàn)（彈坑試驗(yàn)）熱的，熱量的熱壓焊Thermal0 :mljCompressionkm 4prenj擠壓，壓縮TCB ( Thermal Compression Bond)Bonding Diagram壓焊圖/布線圖布線錯(cuò)誤Wrong Bonding線鉤（測拉力）推球頭（測推力）Incomplete, nkm 4pli:tjIncomplete bondNo bondingN2 BOXRTPCTrayt

29、rei盤子，托盤Handing TrayFBIFBI insp-M/CMicroscope 4maikrskupj 顯微鏡Low Power MicroscopeFluxfIks熔劑、焊劑；助熔劑，助焊劑HookEhuk鉤住，吊住，掛住Wire pull hookBall shear tooladj.不完全的，未完成的焊不牢無焊氮?dú)夤駥?shí)時(shí)過程監(jiān)控刀.產(chǎn)品盤壓焊后LI檢圧焊檢驗(yàn)機(jī)低倍顯微鏡vt. & vi.Metal *metljn.金屬Discolordis *kl匕使脫色；（使）變色，（使）褪色Oxide 4ksaidJn.氧化物Metal Discolor鋁條變色Bond Pad Disc

30、olor鋁墊變色Bond Pad Oxide鋁墊氧化StickEstikJvt. & vi.粘貼，張貼a剝皮，剝下的皮PeelingE *pi:liCratering 4kreitri.刀縮孔;陷穴(彈坑) Nonstick bond on pad Bond pad peelingBond pad cratering Limit * limit 限制；限定ScratchEskrtj 抓，搔，刮傷Over rework limitBond remove / seratchBall bond non-stickBall to large (small)Ball bond shortNon-stic

31、k on lead misplaceE, mis pleis 把放錯(cuò)位置 connectionk 4neknj Misplaced bond on LD Wire brokenMissing wireWrong connection defectiveEdi fektivj 有缺陷的，欠缺的Defective loopingSagging sgi鋁墊不粘鋁墊脫落鋁墊彈坑vt.vt. & vi.超過返工數(shù)剔球劃傷金球脫落金球過大（小）金球短路引腳脫落（魚尾脫落）vt.n.連接，聯(lián)結(jié)壓焊打偏斷線漏打錯(cuò)打adj.弧度不良下垂沉，陷，松垂，垂度Loop saggingLow loopHigh loop

32、Loop shortOverhang , uv *h弧度下陷弧度太低弧度太高弧度短路吒伸出；懸掛于之上n.剩余，余渣刀歪曲，曲解Residue rezidju:Distortiondis *t：nWire overhang on LDWire residueLF distortionQuantity kwntiti 數(shù)目，數(shù)量Mismatch mis mtJScrapskrpj廢料Vt.廢棄，丟棄ScratchskrtlQuantity MismatchEmptynot scrapGold Wire Scratch跨越引線框架殘絲引線框架變形刀.就.使配錯(cuò)，使配合不當(dāng)?shù)?卩匕刮傷數(shù)量不符 空粘

33、未報(bào)廢 金絲受損Parameter參數(shù)Statistics統(tǒng)計(jì)Utility應(yīng)用Contact search接觸測Teach教習(xí) Bond tip offset一焊線點(diǎn)糾偏Zoom off center放大倍數(shù)偏心校準(zhǔn)Cali bra t i on校準(zhǔn)BQM焊接質(zhì)量控制PRpatterrecognition一圖像識別Alignment tolerance對點(diǎn)偏差PR indexing圖像控制下的步進(jìn)Capillary焊線劈刀Wire spool送線卷軸Window clamp一窗口夾板Transducer一功率換能器FTX 功能鍵Wire threading一送線器 EFO 電子打火 Line

34、ar power 線性馬達(dá) Vacuum sensor 真空感應(yīng)器Step driver一步進(jìn)驅(qū)動(dòng)Post bond inspection一焊接后檢查Wire pull一拉線Ball shape一推球Ball size一焊球大小Ball thickness一焊球尚度Loop height一線弧高度Loop shape一線弧形狀Neck crack一線頸折損Fine adjust -精確調(diào)整Conversion - 換產(chǎn)品1st bond non stick第一點(diǎn)不粘2nd bond non stick一第二點(diǎn)不粘peeling拔鋁墊（扯皮）Bond off脫焊 Ball deformation

35、一焊球變形servo motor一伺服電機(jī)weld off管腳脫焊crater裂縫gold wire金線missing ball球未燒好塑封：MoldEmuld 模子，鑄型vt. 澆鑄，塑造Molding *muldi 成型（塑封） Compound kmpaund Moiding M/C： Mold Press Presspres 印刷機(jī)weak bond虛焊刀.刀.刀.復(fù)合物，化合物塑封機(jī)Heater khi:tJ刀.加熱器；爐子Pre-heat er預(yù)熱機(jī)ChaseEteisJn追捕，追獵Mold die / Mold chaseMGP moldAuto moldloadEludJ1把裝

36、上車船2裝loaderf ludj裝貨的人，裝貨設(shè)備,裝彈機(jī)Auto L / F loaderhandler 4hndlJ（動(dòng)物）馴化者（抓手）temperature 4temprit溫度，氣溫Pre-heat TemperatureMold TemperatureClampklmpj夾緊；夾住n.夾具Pressure preClamp PressureTransfer pressureTransfer trns *f:轉(zhuǎn)移塑封模具M(jìn)GP多缸模具 自動(dòng)包封機(jī) vt. &億匚自動(dòng)排片機(jī)料餅預(yù)熱溫度 模具溫度vt. &卩丄a壓（力），壓強(qiáng)合模壓強(qiáng)注塑壓強(qiáng)vt. &卩丄轉(zhuǎn)移；遷移n.Curing “

37、kjuri塑化，固化，硫化，硬化CuringtimeCuringtemperaturePre-heatTimeTransferspeedTransfertime固化時(shí)間固化溫度（料餅）預(yù)熱時(shí)間注塑速度注塑時(shí)間PMC time (Post Mold Cure Time)后固化時(shí)間Load / unload上料/下料Sweep swi：pjvt. & vi.掃，打掃,拂去Wire Sweep沖絲Open開路Short短路Fill filvt. & vi.（使）充滿，（使）裝滿，填滿Underfill ndfil刀.（孔型）未充滿Body underfilled膠體未灌滿Incomplete , n

38、km *pli:tadj.不完全的,Incomplete mold未封滿Chip tipn.碎片，缺口Chip package / body chip-out崩角Porosity p： rsitijn.多孔性，有孔性Porosity Body膠體麻點(diǎn)Bubble b?bl刀.泡，水泡，氣泡Blister blist氣泡vt. &卩丄（使）起水泡Smear smiVt.弄臟，弄污n.污跡，污斑Surface s：fis面，表面Roough surface不均勻（表面）未完成的Mold flash廢膠Mold flash廢膠Delaminate di： lmneitj 將分層，分成細(xì)層 Delam

39、inatingVoid v?id空的，空虛的PKG VoidDeep di:pl深的Scratch skrtBody deep scratchDimension di *mennjMold PKG dimensionBTM width / lengthTop width / lengthPKG thickMismatch mis mt 使配錯(cuò)，使配合不當(dāng)Mold mismatch / PKGOffset *fsetjV.后固化vt.剝?nèi)?剝奪,奪走空封分層adj.膠體空洞adj.vt.刮傷膠體刮痕盡尺寸，度量塑封體尺寸背面寬/長正面寬/長塑封體厚度Vt.mismatch包封偏差（膠體錯(cuò)位）Vt

40、.抵消，補(bǔ)償Misalignment *mislainmntln.未對準(zhǔn)Mold offset PKG misalignment偏心PMC (post mold cure)Dummy dmi人體模型Strip stripDummy molded strip料餅醒料（回溫過程）Gate geitjMold gateRemain ri meinj剩余物；殘余Gate remainCompound *kmpaundjAging *eidi老化，成熟的過程Compound AgingLocator lu 4keitJ刀門，柵欄門注澆口、進(jìn)澆口小腳刀復(fù)合物，化合物表示位置之物，土地Block bl?k刀

41、大塊（木料、石料、金屬、冰等）Locator Block定位塊Ejector i 4dektJ驅(qū)逐者，放出器Pin pin大頭針，別針，針Depth dep 0刀深，深度Ejector Pin頂針E-pin Depth頂針深度Storage st:ridn儲藏處，倉庫Cold room / compoundstorage冷藏庫/料餅存放庫Air 空氣?Gun gnjn.槍，炮n.Coating kutij 涂層，覆蓋層Material m 4tirilj材料，原料,素材，資料AirGun氣槍DieCoating芯片涂膠Autodie coating M/C芯片涂膠機(jī)DieCoating Mat

42、erial覆晶膠Car tka:tj刀.手推車ASS YBCart后站推車Tablet tblit刀藥片、止Loader 4ludj裝貨的人，裝貨設(shè)備,裝彈機(jī)Preheater pri:hi:tjn.預(yù)熱器Fixture fikstjn.（房屋等的）固定裝置Auto TabletLoader自動(dòng)排膠粒機(jī)CompoudPreheater咼頻預(yù)熱機(jī)Load /UnloadFixture上料/下料架TabletMagazine膠粒盒Compoud Tablets塑封料餅Molding Cleaning Compoud洗模餅misorientationmis, :rien 4teinj定向誤差，取向誤

43、差PKG Misorientat ion膠體壓反Mold flash on lead塑封溢膠Mold crack膠體裂痕Semiconductor 半導(dǎo)體Molding 模封Onload 上料Offload -出料Belt 皮帶Preheater turntable - 預(yù)熱轉(zhuǎn)盤Transfer傳送Safety Door安全門Pickand place -機(jī)械手Motor馬達(dá)Station -模腔Cleaning brush清潔刷Cylinder氣缸Sensor傳感器Solenoid電磁閥Turn over - 翻轉(zhuǎn)器Degate - 切料口Bearing軸承Picker爪（Pusher -推

44、動(dòng)器Cull bin -垃圾箱Pin針Vacuum pump真空泵Morn it or -顯示器Cable -導(dǎo)線Profile-溫度曲線Alarm報(bào)警Error-錯(cuò)誤Driver驅(qū)動(dòng)Sensor -感應(yīng)器Inspection檢查Parameter參數(shù)Manual手動(dòng)，手冊Reset復(fù)位Initialing初始化Guide -導(dǎo)軌Substrate基板Device 產(chǎn)品種類LotTraveller隨工單Magazine盒子Cylinder -汽缸Bearing - 軸承Stop停止Emergency Stop緊急停止Gripper -夾子Heat -加熱器Pipe -管子r emperatur

45、e溫度Hopper - 漏斗Compress air -壓縮空氣Over flow反面漏膠Semiconductor 半導(dǎo)體MoldingOperation -操作Flange - 法蘭盤Pump-泵Chamber -腔體Vent - 氣孔Value-值A(chǔ)larm報(bào)警Error錯(cuò)誤Inspection檢查Parameter參數(shù)Manual手動(dòng)，手冊Reset復(fù)位Initialing初始化Overflow漏膠Incomplete fill 模封不全 inching扭曲Misalignment模封錯(cuò)位Resin Hole / Void氣孑LWire sweep線彎曲Package mismatch

46、模封錯(cuò)位Foreign materials夕卜來物Rough surface表面粗糙Wrong Orientation模封方向反Eng. Sample工程師樣品Stain/Dirty on package表面臟污Resin burr樹脂有毛刺Resin flashes毛刺Damage frameFRAME損壞Scratch on package樹脂表面劃傷Evaluation評估Crack package 樹脂開裂切筋 Trim-FormSPC sample -SPC 樣品1 切筋Trimming2切筋模Trim die3成形模Form die分離模singulate沖廢De-junk6檢測7

47、再成型機(jī)模具8再成型機(jī)9料盤10連筋11毛刺14溢料15裂紋16離層（分層）17管腳反翹18筋未切19筋凸出20筋切入Dambar cutInspection外觀檢測Reform DieReform systemPlastic trayUncut dambarburrJunkCrackDelaminatingLead tip bendDam-bar uncutDam-bar protrusionDam-bar cut in打印 Marking1打印2印章3激光打印4油墨打印5正印6背印7鏡頭8打印不良模糊MarkingMarking layoutLaser markingInk (UV) ma

48、rkingTop side markBack side markLensIllegible marking9漏打No marking10斷字Broken character11缺字Missing character12印字傾斜Slant marking13印記錯(cuò)誤Wrong marking14重印Remark15印字模糊（褪色）Fade mark16印字粘污Smear19電流current21字體（字形）Font22定位針Location pin23膠皮打印機(jī)Pad printer24激光打印機(jī)Laser Marking M/C25后固化PMC(Post Mold Cure)26后固化烤箱PM

49、C Oven27打印污斑M(jìn)arking stain28印記移位Marking shift電鍍 Plating1電鍍Plating2來料Incoming3沖廢Dejunk4熱煮軟化槽Socking Tank7檢驗(yàn)Inspection外觀檢測8烘烤Curing / Baking 150C; 60-90ms9出料Unload10高速線電鍍High-speed Plating Line11統(tǒng)計(jì)過程控制SPC12搭錫Solder bridge13錫絲、錫須Solder flick / Whisker43水壓Water pressure14鍍層不良Plating defects15發(fā)黃Yellowish1

50、6發(fā)黑Blacken17變色Discolor18露底材（露銅）Expose copper19粘污Smear20鍍層用度Plating thickness 7-20um21鍍層成分Plating composition22外觀Outgoing23易焊性Solder ability24無鉛化Pb-free / lead free25結(jié)合力Adhesive force26可靠性Reliability27電解Electrolytic deflash28清洗（自來水）City water29高壓清洗High pressure rinse30脫脂Descale31清洗（純水）DI water32活化（合金

51、）Activation33預(yù)鍍、預(yù)浸Pre-dip34電鍍Plating35吹風(fēng)Air blow36中和Neutralization37褪鍍Stripper38拖出Drag out39上料機(jī)Loader40下料機(jī)Unloader41純錫Tin42純水（去離子水）DI water電鍍成分，Sn4647515253545556596061626364656667686970717273747544理化分析Physical and chemical analysis45 測丿7儀Plating Thickness Meter Electroplated CoatingThicknessTest離子污

52、染度測試儀 Ion Contamination Tester Contamino CT100c含量測試儀Carbon Tester去氧化HSCU Descale預(yù)浸Pre-dip電鍍電流Current鍍液溫度Temperature 電鍍液plating solution電鍍槽plating tank中和Neutralization烘干Curing錫球Solder ball錫療度和成分Sn thickness & composition沖廢De-junk去膠渣去溢料Degate沖塑，沖膠去飛邊Deflash去膠（塑封工序）錫鉛電鍍Tin lead plating無鉛電鍍Lead free plating; Pure tin plating鍍層起泡Solder bump鍍層剝落Solder peel off鍍層偏用或