電子行業(yè)專業(yè)詞匯術(shù)語(專業(yè)超全)

1、電子行業(yè)專業(yè)詞匯術(shù)語GRR Gauge Repeatability Reproducibility 量測(cè)的再現(xiàn)性與再生性FPI First Piece Inspection 首件檢查Sampling without replacement 不放回抽樣SQA: Source(Supplier) Quality Audit 供貨商品質(zhì)審核1. QC : quality control 質(zhì)量管理2. IQC : incoming quality control 進(jìn)料質(zhì)量管理 3. OQC : output quality control 出貨質(zhì)量管理4. PQC : process quality

2、control 制程質(zhì)量管理也稱 IPQC : in process quality control .5. AQL : acceptable quality level 允收標(biāo)準(zhǔn) 6. CQA: customer quality assurance 客戶品質(zhì)保證7. MA : major defeat 主要缺點(diǎn)8. MI : minor defeat 次要缺點(diǎn)9. CR :critical defeat 關(guān)鍵缺點(diǎn)10. SMT : surface mounting technology表面粘貼技術(shù)11. SMD :surface mounting device 表面粘貼程序 SMC : su

3、rface mounting component 表面粘貼組件12.ECN : engineering change notice 工程變更通知 13.DCN : design change notice 設(shè)計(jì)變更通知14.PCB : printed circuit board 印刷電路板15.PCBA : printed circuit board assembly裝配印刷電路板16. BOM : bill of material 材料清單 17. BIOS : basically input and output system基本輸入輸出系統(tǒng)18. MIL-STD-105E : 美國(guó)陸軍標(biāo)

4、準(zhǔn),也稱單次抽樣計(jì)劃.19. ISO : international standard organization 國(guó)際標(biāo)準(zhǔn)化組織20. DRAM: 內(nèi)存條 21. Polarity : 電性 22. Icicles : 錫尖 23. Non-wetting : 空焊24. Short circuit : 短路 25. Missing component : 缺件 26. Wrong component :錯(cuò)件27 . Excess component :多件 28. Insufficient solder : 錫少29 . Excessive solder :錫多 30. Solder res

5、idue: 錫渣31. Solder ball : 錫球 32. Tombstone : 墓碑33 . Sideward：側(cè)立 34. Component damage :零件破損35. Gold finger:金手指 36. SOP : standard operation process 標(biāo)準(zhǔn)操作流程 37. SIP : standard inspection process 標(biāo)準(zhǔn)檢驗(yàn)流程38 .The good and not good segregation :良品和不良品區(qū)分39. OBW : on board writer 熸錄BIOS40 . Simple random samp

6、ling : 簡(jiǎn)單隨機(jī)抽樣 41. Histogram : 直方圖42 . Standard deviation : 標(biāo)準(zhǔn)差43. CIP : Continuous improvement program 持續(xù)改善計(jì)劃 44. SPC : Statistical process control 制程統(tǒng)制 45 . Sub-contractors : 分包商 46. SQE: Supplier quality engineering 47. Sampling sample :抽樣計(jì)劃 48. Loader : 治具 49. QTS: Quality tracking system 質(zhì)量追查系統(tǒng)5

7、0. Debug : 調(diào)試 51. Spare parts: 備用品 52. Inventory report for : 庫(kù)存表 53. Manpower/Tact estimation 工時(shí)預(yù)算 54. Calibration : 校驗(yàn) 55. S/N :serial number 序號(hào)56. Corrugated pad : 波紋墊 57.Takeout tray: 內(nèi)包裝盒 58. Outer box : 外包裝箱 59. Vericode : 檢驗(yàn)碼 60. Sum of square : 平方和 61. Range : 全距62. Conductive bag : 保護(hù)袋 63.

8、Preventive maintenance :預(yù)防性維護(hù) 64. Base unit : 基體 65. Fixture : 制具 66. Probe : 探針 67. Host probe : 主探針 68. Golden card : 樣本卡 69. Diagnostics program : 診斷程序 70. Frame : 屏面 71. Lint-free gloves : 靜電手套 72 .Wrist wrap : 靜電手環(huán) 73. Target value : 目標(biāo)值 74. Related department : 相關(guān)部門 75. lifted solder 浮焊 76.plu

9、g hole孔塞 77. Wrong direction 極性反 ponent damage or broken 零件破損 79.Unmelted solder熔錫不良 80.flux residue松香未拭 81.wrong label or upside down label貼反 82. mixed parts機(jī)種混裝 83. poor solder mask綠漆不良 84. oxidize 零件氧化 85.stand off height浮高86. IC reverse IC反向 87.supervisor課長(zhǎng) 88. Forman組長(zhǎng) 89. WI=work instruction作業(yè)

10、指導(dǎo) 90. B.P. 非擦除狀態(tài) 91. Internal notification: 內(nèi)部聯(lián)絡(luò)單92. QP :Quality policy質(zhì)量政策 93. QT: Quality target 品質(zhì)目標(biāo) 94. Trend:推移圖 95.Paret柏拉圖 96. UCL: Upper control limit管制上限 97.LCL:Lower control limit管制下限 98. CL: Center line中心線 99.R.T. Rolled throughout yield直通率100. PPM: Parts per million 不良率 101.DPU: Defects

11、 per unit 單位不良率102.Resistor: 電阻 103.Capacitor:電容 104. Resistor array : 排阻 105. Capacitor array: 排容 106. DIODE: 二極管 107.SOT: 三極管 108. Crystal:震蕩器 109.Fuse:保險(xiǎn)絲 110.Bead: 電感 inductance 111.Connector:聯(lián)結(jié)器112.ADM: Administration Department行政單位 113. CE: Component Engineering零件工程 114. CSD :Customer Service

12、Department客戶服務(wù)部 115. ID: Industrial Design工業(yè)設(shè)計(jì) 116.IE: Industrial Engineering工業(yè)工程 117. IR: Industrial Relationship工業(yè)關(guān)系118. ME: Mechanical Engineering機(jī)構(gòu)工程119. MIS :Management Information System信息部 120. MM: Material Management資材 121. PCC: Project Coordination/Control專案協(xié)調(diào)控制 122. PD: Production Departme

13、nt生產(chǎn)部 123. PE: Product Engineering產(chǎn)品工程 124. PM: Product Manager產(chǎn)品經(jīng)理 125. PMC: Production Material Control生產(chǎn)物料管理 126. PSC: Project Support & Control產(chǎn)品協(xié)調(diào) 127. Magnesium Alloy:鎂合金128. Metal Shearing:裁剪 129.CEM:Contract Electronics Manufacturing電子制造服務(wù)企業(yè)EMS: Electronics Manufacturing Services130. ERP: En

14、terprise Resource Planning 企業(yè)資源規(guī)劃 SCM+CRM+ERP+EAI=Network direct TM links procurement, production, Logistics and sales 采購(gòu),生產(chǎn),后勤管理及市場(chǎng)營(yíng)銷的融合 EAI: Enterprise application Integration 企業(yè)應(yīng)用系統(tǒng)整合 CRM: Customer Relationship Planning 客戶服務(wù)規(guī)劃 SCM : Supply chain management 供應(yīng)鏈管理131. OJT: On job training 在職培訓(xùn) 132.

15、Access Time: 光盤搜尋時(shí)間 133. B2CEC:Business to consumer electronic commerce 企業(yè)對(duì)消費(fèi)者的電子商務(wù) B2BEC:Business to business electronic Commerce 企業(yè)間的電子商務(wù)134.CCL:Copper Clad Laminate 銅箔基板 135. Intranet: 企業(yè)內(nèi)部通訊網(wǎng)路136. ISP: Internet Service Provider網(wǎng)絡(luò)服務(wù)提供者 ICP: Internet Content Provider網(wǎng)絡(luò)內(nèi)容提供者137. GSM: Global System

16、for Mobile Communication 泛歐數(shù)字式行動(dòng)電話系統(tǒng)GPS: 全球衛(wèi)星定位系統(tǒng)138. Home Page: 網(wǎng)絡(luò)首頁 139.Video Clip:影像文件 140. HTML:超文標(biāo)記語言 141.Domainname: 網(wǎng)域名稱 142. IP: 網(wǎng)絡(luò)網(wǎng)域通訊協(xié)議地址 143.Notebook:筆記型計(jì)算機(jī)144. VR: Virtual Reality虛擬實(shí)境 145. WAP: Wireless Application Protocol無線應(yīng)用軟件協(xié)議146. LAN : Local area network局域網(wǎng)絡(luò) WW World Wide Web世域網(wǎng) WA

17、N: Wide Area Network 廣域網(wǎng)絡(luò)147. 3C: Computer, Communication, Consumer electronic 計(jì)算機(jī), 通訊, 消費(fèi)性電子三大產(chǎn)品的整合148.Information Supplier Highway:信息高速公路 149.UPS:Uninterrupted power system不斷電系統(tǒng) 150.Processed material: 流程性材料151.Entity/Item:實(shí)體 152.Quality loop:質(zhì)量環(huán)153.Quality losses: 質(zhì)量損失 154.Corrective action:糾正措施

18、155. Preventive action:預(yù)防措施 156.PDCAlan/Do/Check/Action計(jì)劃/實(shí)施/檢查/處理 157. Integrated circuits(IC):集成電路 158.Application program: 應(yīng)用程序159.Utilities:實(shí)用程序 160.Auxiliary storage/Second storage:;輔助存儲(chǔ)器 161.Silicon chip:硅片 162Diskette drive:軟驅(qū)163.Display screen/Monitor:顯示器 164.Foreground:前面 165.Montherboard:母

19、板 166.Mermory board: 內(nèi)存板167.Slot:插槽 168.Busata-bus/address-bus/Control bus: 總線/數(shù)據(jù)總線/地址總線/控制總線169.Plotter:繪圖 170.MPC:Multimedia personal computer多媒體171.Oscillator:振蕩器 172.Automatic teller terminal:自動(dòng)終端(出納)機(jī)173.Joystick port:控制端口 174.VGA: Video Graphics Array顯示卡175.Resolution:分辨率 176.Register:寄存器 177.

20、ISA: Industry Standard Architecture 工業(yè)標(biāo)準(zhǔn)結(jié)構(gòu)178.EISA: Extended Industry Architecture 擴(kuò)展工業(yè)標(biāo)準(zhǔn)結(jié)構(gòu) 179.Adapter: 適配器 180.Peripheral:外部設(shè)備 181.Faxmodem:調(diào)制解調(diào)器 181.NIC:Network interface card網(wǎng)絡(luò)接口卡 182. SCSI: Small computer system interface 183.VESA: Video Electronic Standards Association184. SIMM: Single in-line

21、 memory module 單排座存儲(chǔ)器模塊(內(nèi)存條) 185.Casing:外箱 186.Aluminum:鋁質(zhì) 187.Ceramic: 陶瓷的 188.Platter:圓盤片 189.Actuator:調(diào)節(jié)器 190.Spindle:軸心 191.Actuation arm: 存取臂192.Default code: 缺省代碼 193.Auxiliary port:輔助端口 194.Carriage return : 回車 195.Linefeed:換行 197.Video analog: 視頻模擬 196.ASCII: American Standard Code for Infor

22、mation Interchange美國(guó)信息互換標(biāo)準(zhǔn)代碼198.TTL: Transistor- Transistor logic晶體管-晶體管邏輯電路199.Three-prong plug:三芯電插頭 200.Female connector:連接插座201.Floppy disk:軟盤 202.Output level: 輸出電平203.Vertical/Horizontal synchronization: 場(chǎng)/行同步 204.H(Horizontal)-Phase:行相位205.Compatible:兼容機(jī) 206.Hardware Expansion Card: 硬件擴(kuò)充卡207.

23、Buffer:緩沖 208.CRM:Customer relationship Management 客戶關(guān)系管理 209.WIP: Work in process半成品 210.Waiver:特別采用 211.CXO系列CEO: Chief Executive Office 首席執(zhí)政官；執(zhí)行總裁 COO: Chief Operating Office CFO: Chief Finance Officer CBO: Chief Business Officer CTO: Chief Technology Officer CIO: Chief Information Officer CGO: C

24、hief Government Officer 212. NASDAQ: 納斯達(dá)克證券市場(chǎng) NASDAQ Automated Quotation system 213.VC: Venture Capital 風(fēng)險(xiǎn)投資 214. PDA: Personal Date Assistant個(gè)人數(shù)字助理 PLA: Personal Information Assistant個(gè)人信息助理215. PPAP: Advanced Product Quality Planning and Control Plan 生產(chǎn)性零組件核準(zhǔn)程序216. FMEA: Potential Failure Mode and

25、Effects Analysis 失效模式與效應(yīng)分析217. MSA: Measurement Systems Analysis 量測(cè)系統(tǒng)分析218. QAS: Quality System Assessment 質(zhì)量系統(tǒng)評(píng)鑒 219. Cusum: 累計(jì)總合圖220. Overall Equipment Effectiveness設(shè)備移動(dòng)率221. Benchmarking: 競(jìng)爭(zhēng)標(biāo)桿 Analysis of motion/Ergonomics動(dòng)作分析/人體工程學(xué)222. Roka Yoke 防錯(cuò)法 MCR: machine capability ratio 機(jī)器利用率 223. Mista

26、ke Proofing 防呆法 Taguchi methods田口式方法224, Vertical integration垂直整合 Surveillance定期追蹤審查225. EMS: Electronics Manufacturing Supply-chain226. Cause & Effects charts特性要因圖227. Scatter: 散布圖 Fool-Proof System 防呆系統(tǒng) 228. VE: Value Engineering 價(jià)值工程 QFD: Quality Function Development 質(zhì)量機(jī)能展開229. Arrow Chart 箭頭圖法 A

27、ffiliate Chart親和圖法230. PDPC: Process Decision Program Chart System Chart系統(tǒng)圖法231. Relation Chart 關(guān)邊圖法 Matrix Chart矩陣圖法232. Matrix Data Analysis 矩陣數(shù)據(jù)分析法234. Brain-storm 腦風(fēng)暴法 JIT: Just In Time:及時(shí)性生產(chǎn)模擬235. Deming Prize: 戴明獎(jiǎng) Prototype技術(shù)試作236. BPM: Business Process Management 業(yè)務(wù)流程管 MBO目標(biāo)管理 237. MBP:方針管理 F

28、TA:故障樹分析 QSC 服務(wù)質(zhì)量238. IPPB: Information 情況 planning策劃 Programming規(guī)劃 Budget預(yù)算239. EQ: Emotion Quotient:情商 IQ: Intelligence Quotient:智商240. Implied Needs:隱含要求 Specified Requirement:規(guī)定要求241. Probation:觀察期 Incoming Product released for urgent production 緊急放行242.Advanced quality planning 先進(jìn)的質(zhì)量策劃 243. AOQ

29、: Average Outgoing Quality 平均檢出質(zhì)量 AOQL: Average Outgoing Quality Limit 平均檢出質(zhì)量界限244.Approved Supplier List 經(jīng)核準(zhǔn)認(rèn)可的供應(yīng)商名單245.Attribute date 特征 Benchmarking 基準(zhǔn)點(diǎn) Calibration 校準(zhǔn)246.Capable process工序能力 Capability Index序能力指數(shù) Capability ratio工序能力率247.CHANG CYCLE TIME 修改的時(shí)間周期 Continuous improvement 持續(xù)改進(jìn)248. Co

30、ntrol plans控制策劃 Cost of quality 質(zhì)量成本249. Cycle time reduction減少周期時(shí)間250. Design of experiments 實(shí)驗(yàn)設(shè)計(jì) Deviation / Substitution偏差/置換251. ESD: Electrostatic discharge靜電釋放252. EH&S: Environmental, Health, and Safely 環(huán)境,健康.安全253. ESS: Environmental Stress Screening 環(huán)境應(yīng)力篩選254. FMEA: Failure Mode Effect Anal

31、ysis 失誤模式效應(yīng)分析255. First Article approval 產(chǎn)品的首次論證 256. First pass yield 一次性通過的成品率257. First sample inspection第一次樣品檢驗(yàn)258. FMECA: Failure mode effect and critically analysis 失誤模式,效應(yīng)及后果分析259. Gauge control 測(cè)量?jī)x器控制 260. GR&R: Gauge repeatability and reproducibility 測(cè)量?jī)x器重復(fù)性和再現(xiàn)性261. HALT: Highly Accelerated

32、 Life Test 高加速壽命試驗(yàn)262. HAST: Highly Accelerated Stress Test 高加速應(yīng)力試驗(yàn)263. IN-CONTROL PROCESS 受控制工序 264. INDUSTRIAL AVERAGE 工業(yè)平均數(shù)265. JIT (just in time) manufacturing (實(shí)時(shí))制程 266. Key characteristic關(guān)健特征 267. Key component關(guān)健構(gòu)件 268. Life Testing壽命試驗(yàn)269. Lot traceability 批量可追溯性270. Material review board原材料

33、審查部門 MCR: machine capability ratio機(jī)械能力率271. NONCONFORMANCE不符合 272. OUT-OF-CONTROL PROCESS失控工序273. Pilot Application試產(chǎn)(試用) 274. PPM: Parts per million百萬分之一275. Preventive VS detection預(yù)防與探測(cè) Preventive maintenance預(yù)防維護(hù)276. Process capability index工序能力指 277. Process control工序控制 278. Process improvement工序

34、改進(jìn) 279. Process simplification 過程簡(jiǎn)化280. Quality Clinic Process Chart (QCPC)質(zhì)量診斷過程圖281. Quality information system質(zhì)量資料體系 282. Quality manual質(zhì)量手冊(cè) 283. Quality plan質(zhì)量計(jì)劃 284. Quality planning質(zhì)量策劃285. Quality policy質(zhì)量方針 286. Quality system質(zhì)量體系287. Reliability可靠性 RUN Chart趨勢(shì)表288. Skill Matrix技能表 289. Stat

35、istical quality control (SQC)統(tǒng)計(jì)質(zhì)量控制290. Teamwork 團(tuán)隊(duì)工作 291. Total quality management全面質(zhì)量管理292. Variable data變量數(shù)據(jù) 293. Variation影響變量294. Value Analysis值分析 295. Visual Factory形象化工廠296. Survey Instructions調(diào)查指引 297. Profile 概況298. Improvement Plan改進(jìn)計(jì)劃 299. Evaluation評(píng)估 300. implementation實(shí)施 301. Complian

36、ce符合302. Supplier Audit Report供方審核報(bào)告 303. Site Audit現(xiàn)場(chǎng)審核304. Typical agenda典型的議事日程 305. Internal and external failure costs內(nèi)部和外部的失誤成本306. Failure rate percentage 失誤百分率 307. Productivity (output / input)生產(chǎn)率(產(chǎn)出/投入)308. Customer complaints 客戶投訴 309. Customer satisfaction indices 客戶滿意度指數(shù)310. Root cause

37、analysis of failures失誤根原分析品管中英文名詞對(duì)照表Accuracy準(zhǔn)確度 Active主動(dòng) Action評(píng)價(jià).處理 Activity活動(dòng) Add加Addition rule加法運(yùn)算規(guī)則 Analysis Covariance協(xié)方差分析 Analysis of Variance方差分析Appraisal Variation評(píng)價(jià)變差 Approved承認(rèn) ASQC美國(guó)質(zhì)量學(xué)會(huì) Attribute計(jì)數(shù)值A(chǔ)udit審核 Automatic database recovery數(shù)據(jù)庫(kù)錯(cuò)誤自動(dòng)回復(fù) Average平均數(shù)balance平衡 Balance sheet資產(chǎn)負(fù)債對(duì)照表 Bin

38、omial二項(xiàng)分配 Body機(jī)構(gòu)Brainstorming Techniques腦力風(fēng)暴法 Business Systems Planning企業(yè)系統(tǒng)規(guī)劃Cable電纜 Capability能力 Cause and Effect matrix因果圖.魚骨圖 Center line中心線 check檢查 Check Sheets 檢查表 Chi-square Distribution 卡方分布Clutch spring 離合器彈簧 Coining 壓印加工 Common cause 共同原因Complaint 投訴 Compound factor 調(diào)合因素 Concept 新概念 Condens

39、er 聚光鏡Conformity 合格 Connection 關(guān)聯(lián) Consumers risk 消費(fèi)者之風(fēng)險(xiǎn) Control 控制Control characteristic 管制特性 Control chart 管制圖 Control plan 管制計(jì)劃Correction 糾正 Correlation Methods 相關(guān)分析法 Cost down 降低成本CPI: continuouse Process Improvement 連續(xù)工序改善 Creep 漸變Cross Tabulation Tables 交*表 CS: customer Sevice 客戶中心Cushion 緩沖 Cu

40、stomer 顧客DSA: Defects Analysis System 缺陷分析系統(tǒng) Data 數(shù)據(jù)Data Collection 數(shù)據(jù)收集 Data concentrator 資料集中緩存器DCC: Document Control Center 文控中心 Decision 決策.判定Defects per unit 單位缺點(diǎn)數(shù) Description 描述Detection 難檢度 Device 裝置Digital 數(shù)字 Do 執(zhí)行DOE: Design of Experiments 實(shí)驗(yàn)設(shè)計(jì) Element 元素Else 否則 Engineering recbnology 工程技術(shù)E

41、ntropy 函數(shù) Environmental 環(huán)境Equipment 設(shè)備 Estimated accumulative frequency 計(jì)算估計(jì)累計(jì)數(shù)E Equipment Variation 設(shè)備變異 Event 事件External Failure 外部失效,外部缺陷 FA: Failure Analysis 壞品分析Fact control 事實(shí)管理 Fatique 疲勞FMEA: Failure Mode and Effect analysis 失效模式與效果分析 FPY 合格率FQA: Final Quality Assurance 最終品質(zhì)保證 FQC: Final Qua

42、lity control 最終品質(zhì)控制Full-steer完全轉(zhuǎn)向 function職能 Gauge system量測(cè)系統(tǒng)Grade等級(jí) Gum-roll橡皮滾筒 Health meter體重計(jì)Heat press沖壓粘著 Histogram直方圖 Hi-tech高科技hypergeometric超幾何分配 hysteresis磁滯現(xiàn)象 Improvement改善Inductance電感 Information信息 Initial review先期審查Inspection檢驗(yàn) Internal Failure內(nèi)部失效,內(nèi)部缺陷IPQC: In Process Quality Control制程

43、品質(zhì)控制IQC: Incomming Quality Control來料品質(zhì)控制IS International Organization for Standardization國(guó)際標(biāo)準(zhǔn)組織Law of large number大數(shù)法則 Link連接LCL: Lower Control limit管制下限 LQC: Line Quality Control生產(chǎn)線品質(zhì)控制LSL: Lower Size Limit規(guī)格下限Machine機(jī)械 Manage管理 Materials物料 Measurement量測(cè) Median中位數(shù)Miss feed漏送 Module,sub-system,sub-u

44、nit單位 Momentum原動(dòng)力Monte garlo method原子核分裂熱運(yùn)動(dòng)法 MSA: Measurement System Analysis量測(cè)系統(tǒng)分析 Multiplication rule乘法運(yùn)算規(guī)則NIST 美國(guó):標(biāo)準(zhǔn)技術(shù)院 Normal常態(tài)分布 Occurrence發(fā)生率On.off system開,關(guān)系統(tǒng) Operation Instruction作業(yè)指導(dǎo)書 Organization組織Parameter參數(shù) Parto柏拉圖 Parts零件 Parts per million不良率Passive消極的,被動(dòng)的 Plan計(jì)劃 Pulse 脈沖 Policy 方針Popu

45、lation 群體 Power 力量,能源 PQA: Process Quality Assurance 制程品質(zhì)保證Practice 實(shí)務(wù) Precision 精密度 preemptive 先占式多任務(wù)Pressure 壓縮 Prevention 預(yù)防 Probability 機(jī)率Probability density function 機(jī)率密度函數(shù) Procedure 流程 Process 過程Process capability analysis制程能力分析圖Process control and process capability制程管制與制程能力Producers risk生產(chǎn)者之

46、風(fēng)險(xiǎn) Product產(chǎn)品 Production生產(chǎn)Program方案 Projects項(xiàng)目 QA: Quality Assurance品質(zhì)保證QC: Quality Control品質(zhì)控制 QE: Quality Engineering品質(zhì)工程QFD: Quality Function Desgin品質(zhì)機(jī)能展開 Quality質(zhì)量Quality manual品質(zhì)手冊(cè) Quality policy品質(zhì)政策Random experiment隨機(jī)試驗(yàn) Random numbers隨機(jī)數(shù)Range全距 Record記錄 Reflow回流 Reject拒收 Repair返修Repeatusility再現(xiàn)性 Reproducibility再生性 Requirement要求Residual誤差 Response響應(yīng) Responsibilities職責(zé)Review評(píng)審 Reword返工 Robustness穩(wěn)健性 Rolled yield直通率RPN: Risk Priority Number風(fēng)險(xiǎn)系數(shù) sample抽樣,樣本Sample space樣本空間 Sampling with replacement放回抽樣Sampling without peplacement不