品質(zhì)英語單詞大全

1、零件材料類的專有名詞CPU:centralprocessinguNt#央處理器IC:Integratedcircuit（集成電路MemoryIC:MemoryIntegratedcircuit（記憶集成電路RAM:RandomAccessMemory（隨機(jī)存取存儲(chǔ)器DRAM:DynamicRandomAccessMemory（動(dòng)態(tài)隨機(jī)存取存儲(chǔ)器SRAM:StaicRandomAccessMemory靜態(tài)隨機(jī)存儲(chǔ)器ROM:Read-onlyMemory（只讀存儲(chǔ)器EPROM:ElectricalProgrammableRead-onlyMemory（電可抹只讀存諸器EEPROM:Electric

2、alErasbaleProgrammableRead-onlyMemory也可抹可編程只讀存儲(chǔ)器CMOS:ComplementaryMetal-Oxide-Semiconductor（互補(bǔ)金屬氧化物半導(dǎo)體BIOS:BasicInputOutputSystem（8本輸入輸出系統(tǒng)Transistor:電晶體LED:發(fā)光二極體Resistor:電阻Variator:可變電阻Capadtor:電容Capacitorarray排容Diode:二極體Transistor:三極體Transformer:變壓器（ADPOscillator:頻率振蕩器（0scCrystat石英振蕩器XTAL/OSC:振蕩產(chǎn)生器

3、（XRelay:延時(shí)器Sensor感應(yīng)器Beadcore磁珠Filter:濾波器FlatCable:排線Inductor:電感Buzzer:蜂鳴器Socket插座Slot:插槽Fuse熔斷器Current:電流表Solde門ron:電烙鐵Magnifyingglass:放大鏡Caliper:游標(biāo)卡尺Driver:螺絲起子TFT:液晶顯示器Oscilloscope示波器Connector連接器PCB:printedcircuitboard（印刷電路板PCBA:printedcircuitboardassembly但路板成品PP并行接口HDD:硬盤FDD:軟盤PSU:powersupplyunit

4、（電源供應(yīng)器SPEC規(guī)格Attach:附件Case:機(jī)箱，蓋子Cover:上蓋Base下蓋Bazel而板（panelBracket:支架，鐵片Lable:貼紙Guide:手冊Manual手冊指南Card:網(wǎng)卡Switch:交換機(jī)Hub:集線器Router:路由器Sample才羊品Gap間隙Sponge海綿Pallet棧板Foam保禾【J龍F(tuán)iber:光纖Disk:磁盤片PROG:程序Barcode:條碼System系統(tǒng)SystemBarcode系統(tǒng)條碼M/B:motherboard:主板CD-ROM:光驅(qū)FAN:風(fēng)扇Cable:線材Audio:音效K/B:Keyboard（鍵盤Risercar

5、d:轉(zhuǎn)接卡Cardreade讀卡器Screw螺絲Thermalpad散熱墊Heatsink:散熱片Rubber橡膠墊Rubberfoot:腳墊Bag袋子Washer墊圈Sleeve袖套Config:機(jī)構(gòu)Labelhi-pot:高壓標(biāo)簽Firmwarelabel:燒錄標(biāo)簽Metalcover:金屬蓋子Plasticcover塑膠蓋子Tapeforpacking包裝帶Barcode條碼Tray:托盤Collecto:集線夾Holder:固定器,L鐵Connecter連接器IDE:集成電路設(shè)備，智能磁盤設(shè)備SCSI:小型計(jì)算機(jī)系統(tǒng)接口Gasket導(dǎo)電泡棉AGP:加速圖形接口PCI:周邊組件擴(kuò)展接口L

6、AN:局域網(wǎng)USB:通用用形總線架構(gòu)Slim:小型化COM:用型通訊端口LPT:打印口，并行口Powercord電源線I/O:輸入，輸出Speaker揚(yáng)聲器EPE:泡棉Carton:紙箱Button:按鍵，按鈕Footstand腳架部門名稱的專有名詞QS:Qualitysystem品質(zhì)系統(tǒng)CS:CoutomerSevic谿戶®務(wù)QC:Qualitycontrol品質(zhì)管理IQC:Incomingqualitycontrol進(jìn)料檢驗(yàn)LQC:LineQualityControl生產(chǎn)線品質(zhì)控制IPQC:Inprocessqualitycontrol制程檢驗(yàn)FQC:Finalqualityco

7、ntrol最終檢驗(yàn)OQC:Outgoingqualitycontrol出貨檢驗(yàn)QA:Qualityassurance品質(zhì)保證SQA:Source(supplierQualityAssurance應(yīng)商品質(zhì)保證(VQACQA:CustomerQualityAssurance客戶質(zhì)量保證PQA:ProcessQualityAssurances程品質(zhì)保證QE:Qualityengineer品質(zhì)工程CE:componentengineering件工程EE:equipmentengineering®備工程ME:manufacturingengineering制造工程TE:testingengin

8、eering測試工程PPE:ProductEnginee產(chǎn)品工程IE:Industrialengineer工業(yè)工程ADM:AdministrationDepartment行政部RMA:客戶退回維修CSDI:檢修PC:producingcontrol生管MC:matercontrol物管GAD:GeneralAffairsDept總務(wù)部A/D:Accountant/FinanceDept會(huì)計(jì)LAB:Laboratory實(shí)驗(yàn)室DOE:實(shí)驗(yàn)設(shè)計(jì)HR:人資PMC:企劃RD:研發(fā)W/H:倉庫SI:客驗(yàn)PD:ProductDepartmen蚱產(chǎn)部PA:采購（PUR:PurchaingDeptSMT:Sur

9、facemounttechnology表面粘著技術(shù)MFG:Manufacturing制造MIS:Managementinformationsystem資迅管理系統(tǒng)DCC:documentcontrolcenter文件管制中心廠內(nèi)作業(yè)中的專有名詞QT:Qualitytarget品質(zhì)目標(biāo)QP:Qualitypolicy目標(biāo)方針QI:Qualityimprovement品質(zhì)改善CRITICALDEFECT:嚴(yán)重缺點(diǎn)（CRMAJORDEFECT:主要缺點(diǎn)（MAMINORDEFECT:次要缺點(diǎn)（MIMAX:Maximum最大值MIN:Minimum最小值DIA:Diameter直徑DIM:Dimensi

10、on尺寸LCL:Lowercontrollimit管制下限UCL:Uppercontrollimit管制上限EMI:電磁干擾ESD:靜電防護(hù)EPA:靜電保護(hù)區(qū)域ECN:工程變更ECO:Engineeringchangeorde小程改動(dòng)要求（客戶ECR:工程變更需求單CPI:ContinuousProcessImprovemen連續(xù)工序改善Compatibility:兼容性Marking:標(biāo)t己DWG:Drawing圖面Standardization:標(biāo)準(zhǔn)化Consensus致Code代碼ZD:Zerodefect零缺點(diǎn)Tolerance公差Subjectmatter主要事項(xiàng)Auditor:審核

11、員BOM:Billofmaterial物料清單Rework:重工ID:identification識(shí)別，鑒別，證明PILOTRUN:（試投產(chǎn)FAI:首件檢查FPIR:FirstPieceInspectionReport首件檢查報(bào)告FAA:首件確認(rèn)SPC:統(tǒng)計(jì)制程管制CP:capabilityindex（準(zhǔn)確度CPK:capabilityindexofprocess御J程能力PMP:制程管理計(jì)劃（生產(chǎn)管制計(jì)劃MPI:制程分析DAS:DefectsAnalysisSystem缺陷分析系統(tǒng)PPB:十億分之一Flux:助焊劑P/N:料號(hào)L/N:LotNumber批號(hào)Version:版本Quantity

12、:數(shù)量Validdate:有效日期MIL-STD:Military-Standard軍用標(biāo)準(zhǔn)ICT:InCircuitTest（線路測試ATE:AutomaticTestEquipment自動(dòng)測試設(shè)備MO:ManafactureOrder生產(chǎn)單T/U:TouchUp（錫面修補(bǔ)I/N:手插件P/T:初測F/T:FunctionTest（功能測試-終測ASY:組立P/K:包裝TQM:Totalqualitycontrol全面品質(zhì)管理MDA:manufacturingdefectanalysis制程不良分析（ICTRUN-IN:老化實(shí)驗(yàn)Hl-pot:高壓測試FMI:FrequencyModulati

13、onInspect高頻測試DPPM:DefectPartPerMillion（不良率的一種表達(dá)方式：百萬分之一1000PpM即為0.1%CorrectiveAction:（CAR改善對(duì)策ACC:允收REJ拒收S/S:Samplesizef由樣檢驗(yàn)樣本大小SI-SIV:SpecialI-SpecialIV特殊抽樣水平等級(jí)CON:Concession/Waive特采ISO:國際標(biāo)準(zhǔn)化組織ISA:IndustryStandardArchitecture工業(yè)標(biāo)準(zhǔn)體制結(jié)構(gòu)OBA:開箱稽核FIFO:先進(jìn)先出PDCA:管理循環(huán)Plandocheckaction計(jì)劃，執(zhí)行，檢查，總結(jié)WIP:在制品（半成品S/

14、O:SalesOrder業(yè)務(wù)訂單P/O:PurchaseOrder罪購訂單P/R:PurchaseRequest:謂購單AQL:acceptablequalitylevel允收品質(zhì)水準(zhǔn)LQL;Limitingqualitylevel最低品質(zhì)水準(zhǔn)QVL:qualifiedvendorlist合格供應(yīng)商名冊AVL:認(rèn)可的供貨商清單（ApprovedVendorListQCD:Qualitycostdelivery（品質(zhì)，交期，成本MPM:Manufacturingprojectmanagement制造專案管理KPI:Keyperformanceindicate重要績效指標(biāo)MVT:Manufactu

15、ringVerificationTest制造驗(yàn)證試產(chǎn)Q/R/S:Quality/Reliability/Service質(zhì)量/可靠度/服務(wù)STL:shiptoline（料到上線NTF:Notroublefound誤判CIP:capacityimprovementplan產(chǎn)能改善計(jì)戈UMRB:materialreviewboard（物料審核小組MRB:Materialrejectbill退貨單JIT:justintime（即時(shí)管理5S:seiriseitonseisoseiketsushitsuke（整理,整頓恭掃恭潔，修養(yǎng)SOP:standardoperationproces標(biāo)準(zhǔn)作業(yè)程序SIP:

16、Specificationinspectionproces綱程檢驗(yàn)規(guī)格TOP:TestOperationProcess測試作業(yè)流程WI:workinginstruction（作業(yè)指導(dǎo)書SMD:surfacemountingdevice尚面粘著原件FAR:failureaualysisreport故障分析報(bào)告CAR:Correctiveactionreport改善報(bào)告BPR:企業(yè)流程再造（BusinessProcessReengineeringISAR:首批樣品認(rèn)可（InitialSampleApprovalRequest-JIT:實(shí)時(shí)管理（JustInTimeQCC:品管圈（QualityCo

17、ntrolCircleEngineeringDepartment（T程部TQEM:TotalQualityEnvironmentManagement（全面品質(zhì)環(huán)境管理PD:ProductionDepartment制造LOG:Logistics（后勤支持Shipping:（進(jìn)出口AOQ:AverageOutputQuality平均出貨質(zhì)量AOQL:AverageOutputQualityLevel平均出貨質(zhì)量水平FMEA:failuremodeleffectivenessanalysi能效模式分析CRB:ChangeReviewBoard（X程變更會(huì)議CSA:CustomerSimulateAn

18、alysis客戶模擬分析SQMS:SupplierQualityManagementSystem應(yīng)商品質(zhì)管理系統(tǒng)QIT:QualityImprovementTeam品質(zhì)改善小組QIP:QualityImprovementPlan品質(zhì)改善計(jì)劃CIP:ContinualImprovementPlan持續(xù)改善計(jì)劃M.Q.F.S:MaterialQualityFeedbackSheet來料品質(zhì)回饋單SCAR:SupplierCorrectiveActionReport（供貨商改善對(duì)策報(bào)告8DSheet:8Disciplinessheet（8皿PDCA:PDCA（Plan-Do-Check-Action

19、（管理循環(huán)MPQ:MaterialPackingQuantity（物料最小包裝量DSCN:DeliveryScheduleChangeNotice咬期變更通知QAPS:QualityAssuranceProcessShee印質(zhì)工程表DRP:運(yùn)銷資源計(jì)劃（DistributionResourcePlanningDSS:決策支持系統(tǒng)（DecisionSupportSystemEC:電子商務(wù)（ElectronicCommerceEDI:電子資料交換（ElectronicDataInterchangeEIS:主管決策系統(tǒng)（ExcutiveInformationSystemERP:企業(yè)資源規(guī)劃（Ente

20、rpriseResourcePlanningFMS:彈性制造系統(tǒng)（FlexibleManufactureSystemKM:知識(shí)管理（KnowledgeManagement4L:逐批訂購法（Lot-for-LotLTC:最小總成本法（LeastTotalCostLUC:最小單位成本（LeastUnitCostMES:制造執(zhí)行系統(tǒng)（ManufacturingExecutionSystemMPS:主生產(chǎn)排程（MasterProductionScheduleMRP:物料需求規(guī)劃（MaterialRequirementPlanningMRPH:制造資源計(jì)劃（ManufacturingResourcePl

21、anningOEM:委托代工（OriginalEquipmentManufactureODM:委托設(shè)計(jì)與制造（OriginalDesign&ManufactureOLAP:線上分析處理（On-LineAnalyticalProcessingOLTP:線上交易處理（On-LineTransactionProcessingOPT:最佳生產(chǎn)技術(shù)（OptimizedProductionTechnologyPDCA:PDCA管理循環(huán)（Plan-Do-Check-ActionPDM:產(chǎn)品數(shù)據(jù)管理系統(tǒng)（ProductDataManagementRCCP:粗略產(chǎn)能規(guī)戈U（RoughCutCapacit

22、yPlanningSCM:供應(yīng)鏈管理（SupplyChainManagementSFC現(xiàn)場控制（ShopFloorControlTOC:限制理論（TheoryofConstraintsTQC:全面品質(zhì)管制（TotalQualityControlFYI/R:foryourinformation/reference僅供參考ASAP:盡快S/T:Standardtime標(biāo)準(zhǔn)時(shí)間TPM:totalproductionmaintenance全面生產(chǎn)保養(yǎng)ESDWriststrap:靜電環(huán)IT:informationtechnology信息技術(shù)，資訊科學(xué)CEO:ChiefExecutiveOfficer執(zhí)行

23、總裁COO:ChiefOperaringOfficer首席業(yè)務(wù)總裁SWOT:Strength,Weakness,Opportunity,Threat優(yōu)勢，弱點(diǎn)，機(jī)會(huì)，威脅Competence專業(yè)能力Communication:有效溝通Cooperation統(tǒng)御融合VibrationTesting:振動(dòng)測試IDP:IndividualDevelopmentPlan個(gè)人發(fā)展計(jì)劃MRP:MaterialRequirementPlanning物料需求計(jì)戈UMAT'S:Material材料LRR:LotRejeetRate批退率ATIN:Attention知會(huì)3C:Computer.Commun

24、ication,Consumerelectronic消費(fèi)性電子5W1H:When,Where,Who,What,Why,Ho5M:Man,Machine,Material,Method,Measurement人，機(jī)器，材料，方法，測量4MIE:Man,Material,Machine,Method,Environment人力,物力,財(cái)務(wù)，技術(shù)，時(shí)間（資源7M1I:Manpower,Machine,Material,Method,Market,Management,Money,Information人力,機(jī)器,材料,方法，市場，管理，資金，資訊1 Accuracy準(zhǔn)確度2 Action行動(dòng)3 A

25、ctivity活動(dòng)4 AnalysisCovariance協(xié)方差分析5 AnalysisofVariance方差分析6 Approved承認(rèn)7 Attribute計(jì)數(shù)值8 Average平土勻數(shù)9 Balanceshee簌產(chǎn)負(fù)債對(duì)照表10111213141516171819202122232425262728Binomial二項(xiàng)分配BrainstormingTechniques月而力風(fēng)暴法CauseandEffectMatrix因果圖（魚骨圖CL:CenterLine中心線CheckSheets查表Complaint投訴Conformity合格（符合Control控制Controlchart控

26、制（管制圖Correction糾正CorrelationMethods相關(guān)分析法CPI:continuouseProcessImprovemenJ!續(xù)工序改善CrossTabulationTable汶叉表CS:CustomerSevice?f（戶服（務(wù)中心DSA:DefectsAnalysisSystem缺陷分析系統(tǒng)Data數(shù)據(jù)Description:品名DCC:DocumentControlCenter文控中心Decision決策、判定Defectsperunit單位缺點(diǎn)數(shù)29303132333435363738394041424344454647Description描述Device裝置D

27、o執(zhí)行DOE:DesignofExperiments實(shí)驗(yàn)設(shè)計(jì)Element元素Engineeringrecbnology工程技Environmental環(huán)境Equipment設(shè)備Estimatedaccumulativefrequency#算估計(jì)累計(jì)數(shù)EV:EquipmentVariation設(shè)備變異ExternalFailure外部失效，外部缺陷FA:FailureAnalysis失效分析Factcontrol事實(shí)管理Fatigue疲勞FMEA:FailureModeandEffectAnalysis失效模式與效果分析FPY:First-PassYield（第一次通過合格率FQA:FinalQualityAssurance最終品質(zhì)保證FQC:FinalQualitycontrol最終品質(zhì)控制Gaugesystem®量系統(tǒng)48495051525354555657585960616263646566Grade等級(jí)Histogram直方圖Improvement改善Initialreview先期審查Inspection檢驗(yàn)InternalFailure內(nèi)部失效、內(nèi)部缺陷IPQC:InProcessQualityControl制程品質(zhì)控制IQC:Incomming