濕度敏感元件控制

1、工序操作所用設(shè)備及工具:WT:TO:PE(SMT)(A)主管;IE(A) MGR;操作圖示：操作說(shuō)明：注意事項(xiàng)：REVISION/AMENDMENT HISTORYDATEREV NO.PAGEDESCRIPTION工序操作所用設(shè)備及工具:WT:TO: PE(SMT)(A)主管;IE(A) MGR;(SMT);(IPQC<SMT>); 1 描述 DESCRIPTION1.1 作為一般要求，物料不允許在以下條件下存儲(chǔ)：As a general requirements, materials are not allowed to be stored:陽(yáng)光直接照射，即使通過(guò)窗戶也不行。

2、In direct sunshine, not even through windows.靠近加熱器，冷卻器，濕度調(diào)節(jié)器和光源。 Close to heater, cooler, humidifier and light source.靠近室外以致一再超過(guò)溫度和濕度范圍。 Close to outdoors so that temperature/humidity limits are repeatedly exceeded.1.2 通過(guò)元件包裝或濕度防護(hù)袋(MBB)內(nèi)的如下標(biāo)志可以識(shí)別是濕度敏感元件。參考(FP-R-016)靜電防護(hù)/濕度敏感元件清單。Moisture sensitive d

3、evices can be identified through the following logo attached on the component packaging or inside Moisture Barrier Bag (MBB). Refer for the ESD/Moisture Sensitive Component List. Moisture-Sensitive Devices50%40%60%30%20%10%Humidity IndicatorWarning if Pink Change DesiccantRead at Lavender between Pi

4、nk and Blue箭頭所指變粉紅則須烘烤1.3 元件濕度敏感度表Table for Moisture Sensitive Device等級(jí)Level儲(chǔ)存環(huán)境要求Environment Conditions裝配時(shí)間Assembly Time備注Remarks1溫度£30°C,濕度 85%RH Temperature£30°C,humidity 85%RH無(wú)限制Unlimited非濕度敏感元件Moisture-insensitive comp.2溫度£30°C, 濕度 60%RH Temperature£30°C,

5、humidity 60%RH1年1 year2a溫度£30°C, 濕度 60%RHTemperature£30°C,humidity 60%RH4周4 weeks3溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH168小時(shí)168 hours4溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH72小時(shí)72 hours5溫度£30°C, 濕度 60%RH Temp

6、erature£30°C,humidity 60%RH48小時(shí)48 hours5a溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH24小時(shí)24 hours6T溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH標(biāo)貼上注明時(shí)間Time on Label (TOL)需使用前烘烤Need to bake before useOSP PWBT溫度£30°C, 濕度 640%RH Tempe

7、rature£30°C,humidity 40%RH24小時(shí)24 hours最大保存期限為6個(gè)月Max. shelf life of 6 months1.4 拆封包裝前看包裝是否有破損，檢查濕度顯示卡(HIC)，看是否超出上面1.3所規(guī)定的外界條件。Check that MBB is not broken, and Humidity Indicator Card (HIC) reading is not greater than the Environment Conditions stated in 1.3 above.1.5 PWB的庫(kù)存最多為5個(gè)等級(jí)。板要平放在架子上

8、以避免損壞。Only 5 levels, on the top of PWB stock. And panels must be stored on flat shelf to prevent warpage.1.6 如果MBB損壞或HIC讀數(shù)超過(guò)上面元件濕度敏感度表顯示的外界條件，物料/元件要退回給供應(yīng)商或烘烤，參考下面的濕度敏感元件烘烤設(shè)定表。否則填寫粘在物料盤上或元件袋上的濕度敏感元件記錄表。在上面元件濕度敏感度表所顯示的貼裝時(shí)間內(nèi)使用物料。If the MBB is broken or HIC reading is greater than Environment Conditions

9、 indicated in Table for Moisture Sensitive Device above, material/device must be returned to vendor or bake, refer to Table for Baking Moisture Sensitive Devices below. Otherwise, fill up Humidity sensitive parts label, stick on the component reel or MBB and use the materials before the time indicat

10、ed under “Assembly Time” in Table for Moisture Sensitive Device above.1.7 濕度敏感元件烘烤設(shè)定表Table for Baking Moisture Sensitive Devices條件Condition濕度敏感元件在無(wú)保護(hù)的環(huán)境中暴露的時(shí)間Moisture Sensitive Component Unprotected exposure time in ambient烘烤條件Baking condition1超過(guò)48小時(shí)但是小于168小時(shí)暴露時(shí)間如果是JEDEC等級(jí)5a或者6,超過(guò)24小時(shí)暴露時(shí)間 時(shí)間More tha

11、n 48 hour but less than 168 hour exposure from the requirementIn case of JEDEC class 5a or 6, more than24 hours exposure.12 hours(+10,-2 hrs) 60oC +/-5°CRH £5%2超過(guò)168小時(shí)暴露時(shí)間More than 168 hours exposure168 hours 60oC +/-5°CRH £5%OSP PWB超過(guò)24小時(shí)暴露時(shí)間More than 24 hours exposure5 hours 60

12、oC +/-5°CRH £5%1.8 打開(kāi)濕度防護(hù)袋，填寫濕度敏感元件記錄表(見(jiàn)3.2)，并貼在物料盤上。Upon opening the MBB, fill up Humidity Sensitive Parts label (see 3.2 below) and stick it on the component reel or tray.1.9 如果停產(chǎn)很長(zhǎng)時(shí)間，濕度敏感元件超出了元件濕度敏感度表所顯示的貼裝時(shí)間，濕度敏感元件或物料要放進(jìn)電熱爐或密封包裝。If production will stop for a long time, and/or moisture

13、sensitive components exceeds “Assembly Time” indicated in Table for Moisture Sensitive Device, moisture sensitive components/materials should either be stored at humidity control cabinet, or vacuum seal the components.當(dāng)需要烘烤時(shí)，參考上面1.7電熱爐設(shè)定表格。參考 DI-43-0011電熱爐操作指引。When baking is needed, refer to the tab

14、le above (1.7) for the setting of oven. Refer to DI-43-0011 for the Heating Oven Operation and instructions.1.10 靜電防護(hù)/濕度敏感元件清單(FP-R-016)應(yīng)由SMT制程工程師更新填寫，并由主管或經(jīng)理確認(rèn)。ESD/Moisture Sensitive Component List (FP-R-016) should be updated by SMT Process Engineer and to be verified by Supervisor/Manager.參考文件 RE

15、FERENCE DOCUMENTS 記錄 RECORDS靜電防護(hù)/濕度敏感元件清單(由PRT保管11年)ESD/Moisture Sensitive Component List Form.濕度敏感元件記錄表。Humidity Sensitive Parts label濕度敏感元件記錄表Humidity sensitive parts label開(kāi)封時(shí)間 使用期限開(kāi)始使用時(shí)間Open-timeDurationStart Ssage使用結(jié)束時(shí)間 開(kāi)始儲(chǔ)存時(shí)間 開(kāi)始烘烤時(shí)間Stop UsageStart StoringStart BakingREVISION/AMENDMENT HISTORYDA

16、TEREV NO.PAGEDESCRIPTION2004-8-30A04First Issue工序操作所用設(shè)備及工具:WT:TO:PE(SMT)(A)主管;IE(A) MGR;操作圖示：操作說(shuō)明：注意事項(xiàng)：REVISION/AMENDMENT HISTORYDATEREV NO.PAGEDESCRIPTION工序操作所用設(shè)備及工具:WT:TO: PE(SMT)(A)主管;IE(A) MGR;(SMT);(IPQC<SMT>); 1. 目的: 建立NAMTAI SMT車間濕度敏感元件管理程序Build the Moisture sensitive devices manage pro

17、cess for Namtai SMT workshop. 2 描述 DESCRIPTION2.1 作為一般要求，物料不允許在以下條件下存儲(chǔ)：As a general requirements, materials are not allowed to be stored:陽(yáng)光直接照射，即使通過(guò)窗戶也不行。 In direct sunshine, not even through windows.靠近加熱器，冷卻器，濕度調(diào)節(jié)器和光源。 Close to heater, cooler, humidifier and light source.靠近室外以致一再超過(guò)溫度和濕度范圍。 Close to

18、 outdoors so that temperature/humidity limits are repeatedly exceeded.2.2 濕度敏感元件可以通過(guò)下列附在元件包裝上或在濕度袋子內(nèi)側(cè)的標(biāo)語(yǔ)來(lái)鑒別。特別是IC， 檢查其外部的標(biāo)語(yǔ)和以下的濕度敏感度控制程序。Moisture sensitive devices can be identified through the following logo attached on the component packaging or inside Moisture Barrier Bag (MBB). Especially IC, ch

19、eck for this logo outside and follow moisture sensitivity control procedure.Moisture-Sensitive Devices 濕度敏感元件2.3 元件濕度敏感度表Table for Moisture Sensitive Device等級(jí)Level儲(chǔ)存環(huán)境要求Environment Conditions裝配暴露時(shí)間Assembly Open Time備注Remarks1溫度£30°C,濕度 85%RH Temperature£30°C,humidity 85%RH無(wú)限制Unli

20、mited非濕度敏感元件Moisture-insensitive comp.2溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH1年1 year2a溫度£30°C, 濕度 60%RHTemperature£30°C,humidity 60%RH4周4 weeks3溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH168小時(shí)168 hours4溫度£30°C, 濕

21、度 60%RH Temperature£30°C,humidity 60%RH72小時(shí)72 hours5溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH48小時(shí)48 hours5a溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH24小時(shí)24 hours6T溫度£30°C, 濕度 60%RH Temperature£30°C,humidity 60%RH標(biāo)貼上

22、注明時(shí)間Time on Label (TOL)需使用前烘烤Need to bake before useOSP PWBT溫度£30°C, 濕度 640%RH Temperature£30°C,humidity 40%RH24小時(shí)24 hours最大保存期限為6個(gè)月Max. shelf life of 6 months2.4 拆封包裝前看包裝是否有破損，檢查濕度顯示卡(HIC)，看是否超出上面2.3所規(guī)定的外界 條件。Check that MBB is not broken, and Humidity Indicator Card (HIC) readin

23、g is not greater than the Environment Conditions stated in 1.3 above.Warning if Pink Change DesiccantRead at Lavender between Pink and Blue箭頭所指變粉紅則須烘烤60%50%40%30%10%20%Humidity Indicator2.5 如果濕度包裝袋子破損或濕度顯示卡的讀數(shù)大于以上環(huán)境指示表上的指示數(shù)據(jù)，物料/元件必須退還給賣主或參照以下濕度敏感元件烘烤設(shè)定表去烘烤。If the MBB is broken or HIC reading is grea

24、ter than Environment Conditions indicated in Table for Moisture Sensitive Device above, material/device must be returned to vendor or bake, refer to Table for Baking Moisture Sensitive Devices below. 2.6 濕度敏感元件烘烤設(shè)定表Table for Baking Moisture Sensitive Devices濕度敏感元件在無(wú)保護(hù)的環(huán)境中暴露的時(shí)間Moisture Sensitive Comp

25、onent Unprotected exposure time in ambient烘烤條件Baking condition如果元件超過(guò)2.32.4所規(guī)定的條件If component exceed the requirement on 12.3 12.41.一般要求烘烤(Norma baking condition):A324hrs 120oC +/-5°C2.元件供應(yīng)商有標(biāo)明按照要求按照其要求烘烤.If component supplier provide baking condition please baking by supplier request.3.下表為參考條件:

26、Below sheet is only reference condition. 24hrs 120oC +/-5°C3.儲(chǔ)存與管理(Storage and manage MSC)3.1 PE工程師根據(jù)如元件濕度敏感級(jí)別情況制作”濕度敏感級(jí)別清單”Refer to moisture sensitivity level of the component PE engineer make on list “MSD level list”3.2 IC在使用前需要在料盤上或包裝帶上貼上“濕度敏感元件管理標(biāo)簽”并寫上開(kāi)口時(shí)間和日期在包裝袋上來(lái)監(jiān)控其開(kāi)放時(shí)間。Upon using it, put

27、 on the “MSC manage lable”and write the open time and date on the package to monitor the opening timeP/N可用的裝配時(shí)間開(kāi)封時(shí)間及日期序號(hào)開(kāi)始時(shí)間及日期截止時(shí)間及日期備注12345678910再次儲(chǔ)存時(shí)間剩余裝配時(shí)間A3如:一IC的濕度等級(jí)為:3,剛拆開(kāi)濕度包裝的可用的裝配時(shí)間為:168H; For example:One moisture sensitive component level is 5,upon opening the MBB, Can be use asssembly tim

28、e:168H;可用的裝配時(shí)間為:168HCan be use asssembly time:168H;開(kāi)封時(shí)間及日期為:2005.10.18 AM9:00;Open time and date: 2005.10.18 AM9:00;如果是盤裝IC將每盤IC拿出的“開(kāi)始時(shí)間及日期”, “截止時(shí)間及日期”分別記錄在對(duì) 應(yīng)的序 號(hào) 位置.If the ic package is tray please Note note the “Start use time”, “End use time” of every tray on the serial number. 再次保存在濕度控制柜里或真空封裝的

29、時(shí)間為:2005.10.19 AM9:00;Stored at humidity control cabinet, or vacuum seal the components again time: 2005.10.19 AM9:00 剩余裝配時(shí)間為:144H;Remain assembly time:144h下次再使用時(shí)的可用的裝配時(shí)間:144HNext time use the component again the can be use asssembly time:144h3.3 如果生產(chǎn)將停止很長(zhǎng)一段時(shí)間，或濕度敏感元件會(huì)超過(guò)在濕度敏感元件表上所示的“裝配時(shí)間”，濕度敏感元件/物料應(yīng)該保存在濕度控制柜里，或真空封裝元件。If