品質(zhì)管理英文名詞匯總

1、 Accuracy 準(zhǔn)確度Active 主動(dòng)Action 評(píng)價(jià).處理Activity 活動(dòng)Add 加Addition rule 加法運(yùn)算規(guī)則Analysis Covariance 協(xié)方差分析Analysis of Variance 方差分析Appraisal Variation 評(píng)價(jià)變差A(yù)pproved 承認(rèn)ASQC 美國質(zhì)量學(xué)會(huì)Attribute 計(jì)數(shù)值A(chǔ)udit 審核Automatic database recovery 數(shù)據(jù)庫錯(cuò)誤自動(dòng)回復(fù)Average 平均數(shù)balance 平衡Balance sheet 資產(chǎn)負(fù)債對(duì)照表Binomial 二項(xiàng)分配Body 機(jī)構(gòu)Brainstorming

2、Techniques 腦力風(fēng)暴法 Business Systems Planning 企業(yè)系統(tǒng)規(guī)劃Cable 電纜Capability 能力Cause and Effect matrix 因果圖.魚骨圖Center line 中心線check 檢查Check Sheets 檢查表Chi-square Distribution 卡方分布Clutch spring 離合器彈簧Coining 壓印加工Common cause 共同原因Complaint 投訴Compound factor 調(diào)合因素Concept 新概念Condenser 聚光鏡Conformity 合格Connection 關(guān)聯(lián)Co

3、nsumers risk 消費(fèi)者之風(fēng)險(xiǎn)Control 控制Control characteristic 管制特性Control chart管制圖Control plan 管制計(jì)劃Correction 糾正Correlation Methods 相關(guān)分析法Cost down 降低成本CPI: continuouse Process Improvement 連續(xù)工序改善Creep 漸變Cross Tabulation Tables 交*表CS: customer Sevice 客戶中心Cushion 緩沖Customer 顧客DSA: Defects Analysis System 缺陷分析系統(tǒng)D

4、ata 數(shù)據(jù)Data Collection 數(shù)據(jù)收集Data concentrator 資料集中緩存器DCC: Document Control Center 文控中心Decision 決策.判定Defects per unit 單位缺點(diǎn)數(shù)Description 描述Detection 難檢度Device 裝置Digital 數(shù)字Do 執(zhí)行DOE: Design of Experiments 實(shí)驗(yàn)設(shè)計(jì)Element 元素Else 否則Engineering recbnology 工程技術(shù)Entropy 函數(shù)Environmental 環(huán)境Equipment 設(shè)備Estimated accumu

5、lative frequency 計(jì)算估計(jì)累計(jì)數(shù)EV: Equipment Variation 設(shè)備變異Event 事件External Failure 外部失效,外部缺陷FA: Failure Analysis 壞品分析Fact control 事實(shí)管理Fatique 疲勞FMEA: Failure Mode and Effect analysis 失效模式與效果分析FPY 合格率FQA: Final Quality Assurance 最終品質(zhì)保證FQC: Final Quality control 最終品質(zhì)控制Full-steer 完全轉(zhuǎn)向function 職能Gauge system

6、量測(cè)系統(tǒng)Grade 等級(jí)Gum-roll 橡皮滾筒Health meter 體重計(jì)Heat press 沖壓粘著Histogram 直方圖Hi-tech 高科技hypergeometric 超幾何分配hysteresis 磁滯現(xiàn)象Improvement 改善Inductance 電感Information 信息Initial review 先期審查Inspection 檢驗(yàn)Internal Failure 部失效,部缺陷IPQC: In Process Quality Control 制程品質(zhì)控制IQC: Incomming Quality Control 來料品質(zhì)控制IS Internati

7、onal Organization for Standardization 國際標(biāo)準(zhǔn)組織Law of large number 大數(shù)法則Link 連接LCL: Lower Control limit 管制下限LQC: Line Quality Control 生產(chǎn)線品質(zhì)控制LSL: Lower Size Limit 規(guī)格下限Machine 機(jī)械Manage 管理Materials 物料Measurement 量測(cè)Median 中位數(shù)Miss feed 漏送Module,sub-system,sub-unit 單位Momentum 原動(dòng)力Monte garlo method 原子核分裂熱運(yùn)動(dòng)法M

8、SA: Measurement System Analysis 量測(cè)系統(tǒng)分析Multiplication rule 乘法運(yùn)算規(guī)則NIST 美國:標(biāo)準(zhǔn)技術(shù)院Normal 常態(tài)分布Occurrence 發(fā)生率On.off system 開,關(guān)系統(tǒng)Operation Instruction 作業(yè)指導(dǎo)書Organization 組織Parameter 參數(shù)Parto 柏拉圖Parts 零件Parts per million 不良率Passive 消極的,被動(dòng)的Plan 計(jì)劃Pulse 脈沖Policy 方針Population 群體Power 力量,能源PQA: Process Quality Ass

9、urance 制程品質(zhì)保證Practice 實(shí)務(wù)Precision 精密度preemptive 先占式多任務(wù)Pressure 壓縮Prevention 預(yù)防Probability 機(jī)率Probability density function 機(jī)率密度函數(shù)Procedure 流程Process 過程Process capability analysis 制程能力分析圖Process control and process capability 制程管制與制程能力Producers risk 生產(chǎn)者之風(fēng)險(xiǎn)Product 產(chǎn)品Production 生產(chǎn)Program 方案Projects 項(xiàng)目QA:

10、 Quality Assurance 品質(zhì)保證QC: Quality Control 品質(zhì)控制QE: Quality Engineering 品質(zhì)工程QFD: Quality Function Desgin 品質(zhì)機(jī)能展開Quality 質(zhì)量Quality manual 品質(zhì)手冊(cè)Quality policy 品質(zhì)政策Random experiment 隨機(jī)試驗(yàn)Random numbers 隨機(jī)數(shù)Range 全距Record 記錄Reflow 回流Reject 拒收Repair 返修Repeatusility 再現(xiàn)性Reproducibility 再生性Requirement 要求Residual

11、 誤差Response 響應(yīng)Responsibilities 職責(zé)Review 評(píng)審Reword 返工Robustness 穩(wěn)健性Rolled yield 直通率RPN: Risk Priority Number 風(fēng)險(xiǎn)系數(shù)sample 抽樣,樣本Sample space 樣本空間Sampling with replacement 放回抽樣Sampling without replacement 不放回抽樣Scatter diagram 散布圖分析Scrap 報(bào)廢Screw 螺旋Severity 嚴(yán)重度Shot-preening 微粒沖擊平面法Simple random sampling 簡單隨

12、機(jī)取樣Size 規(guī)格SL: Size Line 規(guī)格中心線Slip 滑動(dòng)Stratified random sampling 分層隨機(jī)抽樣SOP: Standard Operation Procedure 標(biāo)準(zhǔn)作業(yè)書SPC: Statistical Process Control 統(tǒng)計(jì)制程管制Special cause 特殊原因Specification 規(guī)SQA: Source(Supplier) Quality Assurance 供貨商品質(zhì)保證Stage sampling 分段隨機(jī)抽樣Standard Deviation 標(biāo)準(zhǔn)差Sum of squares 統(tǒng)計(jì)表supplier 平方和

13、System 供方systematic sampling 系統(tǒng),體系Statistical tables 系統(tǒng)抽樣Taguchi-method 田口方法Technical committees 技術(shù)委員會(huì)Test piece 測(cè)試片Theory 原理Time stamp 時(shí)間戳印Time-lag 延遲Title 標(biāo)題Torque 轉(zhuǎn)矩Total 求和TQC: Total Quality Control 全面品質(zhì)控制TQM: Total Quality Management 全面品質(zhì)管理Traceability 追溯Training 培訓(xùn)Transaction processing and lo

14、gging 交易處理Trouble 困擾Up and down 上和下UCL: Upper Control Limit 管制上限USL: Upper Size Limit 規(guī)格上限Validation 確認(rèn)Variable 計(jì)量值Variance 變異和Vector 向量Verification 驗(yàn)證Version 版本VOC: voice of Customer 客戶需求VOE: Voice of Engineer 工程需求GRR Gauge Repeatability Reproducibility 量測(cè)的再現(xiàn)性與再生性FPI First Piece Inspection 首件檢查Samp

15、ling without replacement 不放回抽樣SQA: Source(Supplier) Quality Audit 供貨商品質(zhì)審核1. QC : quality control 質(zhì)量管理2. IQC : incoming quality control 進(jìn)料質(zhì)量管理3. OQC : output quality control 出貨質(zhì)量管理 4.PQC : process quality control 制程質(zhì)量管理也稱IPQC : in process quality control . 5. AQL : acceptable quality level 允收標(biāo)準(zhǔn) 6.CQA

16、: customer quality assurance 客戶品質(zhì)保證 7. MA : major defeat 主要缺點(diǎn)8. MI : minor defeat 次要缺點(diǎn) 9. CR :critical defeat 關(guān)鍵缺點(diǎn) 10. SMT : surface mounting technology表面粘貼技術(shù) 11. SMD :surface mounting device 表面粘貼程序 SMC : surface mounting component 表面粘貼組件12.ECN : engineering change notice 工程變更通知 13.DCN : design chan

17、ge notice 設(shè)計(jì)變更通知 14.PCB : printed circuit board 印刷電路板 15.PCBA : printed circuit board assembly裝配印刷電路板 16. BOM : bill of material 材料清單 17. BIOS : basically input and output system基本輸入輸出系統(tǒng) 18. MIL-STD-105E : 美國陸軍標(biāo)準(zhǔn),也稱單次抽樣計(jì)劃. 19. ISO : international standard organization 國際標(biāo)準(zhǔn)化組織 20. DRAM: 存條 21.Polarit

18、y : 電性22. Icicles : 錫尖23. Non-wetting : 空焊24. Short circuit : 短路25. Missing component : 缺件26. Wrong component :錯(cuò)件 27 . Excess component :多件28. Insufficient solder : 錫少29 . Excessive solder :錫多30. Solder residue: 錫渣31. Solder ball : 錫球32. Tombstone : 墓碑33 . Sideward：側(cè)立34. Component damage :零件破損 35. G

19、old finger:金手指36. SOP : standard operation process 標(biāo)準(zhǔn)操作流程 37. SIP : standard inspection process 標(biāo)準(zhǔn)檢驗(yàn)流程 38 .The good and not good segregation :良品和不良品區(qū)分 39. OBW : on board writer 熸錄BIOS 40 . Simple random sampling : 簡單隨機(jī)抽樣41. Histogram : 直方圖42 . Standard deviation : 標(biāo)準(zhǔn)差43. CIP : Continuous improvement

20、 program 持續(xù)改善計(jì)劃 44. SPC : Statistical process control 制程統(tǒng)制 45 . Sub-contractors : 分包商46. SQE: Supplier quality engineering47. Sampling sample :抽樣計(jì)劃 48. Loader : 治具49. QTS: Quality tracking system 質(zhì)量追查系統(tǒng)50. Debug : 調(diào)試51. Spare parts: 備用品52. Inventory report for : 庫存表 53. Manpower/Tact estimation 工時(shí)預(yù)算

21、 54. Calibration : 校驗(yàn) 55. S/N :serial number 序號(hào)56. Corrugated pad : 波紋墊57.Takeout tray: 包裝盒58. Outer box : 外包裝箱59. Vericode : 檢驗(yàn)碼60. Sum of square : 平方和61. Range : 全距62. Conductive bag : 保護(hù)袋 63. Preventive maintenance :預(yù)防性維護(hù)64. Base unit : 基體65. Fixture : 制具 66. Probe : 探針 67. Host probe : 主探針68. Go

22、lden card : 樣本卡 69. Diagnostics program : 診斷程序70. Frame : 屏面 71. Lint-free gloves : 靜電手套72 .Wrist wrap : 靜電手環(huán)73. Target value : 目標(biāo)值74. Related department : 相關(guān)部門75. lifted solder 浮焊76.plug hole孔塞77. Wrong direction 極性反78 ponent damage or broken 零件破損 79.Unmeleted solder熔錫不良80.flux residue松香未拭81.wrong

23、label or upside down label貼反82. mixed parts機(jī)種混裝83. poor solder mask綠漆不良84. oxidize 零件氧化85.stand off height浮高86. IC reverse IC反向87.supervisor課長 88. Forman組長89. WI=work instruction作業(yè)指導(dǎo)90. B.P.V: 非擦除狀態(tài)91. Internal notification: 部聯(lián)絡(luò)單92. QP :Quality policy質(zhì)量政策93. QT: Quality target 品質(zhì)目標(biāo)94. Trend:推移圖95.Pa

24、ret柏拉圖96. UCL: Upper control limit管制上限97.LCL:Lower control limit管制下限98. CL: Center line中心線 99.R.T.Y: Rolled throughout yield直通率 100. PPM: Parts per million 不良率 101.DPU: Defects per unit 單位不良率 102.Resistor: 電阻 103.Capacitor:電容 104. Resistor array : 排阻 105. Capacitor array: 排容 106. DIODE: 二極管 107.SOT:

25、 三極管 108. Crystal:震蕩器 109.Fuse:保險(xiǎn)絲 110.Bead: 電感 111.Connector:聯(lián)結(jié)器 112.ADM: Administration Department行政單位 113. CE: Component Engineering零件工程 114. CSD :Customer Service Department客戶服務(wù)部 115. ID: Industrial Design工業(yè)設(shè)計(jì) 116.IE: Industrial Engineering工業(yè)工程 117. IR: Industrial Relationship工業(yè)關(guān)系 118. ME: Mecha

26、nical Engineering機(jī)構(gòu)工程 119. MIS :Management Information System信息部120. MM: Material Management資材 121. PCC: Project Coordination/Control專案協(xié)調(diào)控制 122. PD: Production Department生產(chǎn)部 123. PE: Product Engineering產(chǎn)品工程 124. PM: Product Manager產(chǎn)品經(jīng)理 125. PMC: Production Material Control生產(chǎn)物料管理 126. PSC: Project Su

27、pport & Control產(chǎn)品協(xié)調(diào) 127.Magnesium Alloy:鎂合金 128. Metal Shearing:裁剪 129.CEM:Contract Electronics Manufacturing電子制造服務(wù)企業(yè)EMS: Electronics Manufacturing Services 130. ERP: Enterprise Resource Planning 企業(yè)資源規(guī)劃 SCM+CRM+ERP+EAI=Network direct TM links procurement, production, Logistics and sales 采購,生產(chǎn),后勤

28、管理與市場(chǎng)營銷的融合 EAI: Enterprise application Integration 企業(yè)應(yīng)用系統(tǒng)整合 CRM: Customer Relationship Planning 客戶服務(wù)規(guī)劃 SCM : Supply chain management 供應(yīng)鏈管理 131. OJT: On job training 在職培訓(xùn) 132.Access Time: 光盤搜尋時(shí)間 133. B2CEC:Business to consumer electronic commerce 企業(yè)對(duì)消費(fèi)者的電子商務(wù) B2BEC:Business to business electronic Comm

29、erce 企業(yè)間的電子商務(wù) 134.CCL:Copper Clad Laminate 銅箔基板 135. Intranet: 企業(yè)部通訊網(wǎng)路 136. ISP: Internet Service Provider網(wǎng)絡(luò)服務(wù)提供者 ICP: Internet Content Provider網(wǎng)絡(luò)容提供者 137. GSM: Global System for Mobile Communication 泛歐數(shù)字式行動(dòng)系統(tǒng) GPS: 全球衛(wèi)星定位系統(tǒng) 138. Home Page: 網(wǎng)絡(luò)首頁 139.Video Clip:影像文件 140. HTML:超文標(biāo)記語言 141.Domainname: 網(wǎng)域

30、名稱 142. IP: 網(wǎng)絡(luò)網(wǎng)域通訊協(xié)議地址 143.Notebook:筆記型計(jì)算機(jī) 144. VR: Virtual Reality虛擬實(shí)境 145. WAP: Wireless Application Protocol無線應(yīng)用軟件協(xié)議 146. LAN : Local area network局域網(wǎng)絡(luò) WWW: World Wide Web世域網(wǎng) WAN: Wide Area Network 廣域網(wǎng)絡(luò) 147. 3C: Computer, Communication, Consumer electronic 計(jì)算機(jī), 通訊, 消費(fèi)性電子三大產(chǎn)品的整合 148.Information Sup

31、plier Highway:信息高速公路 149.UPS:Uninterrupted power system不斷電系統(tǒng) 150.Processed material: 流程性材料 151.Entity/Item:實(shí)體 152.Quality loop:質(zhì)量環(huán)153.Quality losses: 質(zhì)量損失 154.Corrective action:糾正措施 155. Preventive action:預(yù)防措施 156.PDCA:Plan/Do/Check/Action計(jì)劃/實(shí)施/檢查/處理 157. Integrated circuits(IC):集成電路 158.Application

32、 program: 應(yīng)用程序 159.Utilities:實(shí)用程序 160.Auxiliary storage/Second storage:;輔助存儲(chǔ)器 161.Silicon chip:硅片 162Diskette drive:軟驅(qū) 163.Display screen/Monitor:顯示器 164.Foreground:前面 165.Montherboard:母板 166.Mermory board: 存板 167.Slot:插槽 168.Bus:Data-bus/address-bus/Control bus: 總線/數(shù)據(jù)總線/地址總線/控制總線 169.Plotter:繪圖 170

33、.MPC:Multimedia personal computer多媒體 171.Oscillator:振蕩器 172.Automatic teller terminal:自動(dòng)終端(出納)機(jī) 173.Joystick port:控制端口 174.VGA: Video Graphics Array顯示卡 175.Resolution:分辨率 176.Register:寄存器 177.ISA: Industry Standard Architecture: 工業(yè)標(biāo)準(zhǔn)結(jié)構(gòu) 178.EISA: Extended Industry Architecture 179.Adapter: 適配器 180.Pe

34、ripheral:外部設(shè)備 181.Faxmodem:調(diào)制解調(diào)器 181.NIC:Network interface card網(wǎng)絡(luò)接口卡 182. SCSI: Small computer system interface 183.VESA: Video Electronic Standards Association 184. SIMM: Single in-line memory module 單排座存儲(chǔ)器模塊(存條) 185.Casing:外箱 186.Aluminum:鋁質(zhì) 187.Ceramic: 瓷的 188.Platter:圓盤片 189.Actuator:調(diào)節(jié)器 190.Spi

35、ndle:軸心 191.Actuation arm: 存取臂 192.Default code: 缺省代碼 193.Auxiliary port:輔助端口 194.Carriage return : 回車 195.Linefeed:換行 196.ASCII: American Standard Code for Information Interchange 197.Video analog: 視頻模擬 198.TTL: Transistor- Transistor logic晶體管-晶體管邏輯電路 199.Three-prong plug:三芯電插頭 200.Female connector

36、:連接插座 201.Floppy disk:軟盤 202.Output level: 輸出電平 203.Vertical/Horizontal synchronization: 場(chǎng)/行同步 204.H(Horizontal)-Phase:行相位 205 patible:兼容機(jī) 206.Hardware Expansion Card: 硬件擴(kuò)充卡 207.Buffer:緩沖 208.CRM:Customer relationship Management 客戶關(guān)系管理 209.WIP: Work in process半成品 210.Waiver:特別采用 211.CXO系列CEO Chief E

37、xecutive Office首 COO :Chief Operating Office CFO Chief Finance Officer CBO Chief Business Officer CTO Chief Technology Officer CIO Chief Information Officer CGO Chief Government Officer 212. NASDAQ: 納斯達(dá)克證券市場(chǎng) NASDAQ Automated Quotation system 213.VC: Venture Capital 風(fēng)險(xiǎn)投資 214. PDA: Personal Date Assis

38、tant個(gè)人數(shù)字助理 PLA: Personal Information Assistant個(gè)人信息助理 215. PPAP: Advanced Product Quality Planning and Control Plan 生產(chǎn)性零組件核準(zhǔn)程序 216. FMEA: Potential Failure Mode and Effects Analysis 失效模式與效應(yīng)分析 217. MSA: Measurement Systems Analysis 量測(cè)系統(tǒng)分析 218. QAS: Quality System Assessment 質(zhì)量系統(tǒng)評(píng)鑒 219. Cusum: 累計(jì)總合圖 22

39、0. Overall Equipment Effectiveness設(shè)備移動(dòng)率 221. Benchmarking: 競(jìng)爭標(biāo)桿 Analysis of motion/Ergonomics動(dòng)作分析/人體工程學(xué) 222. Roka Yoke 防錯(cuò)法 MCR: machine capability ratio 機(jī)器利用率 223. Mistake Proofing 防呆法 Taguchi methods田口式方法 224, Vertical integration垂直整合 Surveillance定期追蹤審查 225. EMS: Electronics Manufacturing Supply-ch

40、ain 226. Cause & Effects charts特性要因圖 227. Scatter: 散布圖 Fool-Proof System 防呆系統(tǒng) 228. VE: Value Engineering 價(jià)值工程 QFD: Quality Function Development 質(zhì)量機(jī)能展開 229. Arrow Chart 箭頭圖法 Affiliate Chart親和圖法 230. PDPC: Process Decision Program Chart System Chart系統(tǒng)圖法 231. Relation Chart 關(guān)邊圖法 Matrix Chart矩陣圖法 23

41、2. Matrix Data Analysis 矩陣數(shù)據(jù)分析法 234. Brain-storm 腦風(fēng)暴法 JIT: Just In Time:與時(shí)性生產(chǎn)模擬 235. Deming Prize: 戴明獎(jiǎng) Prototype技術(shù)試作 236. BPM: Business Process Management .業(yè)務(wù)流程管 MBO目標(biāo)管理 237. MBP:方針管理 FTA:故障樹分析 QSCV: 服務(wù)質(zhì)量 238. IPPB: Information 情況 planning策劃 Programming規(guī)劃 Budget預(yù)算 239. EQ: Emotion Quotient:情商 IQ: In

42、telligence Quotient:智商240. Implied Needs:隱含要求 Specified Requirement:規(guī)定要求241. Probation:觀察期 Incoming Product released for urgent production 緊急放行242.Advanced quality planning 先進(jìn)的質(zhì)量策劃243. AOQ: Average Outgoing Quality 平均檢出質(zhì)量 AOQL: Average Outgoing Quality Limit 平均檢出質(zhì)量界限244.Approved Supplier List 經(jīng)核準(zhǔn)認(rèn)可的

43、供應(yīng)商245.Attribute date 特征 Benchmarking 基準(zhǔn)點(diǎn) Calibration 校準(zhǔn)246.Capable process 工序能力 Capability Index 工序能力指數(shù) Capability ratio 工序能力率247.CHANGE CYCLE TIME 修改的時(shí)間周期 Continuous improvement 持續(xù)改進(jìn)248. Control plans 控制策劃 Cost of quality 質(zhì)量成本249. Cycle time reduction 減少周期時(shí)間250. Design of experiments 實(shí)驗(yàn)設(shè)計(jì) Deviatio

44、n / Substitution 偏差 / 置換251. ESD: Electrostatic discharge 靜電釋放252. EH&S: Environmental, Health, and Safely 環(huán)境,健康.安全253. ESS: Environmental Stress Screening 環(huán)境應(yīng)力篩選254. FMEA: Failure Mode Effect Analysis 失誤模式效應(yīng)分析255. First Article approval 產(chǎn)品的首次論證256. First pass yield 一次性通過的成品率257. First sample inspection 第一次樣品檢驗(yàn)258. FMECA: Failure mode effect and critically analysis 失誤模式,效應(yīng)與后果分析259. Gauge control 測(cè)量儀器控制260. GR&R: Gauge repeatability and reproducibility 測(cè)量儀器重復(fù)性和再現(xiàn)性261. HALT: Highly Accelerated Life Test 高加速壽命試驗(yàn)262. HAST: Highly Accelerated Stress Test 高加速應(yīng)力試驗(yàn)263. IN-CONTROL PROCESS 受控