敏感元件之溫濕度控制

1、索卡科技電子有限公司PROCESS WORK INSTRUCTIONS 程序工作指導(dǎo)書DOCUMENT NO.: 文件編號SKL-SOP-100EFFECTIVE DATE : 生效 日 期2006/3/10VERSION :版次A0PAGE：頁次1 OF 8SUBJECT：主題敏感組件之溫濕度控制Moisture Sensitive Device ControlORIGINATOR :起草人APPROVED BY : 核準(zhǔn)人DON版次新版生效日期內(nèi)谷（變更敘述）A02006/3/10初版PAGE NO.1234567891011121314151617181920VERSIONA1A1A1A

2、1A1A1A1A1DATE01/0501/0501/0501/0501/0501/0501/0501/05金舜數(shù)碼科技有限公司SUBJECT :主題DOC. NO.SKL-SOP-100敏感組件之溫濕度控制Moisture Sen sitive Device Con trolPAGE NO2 OF 8VERSIONA0 DATE2006/3/101.0 目的Purpose :為避免敏感組件受潮，影響焊錫品質(zhì)，而作此規(guī)范儲存之環(huán)境溫度，濕度控制.To preve nt and reduce the n egative impact of moisture related failures in

3、the manu facturi ng process.2.0 適用范圍Scope :適用于公司所有溫濕度敏感的電子組件.Apply to all Moisture Sen sitive Devices used in Lite on.3.0 定義Definition :IQC,電子倉庫,生產(chǎn)線必須依規(guī)定儲存于適當(dāng)容器及環(huán)境內(nèi).All MSD comp onents in IQC, Warehouse, and producti on lines must be storedin the appropriate storage en vir onment.4.0 設(shè)備Equipme nt :4

4、.1大型防潮箱(20%RH)Large size Dry Storage Cab in et. (=60%RH or Comp onent floor life has expired, and the baking will complied follow form.注意：Package Body Thickness指組件圭寸裝厚度Level:即MSL（濕度敏感等級 一般組件標(biāo)簽上有注明）RH:指相對濕度，例如30攝氏度/85%RH表示在30攝氏度時所含的水分為飽和時所含 水分的85%溫濕度敏感組件：指的是組件在規(guī)定的溫濕度范圍之外存儲將會其功能曲線和焊接的正 常，甚至?xí)p壞組件。6.1烘烤

5、事件必需記錄于烘烤記錄表中，如項目10.0Bak ing eve nt should be record in“ Bak ing Oven Record ” as item 10.07.0烘烤后必須依5.0之儲存條件，否則必須依6.0作烘烤作業(yè).After baking, the materials must be stored according to condition 5.0, or else should follow the bak ing con diti on stated in 6.0.8.0敏感組件之使用管制MSD Usage Control :8.1未開封之材料儲存必須填寫

6、組件儲存卡（bin card）如”12.0進(jìn)行管制.Sealed materials storag must be con trolled by Material Storage Con trol Card 金舜數(shù)碼科技有限公司SUBJECT :主題DOC. NO.SKL-SOP-100敏感組件之溫濕度控制Moisture Sen sitive Device Con trolPAGE NO；4 OF 8VERSION 1A0DATE2006/3/108.2有開封之材料儲存必須填寫組件儲存使用記錄標(biāo)簽”進(jìn)行管制.Un sealed materials must be con trolled by

7、 Material Usage Con trol Record.8.3材料拆封后，應(yīng)立即在組件儲存使用記錄標(biāo)簽”上填寫拆封日期”，拆封時間”及 簽名等并將標(biāo)簽貼于敏感組件之外包裝上.After the package is unsealed, operator must record the seal-off date, time, quantity, etc on the Material Usage Control Record , and paste it on the package.8.4拆封后未上線使用之組件必須入庫保存，并在組件儲存使用記錄標(biāo)簽”上填寫入庫日期”入庫時間”，累計暴

8、露時間”及入庫數(shù)量”等相關(guān)項目.Un sealed materials that have not bee n used, must be resealed for storage, and record the storage date, time, cumulative exposure time, and qua ntity etc, on the MaterialControl Record .8.5拆封后上線使用之組件需填寫組件使用暴露時間記錄標(biāo)貼” (9.2且記錄使用3暴露時間并簽名，直至組件使用完，累計暴露時間超過72小時未使用完之組件 依6.0烘烤作業(yè).組件使用暴露時間記錄標(biāo)貼

9、”貼于IC TRAY盤側(cè)面.Un sealed materials for manu facturi ng process should fill in the Material Baking &Exposure Con trol Record (9.2), and record -of sme and floor life of the materials un til the producti on completes. If the cumulative exposure time of the material exceed72 hours, should follow the bak

10、 ing procedure stated in 6.0. Material Baking & ExpCon trol Record must be pasted on the side of the IC Tray.8.6每一真空包裝袋拆封后必須貼一張組件儲存使用記錄標(biāo)簽”組件未使用完前不可丟棄或 撕毀標(biāo)簽. Material Usage Con trol Record must be recorded and pasted after the package has bee n un sealed, and it must not be removed before the product

11、i on completes.金舜數(shù)碼科技有限公司SUBJECT :主題DOC. NO.SKL-SOP-100敏感組件之溫濕度控制Moisture Sen sitive Device Con trolPAGE NO.5 OF 8 nVERSIONA0DATE2006/3/109.0標(biāo)簽Con trol Labels9.1組件儲存使用記錄標(biāo)簽Material Usage Con trol Record組件存儲使用記錄標(biāo)簽Material Usage Con trol Record料號：品名規(guī)格：管控等級：撤封 日期撤封 時間入庫 時間暴露 時間累計暴 露 時間入庫數(shù)量出庫數(shù)量簽名備注SKL-S0

12、P-100-F0RM05-A9.2組件使用暴露時間記錄標(biāo)貼 Material Baking & Exposure Control Record組件使用暴露時間記錄標(biāo)簽Material Baki ng & Eeposure Con trol Record零件編號烘烤取出/撤封時間Date:Parts NoBaki ng/Seal-offTime:制造工令Order No有效使用期限Use By: (Floor-Life)數(shù)量Qua ntity執(zhí)行人員Operator工程師Engin eer管控等級Leve:SKL-SOP-100-FORM03-A金舜數(shù)碼科技有限公司SUBJECT :主題DOC.

13、 NO.SKL-SOP-100敏感組件之溫濕度控制Moisture Sen sitive Device Con trolPAGE NO.6 OF 8 :VERSIONA0DATE2006/3/1010.0烘烤記錄表Baki ng Ove n Record. (WI-GME-014)烘烤記錄表Bak ing Ove n RecordOve n no. :Year :Order No.Parts No.Temp.CIn putOperatorOutputRemai nQtyOperatorDateTimeQtyDateTimeQty/r /r /r /1 /r /1 /r /1 /I /1 /SK

14、L-SOP-100-FORM01-A部門主管：單位主管金舜數(shù)碼科技有限公司SUBJECT :主題DOC. NO.SKL-SOP-100敏感組件之溫濕度控制Moisture Sen sitive Device Con trolPAGE NO.7 OF8 :VERSIONA0DATE2006/3/1011.0 SMT干燥箱溫濕度記錄表SMT Dry-Box Temperature R Record.索卡科技有限公司干燥箱溫度記錄SMT Dry-Box Temperature Record月份：線別:日班(D/S)備注夜班(N/S)備注日 期溫度(23+-5C )Temperature溫度 Humi

15、dity符號Mark記錄者Remark溫度(23+-5C )Temperature溫度 Humidity符號Mark記錄者RemarkActualResultActualOKConfirmNGActualResultActualOKConfirmNG12345678910111213141516171819202122232425262728293031備注SKL-SOP-100-FORM04-A1.Actual20%rh :OK2.20%vACTUAL60%RH:NG4. 符號(mark):(a)正常(Normal)V(b)不正常(Abnormal):x4. 當(dāng)有不正常之溫度發(fā)生時，應(yīng)在備注欄說明原因用對策5. (a