關(guān)西涂料(PA5000) 最佳操作條件的研究.doc

關(guān)西涂料(PA-5000) 最佳操作條件之研究1.原作者簡介： 2.本范例之榮譽： 1998年榮獲臺灣電路股份有限公司第六屆DOE專題發(fā)表會特優(yōu)獎 3.本范例導(dǎo)讀： 研讀本范例時，請多留意本范例之下列優(yōu)點： 本范例為將DOE運用在新原料量產(chǎn)之范例，縮短了傳統(tǒng)試錯之時間， 使新原料在最短時間立即順利量產(chǎn)。 此專題采用三特性值之實驗，在一次實驗中就找到全面最適條件是一勞永逸之作法。 本范例在量產(chǎn)階段與SPC結(jié)合，用制程能力來評估成果，十分嚴(yán)謹(jǐn)扎實。 本范例在Cross Table斟酌取舍之智慧值得借鏡。 一、選題理由: PCB防焊油墨靜電涂布系統(tǒng) (Electrostatic Spray Coating ) 為本廠新采用的Solder mask涂布方式,有別于一般傳統(tǒng)的Screen coating ;希望藉由D.O.E的方式能夠快速且有效的找出關(guān)西涂料PA-5000運用在靜電涂布系統(tǒng)的操作參數(shù) ,以便順利進入量產(chǎn) 。 二、期望目標(biāo): 期望找出最佳操作條件,使制程能力皆能落于安全區(qū) 三、特性要因分析: 四、樣本量測說明 Q項收集及量測收集地點收集方式給分方式1. S/M厚度HAL后切片以切片實際量測之讀值2. Over hangHAL后100X放大鏡以100X放大鏡實際量測之讀值 ( 兩邊Over hang總和)3.Solder damHAL后100X放大鏡以100X放大鏡實際量測之讀值 ( 扣除 Over hang部分) 五第一階段實驗配置 5.1實驗因子水平及交互作用 5.2點線圖 L16215 5.3直交配列表 采用L16215方式配置 六、第一階段實驗數(shù)據(jù)P/N: 24001411(負(fù)片法) 12345678Over hang1.6421.8301.1921.3802.3752.3301.3420.342Solder dam2.9003.6503.0673.9003.9672.7674.1833.733S/M厚度1.1601.1601.1601.2401.1901.1501.2001.170910111213141516Over hang1.3302.5672.4001.8333.1670.4581.1173.200Solder dam3.3673.1502.1503.7003.1303.3002.9702.717S/M厚度1.3701.4801.4301.4901.4001.4201.5001.440 七、變異數(shù)分析7.1 S/M 厚度 7.1.1 合并后ANOVA FACTORSiDFVF (%)A1.10775611.1077561741.07193.0983*D0.03150610.03150649.518662.59587*I0.02175610.02175634.194491.77599*AH0.01050610.01050616.512770.82997*B0.00680610.00680610.697440.51883*AB0.00330610.0033065.1964630.22452F0.00225610.0022563.5461680.13622G0.00180610.0018062.8388990.09838H0.00030610.0003060.4813350.02774C0.00000610.0000060.0098230.05297e0.00318110.0006360.64108St=1.189193t =99.3589 7.1.2貢獻率柏拉圖 7.2 Solder dam 7.2.1合并后ANOVA FACTORSiDFVF (%)D1.35082511.35082526.6179829.6454*A0.8477810.8477816.0778918.157*G0.5658810.5658810.7317411.7191*AF0.51015310.5101539.67489610.4464*H0.29620810.2962085.6174955.56047*AD0.20634310.2063433.9132323.50817F0.1449710.144972.7493222.10656B0.08746810.0874681.6588050.79334e0.36910670.05272918.0632St=4.378735t =81.9367 7.2.2貢獻率柏拉圖 7.3Over hang 7.3.1合并后ANOVA FACTORSiDFVF (%)AF3.51562513.51562537.3676131.6604*F1.9611.9620.8328517.2658*G1.562511.562516.6078213.5876*AH0.99002510.99002510.522988.29039*A0.85562510.8556259.0944467.04675*I0.51122510.5112255.4338153.85993D0.48302510.4830255.1340773.59899H0.270410.27042.8740841.63151e0.09408270.0948213.0585St=10.807t =86.9414 7.3.3貢獻率柏拉圖 八、Cross Table及第一階段實驗結(jié)論 因子特性質(zhì)ABCDFGHIAHAFS/MA1B1C2D1F2G1H2I1A1H2貢獻率93%0.52%2.60%1.77%0.83%顯著性*Solder damA1B2C2D2F2G2H1I2A1F2貢獻率18.16%29.6%11.7%5.5%10.4%顯著性*OverhangA2B2C1D1F1G2H1I2A1H1A2F1貢獻率7.00%17.26%13.58%8.29%31.66%顯著性*結(jié)論A1B1C2D2F1G2H1I1Over hang AF: A1F1= (1.642+1.380+2.330+1.342)/4=1.674AH: A1H1= (1.642+1.380+2.375+0.342)/4=1.430* A1F2= (1.830+1.192+2.375+0.342)/4=1.430A1H2= (1.830+1.192+2.330+1.342)/4=1.670 A2F1= (1.330+1.883+0.458+1.117)/4=1.119* A2H1= (1.330+1.883+3.167+3.200)/4=2.400 A2F2= (2.567+2.400+3.167+3.200)/4=2.830A2H2= (2.567+2.400+0.458+1.117)/4=3.271Solder dam AF: A1F1= (2.900+3.900+2.767+4.183)/4=3.440 S/M厚度 AH: A1H1= (1.160+1.240+1.190+1.175)/4=1.190 A1F2= (3.650+3.067+3.967+3.733)/4=3.600*A1H2= (1.165+1.160+1.155+1.200)/4=1.170* A2F1= (3.367+3.700+3.300+2.970)/4=3.330A2H1= (1.370+1.495+1.405+1.445)/4=1.430 A2F2= (3.150+2.150+3.130+2.717)/4=2.790A2H2= (1.480+1.430+1.425+3.000)/4=1.460Over hang (望小值) Solder dam (望大值) S/M厚度 (望目值) 結(jié)論: 1.A1,B1,C2,D2,F1,G2,H1,I1為經(jīng)Cross Table分析后之較佳條件, 當(dāng)遇到多特性質(zhì)沖突時以其貢獻率%來取舍 2.經(jīng)分析后決定: 第二階段實驗取C,B,F,H,I為常數(shù)項 ; A1,D2,G2繼續(xù)第二階段實驗,以便找出最佳操作條件 九、第二階段實驗配置 9.1實驗因子與水平 因子代號水平一水平二水平三交互作用AA11A12A13DD21D22D23GG21G22G23 9.2點線圖 十、第二階段實驗數(shù)據(jù)P/N: 24001411(負(fù)片法) 123456789Over hang2.752.623.173.033.033.212.312.863.31Solder dam3.023.113.283.163.203.103.363.063.19S/M厚度1.000.901.101.150.901.001.101.301.30 十一、第二階段實驗解析 11.1 Over hang 之ANOVA FACTORSiDFVF%D0.45875520.2293772.35958332.3347A0.12895520.0644770.6632758.00826G0.03535520.0176770.18184919.4579e0.19442220.09721140.1989St=0.817488t =59.801 11.2 Solder dam 之ANOVA FACTORSiDFVF%G0.07315520.03657717.0569974.5131D0.00775520.0038771.808293.7509A0.00722220.0036111.6839373.17383e0.00428820.00214418.5621St=0.092422t=81.4378 11.3S/M厚度 之ANOVA FACTORSiDFVF%A0.10166620.0508331.96774127.7777D0.01520.00750.29032220.3703G0.01166620.0058330.22580622.2222e0.05166620.02583329.6296St=0.18t=70.3703 11.4第二階段實驗結(jié)論 從第二階段實驗解析發(fā)現(xiàn), 在考慮Over hang , Solder dam與 S/M厚度等三個質(zhì)量特性中發(fā)現(xiàn) A、D、G三個因子水平變化皆不顯著, 表示第二階段實驗因子之各水平皆適用 十二、再現(xiàn)性確認(rèn) 12.1目的: 依實驗所得的最佳操作條件進行再現(xiàn)性確認(rèn)-以再現(xiàn)性與第二階段實驗數(shù)據(jù)做Two sample analysis 測試正片法料號亦適用此最佳操作條件 - 小量產(chǎn)一批做Process capability analysis 12.2測試料號: P/N: 24001411 D/C: 9821 (負(fù)片法) P/N: 24000841 D/C: 9821 (正片法) 十三、標(biāo)準(zhǔn)化及效果確認(rèn):13.1再現(xiàn)性與第二階段Two-Sample Analysis :Two-Sample Analysis ResultsAna. Over2Ana. Over3PooledSample Statistics:Number of obs. AverageVarianceStd. DeviationMedian25 2.932 0.0306 0.174929 2.925 2.862 0.030475 0.174571 2.8550 2.897 0.05375 0.17475 2.9Difference between Means=0.07 Conf. Interval for Diff. in Means: (Equal Vars.) Sample 1 - Sample 2 (Unequal Vars.) Sample 1 - Sample 295 Percent -0.0294018 -0.02940180.164902 0.16490248 D.F. 48.0 D.F.Ratio of Variance=1.0041 Conf. Interval for Ratio of Varances: Sample 1Sample 20 Percent Hypothesis Test for HO: Diff=0 Vs Alt:NEAt Alpha=0.05Computed t statistic=1.41624 Sig. Level=0.163163 so do not reject HO 由Two sample analysis的結(jié)果(so do not reject H0)知道: 此次實驗所得的最佳操作條件的 ”再現(xiàn)性為100%” 13. 2 正片法效果確認(rèn): 由正片法的制程能力改善方向圖的結(jié)果知道: 三個質(zhì)量特性均落在安全區(qū)，所以此次實驗所得的最佳操作條件亦可適用于 ”正片法”。 13.3綜合以上兩點再現(xiàn)性