sd協(xié)議2 0part_1_physical_layer_specification_ver2 00_W

1、ChrontSD GroupMatsushita Electric Industrial Co., Ltd. (Panasonic) SanDisk CorporationToshiba CorporationTechnical CommitteeSD Card AssociationDownloaded by Roger Yu Chrontel on 06/18/2008SD Specifications Part 1Physical Layer SpecificationVersion 2.00May 9, 2006Copyright 2001-2006 SD Group (Panason

2、ic, SanDisk, Toshiba) and SD Card AssociationPhysical Layer Specification Version 2.00Revision HistoryConfidentialiDownloaded by Roger Yu Chrontel on 06/18/2008To the extent this proposed specification, which is being submitted for review under the IP Policy, implements, incorporates by reference or

3、 refers to any portion of versions 1.0 or 1.01 of the SD Specifications (including Parts 1 through 4), adoption of the proposed specification shall require Members utilizing the adopted specification to obtain the appropriate licenses from the SD-3C, LLC, as required for the utilization of those por

4、tion(s) of versions 1.0 or 1.01 of the SD Specifications.For example, implementation of the SD Specifications in a host device under versions 1.0 or1.01 and under the adopted specification requires the execution of a SD Host Ancillary License Agreement with the SD-3C, LLC; and implementation of the

5、SD Specifications under versions 1.0 or 1.01 and under the proposed specification in a SD Card containing any memory storage capability (other than for storage of executable code for a controller or microprocessor within the SD Card) requires the execution of a SD Memory Card License Agreement with

6、the SD-3C, LLC.DateVersionChanges compared to previous issueMarch 22, 20001.0Base version (Draft only)April 15, 20011.01Initial release versionOctober 15, 20041.10- Version 1.01 + supplementary notes Version 1.01e(March 21, 2004)- CMD6 (Switch Function command) is specified and CMD34-37, 50 and 57 a

7、re reserved for new command system.- High-Speed mode is specified.(Up to 25 MB/sec Read/Write rate)- eCommerce command set and Vendor Specific command set are specifiedMay 9, 20062.00- Version 1.10 + supplementary notes Version 1.00.- High Capacity SD Memory Card is specified. (Up to and including 3

8、2 GB)Copyright 2001-2006 SD Group (Panasonic, SanDisk, Toshiba) and SD Card AssociationPhysical Layer Specification Version 2.00Conditions for publicationPublisher:SD Card Association2400 Camino Ramon, Suite 375 San Ramon, CA 94583 USA Telephone: +1 (925) 275-6615,Fax: +1 (925) 886-4870E-mail: offic

9、Copyright Holders:The SD GroupMatsushita Electric Industrial Co., Ltd. (Panasonic) SanDisk Corporation (SanDisk)Toshiba Corporation (Toshiba) The SD Card AssociationNotes:The copyright of the previous versions (Version 1.00 and 1.01) changes thereto are owned by SD Group.and all correctio

10、ns or non-materialThe copyright of material changes to the previous versions (Version 1.01) are owned by SD Card Association.Confidentiality:The contents of this document are deemed confidential information of the SD-3C LLC and/or the SD Card Association (the Disclosers). As such, the contents and y

11、our right to use the contents are subject to the confidentiality obligations stated in the written agreement you entered into with the Disclosers which entitled you to receive this document, such as a Non-Disclosure Agreement, the License Agreement for SDA Memory Card Specifications (also known as L

12、AMS), the SD Host/Ancillary Product License Agreement (also known as HALA) or the IP Policy.Disclaimers:The information contained herein is presented only as a standard specification for SD Card and SD Host/Ancillary products. No responsibility is assumed by SD Card Association for any damages, any

13、infringements of patents or other right of the third parties, which may result from its use. No license is granted by implication or otherwise under any patent or rights of SD Group and SD Card Association or others.iiDownloaded by Roger Yu Chrontel on 06/18/2008ConfidentialCopyright 2001-2006 SD Gr

14、oup (Panasonic, SanDisk, Toshiba) and SD Card AssociationPhysical Layer Specification Version 2.00Conventions Used in This DocumentNaming Conventions Some terms are capitalized to distinguish their definition from their common English meaning. Words not capitalized have their common English meaning.

15、Numbers and Number Bases Hexadecimal numbers are written with a lower case “h” suffix, e.g., FFFFh and 80h. Binary numbers are written with a lower case “b” suffix (e.g., 10b). Binary numbers larger than four digits are written with a space dividing each group of four digits, as in 1000 0101 0010b.

16、All other numbers are decimal.Key Words May: Shall:Indicates flexibility of choice with no implied recommendation or requirement.Indicatesamandatoryrequirement.Designersshallimplementsuchmandatoryrequirements to ensure interchangeability and to claim conformance with the specification. Should: Indic

17、ates a strong recommendation but not a mandatory requirement. Designers shouldgive strong consideration to such recommendations, but there is still implementation.achoiceinApplication NotesSome sections of this document provide guidance to the host implementers as follows:iiiDownloaded by Roger Yu C

18、hrontel on 06/18/2008ConfidentialApplication Note:This is an example of an application note.Copyright 2001-2006 SD Group (Panasonic, SanDisk, Toshiba) and SD Card AssociationPhysical Layer Specification Version 2.00Table of Contents1. General Description12. System Features33. SD Memory Card System C

19、oncept53.1 Read-Write Property53.2 Supply Voltage53.3 Card Capacity63.4 Speed Class73.5 Bus Topology83.5.1 SD Bus83.5.2 SPI Bus93.6 Bus Protocol103.6.1 SD Bus103.6.2 SPI Bus133.7 SD Memory CardPins and Registers144. SD Memory Card Functional Description164.1 General164.2 Card Identification Mode174.

20、2.1 Card Reset174.2.2 Operating Condition Validation174.2.3 Card Initialization and Identification Process194.3 Data Transfer Mode214.3.1 Wide Bus Selection/Deselection234.3.2 2 GByte Card234.3.3 Data Read234.3.4 Data Write244.3.5 Erase264.3.6 Write Protect Management264.3.7 Card Lock/Unlock Operati

21、on2 General2 Parameter and the Result of CMD422 Forcing Erase3.1 Force Erase Function to the Locked Card3 Relation Between ACMD6 and Lock/Unlock State3 Commands Accepted for Locked Card3 Two Types of Lock/Unlock Card334.3.8 Content Protection33

22、4.3.9 Application-Specific Commands3 Application-Specific Command APP_CMD (CMD55)3 General Command - GEN_CMD (CMD56)344.3.10 Switch Function Command3 General3 Mode 0 Operation - Check Function3 Mode 1 Operation - Set Function37ivDownloaded by Roger Yu Chron

23、tel on 06/18/2008ConfidentialCopyright 2001-2006 SD Group (Panasonic, SanDisk, Toshiba) and SD Card AssociationPhysical Layer Specification Version 2.00 Switch Function Status3.1 Busy Status Indication for Functions40.2 Data Structure Version4.3 Function Table of Sw

24、itch Command4 Relationship between CMD6 data & other commands4 Switch Function Flow Example4 Example of Checking4 Example of Switching474.3.11 High-Speed Mode (25 MB/sec interface speed)484.3.12 Command System484.3.13 Send Interface Condition Command (CMD8)494.3.1

25、4 Command Functional Difference in High Capacity SD Memory Card504.4 Clock Control514.5 Cyclic Redundancy Code (CRC)524.6 Error Conditions544.6.1 CRC and Illegal Command544.6.2 Read, Write and Erase Timeout Conditions5 Read5 Write5 Erase544.7 Commands554.7.1 Command Types554.

26、7.2 Command Format554.7.3 Command Classes554.7.4 Detailed Command Description584.8 Card State Transition Table654.9 Responses674.9.1 R1 (normal response command):674.9.2 R1b674.9.3 R2 (CID, CSD register)674.9.4 R3 (OCR register)684.9.5 R6 (Published RCA response)684.9.6 R7 (Card interface condition)

27、694.10 Two Status Information of SD Memory Card704.10.1 Card Status704.10.2 SD Status744.11 Memory Array Partitioning784.12 Timings804.12.1 Command and Response804.12.2 Data Read824.12.3 Data Write834.12.4 Timing Values864.13 Speed Class Specification874.13.1 Allocation Unit (AU)874.13.2 Recording U

28、nit (RU)874.13.3 Write Performance874.13.4 Read Performance884.13.5 Performance Curve Definition894.13.6 Speed Class Definition894.13.7 Consideration for Inserting FAT Update during Recording9Measurement Condition to determine Average TFw91vDownloaded by Roger Yu Chrontel on 06/18/2008Confi

29、dentialCopyright 2001-2006 SD Group (Panasonic, SanDisk, Toshiba) and SD Card AssociationPhysical Layer Specification Version 2.00 Maximum FAT Write Time914.13.8 Measurement Conditions and Requirements of the Speed Class9 Measurement Conditions9 Requirements of the Performa

30、nce Parameters for Each Speed Class9 Requirements of SD File System924.14 Erase Timeout Calculation934.14.1 Erase Unit934.14.2 Case Analysis of Erase Time Characteristics934.14.3 Method for Erase Large Areas944.14.4 Calculation of Erase Timeout Value Using the Parameter Registers945. Card R

31、egisters955.1 OCR register965.2 CID register975.3 CSD Register995.3.1 CSD_STRUCTURE995.3.2 CSD Register (CSD Version 1.0)1005.3.3 CSD Register (CSD Version 2.0)1085.4 RCA register1115.5 DSR register (Optional)1115.6 SCR register1116. SD Memory Card Hardware Interface1136.1 Hot Insertion and Removal1

32、146.2 Card Detection (Insertion/Removal)1146.3 Power Protection (Insertion/Removal)1156.4 Power Scheme1166.4.1 Power Up1166.4.2 Power Down and Power Cycle1176.5 Programmable Card Output Driver (Optional)1186.6 Bus Operating Conditions1206.6.1 Threshold Level for High Voltage Range1206.6.2 Threshold

33、Level for Low Voltage Range1206.6.3 General1206.6.4 Current Consumption1206.6.5 Bus signal line load1216.6.6 Bus Signal Levels1226.7 Bus Timing (Default)1236.8 Bus Timing (High-Speed Mode)1257. SPI Mode1277.1 Introduction1277.2 SPI Bus Protocol1277.2.1 Mode Selection and Initialization1287.2.2 Bus T

34、ransfer Protection1307.2.3 Data Read1307.2.4 Data Write1317.2.5 Erase & Write Protect Management1327.2.6 Read CID/CSD Registers1337.2.7 Reset Sequence1337.2.8 Error Conditions133viDownloaded by Roger Yu Chrontel on 06/18/2008ConfidentialCopyright 2001-2006 SD Group (Panasonic, SanDisk, Toshiba) and

35、SD Card AssociationPhysical Layer Specification Version 2.007.2.9 Memory Array Partitioning1337.2.10 Card Lock/Unlock1337.2.11 Application Specific Commands1337.2.12 Content Protection Command1337.2.13 Switch Function Command1347.2.14 High-Speed Mode1347.2.15 Speed Class Specification1347.3 SPI Mode

36、 Transaction Packets1357.3.1 Command Tokens13 Command Format13 Command Classes13 Detailed Command Description13 Card Operation for CMD8 in SPI mode1417.3.2 Responses14 Format R114 Format R1b14 Format R214 Format R314 Formats R4

37、& R514 Format R71457.3.3 Control Tokens14 Data Response Token14 Start Block Tokens and Stop Tran Token14 Data Error Token1477.3.4 Clearing Status Bits1477.4 Card Registers1487.5 SPI Bus Timing Diagrams1497.5.1 Command/Response150 Host Command to Card Response -

38、 Card is ready150 Host Command to Card Response - card is busy150 Card Response to Host Command1507.5.2 Data Read15 Timing of Single Block Read Operation15 Stop Transmission Timing of Multiple Block Read Operation15 Reading the CSD or CID register1517.5.3 Data W

39、rite15 Timing of Multiple Block Write Operation15 Stop Transmission Timing of Multiple Block Write Operation1527.5.4 Timing Values1537.6 SPI Electrical Interface1537.7 SPI Bus Operating Conditions1537.8 Bus Timing1538. SD Memory Card Mechanical Specification1548.1 Card Package1558.1.

40、1 Design and Format1558.1.2 Reliability and Durability1558.1.3 Electrical Static Discharge (ESD) Requirement1568.1.4 Quality Assurance1568.2 Mechanical Form Factor1578.3 System: card and connector1608.3.1 Card Hot Insertion160viiDownloaded by Roger Yu Chrontel on 06/18/2008ConfidentialCopyright 2001

41、-2006 SD Group (Panasonic, SanDisk, Toshiba) and SD Card AssociationPhysical Layer Specification Version 2.008.3.2 Inverse Insertion1618.3.3 Card Orientation1618.3.4 Write Protect Detection1618.4 Thin (1.4 mm) Standard Size SD Memory Card1618.5 Nonconductive Area163Appendix A164A.1 Power Supply Deco

42、upling164A.2 Connector165A.2.1 General165A.2.2 Card Insertion and Removal165A.2.3 Characteristics167A.3 Related Documentation168Appendix B169B.1 Abbreviations and terms169viiiDownloaded by Roger Yu Chrontel on 06/18/2008ConfidentialCopyright 2001-2006 SD Group (Panasonic, SanDisk, Toshiba) and SD Ca

43、rd AssociationPhysical Layer Specification Version 2.00Table of FiguresFigure 1-1: SD Specifications Documentation Structure1Figure 3-1: Hosts-Cards Usability6Figure 3-2: SD Memory Card System Bus Topology8Figure 3-3: SD Memory Card System (SPI Mode) Bus Topology9Figure 3-4: “no response” and “no da

44、ta” Operations10Figure 3-5: (Multiple) Block Read Operation10Figure 3-6: (Multiple) Block Write Operation11Figure 3-7: Command Token Format11Figure 3-8: Response Token Format11Figure 3-9: Data Packet Format - Usual Data12Figure 3-10: Data Packet Format - Wide Width Data13Figure 3-11: SD Memory Card

45、Shape and Interface (Top View)14Figure 3-12: SD Memory Card Architecture15Figure 4-1: SD Memory Card State Diagram (card identification mode)18Figure 4-2: Card Initialization and Identification Flow (SD mode)20Figure 4-3: SD Memory Card State Diagram (data transfer mode).21Figure 4-4: Use of Switch

46、Command36Figure 4-5: Busy Status of Command System40Figure 4-6: CMD12 during CMD6; Case 1.43Figure 4-7: CMD12 during CMD6; Case 2.43Figure 4-8: Example of Switch Function flow44Figure 4-9: Switching Function Flow45Figure 4-10: CRC7 Generator/Checker52Figure 4-11: CRC16 Generator/Checker53Figure 4-12

47、: Write Protection Hierarchy79Figure 4-13: Identification Timing (card identification mode)80Figure 4-14: SEND_RELATIVE_ADDR Timing80Figure 4-15: Command Response Timing (data transfer mode)81Figure 4-16: Timing of Response End to next CMD Start (data transfer mode)81Figure 4-17: Timing of Command S

48、equences (all modes).81Figure 4-18: Timing of Single Block Read Command82Figure 4-19: Timing of Multiple Block Read Command82Figure 4-20: Timing of Stop Command (CMD12, data transfer mode)82Figure 4-21: Timing of Single Block Write Command83Figure 4-22: Timing of Multiple Block Write Command84Figure

49、 4-23: Stop Transmission during Data Transfer from the Host84Figure 4-24: Stop Transmission during CRC Status Transfer from the Card84Figure 4-25: Stop Transmission received after Last Data Block. Card is busy programming.85Figure 4-26: Stop Transmission received after Last Data Block. Card becomes

50、busy85Figure 4-27: Definition of Allocation Unit (AU)87Figure 4-28: Example of Writing Fragmented AU87Figure 4-29: Card Performances between 16 RUs89Figure 4-30: Three Performance Curves90Figure 4-31: Typical Sequence of FAT Update91Figure 4-32: Example Erase Characteristics (Case 1 TOFFSET=0)93Figu

51、re 4-33: Example Erase Characteristics (Case 2 TOFFSET=2)94Figure 5-1: ERASE_BLK_EN = 0 Example105Figure 5-2: ERASE_BLK_EN = 1 Example105Figure 6-1: Bus Circuitry Diagram113ixDownloaded by Roger Yu Chrontel on 06/18/2008ConfidentialCopyright 2001-2006 SD Group (Panasonic, SanDisk, Toshiba) and SD Ca

52、rd AssociationPhysical Layer Specification Version 2.00Figure 6-2: Improper Power Supply115Figure 6-3: Short Circuit Protection115Figure 6-4: Power-up Diagram116Figure 6-5: SD Memory Card Bus Driver119Figure 6-6: Bus Signal Levels122Figure 6-7: Timing Diagram Data Input/Output Referenced to Clock (D

53、efault)123Figure 6-8: Timing Diagram Data Input/Output Referenced to Clock (High-Speed)125Figure 7-1: SD Memory Card State Diagram (SPI mode)128Figure 7-2: SPI Mode Initialization Flow129Figure 7-3: Single Block Read Operation130Figure 7-4: Read Operation - Data Error131Figure 7-5: Multiple Block Re

54、ad Operation131Figure 7-6: Single Block Write Operation131Figure 7-7: Multiple Block Write Operation132Figure 7-8: No data Operations132Figure 7-9: R1 Response Format143Figure 7-10: R2 Response Format144Figure 7-11: R3 Response Format145Figure 7-12: R7 Response Format145Figure 7-13: Data Error Token

55、147Figure 7-14: Basic Command Response150Figure 7-15: Command Response with Busy Indication (R1b)150Figure 7-16: Timing between Card Response to new Host Command150Figure 7-17: Read Single Block Operations - Bus Timing.151Figure 7-18: Stop Transmission in Read Multiple Block151Figure 7-19: Read CSD/CID - Bus Timing151Figure 7-20: Write Operation - Bus Timing152Figure 7-21: Stop Transmission in Write Multiple Block152Figure 8-1: SD Memory Card - Mechanical Description (1 out of 3)157Figure 8-2: SD Memory Card - Mechanical Description (2 out of 3)158Figure