用動(dòng)畫(huà)的形式講述整個(gè)LCM制作流程

Part-1內(nèi)容1.模組構(gòu)裝流程簡(jiǎn)介2.OLB製程3.Soldering製程TFT-LCD模組構(gòu)裝技術(shù)Part-155分鐘H231陳晶川Part-255分鐘H231高宏成中場(chǎng)休息10分鐘訊號(hào)處理(電氣迴路)訊號(hào)B/L電源迴路DriverICDataDriverICScanPanelLCD模組的基本架構(gòu)模組機(jī)構(gòu)訊號(hào)介面LCD模組製程是將LCD的各部品依其功能將其統(tǒng)合在設(shè)計(jì)好的模組架構(gòu)中且使該模組能達(dá)到所需要的品質(zhì)要求

OLB/COGBondingSolder/ACFBondingBezel組立B/L組立現(xiàn)行模組製程流程端子清潔ACF貼付TCP搭載TCP壓著SolderingACF壓合PCBACF貼付onPCBPANELPCBACFTape組立遮光膠帶,Gum,B/L,Bezel,螺絲Aging外觀修飾入庫(kù)包裝材矽膠塗佈*ACFTapeTCP標(biāo)籤,保護(hù)膜包裝OLB檢查組立檢查終檢檢查外觀檢查QA檢查絕緣片OuterLeadBondingProcessSolderingProcess(半田)ACFonPCBProcess製程流程-說(shuō)明-1.端子清潔TCP壓著(本壓)PANELACF貼付ACFTapeTCP搭載(假壓)TCPOLB檢查製程流程-說(shuō)明-2.PCB矽膠塗佈Soldering(半田)OLB檢查製程流程-說(shuō)明-3.組立遮光膠帶,Gum,B/L,Bezel,螺絲Soldering組立檢查製程流程-說(shuō)明-4.絕緣片組立檢查組立ControlBox

PatternGeneratorPowerSupplyAging標(biāo)籤,保護(hù)膜終檢檢查外觀修飾外觀檢查QA包裝,入庫(kù)HannStarPanelAlignmentMark對(duì)位方式:CCD辨識(shí)PanelMark圖解OLB製程流程PanelinCleanPanel對(duì)位ACF貼附TAB假壓TABPuncherTAB本壓Panelout自動(dòng)機(jī)臺(tái)TCP對(duì)位Panel對(duì)位ACF貼付onPanelACF圖解OLB製程流程PanelinCleanPanel對(duì)位ACF貼附TAB假壓TABPuncherTAB本壓Panelout自動(dòng)機(jī)臺(tái)TCP對(duì)位Panel對(duì)位OLBAlignmentMarkC/F(上玻璃)DriverICTCPAlignmentMarkDriverICTCPLeadC/F(上玻璃)CheckPoint1CheckPoint3CheckPoint2TCP本壓溫度壓力圖解OLB製程流程PanelinCleanPanel對(duì)位ACF貼附TAB假壓TABPuncherTAB本壓Panelout自動(dòng)機(jī)臺(tái)TCP對(duì)位Panel對(duì)位TCP搭載與壓著TCP正視側(cè)視ACF壓合狀況5μm2~4μmAnisotropicConductiveFilm:異方性導(dǎo)電膠變形破裂1.機(jī)械強(qiáng)度

控制參數(shù):製程溫度◎製程壓力○ACF種類(膠材,尺寸)◎OLB半成品之要求2電性導(dǎo)通

控制參數(shù):製程對(duì)位精度◎ACF種類(導(dǎo)電粒子特性,大小,密度)◎接合面積◎製程壓力◎

3.外觀

要求項(xiàng)目:TCP無(wú)刮傷損傷變形◎Panel無(wú)損傷裂痕◎光箱SignalinExternalFPCOLB測(cè)試-----OLB製程之檢驗(yàn)矽膠塗佈避免異物進(jìn)入隔絕空氣,水避免外界直接接觸材質(zhì):Silicone,Epoxy,UVglue端子焊接熔接金屬:錫鉛合金製程參數(shù):溫度,壓力,加熱時(shí)間輔助器材:焊油,治具對(duì)位方式:機(jī)械(定位PIN)DriverICDriverIC端子焊接輔助器材:烙鐵,焊油我是烙鐵我是烙鐵我是烙鐵我是烙鐵我是烙鐵我是焊油我是焊油錫的融點(diǎn)為232℃，鉛的融點(diǎn)為327℃,63-37之錫鉛比為共晶組成熔點(diǎn)溫度為183℃焊油的作用1.去除表面氧化物2.預(yù)防銲錫表面氧化3