CB專(zhuān)業(yè)英譯術(shù)語(yǔ)

PCB專(zhuān)業(yè)英譯術(shù)語(yǔ)一、綜合詞匯1、印制電路：printedcircuit2、印制線(xiàn)路：printedwiring3、印制板：printedboard4、印制板電路：printedcircuitboard(PCB)5、印制線(xiàn)路板：printedwiringboard(PWB)6、印制元件：printedcomponent7、印制接點(diǎn)：printedcontact8、印制板裝配：printedboardassembly9、板：board10、單面印制板：single-sidedprintedboard(SSB)11、雙面印制板：double-sidedprintedboard(DSB)12、多層印制板：mulitlayerprintedboard(MLB)13、多層印制電路板：mulitlayerprintedcircuitboard14、多層印制線(xiàn)路板：mulitlayerpritedwiringboard15、剛性印制板：rigidprintedboard16、剛性單面印制板：rigidsingle-sidedprintedborad17、剛性雙面印制板：rigiddouble-sidedprintedborad18、剛性多層印制板：rigidmultilayerprintedboard19、撓性多層印制板：flexiblemultilayerprintedboard20、撓性印制板：flexibleprintedboard21、撓性單面印制板：flexiblesingle-sidedprintedboard22、撓性雙面印制板：flexibledouble-sidedprintedboard23、撓性印制電路：flexibleprintedcircuit(FPC)24、撓性印制線(xiàn)路：flexibleprintedwiring25、剛性印制板：flex-rigidprintedboard,rigid-flexprintedboard26、剛性雙面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted27、剛性多層印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard28、齊平印制板：flushprintedboard29、金屬芯印制板：metalcoreprintedboard30、金屬基印制板：metalbaseprintedboard31、多重布線(xiàn)印制板：mulit-wiringprintedboard32、陶瓷印制板：ceramicsubstrateprintedboard33、導(dǎo)電膠印制板：electroconductivepasteprintedboard34、模塑電路板：moldedcircuitboard35、模壓印制板：stampedprintedwiringboard36、順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminatedmulitlayer37、散線(xiàn)印制板：discretewiringboard38、微線(xiàn)印制板：microwireboard39、積層印制板：buile-upprintedboard40、積層多層印制板：build-upmulitlayerprintedboard(BUM)41、積層撓印制板：build-upflexibleprintedboard42、表面層合電路板：surfacelaminarcircuit(SLC)43、埋入凸塊連印制板：B2itprintedboard44、多層膜基板：multi-layeredfilmsubstrate(MFS)45、層間全內(nèi)導(dǎo)通多層印制板：ALIVHmultilayerprintedboard46、載芯片板：chiponboard(COB)47、埋電阻板：buriedresistanceboard48、母板：motherboard49、子板：daughterboard50、背板：backplane51、裸板：bareboard52、鍵盤(pán)板夾心板：copper-invar-copperboard53、動(dòng)態(tài)撓性板：dynamicflexboard54、靜態(tài)撓性板：staticflexboard55、可斷拼板：break-awayplanel56、電纜：cable57、撓性扁平電纜：flexibleflatcable(FFC)58、薄膜開(kāi)關(guān)：membraneswitch59、混合電路：hybridcircuit60、厚膜：thickfilm61、厚膜電路：thickfilmcircuit62、薄膜：thinfilm63、薄膜混合電路：thinfilmhybridcircuit64、互連：interconnection65、導(dǎo)線(xiàn)：conductortraceline66、齊平導(dǎo)線(xiàn)：flushconductor67、傳輸線(xiàn)：transmissionline68、跨交：crossover69、板邊插頭：edge-boardcontact70、增強(qiáng)板：stiffener71、基底：substrate72、基板面：realestate73、導(dǎo)線(xiàn)面：conductorside74、元件面：componentside75、焊接面：solderside76、印制：printing77、網(wǎng)格：grid78、圖形：pattern79、導(dǎo)電圖形：conductivepattern80、非導(dǎo)電圖形：non-conductivepattern81、字符：legend82、標(biāo)志：mark[/size]ilww2004-11-1016:18:00)二、基材：1、基材：basematerial2、層壓板：laminate3、覆金屬箔基材：metal-cladbadematerial4、覆銅箔層壓板：copper-cladlaminate(CCL)5、單面覆銅箔層壓板：single-sidedcopper-cladlaminate6、雙面覆銅箔層壓板：double-sidedcopper-cladlaminate7、復(fù)合層壓板：compositelaminate8、薄層壓板：thinlaminate9、金屬芯覆銅箔層壓板：metalcorecopper-cladlaminate10、金屬基覆銅層壓板：metalbasecopper-cladlaminate11、撓性覆銅箔絕緣薄膜：flexiblecopper-claddielectricfilm12、基體材料：basismaterial13、預(yù)浸材料：prepreg14、粘結(jié)片：bondingsheet15、預(yù)浸粘結(jié)片：preimpregnatedbondingsheer16、環(huán)氧玻璃基板：epoxyglasssubstrate17、加成法用層壓板：laminateforadditiveprocess18、預(yù)制內(nèi)層覆箔板：masslaminationpanel19、內(nèi)層芯板：corematerial20、催化板材：catalyzedboard,coatedcatalyzedlaminate21、涂膠催化層壓板：adhesive-coatedcatalyzedlaminate22、涂膠無(wú)催層壓板：adhesive-coateduncatalyzedlaminate23、粘結(jié)層：bondinglayer24、粘結(jié)膜：filmadhesive25、涂膠粘劑絕緣薄膜：adhesivecoateddielectricfilm26、無(wú)支撐膠粘劑膜：unsupportedadhesivefilm27、覆蓋層：coverlayer(coverlay)28、增強(qiáng)板材：stiffenermaterial29、銅箔面：copper-cladsurface30、去銅箔面：foilremovalsurface31、層壓板面：uncladlaminatesurface32、基膜面：basefilmsurface33、膠粘劑面：adhesivefaec34、原始光潔面：platefinish35、粗面：mattfinish36、縱向：lengthwisedirection37、模向：crosswisedirection38、剪切板：cuttosizepanel39、酚醛紙質(zhì)覆銅箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL)40、環(huán)氧紙質(zhì)覆銅箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL)41、環(huán)氧玻璃布基覆銅箔板：epoxidewovenglassfabriccopper-cladlaminates42、環(huán)氧玻璃布紙復(fù)合覆銅箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates43、環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates44、聚酯玻璃布覆銅箔板：ployesterwovenglassfabriccopper-cladlaminates45、聚酰亞胺玻璃布覆銅箔板：polyimidewovenglassfabriccopper-cladlaminates46、雙馬來(lái)酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates47、環(huán)氧合成纖維布覆銅箔板：epoxidesyntheticfiberfabriccopper-cladlaminates48、聚四乙烯玻璃纖維覆銅箔板：teflon/fiberglasscopper-cladlaminates49、超薄型層壓板：ultrathinlaminate50、陶瓷基覆銅箔板：ceramicsbasecopper-cladlaminates51、紫外線(xiàn)阻擋型覆銅箔板：UVblockingcopper-cladlaminatesilww2004-11-1016:19:00)三、基材的材料1、A階樹(shù)脂：A-stageresin2、B階樹(shù)脂：B-stageresin3、C階樹(shù)脂：C-stageresin4、環(huán)氧樹(shù)脂：epoxyresin5、酚醛樹(shù)脂：phenolicresin6、聚酯樹(shù)脂：polyesterresin7、聚酰亞胺樹(shù)脂：polyimideresin8、雙馬來(lái)酰亞胺三嗪樹(shù)脂：bismaleimide-triazineresin9、丙烯酸樹(shù)脂：acrylicresin10、三聚氰胺甲醛樹(shù)脂：melamineformaldehyderesin11、多官能環(huán)氧樹(shù)脂：polyfunctionalepoxyresin12、溴化環(huán)氧樹(shù)脂：brominatedepoxyresin13、環(huán)氧酚醛：epoxynovolac14、氟樹(shù)脂：fluroresin15、硅樹(shù)脂：siliconeresin16、硅烷：silane17、聚合物：polymer18、無(wú)定形聚合物：amorphouspolymer19、結(jié)晶現(xiàn)象：crystallinepolamer20、雙晶現(xiàn)象：dimorphism21、共聚物：copolymer22、合成樹(shù)脂：synthetic23、熱固性樹(shù)脂：thermosettingresin24、熱塑性樹(shù)脂：thermoplasticresin25、感光性樹(shù)脂：photosensitiveresin26、環(huán)氧當(dāng)量：weightperepoxyequivalent(WPE)27、環(huán)氧值：epoxyvalue28、雙氰胺：dicyandiamide29、粘結(jié)劑：binder30、膠粘劑：adesive31、固化劑：curingagent32、阻燃劑：flameretardant33、遮光劑：opaquer34、增塑劑：plasticizers35、不飽和聚酯：unsatuiatedpolyester36、聚酯薄膜：polyester37、聚酰亞胺薄膜：polyimidefilm(PI)38、聚四氟乙烯：polytetrafluoetylene(PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(FEP)40、增強(qiáng)材料：reinforcingmaterial41、玻璃纖維：glassfiber42、E玻璃纖維：E-glassfibre43、D玻璃纖維：D-glassfibre44、S玻璃纖維：S-glassfibre45、玻璃布：glassfabric46、非織布：non-wovenfabric47、玻璃纖維墊：glassmats48、紗線(xiàn)：yarn49、單絲：filament50、絞股：strand51、緯紗：weftyarn52、經(jīng)紗：warpyarn53、但尼爾：denier54、經(jīng)向：warp-wise55、緯向：weft-wise,filling-wise56、織物經(jīng)緯密度：threadcount57、織物組織：weavestructure58、平紋組織：plainstructure59、壞布：greyfabric60、稀松織物：wovenscrim61、弓緯：bowofweave62、斷經(jīng)：endmissing63、缺緯：mis-picks64、緯斜：bias65、折痕：crease66、云織：waviness67、魚(yú)眼：fisheye68、毛圈長(zhǎng)：featherlength69、厚薄段：mark70、裂縫：split71、捻度：twistofyarn72、浸潤(rùn)劑含量：sizecontent73、浸潤(rùn)劑殘留量：sizeresidue74、處理劑含量：finishlevel75、浸潤(rùn)劑：size76、偶聯(lián)劑：couplintagent77、處理織物：finishedfabric78、聚酰胺纖維：polyarmidefiber79、聚酯纖維非織布：non-wovenpolyesterfabric80、浸漬絕緣縱紙：impregnatinginsulationpaper81、聚芳酰胺纖維紙：aromaticpolyamidepaper82、斷裂長(zhǎng)：breakinglength83、吸水高度：heightofcapillaryrise84、濕強(qiáng)度保留率：wetstrengthretention85、白度：whitenness86、陶瓷：ceramics87、導(dǎo)電箔：conductivefoil88、銅箔：copperfoil89、電解銅箔：electrodepositedcopperfoil(EDcopperfoil)90、壓延銅箔：rolledcopperfoil91、退火銅箔：annealedcopperfoil92、壓延退火銅箔：rolledannealedcopperfoil(RAcopperfoil)93、薄銅箔：thincopperfoil94、涂膠銅箔：adhesivecoatedfoil95、涂膠脂銅箔：resincoatedcopperfoil(RCC)96、復(fù)合金屬箔：compositemetallicmaterial97、載體箔：carrierfoil98、殷瓦：invar99、箔（剖面）輪廓：foilprofile100、光面：shinyside101、粗糙面：matteside102、處理面：treatedside103、防銹處理：stainproofing104、雙面處理銅箔：doubletreatedfoililww2004-11-1016:20:00)四、設(shè)計(jì)1、原理圖：shematicdiagram2、邏輯圖：logicdiagram3、印制線(xiàn)路布設(shè)：printedwirelayout4、布設(shè)總圖：masterdrawing5、可制造性設(shè)計(jì)：design-for-manufacturability6、計(jì)算機(jī)輔助設(shè)計(jì)：computer-aideddesign.(CAD)7、計(jì)算機(jī)輔助制造：computer-aidedmanufacturing.(CAM)8、計(jì)算機(jī)集成制造：computerintegratmanufacturing.(CIM)9、計(jì)算機(jī)輔助工程：computer-aidedengineering.(CAE)10、計(jì)算機(jī)輔助測(cè)試：computer-aidedtest.(CAT)11、電子設(shè)計(jì)自動(dòng)化：electricdesignautomation.(EDA)12、工程設(shè)計(jì)自動(dòng)化：engineeringdesignautomaton.(EDA2)13、組裝設(shè)計(jì)自動(dòng)化：assemblyaidedarchitecturaldesign.(AAAD)14、計(jì)算機(jī)輔助制圖：computeraideddrawing15、計(jì)算機(jī)控制顯示：computercontrolleddisplay.(CCD)16、布局：placement17、布線(xiàn)：routing18、布圖設(shè)計(jì)：layout19、重布：rerouting20、模擬：simulation21、邏輯模擬：logicsimulation22、電路模擬：circitsimulation23、時(shí)序模擬：timingsimulation24、模塊化：modularization25、布線(xiàn)完成率：layouteffeciency26、機(jī)器描述格式：machinedescriptionmformat.(MDF)27、機(jī)器描述格式數(shù)據(jù)庫(kù)：MDFdatabse28、設(shè)計(jì)數(shù)據(jù)庫(kù)：designdatabase29、設(shè)計(jì)原點(diǎn)：designorigin30、優(yōu)化（設(shè)計(jì)）：optimization(design)31、供設(shè)計(jì)優(yōu)化坐標(biāo)軸：predominantaxis32、表格原點(diǎn)：tableorigin33、鏡像：mirroring34、驅(qū)動(dòng)文件：drivefile35、中間文件：intermediatefile36、制造文件：manufacturingdocumentation37、隊(duì)列支撐數(shù)據(jù)庫(kù)：queuesupportdatabase38、元件安置：componentpositioning39、圖形顯示：graphicsdispaly40、比例因子：scalingfactor41、掃描填充：scanfilling42、矩形填充：rectanglefilling43、填充域：regionfilling44、實(shí)體設(shè)計(jì)：physicaldesign45、邏輯設(shè)計(jì)：logicdesign46、邏輯電路：logiccircuit47、層次設(shè)計(jì)：hierarchicaldesign48、自頂向下設(shè)計(jì)：top-downdesign49、自底向上設(shè)計(jì)：bottom-updesign50、線(xiàn)網(wǎng)：net51、數(shù)字化：digitzing52、設(shè)計(jì)規(guī)則檢查：designrulechecking53、走（布）線(xiàn)器：router(CAD)54、網(wǎng)絡(luò)表：netlist55、計(jì)算機(jī)輔助電路分析：computer-aidedcircuitanalysis56、子線(xiàn)網(wǎng)：subnet57、目標(biāo)函數(shù)：objectivefunction58、設(shè)計(jì)后處理：postdesignprocessing(PDP)59、交互式制圖設(shè)計(jì)：interactivedrawingdesign60、費(fèi)用矩陣：costmetrix61、工程圖：engineeringdrawing62、方塊框圖：blockdiagram63、迷宮：moze64、元件密度：componentdensity65、巡回售貨員問(wèn)題：travelingsalesmanproblem66、自由度：degreesfreedom67、入度：outgoingdegree68、出度：incomingdegree69、曼哈頓距離：manhattondistance70、歐幾里德距離：euclideandistance71、網(wǎng)絡(luò)：network72、陣列：array73、段：segment74、邏輯：logic75、邏輯設(shè)計(jì)自動(dòng)化：logicdesignautomation76、分線(xiàn)：separatedtime77、分層：separatedlayer78、定順序：definitesequencilww2004-11-1016:21:00)五、形狀與尺寸：1、導(dǎo)線(xiàn)（通道）：conduction(track)2、導(dǎo)線(xiàn)（體）寬度：conductorwidth3、導(dǎo)線(xiàn)距離：conductorspacing4、導(dǎo)線(xiàn)層：conductorlayer5、導(dǎo)線(xiàn)寬度/間距：conductorline/space6、第一導(dǎo)線(xiàn)層：conductorlayerNo.17、圓形盤(pán)：roundpad8、方形盤(pán)：squarepad9、菱形盤(pán)：diamondpad10、長(zhǎng)方形焊盤(pán)：oblongpad11、子彈形盤(pán)：bulletpad12、淚滴盤(pán)：teardroppad13、雪人盤(pán)：snowmanpad14、V形盤(pán)：V-shapedpad15、環(huán)形盤(pán)：annularpad16、非圓形盤(pán)：non-circularpad17、隔離盤(pán)：isolationpad18、非功能連接盤(pán)：monfunctionalpad19、偏置連接盤(pán)：offsetland20、腹（背）裸盤(pán)：back-bardland21、盤(pán)址：anchoringspaur22、連接盤(pán)圖形：landpattern23、連接盤(pán)網(wǎng)格陣列：landgridarray24、孔環(huán)：annularring25、元件孔：componenthole26、安裝孔：mountinghole27、支撐孔：supportedhole28、非支撐孔：unsupportedhole29、導(dǎo)通孔：via30、鍍通孔：platedthroughhole(PTH)31、余隙孔：accesshole32、盲孔：blindvia(hole)33、埋孔：buriedviahole34、埋/盲孔：buried/blindvia35、任意層內(nèi)部導(dǎo)通孔：anylayerinnerviahole(ALIVH)36、全部鉆孔：alldrilledhole37、定位孔：toalinghole38、無(wú)連接盤(pán)孔：landlesshole39、中間孔：interstitialhole40、無(wú)連接盤(pán)導(dǎo)通孔：landlessviahole41、引導(dǎo)孔：pilothole42、端接全隙孔：terminalclearomeehole43、準(zhǔn)表面間鍍覆孔：quasi-interfacingplated-throughhole44、準(zhǔn)尺寸孔：dimensionedhole45、在連接盤(pán)中導(dǎo)通孔：via-in-pad46、孔位：holelocation47、孔密度：holedensity48、孔圖：holepattern49、鉆孔圖：drilldrawing50、裝配圖：assemblydrawing51、印制板組裝圖：printedboardassemblydrawing52、參考基準(zhǔn)：datumreferan電路板朮語(yǔ)總整理

*****A*****AbieticAcid松脂酸.AbrasionResistance耐磨性.Abrasives磨料,刷材.ABS樹(shù)脂.Absorption吸收(入).AcImpedance交流阻抗.AcceleratedTest(Aging)加速老化(試驗(yàn)).Acceleration速化反應(yīng).Accelerator加速劑,速化劑.Acceptability,Acceptance允收性,允收.AccessHole露出孔,穿露孔.Accuracy準(zhǔn)確度.AcidNumber(AcidValue)酸值.AcousticMicroscope(AM)感音成像顯微鏡.Acrylic壓克力(聚丙烯酸樹(shù)脂).ActinicLight(orIntensity,orRadiation)有效光.Activation活化.Activator活化劑.ActiveCarbon活性炭.ActiveParts(Devices)主動(dòng)零件.Acutance解像銳利度.AdditionAgent添加劑.AdditiveProcess加成法.Adhesion附著力.AdhesionPromotor附著力促進(jìn)劑.Adhesive膠類(lèi)或接著劑.Admittance導(dǎo)納(阻抗的倒數(shù)).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.AirInclusion氣泡夾雜.AirKnife風(fēng)刀.Algorithm演算法.AliphaticSolvent脂肪族溶劑.AluminiumNitride(AlN)氮化鋁.AmbientTamp環(huán)境溫度.Amorphous無(wú)定形,非晶形.Amp-Hour安培小時(shí).AnalogCircuit/AnalogSignal類(lèi)比電路/類(lèi)比訊號(hào).AnchoringSpurs著力爪.Angleof

Contack接觸角.AngleofAttack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal韌化(退火).AnnularRing孔環(huán).Anode陽(yáng)極.AnodeSludge陽(yáng)極泥.Anodizing陽(yáng)極化.ANSI美國(guó)標(biāo)準(zhǔn)協(xié)會(huì).Anti-FoamingAgent消泡劑.Anti-pitAgent抗凹劑.AOI自動(dòng)光學(xué)檢驗(yàn).Apertures開(kāi)口,鋼版開(kāi)口.AQL品質(zhì)允收水準(zhǔn).AQL(AcceptableQualityLevel)允收品質(zhì)水準(zhǔn).AramidFiber聚醯胺纖維.ArcResistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器.AspectRatio縱橫比.Assembly組裝裝配.A-stageA階段.ATE自動(dòng)電測(cè)設(shè)備.Attenuation訊號(hào)衰減.Autoclave壓力鍋.Axial-lead軸心引腳.Azeotrope共沸混合液.

*****B*****BackLight(BackLighting)背光法.BackTaper反錐斜角.Backpanels,Backplanes支撐板.Back-up墊板.BalancedTransmissionLines平衡式傳輸線(xiàn).BallGridArray球腳陣列(封裝).Bandability彎曲性.BankingAgent護(hù)岸劑.BareChipAssembly裸體晶片組裝.Barrel孔壁,滾鍍.BaseMaterial基材.BasicGrid基本方格.Batch批.Baume波美度(凡液體比重比水重則

Be=145-(145÷Sp.Gr)凡液體比重比水輕則

Be=140÷(Sp.Gr-130)*Sp.Gr為比重即同體勣物質(zhì)對(duì)"純水"1g/cm的比值).Beamlead光芒式的平行密集引腳.Bed-of-NailTesting針床測(cè)試.BellowsConact彈片式接觸.BetaRayBackscatter貝他射線(xiàn)反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-LevelStencil]雙階式鋼板.Binder粘結(jié)劑.Bits頭(DrillBits).BlackOxide黑氧化層.Blanking沖空斷開(kāi).Bleack漂洗.Bleeding溢流.BlindViaHole肓通孔.Blister局部性分層或起泡.BlockDiagram電路系統(tǒng)塊圖.Blockout封綱.Blotting干印.BlottingPaper吸水紙.BlowHole吹孔.BluePlaque藍(lán)紋(錫面鈍化層).BlurEdge(Circle)模糊邊帶(圈).BombSight彈標(biāo).BondStrength結(jié)合強(qiáng)度.Bondability結(jié)合性.BondingLayer結(jié)合層接著層.BondingSheet(Layer)接合片.BondingWire結(jié)合線(xiàn).Bow,Bowing板彎.Braid編線(xiàn).Brazing硬焊(用含銀的銅鋅合金焊條).在425℃~870℃下進(jìn)行熔接的方式).BreakPoint顯像點(diǎn).Break-awayPanel可斷開(kāi)板.BreakdownVoltage崩潰電壓.Break-out破出.Bridging搭橋.BrightDip光澤浸漬處理.Brightener光澤劑.BrownOxide棕氧化.BrushPlating刷鍍.B-stageB階段.BuildUpProcess增層法制程.Build-up堆積.Bulge鼓起.Bump突塊.BumpingProcess凸塊制程.Buoyancy浮力.BuriedViaHole埋導(dǎo)孔.Burn-in高溫加速老化試驗(yàn).Burning燒焦.Burr毛頭.BusBar匯電桿.ButterCoat外表樹(shù)脂層.

*****C*****C4ChipJointC4晶片焊接.Cable電纜.CAD電腦輔助設(shè)計(jì).CalenderedFabric軋平式綱布.CapLamination帽式壓合法.Capacitance電容.CapacitiveCoupling電容耦合.CapillaryAction毛細(xì)作用.Carbide碳化物.CarbonArcLamp碳弧燈.CarbonTreatment,Active活化炭處理.Card卡板.CardCages/CardRacks電路板搆裝箱.CarlsonPin卡氏定位稍.Carrier載體.Cartridge濾心.Castallation堡型勣體電路器.CatalyzedBoard,CatalyzedSubstrate催化板材.Catalyzing催化.Cathode陰極.Cation陰向離子,陽(yáng)離子.CaulPlate隔板.Cavitation空泡化

半真空.Center-to-CenterSpacing中心間距.Ceramics陶瓷.Cermet陶金粉.Certificate証明書(shū).CFC氟氫碳化物.Chamfer倒角.CharacteristicImpedance特性阻抗.Chase綱框.CheckList檢查清單.Chelate螯合.ChemicalMilling化學(xué)研磨.ChemicalResistance抗化性.Chemisorption化學(xué)吸附.Chip晶片(粒).ChipInterconnection晶片互連.ChiponBoard晶片粘著板.ChipOnGlass晶玻接裝(COG).Chisel鑽針的尖部.ChlorinatedSolvent含氯溶劑,氯化溶劑.CircumferentialSeparation環(huán)狀斷孔.Clad/Cladding披覆.CleanRoom無(wú)塵室.Cleanliness清潔度.Clearance余地,余環(huán).ClinchedLeadTerminal緊箝式引腳.Clinched-wireThroughConnection通孔彎線(xiàn)連接法.ClipTerminal繞線(xiàn)端接.Coat,Coating皮膜表層.CoaxialCable同軸纜線(xiàn).CoefficientofThermalExpansion熱膨脹系數(shù).Co-Firing共繞.ColdFlow冷流.ColdSolderJoint冷焊點(diǎn).CollimatedLight平行光.Colloid膠體.ColumnarStructure柱狀組織.CombPattern梳型電路.ComplexIon錯(cuò)離子.ComponentHole零件孔.ComponentOrientation零件方向.ComponentSide組件面.Composites,(CEM-1,CEM-3)復(fù)合板材.CondensationSoldering凝熱焊接,液化放熱焊接.Conditioning整孔.Conductance導(dǎo)電.ConductiveSalt導(dǎo)電鹽.Conductivity導(dǎo)電度.ConductorSpacing導(dǎo)體間距.ConformalCoating貼護(hù)層.Conformity吻合性,服貼性.Connector連接器.ContactAngle接觸角.ContactArea接觸區(qū).ContactResistance接觸電阻.Continuity連通性.ContractService協(xié)力廠,分包廠.ControlledDepthDrilling定深鑽孔.ConversionCoating轉(zhuǎn)化皮膜.Coplanarity共面性.Copolymer共聚物.CopperFoil銅皮.CopperMirrorTest銅鏡試驗(yàn).CopperPaste銅膏.Copper-Invar-Copper(CIC)綜合夾心板.CoreMaterial內(nèi)層板材,核材.CornerCrack通孔斷角.CornerMark板角標(biāo)記.Counterboring方型擴(kuò)孔.Countersinking錐型擴(kuò)孔.CouplingAgent偶合劑.Coupon,TestCoupon板邊試樣.Coverlay/Covercoat表護(hù)層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.CrossectionArea截面積.CrosshatchTesting十字割痕試驗(yàn).Crosshatching十字交叉區(qū).Crosslinking,Crosslinkage交聯(lián),架橋.Crossover越交,搭交.Crosstalk雜訊,串訊.CrystallineMeltingPoint晶體熔點(diǎn).C-StageC階段.Cure硬化,熟化.CurrentDensity電流密度.Current-CarryingCapability載流能力.CurtainCoating濂塗法.

*****D*****DaisyChainedDesign菊瓣設(shè)計(jì).DatumReference基準(zhǔn)參考.DaughterBoard子板.Debris碎屑,殘材.Deburring去毛頭.DeclinationAngle斜射角.Definition邊緣逼真度.Degradation劣化.Degrasing脫脂.DeionizedWater去離子水.Delamination分離.DendriticGrowth枝狀生長(zhǎng).Denier丹尼爾(是編織紡織所用各種紗類(lèi)直徑單位,定義9000米紗束所具有的重量(以克米計(jì))).Densitomer透光度計(jì).Dent凹陷.Deposition皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機(jī).Developing顯像.Deviation偏差.Device電子元件.Dewetting縮錫.D-glassD玻璃.DiazeFilm偶氮棕片.Dichromate重鉻酸鹽.Dicing晶片分割.Dicyandiamide(Dicy)雙氰胺.Die沖模.DieAttach晶粒安裝.DieBonding晶粒接著.DieStamping沖壓.Dielectric介質(zhì).DielectricBreakdownVoltage介質(zhì)崩潰電壓.DielectricConstant介質(zhì)常數(shù).DielectricStrength介質(zhì)強(qiáng)度.DifferentialScanningCalorimetry(DSC)微差掃瞄熱卡分析法.DiffusionLayer擴(kuò)散層.Digitizing數(shù)位化.DihedralAngle雙反斜角.DimensionalStability尺度安定性.Diode二極體.DipCoating浸塗法.DipSoldering浸焊法.DIP(DualInlinePackage)雙排腳封裝體.Dipole偶極,雙極.Direct/IndirectStencil直接/間接版膜.DirectEmulsion直接乳膠.DirectPlating直接電鍍.DiscreteCompenent散裝零件.DiscreteWiringBoard散線(xiàn)電路板,復(fù)線(xiàn)板.DishDown碟型下陷.Dispersant分散劑.DissipationFactor散失因素.DisspationFactor散逸因子.DisturbedJoint受擾焊點(diǎn).DoctorBlade修平刀,刮平刀.DogEar狗耳.Doping摻雜.DoubleLayer雙電層.DoubleTreatedFoil雙面處理銅箔.DragIn/DragOut帶[進(jìn)/帶出.DragSoldering拖焊.Drawbridging吊橋效應(yīng).Drift漂移.DrillFacet鑽尖切削面.DrillPointer鑽針重磨機(jī).DrilledBlank已鑽孔的裸板.Dross浮渣.DrumSide銅箔光面.DryFilm干膜.DualWaveSoldering雙波焊接.Ductility展性.DummyLand假焊墊.Dummy,Dummying假鍍(片).Durometer橡膠硬度計(jì).DYCOstrate電漿蝕孔增層法.DynamicFlex(FPC)動(dòng)態(tài)軟板.

*****E*****E-Beam(ElectronBeam)電子束.EddyCurrent渦電流.EdgeSpacing板邊空地.Edge-BoardConnector板邊(金手指)承接器.Edge-BoardContact板邊金手指.Edge-DipSolderabilityTest板邊焊錫性測(cè)試.EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級(jí)玻璃.Elastomer彈性體.ElectricStrength(耐)電性強(qiáng)度.Electrodeposition電鍍.Electro-depositionPhotoresist電著光阻,電泳光阻.Electroforming電鑄.Electroless-Deposition無(wú)電鍍.ElectrolyticToughPitch電解銅..Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動(dòng),電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation延伸性,延伸率.Embossing凸出性壓花.EMF(ElectromotiveForce)電動(dòng)勢(shì).EMI(ElectromagneticInterference)電磁干擾.Emulsion乳化.EmulsionSide藥膜面.Encapsulating膠囊.Encroachment沾污,侵犯.EndTap封頭.Entek有機(jī)護(hù)銅處理.Entrapment夾雜物.EntryMaterial蓋板.EpoxyResin環(huán)氧樹(shù)脂.EtchFactor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.EtchingIndicator蝕刻指標(biāo).EtchingResist蝕刻阻劑.EuteticComposition共融組成.Exotherm放熱(曲線(xiàn)).Exposure曝光.Eyelet鉚眼.

*****F*****Fabric綱布.FaceBonding反面朝下結(jié)合.Failure故障.FanOutWiring/FanInWiring扇出布線(xiàn)/扇入布線(xiàn).Farad法拉.Farady法拉第.FatigueStrength抗疲勞強(qiáng)度.Fault缺陷.FaultPlane斷層面.FeedThroughHole導(dǎo)通孔.Feeder進(jìn)料器.FiberExposure玻纖顯露.FiducialMark基準(zhǔn)記號(hào).Filament纖絲.Fill緯向.Filler填充料.Fillet內(nèi)圓填角.Film底片.FilmAdhesive接著膜,粘合膜.Filter過(guò)濾器.FineLine細(xì)線(xiàn).FinePitch密腳距,密線(xiàn)距,密墊距.Fineness粒度,純度.Finger手指.Finishing終修(飾).FiniteElementMethod有限要素分析法.FirstArticle首產(chǎn)品.FirstPass-Yield初檢良品率.Fixture夾具.Flair刃角變形.FlamePoint自燃點(diǎn).FlameResistant耐燃性.FlammabilityRate燃性等級(jí).Flare扇形崩口.FlashPlating閃鍍.Flashover閃絡(luò).FlatCable扁平排線(xiàn).FlatPack扁平封裝(之零件).Flatness平坦度.FlexiblePrintedCircuit(FPC)軟板.FlexuralFailure撓曲損壞.FlexuralModule彎曲模數(shù),抗撓性模數(shù).FlexuralStrength抗撓強(qiáng)度.FlipChip覆晶,扣晶.Flocculation絮凝.FloodStrokePrint覆墨沖程印刷.FlowSoldering(WaveSoldering)流焊.Fluorescence熒光.FlurocarbonResin碳氟樹(shù)脂.FlushConductor嵌入式線(xiàn)路

,貼平式導(dǎo)體.FlushPoint閃火點(diǎn).Flute退屑槽.Flux助焊劑.FoilBurr銅箔毛邊.FoilLamination銅箔壓板法.Foot殘足(干膜殘余物).FootPrint(LandPattern)腳墊.ForeignMaterial外來(lái)物,異物.Form-to-List布線(xiàn)說(shuō)明清單.FourPointTwisting四點(diǎn)扭曲法.FreeRadical自由基.Freeboard干舷.Frequency頻率.Frit玻璃熔料.Fully-AdditiveProcess全加成法.FungusResistance抗霉性.FusedCoating熔錫層.Fusing熔合.FusingFluid助熔液.

*****G*****G-10由連續(xù)玻纖所織成的玻纖布與環(huán)氧樹(shù)脂粘結(jié)劑所復(fù)合成的材料.Gage,Gauge量規(guī).GalliumArsenide(GaAs)砷化鎵.GalvanicCorrosion賈凡尼式腐蝕(電解式腐蝕).GalvanicSeries賈凡尼次序(電動(dòng)次序).Galvanizing鍍鋅.GAP第一面分離,長(zhǎng)刃斷開(kāi).GateArray閘列,閘極陣列.GelTime膠化時(shí)間.GelationParticle膠凝點(diǎn).GerberData,GerberFile格博檔案(是美商Gerber公司專(zhuān)為PCB面線(xiàn)路圖形與孔位,所發(fā)展一系列完整的軟體檔案).GhostImage陰影.Gilding鍍金(現(xiàn)為:GlodPlating).GlassFiber玻纖.GlassFiberProtrusion/Gouging,Groove玻纖突出/挖破.GlassTransitionTemperature,Tg玻璃態(tài)轉(zhuǎn)化溫度.Glaze釉面,釉料.GlobTop圓頂封裝體.GloubleTest球狀測(cè)試法.Glycol(EthyleneGlycol)乙二醇.GoldenBoard測(cè)試用標(biāo)準(zhǔn)板.GrainSize結(jié)晶粒度.GrassLeak大漏.Grid標(biāo)準(zhǔn)格.GroundPlane/EarthPlane接地層.GroundPlaneClearance接地空環(huán).GuidePin導(dǎo)針.Gull/WingLead鷗翼引腳.

*****H*****Halation環(huán)暈.HalfAngle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名.HardAnodizing硬陽(yáng)極化.HardChromePlating鍍硬鉻.HardSoldering硬焊.Hardener(CuringAgent)硬化劑(或CuringAgent).Hardness硬度.Haring-BlumCell海固槽.Harness電纜組合.HayWire跳線(xiàn).HeatCleaning燒潔.HeatDissipation散熱.HeatDistortionPoint(Temp)熱變形點(diǎn)(溫度).HeatSealing熱封.HeatSinkPlane散熱層.HeatTransferPaste導(dǎo)熱膏.HeatsinkTool散熱工具.Hertz(Hz)赫.HighEfficiencyParticulateAirFilter(HEPA)高效空氣塵粒過(guò)瀘機(jī).HipotTest高壓電測(cè).Hi-Rel高度靠度.Hit擊(鑽孔時(shí)鑽針每一次"刺下"的動(dòng)作).HoldingTime停置時(shí)間.HoleBreakout孔位破出.HoleCounter數(shù)孔機(jī).HoleDensity孔數(shù)密度.HolePreparation通孔準(zhǔn)備.HolePullStrength孔壁強(qiáng)度.HoleVoid破洞.Hook切削刀緣外凸.HotAirLevelling噴錫.HotBarSoldering熱把焊接.HotGasSoldering熱風(fēng)手焊.HTE(HighTemperatureElongation)高溫延伸性.HullCell哈氏槽.HybridIntegratedCircuit混成電路.HydraulicBulgeTest液壓鼓起試驗(yàn).HydrogenEmbrittlement氫脆.HydrogenOvervoltage氫過(guò)(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.

*****I*****I.C.Socket勣體電路器插座.Icicle錫尖.Illuminance照度.ImageTransfer影像轉(zhuǎn)移.ImmersionPlating浸鍍.Impedance阻抗.ImpedanceMatch阻抗匹配.Impregnate含浸.In-CircuitTesting組裝板電測(cè).Inclusion異物,夾雜物.IndexingHole基準(zhǔn)孔.Inductance(L)電感.Infrared(IR)紅外線(xiàn).Input/Output輸入/輸出.Insert,Insertion插接.InspectionOverlay套檢底片.InsulationResistance絕緣電阻.IntegratedCircuit(IC)勣體電路器.InterFace介面.Interconnection互連.IntermetallicCompound(IMC)介面共化物.InternalStress內(nèi)應(yīng)力.Interposer互邊導(dǎo)電物.InterstitialVia-Hole(IVH)局部層間導(dǎo)通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).IonCleanliness離子清潔度.IonExchangeResins離子交換樹(shù)脂.IonMigration離子遷移.Ionizable(Ionic)Contaimination離子性污染.Ionization游離,電離.IonizationVoltage(CoronaLevel)電離化電壓(電纜內(nèi)部狹縫空氣中,引起其電離所施加之最小電壓).IPC美國(guó)印刷電路板協(xié)會(huì).Isolation隔離性,隔絕性.

*****J*****JEDEC(JointElectronicDevice

聯(lián)合電子元件工程委員會(huì).EngineeringCouncil)J-LeadJ型接腳.JobShop專(zhuān)業(yè)工廠.Joule焦耳.JumperWire跳線(xiàn).Junction接(合)面,接頭.Just-In-Time(JIT)適時(shí)供應(yīng),及時(shí)出現(xiàn).

*****K*****Kapton聚亞醯胺軟板.Karat克拉

(1克拉(鑽石)=0.2g

純金則24k金為100%的鈍金.Kauri-ButanolValue考立丁醇值(簡(jiǎn)稱(chēng)K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵KeyBoard鍵盤(pán).KissPressure吻壓,低壓.KnoopHardness努普硬度.KnownGoodDie(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).KraftPaper牛皮紙.

*****L*****LamdaWave延伸平波.LaminarFlow平流.LaminarStructure片狀結(jié)搆.LaminateVoid板材空洞.Laminate(s)基板.LaminationVoid壓合空洞.Laminator壓膜機(jī).Land孔環(huán)焊墊,表面焊墊.LandlessHole無(wú)環(huán)通孔.LaserDirectImaging(LDI)雷射直接成像.LaserMaching雷射加工法.LaserPhotogenerator(LPG),LaserPhotoplotter雷射曝光機(jī).LaserSoldering雷射焊接法.LayBack刃角磨損.LayOut布線(xiàn),布局.LayUp疊合.LayertoLayerSpacing層間距離Leaching焊散漂出,熔出.Lead引腳.LeadFrame腳架.LeadPitch腳距.LeakageCurrent漏電電流.Legend文字標(biāo)記.Leveling整平.LiftedLand孔環(huán)(焊墊)浮起.Ligand錯(cuò)離子附屬體.LightEmittingDiodes(LED)發(fā)光二極體.LightIntegrator光能累積器.LightIntensity光強(qiáng)度.LimitingCurrentDensity極限電流密度.LiquidCrystalDisplay(LCD)液晶顯示器.LiquidDielectrics液態(tài)介質(zhì).LiquidPhotoimagibleSolderMask,(LPSM)液態(tài)感光防焊綠漆.LocalAreaNetwork區(qū)域性網(wǎng)路.Logic邏輯.LogicCircuit邏輯電路.LossFactor損失因素.LossTangent(TanδDK)損失正切.LotSize批量.Luminance發(fā)光強(qiáng)度.Lyophilic親水性膠體.

*****M*****Macro-ThrowingPower巨觀分布力.MajorDefect主要(嚴(yán)重)缺點(diǎn).MajorWeaveDirection主要織向.Margin刃帶(鑽頭尖部).Marking標(biāo)記.Mask阻劑.MassFinishing大量整面(拋光).MassLamination大型壓板.MassTransport質(zhì)量輸送.MasterDrawing主圖.Mat蓆(用于CEM-3(CompositeEpoxyMaterial)的復(fù)合材料.)MatteSide毛面(電鍍銅皮(EDFoil)之粗糙面).Mealing泡點(diǎn).MeanTimeToFailure(MTTF)故障前可用之平均時(shí)數(shù).Measling白點(diǎn).MechanicalStretcher機(jī)械式張網(wǎng)機(jī).MechanicalWarp機(jī)械式纏繞.Mechanism機(jī)理.MembraneSwitch薄膜開(kāi)關(guān).MeniscographTest弧面狀沾錫試驗(yàn).Meniscus彎月面.MercuryVaperLamp汞氣燈.MeshCount綱目數(shù).MetalHalideLamp金屬鹵素?zé)?Metallization金屬化.MetallizedFabric金屬化綱布.Micelle微胞.MicroWireBoard微封線(xiàn)板.Micro-electronios微電子.Microetching微蝕.Microsectioning微切片法.Microstrip微條.MicrostripLine微條線(xiàn),微帶線(xiàn).MicrothrowingPower微分布力.Microwave微波.Migration遷移.MigrationRate遷移率.Mil英絲.MinimumAnnularRing孔環(huán)下限.MinimumElectricalSpacing電性間距下限.MinorWeaveDirection次要織向.Misregistration對(duì)不準(zhǔn)度.MixedComponmtMountingTechnology混合零件之組裝技術(shù).Modem調(diào)變及解調(diào)器.Modification修改.Module模組.ModulusofElasticity彈性系數(shù).MoistureandInsulationResistanceTest溼氣與絕緣電阻試驗(yàn).MoldRelease脫模劑,離型劑.Mole摩爾.Monofilament單絲.MotherBoard主機(jī)板,母板.MouldedCircuit模造立體電路機(jī).MountingHole安裝孔.MountingHole組裝孔,機(jī)裝孔.MouseBite鼠齒(蝕刻后線(xiàn)路邊緣出現(xiàn)不規(guī)則缺口).Multi-Chip-Module(MCM)多晶片芯片模組.MultiwiringBoard(orDiscreteWiringBoard)復(fù)線(xiàn)板.

*****N*****N.C.數(shù)值控制.NailHead釘頭.NearIR近紅外線(xiàn).Negative負(fù)片,鑽尖的第一面外緣變窄.NegativeEtch-back反回蝕.NegativeStencil負(fù)性感光膜.Negative-ActingResist負(fù)性作用之阻劑.Network綱狀元件.Newton牛頓.NewtonRing牛頓環(huán).NewtonianLiquid牛頓流體.Nick缺口.N-MethylPyrrolidine(NMP)N-甲基四氫嗶咯.NobleMetalPaste貴金屬印膏.Node節(jié)點(diǎn).Nodule節(jié)瘤.Nomencleature標(biāo)示文字符號(hào).NominalCuredThickness標(biāo)示厚度.Non-CircularLand非圓形孔環(huán)焊墊.Non-flammable非燃性.Non-wetting不沾錫.NormalConcentration

(Strength)標(biāo)準(zhǔn)濃度,當(dāng)量濃度.NormalDistribution常態(tài)分布.Novolac酯醛樹(shù)脂.Nucleation,Nucleating核化.NumericalControl數(shù)值控制.Nylon尼龍.

*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(OxyenFreeHighConductivity)無(wú)氧高導(dǎo)電銅.Ohm歐姆.Oilcanning蓋板彈動(dòng).OLB(OuterLeadBond)外引腳結(jié)合.Oligomer寡聚物.OmegaMeter離子污染檢測(cè)儀.OmegaWave振盪波.On-ContactPrinting密貼式印刷.Opaquer不透明劑,遮光劑.OpenCircuits斷線(xiàn).OpticalComparater光學(xué)對(duì)比器(光學(xué)放大器.)OpticalDensity光密度.OpticalInspection光學(xué)檢驗(yàn).OpticalInstrument光學(xué)儀器.OrganicSolderabilityPreservatives(OSP)有機(jī)保焊劑.Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側(cè)出.Output產(chǎn)出,輸出.Overflow溢流.Overhang總懸空.Overlap鑽尖點(diǎn)分離.Overpotantial(Overvoltage)過(guò)電位,過(guò)電壓.Oxidation氧化.OxygenInhibitor氧化抑制劑.OzoneDepletion臭氧層耗損.

*****P*****Packaging封裝,搆裝.Pad焊墊,圓墊.PadMaster圓墊底片.PadsOnlyBoard唯墊板.Palladium鈀.Panel制程板.PanelPlating全板鍍銅.PanelProcess全板電鍍法.PaperPhenolic紙質(zhì)酚醛樹(shù)脂(板材).PartingAgent脫膜劑.Passivation鈍化,鈍化外理.PassiveDevice(Component)被動(dòng)元件(零件)Paste膏,糊.Pattern板面圖形.PatternPlating線(xiàn)路電鍍.PatternProcess線(xiàn)路電鍍法.PeakVoltage峰值電壓.PeelStrength抗撕強(qiáng)度.PeriodicReverse(PR)Current周期性反電流.Peripheral周邊附屬設(shè)備.Permeability透氣性,導(dǎo)磁率.Permittivity誘電率,透電率.pHValue酸堿值.Phase相.PhaseDiagram相圖.Phenolic酚醛樹(shù)脂.Photofugitive感光褪色.Photographicfilm感光成像之底片.Photoinitiator感光啟始劑.Photomask光罩.Photoplotter,Plotter光學(xué)繪圖機(jī).Photoresist光阻.PhotoresistChemicalMachinning(Milling)光阻式化學(xué)(銑刻)加工.Phototool底片.Pickand

Place拾取與放置.Piezoelectric壓電性.Pin插腳,插梢,插針.PinGridArray(PGA)矩陣式針腳對(duì)裝.Pinhole針孔.PinkRing粉紅圈.Pitch跨距,腳距,墊距,線(xiàn)距.Pits凹點(diǎn).PlainWeave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.PlatedThroughHole鍍通孔.Platen熱盤(pán).Plating鍍.Plotting標(biāo)繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.PneumaticStretcher氣動(dòng)拉伸器.PogoPin伸縮探針.Point鑽尖.PointAngle鑽尖面.PointSourceLight點(diǎn)狀光源.Poise泊."粘滯度"單位=1dyne*sec/cm2.PolarSolvent極性溶劑.Polarity電極性.Polarization分極,極化.PolarizingSlot偏槽.PolyesterFilms聚酯類(lèi)薄片.PolymerThickFilm(PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.PopcornEffect爆米花效應(yīng).Porcelain瓷材,瓷面.PorosityTest疏孔度試驗(yàn).PositiveActingResist正性光阻劑.PostCure后續(xù)硬化,后烤.PostSeparation后期分離,事后公離.PotLife運(yùn)用期,鍋中壽命.Potting鑄封,模封.PowerSupply電源供應(yīng)器.Preform預(yù)制品.Preheat預(yù)熱.Prepreg膠片,樹(shù)脂片.PressPlate鋼板.Press-FitContact擠入式接觸.PressureFoot壓力腳.Pre-tinning預(yù)先沾錫.PrimaryImage線(xiàn)路成像.PrintThrough壓透,過(guò)度擠壓..Probe探針.ProcessCamera制程用照像機(jī).ProcessWindow操作范圍.ProductionMaster生產(chǎn)底片.Profile輪廓,部面圖,升溫曲線(xiàn)圖稜線(xiàn).Propagation傳播.PropagationDelay傳播延遲.PuddleEffect水坑效應(yīng).PullAway拉離.PulsePlating脈沖電鍍法.PumicePowder浮石粉.Punch沖切.Purge,Purging淨(jìng)空,淨(jìng)洗.PurplePlague紫疫(金與鋁的共化物層).Pyrolysis熱裂解,高溫分解.

*****Q*****QuadFlatPack(QFP)方扁形封裝體.QualificationAgency資格認(rèn)証機(jī)搆.QualificationInspection資格檢驗(yàn).QualifiedProductsList