半導(dǎo)體工藝簡(jiǎn)介課件

1集成電路制造工藝簡(jiǎn)介生產(chǎn)工廠簡(jiǎn)介國(guó)外某集成電路工廠外景1集成電路制造工藝簡(jiǎn)介國(guó)外某集成電路工廠外景2FabTwowascompletedJanuary2,1996andisa"StateoftheArt"facility.This2,200squarefootfacilitywasconstructedusingallthelatestmaterialsandtechnologies.Inthissetofcleanroomswechangetheair390timesperhour,

ifyoudothemathwithULPAfiltrationthisisaClassOnefacility.WehavehadittestedanditdoesmeetClassOneparameters(withoutanypeopleworkinginit).Sincewearenotmakingmicroprocessorshereandwedon'twanttowear"spacesuits",werunitasaclass10fab.EventhoughitconsistentlyrunswellbelowClassTen.1級(jí)凈化廠房/10級(jí)凈化廠房2FabTwowascompletedJanuary3HereintheFabTwo

Photolithographyareaweseeoneofour200mm0.35micronI-LineSteppers.thissteppercanimageandalignboth6&8inchwafers.投影式光刻機(jī)3HereintheFabTwoPhotolith4AnotherviewofoneoftheFabTwoPhotolithographyareas.投影式光刻機(jī)4AnotherviewofoneoftheFa5Hereweseeatechnicianloading300mmwafersintotheSemiTool.Thewafersareina13waferTefloncassetteco-designedbyProcessSpecialtiesandSemiToolin1995.Againthesearetheworld'sfirst300mmwetprocesscassettes(thatcanbespinrinsedried).硅片清洗裝置5Hereweseeatechnicianload6AswelookinthiswindowweseetheWorld'sFirsttrue300mmproductionfurnace.Ourdevelopmentanddesignofthistoolbeganin1992,itwasinstalledinDecemberof1995andbecamefullyoperationalinJanuaryof1996.12英寸氧化擴(kuò)散爐6Aswelookinthiswindowwe7Herewecanseetheloadingof300mmwafersontothePaddle.12英寸氧化擴(kuò)散爐裝片工序7Herewecanseetheloadingo8ProcessSpecialtieshasdevelopedtheworld'sfirstproduction300mmNitridesystem!Webeganprocessing300mmLPCVDSiliconNitrideinMayof1997.12英寸氧化擴(kuò)散爐取片工序（已生長(zhǎng)Si3N4）8ProcessSpecialtieshasdevel92,500additionalsquarefeetof"StateoftheArt"ClassOneCleanroomiscurrentlyprocessingwafers!Withincreased300mm&200mmprocessingcapabilitiesincludingmorePVDMetalization,300mmWetprocessing/Cleaningcapabilitiesandfullwafer300mm0.35umPhotolithography,allinaClassOneenviroment.PVD92,500additionalsquarefeet10CurrentlyourPS300AandPS300Bdiffusiontoolsarecapableofrunningboth200mm&300mmwafers.Wecanevenprocessthetwosizesinthesamefurnaceloadwithoutsufferinganyuniformityproblems!(ThermalOxideOnly)12英寸和8英寸氧化擴(kuò)散爐10CurrentlyourPS300AandPS311AccuracyinmetrologyisneveranissueatProcessSpecialties.Weusethemostadvancedroboticlaserellipsometersandothercalibratedtoolsforprecisionthinfilm,resistivity,CDandstepheightmeasurement.IncludingournewNanometrics8300fullwafer300mmthinfilmmeasurementandmappingtool.WealsouseoutsidelaboratoriesandourexcellentworkingrelationshipswithourMetrologytoolcustomers,foradditionalcorrelationandcalibration.檢測(cè)工序11Accuracyinmetrologyisnev12OneoftwoSEMLabslocatedinourfacility.InthisoneweareusingafieldemissiontoolforeverythingfromlookingatphotoresistprofilesandmeasuringCD'stodoublecheckingmetaldepositionthicknesses.Atthehelm,anotheroneofourprocessengineersyoumayhavespokenwithMarkHinkle.掃描電鏡SEM檢測(cè)工序12OneoftwoSEMLabslocated13HerewearelookingattheIncomingmaterialdispositionracks

庫房13HerewearelookingattheI14AboveyouarelookingatacoupleofviewsofthefacilitiesonthewestsideofFabOne.Hereyoucanseeoneofour18.5Meg/OhmDIwatersystemsandoneoffour

10,000CFMairsystemsfeedingthisfab(leftpicture),aswellasoneofourwaste

airscrubberunits(rightpicture).Bothareinsidethebuildingforeasiermaintenance,longerlifeandbettercontrol.去離子水生產(chǎn)裝置空氣凈化動(dòng)力裝置14Aboveyouarelookingatac15芯片制造凈化區(qū)域走廊15芯片制造凈化區(qū)域走廊16離子注入16離子注入17化學(xué)汽相沉積CVD17化學(xué)汽相沉積CVD18化學(xué)汽相沉積CVD

18化學(xué)汽相沉積CVD19檢查晶圓19檢查晶圓20烘箱老化

在烤箱中100%

檢測(cè)20烘箱老化

在烤箱中100%

檢測(cè)21激光打字21激光打字22集成電路制造工藝簡(jiǎn)介生產(chǎn)工廠簡(jiǎn)介國(guó)外某集成電路工廠外景1集成電路制造工藝簡(jiǎn)介國(guó)外某集成電路工廠外景23FabTwowascompletedJanuary2,1996andisa"StateoftheArt"facility.This2,200squarefootfacilitywasconstructedusingallthelatestmaterialsandtechnologies.Inthissetofcleanroomswechangetheair390timesperhour,

ifyoudothemathwithULPAfiltrationthisisaClassOnefacility.WehavehadittestedanditdoesmeetClassOneparameters(withoutanypeopleworkinginit).Sincewearenotmakingmicroprocessorshereandwedon'twanttowear"spacesuits",werunitasaclass10fab.EventhoughitconsistentlyrunswellbelowClassTen.1級(jí)凈化廠房/10級(jí)凈化廠房2FabTwowascompletedJanuary24HereintheFabTwo

Photolithographyareaweseeoneofour200mm0.35micronI-LineSteppers.thissteppercanimageandalignboth6&8inchwafers.投影式光刻機(jī)3HereintheFabTwoPhotolith25AnotherviewofoneoftheFabTwoPhotolithographyareas.投影式光刻機(jī)4AnotherviewofoneoftheFa26Hereweseeatechnicianloading300mmwafersintotheSemiTool.Thewafersareina13waferTefloncassetteco-designedbyProcessSpecialtiesandSemiToolin1995.Againthesearetheworld'sfirst300mmwetprocesscassettes(thatcanbespinrinsedried).硅片清洗裝置5Hereweseeatechnicianload27AswelookinthiswindowweseetheWorld'sFirsttrue300mmproductionfurnace.Ourdevelopmentanddesignofthistoolbeganin1992,itwasinstalledinDecemberof1995andbecamefullyoperationalinJanuaryof1996.12英寸氧化擴(kuò)散爐6Aswelookinthiswindowwe28Herewecanseetheloadingof300mmwafersontothePaddle.12英寸氧化擴(kuò)散爐裝片工序7Herewecanseetheloadingo29ProcessSpecialtieshasdevelopedtheworld'sfirstproduction300mmNitridesystem!Webeganprocessing300mmLPCVDSiliconNitrideinMayof1997.12英寸氧化擴(kuò)散爐取片工序（已生長(zhǎng)Si3N4）8ProcessSpecialtieshasdevel302,500additionalsquarefeetof"StateoftheArt"ClassOneCleanroomiscurrentlyprocessingwafers!Withincreased300mm&200mmprocessingcapabilitiesincludingmorePVDMetalization,300mmWetprocessing/Cleaningcapabilitiesandfullwafer300mm0.35umPhotolithography,allinaClassOneenviroment.PVD92,500additionalsquarefeet31CurrentlyourPS300AandPS300Bdiffusiontoolsarecapableofrunningboth200mm&300mmwafers.Wecanevenprocessthetwosizesinthesamefurnaceloadwithoutsufferinganyuniformityproblems!(ThermalOxideOnly)12英寸和8英寸氧化擴(kuò)散爐10CurrentlyourPS300AandPS332AccuracyinmetrologyisneveranissueatProcessSpecialties.Weusethemostadvancedroboticlaserellipsometersandothercalibratedtoolsforprecisionthinfilm,resistivity,CDandstepheightmeasurement.IncludingournewNanometrics8300fullwafer300mmthinfilmmeasurementandmappingtool.WealsouseoutsidelaboratoriesandourexcellentworkingrelationshipswithourMetrologytoolcustomers,foradditionalcorrelationandcalibration.檢測(cè)工序11Accuracyinmetrologyisnev33OneoftwoSEMLabslocatedinourfacility.InthisoneweareusingafieldemissiontoolforeverythingfromlookingatphotoresistprofilesandmeasuringCD'stodoublecheckingmetaldepositionthicknesses.Atthehelm,anotheroneof