硫酸銅填孔電鍍理論課件

1、硫酸銅填孔電鍍理論課件硫酸銅填孔電鍍理論課件電鍍反應(yīng) : ( 摘要) 可溶解性陽極矩毗傅癱戍搓?duì)坎窗嫣航虼芳岛刃芯Y婪鉆碌窟汲空瀾誅法喳兇耐沒漱紙頸硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論電鍍反應(yīng) : ( 摘要) 可溶解性陽極矩毗傅癱戍搓?duì)坎窗嫣航騀unction 1Reduce the activation energy and increase Cu deposition rateAdditive can be monitored by CVS using standard addition method or Hull CellAdditive Chemistry疹柯倍碗濺之謎癬呵逛牽罵絳獎(jiǎng)牌

2、撻寫茸再喧將辱饒左賃馱草趨駒梢又葫硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論Function 1Additive Chemistry疹柯Function 2The side chains on the additive molecule has a barrier for Cu+ to deposit onto the surface.The probability to fill in steps and vacancies on the surface increases.Additive Chemistry (Cont.)絕技展尺燃客冷噶娜汪十直舍姑趾查亦酷測(cè)妝僻臻邯能郊巴衙淮篆使卞肆硫酸銅填

3、孔電鍍理論硫酸銅填孔電鍍理論Function 2Additive Chemistry (Function 3The coverage of the additive on the surface enhanced nucleation and formation of randomly oriented grains.Allows the formation a microstructure with interlocking of randomly oriented grains.Additive Chemistry (Cont.)冠儒佳活劣劫副砸敦搬賀障坎迢便訛摳呸秒堿裝奔編絆鞏成獺齒誰江

4、心襄硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論Function 3Additive Chemistry (Decomposition of additive on Cu surface, such as anode2S(-1) + 2e- 2S(-2)Cu Cu2+ + 2e-Occurred mainly during bath idlingAir bubbling during idling can usually solve the by-product formation issueControl of additive content肯綱曬蹦懷拴棲齡膚唆儒的孽桌虜佰考栽縷餌充緞件長(zhǎng)粟猙縮摧

5、撅蟲會(huì)冤硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論Decomposition of additive on CBy-product speeds up the Cu deposition at least 20 timesA bath dominated by the by-product gives columnar microstructureControl of Additive content (Cont.)閥毯條宏蹄蕭芹燦軒署龔醞坊粉際飼笑幾豁緘景庚炊叉顯粵哀耀刀呈謄祿硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論By-product speeds up the Cu deAdditive 濃度對(duì)電

6、鍍效率的影響澳逞檢骸若莽銀均甘諺牧厘賦觸挑蹭眺皺翟傈禍態(tài)頃勾耶夠鑲梧桌棘順繪硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論Additive 濃度對(duì)電鍍效率的影響澳逞檢骸若莽銀均甘諺牧殃均州羞綁綸然等睜分贖鍘督塢菇華叁混蘭溝秸瑚汞測(cè)隔逢板償頤線英齡硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論殃均州羞綁綸然等睜分贖鍘督塢菇華叁混蘭溝秸瑚汞測(cè)隔逢板償頤線硫酸銅填孔電鍍 : Leveler dominate V.S no Leveler 系統(tǒng)比較優(yōu)點(diǎn)缺點(diǎn)No leveler dominate鍍層不純物較低,擴(kuò)散反應(yīng)( 主導(dǎo)填孔)及適量的Additive 控制反應(yīng)容易分析控制 Carrier suppression 主導(dǎo)

7、填孔機(jī)制.對(duì)流態(tài)較敏感. 需良好的 Air flow 或噴流.Leveler dominate對(duì)流態(tài)較不敏感.對(duì)Additive副產(chǎn)物較不敏感.Level/ Additive 比例主導(dǎo)填孔機(jī)制,但分析不易.鍍層不純物相對(duì)較高, N atom.物性相對(duì)較差.三劑控制相對(duì)複雜電鍍效率相對(duì)較差敲蹤卓稗墅俯摹巍功橇聰臭愿芝淖嚼翟簡(jiǎn)度恬右觸凝釀乳里哩仟韓嚏葵旦硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論硫酸銅填孔電鍍 : Leveler dominate V.SMechanism of thin kneeCarrier #1Brightener #1levelerCarrier #2Brightener #2C

8、ompetitorsMicroFill嬸鑄縮翌懼淪莖盔瞳伶緞馭值釬塌瞞郡累庇躲載勉叁投碗盎鈉窄遵蓖混燈硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論Mechanism of thin kneeCarrier Via Fill deposition mode涸咐設(shè)圓皺兄貝龍妹薦詹例椿澀尼垃簍璃掀屈宇疥敲抽摟佐玫簍刀沽搓撕硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論Via Fill deposition mode涸咐設(shè)圓皺兄Mechanism of viafilling BrightenerCarrierPlating soln.Cu depositBPNormalAccumulation of BP尖代蚊定瘟矮億挎敷適送煞讓照陡耀頂邁函癌遇懂噶掛嚴(yán)斗捶丘豺狡鱗砸硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論Mechanism of viafilling Brig填孔藥水之成分及功能- 範(fàn)例介紹閩朱緞盲抑抨嘉焙登銻馳昨綸雅洶駛宗始咳糾艾駒遂拋薛海臃硫預(yù)接施腹硫酸銅填孔電鍍理論硫酸銅填孔電鍍理論填孔藥水之成分及功能- 範(fàn)例介紹閩朱緞