高頻信號傳輸特性和電路量測

1、關(guān)于高頻信號傳輸特性與電路量測第一張，PPT共三十三頁，創(chuàng)作于2022年6月PurposePurpose is to describe practical HW options for production on-wafer RF test and to compare these options with respect to RF Performance and Production worthiness第二張，PPT共三十三頁，創(chuàng)作于2022年6月OutlineWhy RF test on-wafer?Typical RF and IF measurements required on

2、a RF deviceProduction RF testers availableTester to probe card InterfacesProbe cardsCalibrationProbe stationsConclusion第三張，PPT共三十三頁，創(chuàng)作于2022年6月Typical ATE Wafer probing ConfigurationTester Docking HeadProbe Card and InterfaceWafer Probe Station第四張，PPT共三十三頁，創(chuàng)作于2022年6月Why RF test on-wafer?Discover wafe

3、r process influences to the RF performance at wafer level .Immediate Process feedbackPerform device RF performance validation as soon as silicon is available.Known Good Die (KGD) delivery to customers demands full performance test at wafer.Advanced packaging methods like flip-chip require RF wafer p

4、robing.Complimentary testing between probe and final test improves test efficiency and reduces cost.第五張，PPT共三十三頁，創(chuàng)作于2022年6月Typical RF and IF measurementsAM-PM conversion (static)Adjacent channel powerComplex demodulationDigital input-threshold voltageDigital output levelsEfficiency (RF out/DC in)Fre

5、quencycwvs time (tune drift)Gain or lossvs control voltage or digital stateGain compressionPout N dB, saturationHarmonic distortiondBcSOI, TOII/Q modulator imbalance (static)amplitude & phase errorI/Q modulator suppression carrier & unwanted sideband第六張，PPT共三十三頁，創(chuàng)作于2022年6月Typical RF and IF measureme

6、ntsIsolationMinimum detectable signalMixer conversion gain or lossMixer leakagesLO-RF, LO-IF, carrier feed through Noise figureNth order intermodulationtwo-tone IP3, IP5Phase noise/jitter (cw)modulated Power (dBm)output powervs bias voltagePulsed RF measurementsfrequencypowerS-parametersPulsed RF pr

7、ofile signal overshoot & ringingRF rise time (10% to 90%)S-parametersgain/loss isolation, match, VSWR, gamma第七張，PPT共三十三頁，創(chuàng)作于2022年6月Typical RF and IF measurementsSpurious signals known frequency, searchSupply currentsenabled, sleep modeSwitching speed digital input to gain or frequencyVCO frequencyvs

8、 voltagetune linearitytune rangetune sensitivity (dc-freq)vs digital stateVoltagesVSWR第八張，PPT共三十三頁，創(chuàng)作于2022年6月RF Testers AvailableAdvantestCredenceHP 84000LTXTeradyne A585TMTRoosNumber of RF channels and frequencyCalibration methodDifferent types of measurements it supportsGUI Production throughputFo

9、otprintCostService and support第九張，PPT共三十三頁，創(chuàng)作于2022年6月Tester to Probe Card InterfacesCabled InterfaceTower FixtureDirect Docking第十張，PPT共三十三頁，創(chuàng)作于2022年6月Cabled InterfaceMajor AdvantagesFlexibilityCostMajor DisadvantagesComplexityMore RF loss in cableNot as production worthy第十一張，PPT共三十三頁，創(chuàng)作于2022年6月Tower

10、 InterfaceTop board is the tester load boardBottom board is the probe cardSpring loaded interface between for mechanical isolationTower interface is defined as probe card and load board mechanically connected so it is one unit between tester and prober第十二張，PPT共三十三頁，創(chuàng)作于2022年6月Tower InterfaceMajor Adv

11、antagesAvailable board real estateHighly interchangableProduction worthyMajor DisadvantagesCost of inventorytheta adjustment第十三張，PPT共三十三頁，創(chuàng)作于2022年6月Direct Docking Probe CardBlind-mate OSSP RF connectorsDevice specific components mounted to the probe boardComponents mounted closely to the probe head

12、on board and critical components mounted on membrane core第十四張，PPT共三十三頁，創(chuàng)作于2022年6月PIB shown with RF semi-rigid cablingProbe interface board that fits in the test head on a direct docking solution第十五張，PPT共三十三頁，創(chuàng)作于2022年6月Probe CardsThe Probe card is where the rubber meets the roadUsually least attentio

13、n and money is spent on this pieceProbe card is critical to measurement and calibration performanceControlled impedance linesS21 low insertion lossCan be calibrated out ifS11 is greater than -10 dBLow ground and common lead inductancePower bypassing close to DUT第十六張，PPT共三十三頁，創(chuàng)作于2022年6月RFIC Probe Ele

14、ctrical Performance ComparisonType of AberrationTypicalNeedle CardCoax plusNeedles CardRFICPyramid CardAttenuation 2 GHz 3 dB0.2 dB0.6 dBReturn loss 2 GHz - 5 dB-25 dB-16 dBCoupled-linecrosstalk 2 GHz,150 um pitch -10 dB-40 dB (500 mm pitch min.)- 50 dBCommon-leadInductance Single-ground crosstalk 2

15、 GHz 10 - 20 nH - 1dB 3 - 8 nH - 1 to - 4 dB 0.4 - 0.2 nH- 20 to - 26 dB第十七張，PPT共三十三頁，創(chuàng)作于2022年6月Ceramic Blade CardsAdvantagesCostLead timeDisadvantagesLead inductance (3 - 8 nH)Bypass structures will have LC responseExtensive Maintenance第十八張，PPT共三十三頁，創(chuàng)作于2022年6月Coaxial probe with ceramic bladesRF los

16、s (.2dB 2 Ghz)Ground lead inductance (3-8 nH)Single ground cross-talk (-1to -4 dB)第十九張，PPT共三十三頁，創(chuàng)作于2022年6月Coaxial Probe CardTypical coaxial probe cardDifferent card configurations for different testers40 Ghz BW or higher3-8 nH ground lead inductanceFragile solution for production test第二十張，PPT共三十三頁，創(chuàng)

17、作于2022年6月Membrane Pyramid ProbeShort, low-loss lines for high frequency signals (3 dB 20 Ghz.2nH ground inductance14 ohm impedance bypass structures close to DUTProvides excellent mechanical supportControllable microscrubField replaceableProduction worthy第二十一張，PPT共三十三頁，創(chuàng)作于2022年6月Membrane ModelTwo me

18、tal layers, top is signal, bottom is groundGSG, 20 GHz microstrip, 40 microns over 250 micron solid ground80 micron line over mesh exhibits approximately 80 ohm impedancePower line is a 14 ohm transmission line up to the bypass cap. Ground inductance usually 0.2 nH or less depending on layoutBypass

19、capacitors usually within 30 psec of DUT第二十二張，PPT共三十三頁，創(chuàng)作于2022年6月Vector Network Analyzer (VNA) Measurement CorrectionvvvForwardReverseSwitchPerfectReflectometerPort 1ErrorAdapterPort 2DUTSMicrowave Errors (Forward) Calibration StandardsDirectivity Port-2 MatchOpen RF through line (thru)Port-1 MatchT

20、ransmission TrackingShortLineReflection TrackingCrosstalkLoadEtc.aoboa3b3第二十三張，PPT共三十三頁，創(chuàng)作于2022年6月Un-corrected Response Full2-PortDUTDUTDUTConvenientGenerally not accurateNo errors removedUse when highest accuracy is not requiredRemoves frequency response errorHighest accuracy for 2-port devicesRemo

21、ves these errorsdirectivitysource matchload matchreflection trackingtransmission trackingcrosstalk (thru)OOSSLL thruCalibration Options and Standards第二十四張，PPT共三十三頁，創(chuàng)作于2022年6月RF Calibration ArchitectureMeasurement calibration with calibration boards De-embed Loss Phase shift MismatchCalibration plane

22、 ( precision blindmate connectors)Measurement plane( probe tips)EDESETCalibration plane extended to probe tips with de-embedding第二十五張，PPT共三十三頁，創(chuàng)作于2022年6月Two Port With Switch Corrections *thru reflect-match (LRM) *thru reflect-reflect-match (LRRM) *thru-reflect-line (TRL or LRL) *short-open-load-reci

23、procal two port (SOLR) thru-short-delay (TSD) thru-attenuation-reflect thru-attenuation-short thru-attentuation-network thru-line-network thru-match-shortCalibrate with at least seven known reflection and/or transmission coefficients*popular第二十六張，PPT共三十三頁，創(chuàng)作于2022年6月Popular Calibration Methods for Wa

24、fer Probing Z0 Inherently Probe Card Absolute Reference Consistent Support Accuracy Trimmed ResistorNo Fair Fair Transmission Best (if LinesYes Poor Corrected) Trimmed ResistorYes Fair Good Trimmed ResistorYesBestGoodSOLTTRLLRM/LRRMSOLR第二十七張，PPT共三十三頁，創(chuàng)作于2022年6月SOLR CalibrationShort-Open-Load-Reciprocal CalibrationReciprocal thru S12 = S21tolerant to lossy linesconvenient for use with probe cardsFixed probe spacing would otherwise require cu