PCB元件封裝庫(kù)規(guī)范

1、 深圳市XXXX科技有限公司企業(yè)標(biāo)準(zhǔn) （設(shè)計(jì)標(biāo)準(zhǔn)） 印制電路板設(shè)計(jì)規(guī)范 元器件封裝庫(kù)尺寸要求 1 范圍 本標(biāo)準(zhǔn)規(guī)定了印制電路板（以下簡(jiǎn)稱PCB）設(shè)計(jì)所使用的元器件封裝庫(kù)中的焊盤圖形及SMD焊盤圖形尺寸要求。 本標(biāo)準(zhǔn)適用于深圳市國(guó)新動(dòng)力科技有限公司。 2 引用標(biāo)準(zhǔn) 印制電路板設(shè)計(jì)規(guī)范工藝性要求。 印制電路板設(shè)計(jì)規(guī)范元器件封裝庫(kù)基本要求。 3 術(shù)語(yǔ) SMD: Surface Mount Devices/表面貼裝元件。 RA：Resistor Arrays/排阻。 MELF：Metal electrode face components/金屬電極無(wú)引線端面元件. SOT：Small outline

2、transistor/小外形晶體管。 SOD：Small outline diode/小外形二極管。 SOIC：Small outline Integrated Circuits/小外形集成電路. SSOIC: Shrink Small Outline Integrated Circuits/縮小外形集成電路. SOP: Small Outline Package Integrated Circuits/小外形封裝集成電路. SSOP: Shrink Small Outline Package /縮小外形封裝集成電路. TSOP: Thin Small Outline Package/薄小外形

3、封裝. TSSOP: Thin Shrink Small Outline Package/收縮薄小外形封裝. CFP: Ceramic Flat Packs/陶瓷扁平封裝. SOJ:Small outline Integrated Circuits with J Leads/ “J” 形引腳小外形集成電路. PQFP：Plastic Quad Flat Pack/塑料方形扁平封裝。 SQFP：Shrink Quad Flat Pack/縮小方形扁平封裝。 CQFP：Ceramic Quad Flat Pack/陶瓷方形扁平封裝。 PLCC：Plastic leaded chip carrier

4、s/塑料封裝有引線芯片載體。 LCC ：Leadless ceramic chip carriers/無(wú)引線陶瓷芯片載體。 DIP：Dual-In-Line components/雙列引腳元件。 PBGA：Plastic Ball Grid Array /塑封球柵陣列器件。 4 使用說(shuō)明 4.1 表格中的“min”表示最小尺寸； “max”最大尺寸； “ref”表示參考尺寸； “basic” 表示基本尺寸；封裝名稱中的 “mm”表示公制型號(hào)； in表示英制型號(hào)。 4.2 區(qū)域網(wǎng)格表示圖形占用的網(wǎng)格數(shù)，表中給出為網(wǎng)格的數(shù)量，換算成mm時(shí)，應(yīng)乘以0.5 mm。 5 焊盤圖形 5.1 SMD：表面貼

5、裝方焊盤圖形尺寸 表面貼裝方焊盤圖形尺寸應(yīng)符合圖1的要求。焊盤名稱X（mm）Y（mm）焊盤名稱X（mm）Y（mm）焊盤名稱X（mm）Y（mm）SMD0r17X1r600.171.60SMD0r80X3r400.803.40SMD2r20X2r002.202.00SMD0r25X1r600.251.60SMD1r00X0r901.000.90SMD2r20X2r602.202.60SMD0r30X1r600.281.80SMD1r00X1r001.001.00SMD2r40X2r002.402.00SMD0r35X1r600.351.80SMD1r00X1r401.001.40SMD2r40X2

6、r402.402.40SMD0r35X2r600.352.60SMD1r00X1r601.001.60SMD2r40X2r602.402.60SMD0r40X1r600.401.60SMD1r00X3r401.003.40SMD2r60X1r452.601.45SMD0r40X1r800.401.80SMD1r20X1r401.201.40SMD2r60X1r502.601.50SMD0r40X2r200.402.20SMD1r20X2r001.202.00SMD2r70X1r602.701.60SMD0r50X1r800.501.80SMD1r20X2r201.202.20SMD2r70X1

7、r802.701.80SMD0r50X2r000.502.00SMD1r30X1r001.301.00SMD2r80X1r402.801.40SMD0r50X2r200.502.20SMD1r40X2r201.402.20SMD3r20X1r803.201.80SMD0r60X2r000.602.00SMD1r40X2r401.402.40SMD3r40X1r903.401.90SMD0r60X2r200.602.20SMD1r40X3r401.403.40SMD3r60X1r803.601.80SMD0r65X2r200.652.20SMD1r50X1r301.501.30SMD3r60X2

8、r203.602.20SMD0r65X2r400.652.40SMD1r60X1r201.601.20SMD4r00X1r804.001.80SMD0r65X2r600.652.60SMD1r60X1r301.601.30SMD5r40X6r205.406.20SMD0r70X0r600.700.60SMD1r80X1r401.801.40SMD4r00X1r804.001.80SMD0r80X1r400.801.40SMD1r80X1r601.801.60SMD6r80X1r906.801.90SMD0r80X1r600.801.60SMD2r00X1r602.001.60SMD6r80X9

9、r606.809.60SMD0r80X2r600.802.60SMD2r00X1r802.001.80SMD13r60X13r4013.6013.40圖1 表面貼裝方焊盤圖形尺寸5.2 SMDC：表面貼裝圓焊盤圖形尺寸表面貼裝圓焊盤圖形尺寸應(yīng)符合圖2要求。見(jiàn)圖2： 焊盤名稱C（mm） 焊盤名稱 C（mm）SMDC0r350.35 SMDC0r90 0.90SMDC0r400.40 SMDC1r00 1.00SMDC0r500.50 SMDC2r60 2.60SMDC0r600.60圖 2 表面貼裝圓焊盤圖形尺寸5.3 SMDF表面貼裝手指焊盤圖形尺寸表面貼裝手指焊盤圖形尺寸應(yīng)符合圖3要求。見(jiàn)圖

10、3： 焊盤名稱X（mm）Y(mm)焊盤名稱X（mm）Y(mm)SMDF1r00X2r501.002.50SMDF1r80X2r501.802.50SMDF1r00X2r801.002.80SMDF1r80X2r301.802.30圖3 表面貼裝手指焊盤圖形尺寸5.4 THC通孔圓焊盤圖形尺寸通孔圓焊盤圖形尺寸應(yīng)符合圖4要求。見(jiàn)圖4：焊盤名稱C（mm/mil）D(mm/mil)焊盤名稱C（mm/mil）D(mm/mil)THC0r50D0r200.45/180.20/8THC1r30D0r801.30/510.80/32THC0r60D0r300.60/240.30/12THC1r40D0r90

11、1.40/550.90/36THC0r70D0r400.70/280.40/16THC1r50D1r001.50/601.00/40THC0r90D0r500.80/360.50/20THC2r60D1r302.60/1021.30/51THC1r10D0r601.10/440.60/24THC3r20D1r603.20/1261.60/63THC1r20D0r701.20/480.70/28THC4r00D2r004.00/1582.00/79THC1r20D0r701.23/490.73/29THC0r00D3r000/03.00/118圖4 通孔圓焊盤圖形尺寸5.5 THS通孔方焊盤圖形

12、尺寸通孔方焊盤圖形尺寸應(yīng)符合圖5要求。見(jiàn)圖5：焊盤名稱S（mm/mil）D(mm/mil)焊盤名稱S（mm/mil）D(mm/mil)THS1R10D0R601.10/440.60/24THS1r50D1r001.50/601.00/40THS1r20D0r701.20/480.70/28THS2r60D1r302.60/1021.30/51THS1r30D0r801.30/510.80/32THS3r20D1r603.20/1261.60/63THS1r40D0r901.40/550.90/36THS4r00D2r004.00/1582.00/79圖5 通孔方焊盤圖形尺 5.6 THR通孔矩

13、形焊盤圖形尺寸通孔矩形焊盤圖形尺寸應(yīng)符合圖6要求。見(jiàn)圖6： 焊盤名稱X（mm/mil）Y（mm/mil）D(mm/mil)THR1r20X1r40D0r701.20/481.40/550.70/28圖6 通孔矩形焊盤圖形尺寸6 SMD 元器件及焊盤圖形尺寸6.1 SMD分立元件6.1.1 SMD電阻6.1.1.1 SMD電阻元件尺寸SMD電阻元件尺寸應(yīng)符合圖7的規(guī)定。見(jiàn)圖7：封裝名稱L(mm)S(mm)W(mm)T(mm)H(mm)minmaxminmaxminmaxminmaxmax0402R1.001.100.400.700.480.600.100.300.400603R1.501.700

14、.701.110.700.950.150.400.600805R1.852.150.551.321.101.400.150.650.651206R3.053.351.552.321.451.750.250.750.711210R3.053.351.552.322.342.640.250.750.712010R4.855.153.153.922.352.650.350.850.712512R6.156.454.455.223.053.350.350.850.71圖7 SMD電阻元件尺寸6.1.1.2 SMD電阻的焊盤尺寸 SMD電阻的焊盤尺寸應(yīng)符合圖8的規(guī)定。見(jiàn)圖8：封裝名稱Z(mm)G(mm)

15、X(mm)Y(mm)C(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）refref0402R2.200.400.700.901.30240603R2.800.601.001.101.70460603R-W3.200.800.701.202.00460805R3.200.601.501.301.90480805R-W3.600.801.001.402.20481206R4.401.201.801.602.804101206R-W4.801.201.201.803.004101210R4.401.202.701.602.806102010R6.202.602.701.804.406142512R7.403.803

16、.201.805.60816 注：大于 0603R的元件在波峰焊時(shí)， Y-尺寸向外側(cè)增加 0.2mm， X-尺寸減小 30% 。封裝名稱加后綴“ -W”。圖8 SMD電阻的焊盤尺寸6.1.2 SMD電容6.1.2.1 SMD電容元件尺寸SMD電容元件尺寸應(yīng)符合圖9的規(guī)定。見(jiàn)圖9：封裝名稱L(mm)S(mm)W(mm)T(mm)H(mm)minmaxminmaxminmaxminmaxmax0402C0.901.100.300.650.400.600.100.300.600504C1.021.320.260.720.771.270.130.381.020603C1.451.750.450.970

17、.650.950.200.500.850805C1.802.200.301.111.051.450.250.751.101206C3.003.401.502.311.401.800.250.751.351210C3.003.401.502.312.302.700.250.751.351812C4.204.802.303.463.003.400.250.951.351825C4.204.802.303.466.006.800.250.951.10圖9 SMD電容元件尺寸6.1.2.2 SMD電容焊盤尺寸SMD電容焊盤尺寸應(yīng)符合圖10的規(guī)定。見(jiàn)圖 10：封裝名稱Z(mm)G(mm)X(mm)Y(m

18、m)C(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）refref0402C1.600.400.700.601.00240504C2.000.401.300.801.20460603C2.800.601.001.101.70460603C-W3.200.800.701.202.00460805C3.200.601.501.301.90480805C-W3.600.801.001.402.20481206C4.401.201.801.602.804101206C-W4.801.201.201.803.004101210C4.401.202.701.602.806101812C5.802.003.401.903.

19、908121825C5.802.006.801.903.901412 注：大于 0603C的元件在波峰焊時(shí)， Y-尺寸向外側(cè)增加 0.2mm， X-尺寸減小 30% 。封裝名稱加后綴“ -W”。圖10 SMD電容焊盤尺寸6.1.3 SMD電感6.1.3.1 SMD電感元件尺寸SMD電感元件尺寸應(yīng)符合圖11的規(guī)定。見(jiàn)圖 11：封裝名稱L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax2012L-C1.702.301.101.760.601.200.100.301.203216L-C2.903.50

20、1.902.631.301.900.200.501.904516L-C4.204.802.603.530.601.200.300.801.90-2825L-P2.202.800.901.621.952.112.102.540.370.652.290.073225L-P2.903.500.901.831.401.80-0.501.002.000.504532L-P4.204.802.203.133.003.40-0.501.002.800.505038L-P4.354.952.813.512.462.623.413.810.510.773.800.763225-3230L-M3.003.401.

21、602.181.802.002.302.700.400.702.400.514035L-M3.814.320.811.601.201.502.923.181.201.502.671.274532L-M4.204.802.303.152.002.203.003.400.650.953.400.505650L-M5.305.503.304.323.804.204.705.300.501.005.801.008530L-M8.258.765.256.041.201.502.923.181.201.502.671.27 注：C 為Chip的簡(jiǎn)寫,P為 Prec.w/w ( Precision wire

22、 wound ) 的簡(jiǎn)寫,M為 Molded的簡(jiǎn)寫。圖11 SMD電感元件尺寸6.1.3.2 SMD電感焊盤尺寸SMD電感焊盤尺寸應(yīng)符合圖12的規(guī)定。見(jiàn)圖 12：封裝名稱Z(mm)G(mm)X(mm)C(mm)Y(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）refref2012L-C3.001.001.002.001.00483216L-C4.201.801.603.001.206104516L-C5.802.601.004.201.604122825L-P3.801.002.402.401.406103225L-P4.601.002.002.801.806104532L-P5.802.203.604.00

23、1.808145038L-P5.803.002.804.401.408143225-3230L-M4.401.202.202.801.606104035L-M5.401.001.403.202.208124532L-M5.801.802.403.802.008145650L-M6.803.204.005.001.8012168530L-M9.805.001.407.402.4082注 1后綴“ -C”的元件在波峰焊時(shí)，Y-尺寸向外側(cè)增加 0.2mm，X-尺寸減小 30%。封裝名稱加后綴“ -W”。 2 后綴“ -P”和“ -M”的元件在波峰焊時(shí)，Y-尺寸向外側(cè)增加0.2mm，X-尺寸不變，封裝

24、名稱加后綴“ -W”。圖 12 SMD電感焊盤尺寸6.1.4 SMD鉭電容6.1.4.1 SMD鉭電容元件尺寸 SMD鉭電容元件尺寸應(yīng)符合圖13的規(guī)定。見(jiàn)圖13：封裝名稱L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax3216T3.003.400.801.741.171.211.401.800.501.100.701.803528T3.303.701.102.042.192.212.603.000.501.100.702.106032T5.706.302.503.542.192.212.903

25、.501.001.601.002.807343T7.007.603.804.842.392.914.004.601.001.601.003.1圖 13 SMD鉭電容元件尺寸6.1.4.2 SMD鉭電容焊盤尺寸SMD鉭電容的焊盤尺寸應(yīng)符合圖14的規(guī)定。見(jiàn)圖 14：封裝名稱Z(mm)G(mm)X(mm)Y(mm)C(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）refref3216T4.800.801.202.002.806123528T5.001.002.202.003.008126032T7.602.402.202.605.008187343T9.003.803.002.606.401020注：元件在波峰焊時(shí)

26、， Y尺寸向外側(cè)增加0.2mm， X 尺寸不變，封裝名稱加后綴“ -W”。圖14 SMD鉭電容焊盤尺寸6.1.5 MELF（金屬電極無(wú)引線端面元件）6.1.5.1 MELF元件尺寸MELF元件尺寸應(yīng)符合圖15的規(guī)定。見(jiàn)圖15：mm in封裝名稱L(mm)S(mm)W(mm)T(mm)元件類型MinMaxminmaxminmaxminmaxSOD80MLL343.303.702.202.651.601.700.410.55二極管SOD87MLL414.805.203.804.252.442.540.360.50二極管2012M0805M1.902.101.161.441.351.450.230.

27、370.10mW電阻3216M1206M3.003.401.862.311.751.850.430.570.25mW電阻3516M1406M3.303.702.162.611.551.650.430.570.12W電阻5923M2309M5.706.104.364.812.402.500.530.670.25W電阻圖15 MELF元件尺寸6.1.5.2 MELF的焊盤尺寸MELF的焊盤尺寸應(yīng)符合圖16的規(guī)定。見(jiàn)圖16：mm in封裝名稱Z(mm)G(mm)X(mm)Y(mm)C(mm)AB區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）refrefSOD80MLL344.802.001.801.403.400.500

28、.50612SOD87MLL416.303.402.601.454.850.500.506142012M0805M3.200.601.601.301.900.500.35483216M1206M4.401.202.001.602.800.500.556103516M1406M4.802.001.801.403.400.500.556125923M2309M7.204.202.601.505.700.500.65618注：元件在波峰焊時(shí)， Y尺寸向外側(cè)增加0.2mm， X 尺寸不變，封裝名稱加后綴“ -W”。圖 16 MELF焊盤尺寸6.1.6 SMD排阻6.1.6.1 SMD排阻元件尺寸 SM

29、D排阻元件尺寸應(yīng)符合圖 17的規(guī)定。見(jiàn)圖17： 封裝名稱L(mm)W(mm)T(mm)A(mm)B(mm)P(mm)C(mm)06033.20.101.60.150.50.100.50.150.30.150.80.10.30.1512065.080.303.20.200.60.100.90.150.50.201.270.10.30.15圖17 SMD排阻元件尺寸6.1.6.2 SMD排阻焊盤尺寸SMD排阻焊盤尺寸應(yīng)符合圖18的規(guī)定。見(jiàn)圖 18： 封裝名稱區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）1206RA8x6圖 18 SMD排阻焊盤尺寸6.1.7 SOT 236.1.7.1 元件尺寸SOT 23的尺寸應(yīng)符合

30、圖19的規(guī)定。見(jiàn)圖19：封裝名稱L(mm)S(mm)W(mm)T(mm)H(mm)P(mm)MinmaxminmaxminmaxminmaxmaxnomSOT 232.302.601.101.470.360.460.450.601.100.95圖19 SOT 23的元件尺寸 6.1.7.2 SOT 23的焊盤尺寸SOT 23的焊盤尺寸應(yīng)符合圖20的規(guī)定。見(jiàn)圖20 封裝名稱Z(mm)G(mm)X(mm)Y(mm)C(mm)E(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）refRefrefSOT 23(回流焊)3.600.801.001.402.200.9588注:如果采用波峰焊工藝，“ Y” 尺寸外延0.2

31、mm。圖 20 SOT 23 焊盤尺寸6.1.8 SOT 896.1.8.1 元件尺寸SOT 89的尺寸應(yīng)符合圖21的規(guī)定。見(jiàn)圖21：封裝名稱L(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxminmaxmaxbasicSOT 893.944.250.891.200.360.480.440.561.621.832.602.851.601.50圖21 SOT 89的元件尺寸6.1.8.2 SOT 89的焊盤尺寸SOT 89的焊盤尺寸應(yīng)符合圖22的規(guī)定。見(jiàn)圖22：封裝名稱Z(mm)Y1(mm)X1(mm

32、)X2(mm)X3(mm)Y2(mm)Y3(mm)E(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）MinmaxminmaxrefRefbasicSOT 895.401.400.800.801.001.802.002.404.901.501210圖 22 SOT 89 焊盤尺寸6.1.9 SOD 1236.1.9.1 元件尺寸SOD 123的尺寸應(yīng)符合圖23的規(guī)定。見(jiàn)圖23：封裝名稱L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)minMaxMinmaxminmaxminmaxMinmaxmaxSOD 1233.553.852.352.930.450.651.401.700.250.601.3

33、5SMB5.215.592.173.311.962.213.303.940.761.522.41圖23 SOD 123的元件尺寸6.1.9.2 SOD 123的焊盤尺寸SOD 123的焊盤尺寸應(yīng)符合圖24的規(guī)定。見(jiàn)圖24：封裝名稱Z(mm)G(mm)X(mm)Y(mm)C(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）refrefSOD 1235.001.800.801.603.40412SMB6.802.002.402.404.40816圖24 SOD 123 焊盤尺寸6.1.10 SOT 1436.1.10.1 元件尺寸SOT 143的尺寸應(yīng)符合圖25的規(guī)定。見(jiàn)圖25：封裝名稱L(mm)S(mm)W1(m

34、m)W2(mm)T(mm)P1(mm)P2(mm)H(mm)MinMaxminmaxMinmaxminmaxMinmaxbasicbasicMaxSOT 1432.102.641.001.690.370.460.760.890.250.551.921.721.20圖25 SOT 143的元件尺寸6.1.10.2 SOT 143的焊盤尺寸SOT 143的焊盤尺寸應(yīng)符合圖26的規(guī)定。見(jiàn)圖26： 封裝名稱Z(mm)G(mm)X1(mm)X2(mm)C(mm)E1(mm)E2(mm)Y(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）MinmaxrefbasicBasicrefSOT 1433.600.801.001.

35、001.202.201.901.701.4088圖 26 SOT 143 焊盤尺寸6.1.11 SOT 2236.1.11.1 元件尺寸SOT 223的尺寸應(yīng)符合圖27的規(guī)定。見(jiàn)圖27：封裝名稱L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P2(mm)P1(mm)MinMaxminmaxMinmaxminmaxMinmaxMaxbasicbasicSOT 2236.707.304.104.920.600.882.903.180.901.301.802.304.60圖27 SOT 223的元件尺寸6.1.11.2 SOT 223的焊盤尺寸SOT 223的焊盤尺寸應(yīng)符合圖28的規(guī)

36、定。見(jiàn)圖28： 封裝名稱Z(mm)G(mm)X1(mm)X2(mm)C(mm)E1(mm)E2(mm)Y(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）MinmaxrefbasicBasicrefSOT 1438.404.001.203.403.606.202.304.602.201814圖 28 SOT 223 焊盤尺寸6.1.12 TO 252/TO 2686.1.12.1 元件尺寸TO 252的尺寸應(yīng)符合圖29的規(guī)定。見(jiàn)圖29：封裝名稱L(mm)W1(mm)W2(mm)T1(mm)T2(mm)P1(mm)P2(mm)H(mm)MinMaxminmaxMinmaxminmaxMinmaxbasicbasi

37、cmaxTS-003a9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005b14.6015.880.510.916.226.862.292.798.009.002.545.084.83TO 26818.7019.101.151.4513.3013.602.402.7012.4012.705.4510.905.1注a : 以前為TO 252。注b ：以前為 TO 263。圖29 TO 252的元件尺寸6.1.12.2 TO 252的焊盤尺寸TO 252的焊盤尺寸應(yīng)符合圖30的規(guī)定。見(jiàn)圖30：封裝名稱Z(mm)Y1(mm)Y2(mm

38、)X1(mm)X2(mm)C(mm)區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）refS-003*11.201.606.201.005.407.302416TS-005*16.603.409.601.006.8010.103624TO 26819.803.4013.401.4013.6011.404234圖 30 TO 252 焊盤尺寸6.1.13 SMD220元件6.1.13.1 SMD220元件尺寸元件尺寸應(yīng)符合圖31的規(guī)定。見(jiàn)圖31：封裝名稱D2PaK(SMD-220)圖31 SMD-220元件尺寸 6.1.13.2 SMD-220 焊盤尺寸焊盤尺寸應(yīng)符合圖32的規(guī)定。見(jiàn)圖32：封裝名稱區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)

39、碼）SMD-22024x36圖 32 SMD-220焊盤尺寸6.1.14 SMA元件(對(duì)應(yīng)物料代碼為15100016a)6.1.14.1 SMA元件尺寸SMA元件尺寸應(yīng)符合圖 33的規(guī)定。見(jiàn)圖33：封裝名稱SMAPLASTIC PACKAGECASE 403B-01ISSUE O圖33 SMA元件尺寸6.1.14.2 SMA焊盤尺寸焊盤尺寸應(yīng)符合圖34的規(guī)定。見(jiàn)圖34： 封裝名稱區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）SMA6x14圖 34 SMA焊盤尺寸6.1.15 SOT-323元件(對(duì)應(yīng)物料代碼為15100001)6.1.15.1 SOT-323元件尺寸SOT-323元件尺寸應(yīng)符合圖35的規(guī)定。見(jiàn)圖 3

40、5：封裝名稱SOT-323(SC-70 3 Lead)圖35 SOT-323元件尺寸6.1.15.2 SOT-323焊盤尺寸SOT-323焊盤尺寸應(yīng)符合圖36的規(guī)定。見(jiàn)圖 36： 封裝名稱區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）SOT-3234x6圖 37 SOT-323焊盤尺寸6.1.16 SOT-363 元件6.1.16.1 SOT-363 元件尺寸SOT-363元件尺寸應(yīng)符合圖38的規(guī)定。見(jiàn)圖38：封裝名稱SOT-363(SC-70 6 Lead)圖38 SOT-363元件尺寸6.1.16.2 SOT-363焊盤尺寸SOT-363焊盤尺寸應(yīng)符合圖39的規(guī)定。見(jiàn)圖 39：封裝名稱區(qū)域網(wǎng)格（網(wǎng)格單元號(hào)碼）S

41、OT-3634x6圖 39 SOT-363焊盤尺寸6.2 兩側(cè)翼形引腳元件6.2.1 SOICSmall Outline Integrated Circuits:小外形集成電路6.2.1.1 元件尺寸SOIC 的尺寸應(yīng)符合圖40的規(guī)定。見(jiàn)圖40： 封裝名稱L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mmminmaxminMaxminmaxminmaxminmaxminmaxminmaxbasicSO8-1505.806.203.264.550.330.510.401.273.804.004.805.001.351.751.27SO8-30010.0010.657.

42、468.850.330.510.401.277.407.605.055.452.352.651.27SO14-1505.806.203.264.550.330.510.401.273.804.008.558.751.351.751.27SO14-30010.0010.657.468.850.330.510.401.277.407.608.809.202.352.651.27SO16-1505.806.203.264.550.330.510.401.273.804.009.8010.001.351.751.27SO16-30010.0010.657.468.850.330.510.401.277

43、.407.6010.1010.502.352.651.27SO20-30010.0010.657.468.850.330.510.401.277.407.6012.6013.002.352.651.27SO24-30010.2910.648.219.010.360.510.531.047.407.6015.5415.852.342.641.27SO24-35011.8112.179.7310.540.360.510.531.048.769.0215.5415.852.342.641.27SO28-30010.2910.648.219.010.360.510.531.047.407.6018.0818.392.342.641.27SO28-35011.8112.179.7310.540.360.510.531.048.769.0218.0