使用SI9000進行PCB常規(guī)阻抗計算

1、SI9000常規(guī)阻抗計算常規(guī)信號分為微帶線和帶狀線，微帶線指該信號線只有一個參考平面(表底層)，帶狀線指該信號線在兩個參考平面之間(內(nèi)層)，故 阻抗計算需要選擇不同模型來完成。外層(微帶線)單端阻抗計算模型1.單端阻抗結(jié)構(gòu) >2.單端阻抗模型 >3.設置相應參數(shù)說明：介電常數(shù)和板材有關，常規(guī) FR4介電常數(shù)在4.2-4.5之間，常規(guī)半固化片介電常數(shù) 106(3.9 )、1080(4.2)、2116(4.2)、7628(4.5)，羅杰斯板材RO4350階電常數(shù)是3.66 , M6板材介電常數(shù)在3.3-3.5之間。二、外層（微帶線）差分阻抗計算模型1.差分阻抗結(jié)構(gòu)一一2.差分阻抗模型一

2、一3.設置相應參數(shù)說明：常規(guī)差分控制阻抗 lOOohn，USB控 90ohm Typec控90ohm以下是1.6mm板厚常規(guī)八層板的層疊1.3個信號層、2個地、一個電源2.射頻隔層參考，線寬16mil3.關鍵信號在S1層，注意S2跨分割問題，適用于雜線多的情況37. t)ohm4hohmbOohmdiffflbdiffMdifflOO7TOPOLPF1.54GND021.2CORE4.3511.2PF1632L2CORE4.3P0WBR05L2PFL6S31.2CORE4,3G11DQ7FF電BOT081.611e. ss55.5/7. 65. 1/84- 1/5L沁弓1E 5&55.

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10、層（帶狀線）單端阻抗計算模型1.單端阻抗結(jié)構(gòu) >2.單端阻抗模型 >3.設置相應參數(shù)四、內(nèi)層（帶狀線）差分阻抗計算模型1.差分阻抗結(jié)構(gòu)一一2.差分阻抗模型一一3.設置相應參數(shù)厚厘鋼厚Coz）37 , bahmbOohmdiffHbdiff90difflOO參考矣Torai1.65+plal ins10, 57.5&G.6/&. B6. 9/7.24. S/e. 2LZPP4GHD02L21CORE4.3S11.21Sl EG55.5/7. S二 i/e4.L2&L5PPL&IL21& &5B. 5/T, B5】得4. 1/9L2&am

11、p;L5DORE4.3POWERO51.21PP16富1.21Al ££55.5/7. 6二 i/e4. 1/9L5ltL7DORE1.3Gffoav1.21PF4BOT03LSD. 5+platinp10. 57.566*5/6. &5. 9/7.24. 9/G. 2LT根據(jù)常規(guī)8層板層疊計算內(nèi)層阻抗A.內(nèi)層單端阻抗模型：S1: H1 = 16+1.2+4.3=21.5H2=1.2+4.3=5.5S1層50ohm 5mil （說明：阻抗允許誤差正負 10% H1和H2數(shù) 值）S1和S2參考層面厚度相差較小阻抗線寬一致（說明：如果 H1 和H2數(shù)值正確，H1和H2即

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20、OO<10UJajcoan |aooou |Buaan| Q.QQQO I 1 2D0U | lQVD廣 Wirtcnsdl.crlyi.UlCjmidia |Caculci I=PTitl ThicFint阿Lcskiss CiltuhtionirK4. n yCnlcisonIdeianDE Miriinun kaKiULmClMMOIUQOJO I4 2Q00 I*?OI CLOOOO 22.700 I 227DQI QinM| 0M| 42000| a oooo | mod | eidoq| aooool <10001 4iooo 3込訂L. ULU0.K004J003il 3ED03culalE |IXrjkh |Cdubfaia |CdDuhlc I8-0003 |B0DD0Cslp.itaieso isMereS1、S2、S3: 100ohm同理計算，概不贅述。（關于射頻線阻抗計算隔層參考，共面阻抗計算參考 SI9000 隔層及 共面模型計算 ）阻抗說明:疊層厚度通常由單板實際情況決定，如果疊層確定，線寬變小，阻抗變大，差分阻抗線之間的間