IC代工生產(chǎn)管理培訓(xùn)

1、1：什么是pc2：什么是mpc3：mpc需要關(guān)注和解決那些問題4：mpc專業(yè)詞匯解釋 pc就是production controlpc 是著眼在公司層面，根據(jù)銷售訂單以及生產(chǎn)線產(chǎn)能進(jìn)行制定生產(chǎn)投入產(chǎn)出計(jì)劃職責(zé)：1. 產(chǎn)品的投入計(jì)劃2. 確保產(chǎn)品交貨期，以及產(chǎn)出計(jì)劃。3. 確認(rèn)制品move情況以及提醒交貨期會(huì)有延遲的產(chǎn)品4. 執(zhí)行客戶需求的產(chǎn)品釋放以及停滯等等 mpc 的客戶是mpp,mpp客戶是pc。也就是說詳細(xì)的完成pc所下達(dá)的任務(wù)。1. 按生產(chǎn)計(jì)劃檢查、跟蹤并準(zhǔn)確及時(shí)報(bào)告生產(chǎn)流程中的問題。 2. 依據(jù)wip、制品交期、設(shè)備負(fù)荷、制程時(shí)間限制以及在制品及設(shè)備的運(yùn)行狀況等因素調(diào)整實(shí)時(shí)調(diào)度系統(tǒng)的

2、運(yùn)行3. 提高人員及設(shè)備利用率制品流通率的管理及有關(guān)數(shù)據(jù)的提供 4. 依據(jù)生產(chǎn)數(shù)據(jù)計(jì)算生產(chǎn)能力。the mission of a manufacturing fab : to satisfy customer and maximize the capacity and wafer output what customer wants? on time delivery good wafer quality low unit price mfg indices indicates the performance of a fabindex nameshort descctcycle timetr

3、turn ratiomovewafer movementwipproduction wafer in processengwipengineer wafer in processyieldfab yieldholdhold wipterminateengineer wafer scrapscrapproduction wafer scrapreworkrework waferwswafer startwowafer out英文全名：cycle/time中文全名: 運(yùn)轉(zhuǎn)周期定義: the average lead time which one wafer must pay for running

4、,waiting,holding,and time on bank from wafer start to qc-inspection計(jì)算方式: cycle_time_waferi/wafer_output 計(jì)算頻率/單位: 天指標(biāo)意義: 1.考量fab的硅片的運(yùn)轉(zhuǎn)速度2.衡量fab的run貨效率英文全名：turnratio t/r中文全名: 在制品周轉(zhuǎn)率定義: average number of stages which one wafer can penetrate in one day 每片硅片平均每天跑過的stage數(shù)計(jì)算方式: stage move/wip wip=(boh+eoh)

5、/2計(jì)算頻率/單位: 每日指標(biāo)意義: 1.由turn ratio可知硅片處理速度是否正常 2.此指標(biāo)為stage move與wip的比值，因此由此可以得知目前的wip量是否合理，在制品積壓成本是否過高，以及生產(chǎn)流程是否順暢 英文全名：wafer moves中文全名: 硅片移動(dòng)量定義: 一片硅片完成一個(gè)stage 稱為一個(gè)stage move; 一片硅片完成一個(gè)step 稱為step move計(jì)算方式: 由fab中實(shí)際操作的硅片數(shù)加總得到計(jì)算頻率/單位: 每日或每月指標(biāo)意義: 1.由各個(gè)移動(dòng)量可以了解目前硅片之處理速度是否 正常 2.由移動(dòng)量預(yù)估硅片是否趕上速度 3.籍此衡量各區(qū)域之生產(chǎn)績效英文

6、全名：廣義上 work in process 在半導(dǎo)體行業(yè):wafer in process中文全名: 在制品定義: 從硅片投入到硅片產(chǎn)出，fab內(nèi)各站積壓了相當(dāng)數(shù)量的硅片，統(tǒng)稱為fab內(nèi)的wip計(jì)算方式: 堆積硅片求和計(jì)算頻率/單位: 每日或每月/片指標(biāo)意義: 衡量一個(gè)fab的生產(chǎn)能力的標(biāo)志 pwip : production wipengwip : engineering wip英文全名：yield中文全名: 良率定義: 產(chǎn)出硅片良品數(shù)量與投入生產(chǎn)之硅片數(shù)量的比率計(jì)算方式: 硅片產(chǎn)出量/（硅片產(chǎn)出量+硅片報(bào)廢量）計(jì)算頻率/單位: 每月 %指標(biāo)意義: 由良率可以顯示所生產(chǎn)硅片之制造環(huán)境，制程

7、，規(guī)格方面之綜合表現(xiàn)，故其為最重要的品質(zhì)指標(biāo)英文全名:hold中文全名:硅片擱置定義: 在生產(chǎn)過程中因?yàn)榭刂苹蛘吖こ淘驎簳r(shí)無法進(jìn)行生產(chǎn)的硅片數(shù)量計(jì)算方式: 所有hold wip數(shù)量相加計(jì)算頻率/單位: 每日或每月 片指標(biāo)意義: 1. 衡量工廠生產(chǎn)穩(wěn)定度 2.衡量因工程原因?qū)ιa(chǎn)周期的影響英文全名：scrap中文全名:報(bào)廢硅片定義: total wafer scrap quantity in fab計(jì)算方式: 所有scrap求和計(jì)算頻率/單位: 每日或每月 片指標(biāo)意義: 1.衡量制程穩(wěn)定度 2.衡量一個(gè)fab的生產(chǎn)良率 3.eng wip terminate 用以衡量工廠研發(fā)或者保持制程穩(wěn)定而

8、用掉的cost英文全名:rework中文全名:返工定義: total rework count in fab litho area計(jì)算方式: 所有rework 數(shù)目累加計(jì)算頻率/單位: 每日或每月 片指標(biāo)意義: 1.衡量litho制程穩(wěn)定度 2.衡量litho無效 movement數(shù)量英文全名:wafer start中文全名:硅片下線定義: total wafer start count計(jì)算方式: 所有下線數(shù)目累加計(jì)算頻率/單位: 每日或每月 片指標(biāo)意義: 衡量工廠生產(chǎn)規(guī)模英文全名:wafer out中文全名:硅片出貨定義: total wafer out count計(jì)算方式: 所有出貨數(shù)目累

9、加計(jì)算頻率/單位: 每日或每月 片指標(biāo)意義: 衡量工廠生產(chǎn)規(guī)模v what is a “golden” fabindex namedirectionctas short as possibletras large as possiblemove / pwipas large as possibleengwipas few as possibleyieldas large as possibleholdas few as possibleterminateas few as possiblereworkas few as possiblewsa absolute index, related t

10、o capability of the fabwoa absolute index, related to capability of the fabmovea absolute index, related to capability of the fabpwipa absolute index, related to capability of the fabwafer moveswafer step movelocation movewafer in process (wip)end on hand & begin on handturn ratio (t/r) - daily

11、equipment up timewafer per hour (wph)equipment efficiencyutilizationmanufacturing efficiencycycle time per mask layer (c/t)wafer outline yield wafer acceptance test (wat) fab yield definitionowafer step move = 1 wafer moving from one step to another.owafer stage move = 1 wafer moving from one stage

12、to another. method of calculationosum of actual fab or section wafer stage moves to give fab wafers move, and section wafers move respectively. purpose of wafer move indexofrom present amount of wafer moves, we can determine if the present production rate of the section or fab is normal.ouse as a me

13、asurement index to compare shift to shift or fab to fabscenario 1: particular lot of 25 wafers completed 4 stages on the 1st of february 2000.scenario 2: particular lot of 25 wafers completed 70 stages in the month of january 2000.scenario 1 moves: on the 1st of february 2000, wafer move = 25 x 4 =

14、100 scenario 2 moves: in the month of january 2000, wafer move = 25 x 70 = 1750 definitionowafer step move - 1 wafer moving from one step to another.(note: 1 step is equivalent to 1 equipment move or 1 metrology step.) method of calculation osum of actual fab, section or equipment wafer step moves t

15、o give fab wafers move, section wafers move and equipment wafer moves respectively. purpose of wafer step move indexofrom present amount of wafer moves, we can determine if the present production rate of the equipment or section is normal.ouse as a measurement index to compare equipment to equipment

16、 or performance of operator to operator.scenario 1: particular lot of 25 wafers completed 6 steps on the 1st of february 2000.scenario 1 step moves: on the 1st of february 2000, wafer move = 25 x 6 = 150 step moves (assuming the average number of steps per stages 3 steps / stage)stage moves on 1st o

17、f february 2000 = 150 / 3 = 50 stage moves definitionototal number of wafer stage move 1 wafer moving from one stage to another. method of calculation osum of stage moves within process area (cvd, pvd, photo, etc). purpose of location move indexofrom present amount of wafer moves, we can determine i

18、f the present production rate of the process area is normal.ouse as a measurement index to compare day to day or month to month performance of a process area.scenario 1: wafer move in the cvd area for imd = 1200, peteos = 800, sacvd = 500, hdp = 400 and bpteos = 400.scenario 1 locaton moves: cvd loc

19、ation moves = 1,200 + 800 + 500 + 400 + 400= 3,000 moves definitiononumber of wafers per step, stage, section, shift or fab. (ie running, wait, hold, etc) method of calculation osum of all wafers in that step, stage, section, shift or fab respectively. purpose of work in process indexofrom present a

20、mount of wafer moves, we can determine if the present capacity of the equipment, section or fab is sufficient.ouse as an indicator to possible bottleneck in the fab.omovement of the wip index will reflect the stability of the equipment / process and at the same time the capability (constraints) of t

21、he equipment. definitionoeoh - wip per stage, section or shift or fab at the end of a shift.oboh - wip per stage, section or shift or fab at the start of a shift. method of calculation osum of all wafers in that stage, section, shift or fab respectively at the end or start of a shift. purpose of eoh

22、 and boh indexoby comparing the eoh and the boh of a shift, we can have a feel of the performance of the equipment and the shift. an increase in wip from the boh to eoh may indicate poor equipment status in the different fabs or sections or shifts, or poor dispatching skill of the shift if the equip

23、ment status is normal. definitiononumber of stages completed by each wafer per day. method of calculation ot/r = total stage moves per day / average wip(note: average wip per day = boh + eoh / 2) purpose of turn ratio indexofrom the t/r we can determine if the current wafer production rate is normal

24、 or too slow.oas this indicator takes the ratio of stage moves to average wip, therefore we could determine if: current wip is reasonable relative to bench marked quantity. is the cost of wip (inventory) relative to the cost of equipment lost time proportional. current production flow is smooth with

25、 no bottleneck is the stage target realistic.scenario 1: on the 1st of february 2000, total stage move (cvd) is 10,000, the boh wip on that day is 5,500 and eoh wip on that day is 6,000.scenario 1 t/r: on the 1st of february 2000, t/r = 10,000 / (5,500 +6,000) / 2 = 1.74(note: an average t/r of 2.1

26、to 2.2 is reasonable for a fab) definitionotime when equipment is fit-for-production. method of calculation oup time = run time + lost time + test time + backup time purpose of up time indexofrom the up time we can determine the total amount of time available for production.othe ratio of lost time t

27、o available time is used to determine the room for improvement in terms of utilization for a particular equipment. scenario 1: in february 2000, run time = 700 hours, lost time = 100 hours, test time = 100 hours, and backup time = 50 hours for wcvd equipment. scenario 1 wcvd available time: in febru

28、ary 2000, avail time= 950 hourslost rate = 100 / 950= 10.5% definitiononumber of wafers processed per hour. method of calculation owph = wafer move / run time purpose of wafer per hour (wph) index (1)ofrom the present equipment wph we can determine whether the current equipment rate of production to

29、tal is normal.othe equipment wph can be used to derive the equipment capacity, which can be in turn used to determine if the total capacity for a particular capability is sufficient. purpose of wafer per hour (wph) index (2)othe ratio of the current equipment wph to the theoretical wph (t wph) can b

30、e used to determine if the equipment is presently operating in the optimum conditions.owph index can also be used to measure individual ma or shift performance, especially so in manual operations.orelative wph between equipment running the same recipe can be used to determine the individual equipmen

31、tscenario 1: on 1st of february 2000, run time = 20 hours and wafer moves = 1700 wafers for wcvd equipment. scenario 2: the same equipment for the month of february 2000, run time = 600 hours and the total wafer moves = 54,000 wafers. scenario 3: run time = 12 hours, wafer moves by operator a = 500

32、and operator b = 400 on the same equipment.scenario 1 wcvd wph: on 1st of february 2000, wph = 1,700 / 20 = 85 wafers / hourscenario 2 wcvd wph: in the month of february 2000, wph = 54,000 / 600 = 90 wafers / hourtherefore, we can say that the current equipment rate of production is lower than the a

33、verage for the whole month.scenario 3: operator a has a wph = 500 / 12 = 41.67 wafers / hour operator b has a wph = 400 / 12 = 33.33 wafers / hour definitionopercentage of the actual wafer moves per hour to the ideal wafer moves per hour. method of calculation oequipment efficiency = (total actual w

34、afer moves / total run time) / (average ideal wph) x 100%note: as the “ideal wph” is dependent on the recipe of the lot processed, the “average ideal wph” is the sum of the “ideal wph” multiple by the proportion of the number of lots (during the period of time) with that recipe divided by the total

35、run time. purpose of equipment efficiency indexothe equipment efficiency index show how much deviation from the optimum performance is the equipment being operated in.odetermine if there is any weakness / abnormality with an equipment capabilities / fab wip profile / process capability.obase on the

36、efficiency of the equipment, we are able to look into methods to optimize the equipment and increase the throughput of the equipment. example of some situations that lowers the equipment efficiency:oonly 1 smif arm is in working condition.otakes a longer time than usual to achieve required vacuum fo

37、r the load lock equipment problem.osmif arm unable to unload automatically therefore status remains “run” (run time increases without increase in output) even when wafers already completed its process.othe bottleneck chamber of the equipment is down and therefore the impact deducted is less than the

38、 actual impact.otime require for achieving vacuum is the same for a lot with 25 wafers and one with only 1 wafer. therefore the time per wafer is increase significantly when lot with only 1 wafer is processed.scenario 1: on 1st of february 2000, shift a, wcvd equipment, wafer moves = 375 wafers, run

39、 time = 12 hours. the lots consist of 5 lots of recipe a and 10 lots of recipe b. recipe a: ideal wph = 30, recipe b: ideal wph = 45.scenario 1 efficiency: average idea wph = (5 / 15 x 30) + (10/15 x 45)= 40 wafer per hourequipment efficiency = (375 / 12) / (40) x 100= 78.13% definitionothe amount o

40、f time demanded of an equipment for production, versus the total amount of time available. odemand / capacity method of calculation outilization = (run time + test time + back up time) / total time x 100% purpose of utilization indexofor a utilization index greater than 100% for certain equipment, w

41、e can safely say that the present equipment capacity is not sufficient for the present demand.oif the utilization is low for certain equipment, but the wip is high, it could be due to the equipment not having the capability to run the recipes required by the wip.scenario 1: in a day (24 hours), wcvd

42、 equipment has run time = 12 hours and back up time = 6 hours. scenario 1 utilization: utilization = (12+6) / 24 x 100%= 75% definitionopercentage of the equipment available time used for production (run time, test time and back up time) over the total equipment available time (run time, test time,

43、lost time and back up time). method of calculation omanufacturing efficiency = (utilization / availability) x 100% purpose of manufacturing efficiency indexn the manufacturing efficiency index compares the performance of the operator under a high wip situation. the higher the efficiency index the be

44、tter the performance.n one of the indicators for low wip for specific equipment, section or fab.n a high wip and low manufacturing efficiency index could be due to equipment constraint and its capabilities. scenario 1: operator as equipment has run time = 8 hours, test time = 1 hour, back up time =

45、0 and lost time = 3 hours. scenario 1 operator a: manufacturing efficiency =(8+1+0) / (8+1+0+3) x 100% = 75% definitionoaverage number of days required for processing between two photo stages. (1 layers . one photo stage to another)oas each individual layer is defined by a photo stage, therefore the

46、 number of layers of a product is equivalent to the number of photo stages.note: for 0.25 micron technology, there is an average of 25 layers. method of calculation c/t = (time which wafer passes the qc test time at wafer start) / number of photo stages. purpose of wafer move indexobase on the numbe

47、r of layers of the product, and the use of the average cycle time of the fab, we are able to determine the average time required for the product from start to completion. thereby, enabling us to decide on the date for the product wafer start in order to meet the delivery schedule. scenario 1: a part

48、icular product has 16 layers, and the time required from wafer start till qc testing is 40 days. scenario 1 c/t per layer: c/t per layer = 40 / 16= 2.5 days per layer definitionototal quantity of wafers that passes the qc test. method of calculation oproduction controller (pc) will announced the off

49、icial wafer out quantity. purpose of wafer out indexothe wafer out index will indicate the fab output status. scenario 1: in the month of february 2000, quantity of wafers that passes qc test =15,000 wafers. scenario 1 wafer out: in the month of february 2000 wafer out = 15,000 wafersdefinitionopercentage of wafers produced by the fab prior to wat.method of calculation line yield = (quantity of wafer produced) / (quantity of wafer produced) + (quantity of wafer scrapped in the production process)= (quantity of wafer produced) / (quantity of raw wafer used for produc