LED照明常用詞匯中英文對照

1、LED照明常用詞匯中英文對照(一)1 backplane 背板2 Band gap voltage reference 帶隙電壓參考3 benchtop supply 工作臺電源4 Block Diagram 方塊圖 5 Bode Plot 波特圖6 Bootstrap 自舉7 Bottom FET Bottom FET8 bucket capcitor 桶形電容9 chassis 機架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 鐵芯飽和13 crossover frequency 交叉頻

2、率14 current ripple 紋波電流15 Cycle by Cycle 逐周期16 cycle skipping 周期跳步17 Dead Time 死區(qū)時間18 DIE Temperature 核心溫度19 Disable 非使能，無效，禁用，關(guān)斷20 dominant pole 主極點21 Enable 使能，有效，啟用22 ESD Rating ESD額定值23 Evaluation Board 評估板24 Exceeding the specifications below may result in permanentdamage to the device, or devi

3、ce malfunction. Operation outside of theparameters specified in the Electrical Characteristics section is notimplied.超過下面的規(guī)格使用可能引起永久的設(shè)備損害或設(shè)備故障。建議不要工作在電特性表規(guī)定的參數(shù)范圍以外。25 Failling edge 下降沿26 figure of merit 品質(zhì)因數(shù)27 float charge voltage 浮充電壓28 flyback power stage 反馳式功率級29 forward voltage drop 前向壓降30 free-

4、running 自由運行31 Freewheel diode 續(xù)流二極管32 Full load 滿負載 33 gate drive 柵極驅(qū)動34 gate drive stage 柵極驅(qū)動級35 gerber plot Gerber 圖36 ground plane 接地層37 Henry 電感單位：亨利38 Human Body Model 人體模式39 Hysteresis 滯回40 inrush current 涌入電流41 Inverting 反相42 jittery 抖動43 Junction 結(jié)點44 Kelvin connection 開爾文連接45 Lead Frame 引腳

5、框架46 Lead Free 無鉛47 level-shift 電平移動48 Line regulation 電源調(diào)整率49 load regulation 負載調(diào)整率50 Lot Number 批號51 Low Dropout 低壓差52 Miller 密勒 53 node 節(jié)點54 Non-Inverting 非反相55 novel 新穎的56 off state 關(guān)斷狀態(tài)57 Operating supply voltage 電源工作電壓58 out drive stage 輸出驅(qū)動級59 Out of Phase 異相60 Part Number 產(chǎn)品型號61 pass transis

6、tor pass transistor62 P-channel MOSFET P溝道MOSFET63 Phase margin 相位裕度64 Phase Node 開關(guān)節(jié)點65 portable electronics 便攜式電子設(shè)備66 power down 掉電67 Power Good 電源正常68 Power Groud 功率地69 Power Save Mode 節(jié)電模式70 Power up 上電71 pull down 下拉72 pull up 上拉73 Pulse by Pulse 逐脈沖（Pulse by Pulse）74 push pull converter 推挽轉(zhuǎn)換器7

7、5 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二極管78 resistive divider 電阻分壓器79 ringing 振 鈴80 ripple current 紋波電流81 rising edge 上升沿82 sense resistor 檢測電阻83 Sequenced Power Supplys 序列電源84 shoot-through 直通，同時導(dǎo)通85 stray inductances. 雜散電感86 sub-circuit 子電路87 substrate 基板88 Telecom 電信89 Thermal Informati

8、on 熱性能信息90 thermal slug 散熱片91 Threshold 閾值92 timing resistor 振蕩電阻93 Top FET Top FET94 Trace 線路，走線，引線95 Transfer function 傳遞函數(shù)96 Trip Point 跳變點97 turns ratio 匝數(shù)比，Np / Ns。（初級匝數(shù)/次級匝數(shù)）98 Under Voltage Lock Out (UVLO) 欠壓鎖定99 Voltage Reference 電壓參考100 voltage-second product 伏秒積101 zero-pole frequency comp

9、ensation 零極點頻率補償102 beat frequency 拍頻103 one shots 單擊電路104 scaling 縮放105 ESR 等效串聯(lián)電阻 Page106 Ground 地電位107 trimmed bandgap 平衡帶隙108 dropout voltage 壓差109 large bulk capacitance 大容量電容110 circuit breaker 斷路器111 charge pump 電荷泵112 overshoot 過沖LED照明常用詞匯中英文對照(二)1） 元件設(shè)備三繞組變壓器：three-column transformer ThrCln

10、Trans雙繞組變壓器：double-column transformer DblClmnTrans電容器：Capacitor并聯(lián)電容器：shunt capacitor電抗器：Reactor母線：Busbar輸電線：TransmissionLine發(fā)電廠：power plant斷路器：Breaker刀閘(隔離開關(guān))：Isolator分接頭：tap電動機：motor2） 狀態(tài)參數(shù)有功：active power無功：reactive power電流：current容量：capacity電壓：voltage檔位：tap position有功損耗：reactive loss無功損耗：active lo

11、ss功率因數(shù)：power-factor功率：power功角：power-angle電壓等級：voltage grade空載損耗：no-load loss鐵損：iron loss銅損：copper loss空載電流：no-load current阻抗：impedance正序阻抗：positive sequence impedance負序阻抗：negative sequence impedance零序阻抗：zero sequence impedance電阻：resistor電抗：reactance電導(dǎo)：conductance電納：susceptance無功負載：reactive load 或者QL

12、oad有功負載: active load PLoad遙測：YC(telemetering)遙信：YX勵磁電流(轉(zhuǎn)子電流)：magnetizing current定子：stator功角：power-angle上限:upper limit下限：lower limit并列的：apposable高壓: high voltage低壓：low voltage中壓：middle voltage電力系統(tǒng) power system發(fā)電機 generator勵磁 excitation勵磁器 excitor電壓 voltage電流 current母線 bus變壓器 transformer升壓變壓器 step-up

13、transformer高壓側(cè) high side輸電系統(tǒng) power transmission system輸電線 transmission line固定串聯(lián)電容補償fixed series capacitor compensation穩(wěn)定 stability電壓穩(wěn)定 voltage stability功角穩(wěn)定 angle stability暫態(tài)穩(wěn)定 transient stability電廠 power plant能量輸送 power transfer交流 AC裝機容量 installed capacity電網(wǎng) power system落點 drop point開關(guān)站 switch stat

14、ion雙回同桿并架 double-circuit lines on the same tower變電站 transformer substation補償度 degree of compensation高抗 high voltage shunt reactor無功補償 reactive power compensation故障 fault調(diào)節(jié) regulation裕度 magin三相故障 three phase fault故障切除時間 fault clearing time極限切除時間 critical clearing time切機 generator triping高頂值 high limi

15、ted value強行勵磁 reinforced excitation線路補償器 LDC(line drop compensation)機端 generator terminal靜態(tài) static (state)動態(tài) dynamic (state)單機無窮大系統(tǒng) one machine - infinity bus system機端電壓控制 AVR電抗 reactance電阻 resistance功角 power angle有功（功率） active power無功（功率） reactive power功率因數(shù) power factor無功電流 reactive current下降特性 dro

16、op characteristics斜率 slope額定 rating變比 ratio參考值 reference value電壓互感器 PT分接頭 tap下降率 droop rate仿真分析 simulation analysis傳遞函數(shù) transfer function框圖 block diagram受端 receive-side裕度 margin同步 synchronization失去同步 loss of synchronization阻尼 damping搖擺 swing保護斷路器 circuit breaker電阻：resistance電抗：reactance阻抗：impedance電

17、導(dǎo)：conductance電納：susceptance導(dǎo)納：admittance電感：inductance電容: capacitance印制電路printed circuit印制線路 printed wiring印制板 printed board印制板電路 printed circuit board印制線路板 printed wiring board印制元件 printed component印制接點 printed contact印制板裝配 printed board assembly板 board剛性印制板 rigid printed board撓性印制電路 flexible printe

18、d circuit撓性印制線路 flexible printed wiring齊平印制板 flush printed board金屬芯印制板 metal core printed board金屬基印制板 metal base printed board多重布線印制板 mulit-wiring printed board塑電路板 molded circuit board散線印制板 discrete wiring board微線印制板 micro wire board積層印制板 buile-up printed board表面層合電路板 surface laminar circuit埋入凸塊連印制

19、板 B2it printed board載芯片板 chip on board埋電阻板 buried resistance board母板 mother board子板 daughter board背板 backplane裸板 bare board鍵盤板夾心板 copper-invar-copper board動態(tài)撓性板 dynamic flex board靜態(tài)撓性板 static flex board可斷拼板 break-away planel電纜 cable撓性扁平電纜 flexible flat cable (FFC)薄膜開關(guān) membrane switch混合電路 hybrid circ

20、uit厚膜 thick film厚膜電路 thick film circuit薄膜 thin film薄膜混合電路 thin film hybrid circuit互連 interconnection導(dǎo)線 conductor trace line齊平導(dǎo)線 flush conductor傳輸線 transmission line跨交 crossover板邊插頭 edge-board contact增強板 stiffener基底 substrate基板面 real estate導(dǎo)線面 conductor side元件面 component side焊接面 solder side導(dǎo)電圖形 condu

21、ctive pattern非導(dǎo)電圖形 non-conductive pattern基材 base material層壓板 laminate覆金屬箔基材 metal-clad bade material覆銅箔層壓板 copper-clad laminate (CCL)復(fù)合層壓板 composite laminate薄層壓板 thin laminate基體材料 basis material預(yù)浸材料 prepreg粘結(jié)片 bonding sheet預(yù)浸粘結(jié)片 preimpregnated bonding sheer環(huán)氧玻璃基板 epoxy glass substrate預(yù)制內(nèi)層覆箔板 mass la

22、mination panel內(nèi)層芯板 core material粘結(jié)層 bonding layer粘結(jié)膜 film adhesive無支撐膠粘劑膜 unsupported adhesive film覆蓋層 cover layer (cover lay)增強板材 stiffener material銅箔面 copper-clad surface去銅箔面 foil removal surface層壓板面 unclad laminate surface基膜面 base film surface膠粘劑面 adhesive faec原始光潔面 plate finish粗面 matt finish剪切板

23、cut to size panel超薄型層壓板 ultra thin laminateA階樹脂 A-stage resinB階樹脂 B-stage resinC階樹脂 C-stage resin環(huán)氧樹脂 epoxy resin酚醛樹脂 phenolic resin聚酯樹脂 polyester resin聚酰亞胺樹脂 polyimide resin雙馬來酰亞胺三嗪樹脂 bismaleimide-triazine resin丙烯酸樹脂 acrylic resin三聚氰胺甲醛樹脂 melamine formaldehyde resin多官能環(huán)氧樹脂 polyfunctional epoxy resi

24、n溴化環(huán)氧樹脂 brominated epoxy resin環(huán)氧酚醛 epoxy novolac氟樹脂 fluroresin硅樹脂 silicone resin硅烷 silane聚合物 polymer無定形聚合物 amorphous polymer結(jié)晶現(xiàn)象 crystalline polamer雙晶現(xiàn)象 dimorphism共聚物 copolymer合成樹脂 synthetic熱固性樹脂 thermosetting resin Page熱塑性樹脂 thermoplastic resin感光性樹脂 photosensitive resin環(huán)氧值 epoxy value雙氰胺 dicyandiam

25、ide粘結(jié)劑 binder膠粘劑 adesive固化劑 curing agent阻燃劑 flame retardant遮光劑 opaquer增塑劑 plasticizers不飽和聚酯 unsatuiated polyester聚酯薄膜 polyester聚酰亞胺薄膜 polyimide film (PI)聚四氟乙烯 polytetrafluoetylene (PTFE)增強材料 reinforcing material折痕 crease云織 waviness魚眼 fish eye毛圈長 feather length厚薄段 mark裂縫 split捻度 twist of yarn浸潤劑含量 si

26、ze content浸潤劑殘留量 size residue處理劑含量 finish level偶聯(lián)劑 couplint agent斷裂長 breaking length吸水高度 height of capillary rise濕強度保留率 wet strength retention白度 whitenness導(dǎo)電箔 conductive foil銅箔 copper foil壓延銅箔 rolled copper foil光面 shiny side粗糙面 matte side處理面 treated side防銹處理 stain proofing雙面處理銅箔 double treated foil模

27、擬 simulation邏輯模擬 logic simulation電路模擬 circit simulation時序模擬 timing simulation模塊化 modularization設(shè)計原點 design origin優(yōu)化（設(shè)計） optimization (design)供設(shè)計優(yōu)化坐標軸 predominant axis表格原點 table origin元件安置 component positioning比例因子 scaling factor掃描填充 scan filling矩形填充 rectangle filling填充域 region filling實體設(shè)計 physical d

28、esign邏輯設(shè)計 logic design邏輯電路 logic circuit層次設(shè)計 hierarchical design自頂向下設(shè)計 top-down design自底向上設(shè)計 bottom-up design費用矩陣 cost metrix元件密度 component density自由度 degrees freedom出度 out going degree入度 incoming degree曼哈頓距離 manhatton distance歐幾里德距離 euclidean distance網(wǎng)絡(luò) network陣列 array段 segment邏輯 logic邏輯設(shè)計自動化 logic design automation分線 separated time分層 separated layer定順序 definite sequence導(dǎo)線（通道） conduction