LED焊線原理介紹參考文檔

1 什麼是WIREBOND L F 2 一 W B銲線基本理論 二 BONDING 固態(tài)銲接 的四大基本要素 要如何才能得到最佳的銲接 主要要素如下A 壓力 BONDFORCE B 振盪功率 BONDPOWER C 銲接時間 BONDTIME D 銲接溫度 TEMPERATURE 1 目前我們電子產(chǎn)品銲接是採用固態(tài)銲接 所謂固態(tài)銲接 就是金屬在未達熔解溫度下之銲接 決定固態(tài)銲接的要素有那些 3 1 鋁墊之構造 a 最上層為少量水氣與雜質(zhì)b 第二層為氧化鋁c 第三層才是純鋁d 第四層是二氧化鋁e 最下層就是矽層 2 最佳之銲接 就是金球與純鋁密切結合 故如何運用四大基本要素 掌控最佳配合時機為學習要旨 如壓力 振盪過大會造成缺鋁或矽崩過小昨則無法有效排除第一 二層與純鋁層作密切接合銲接 三 金球與鋁墊之最佳銲接 4 溫度 溫度 金球 二氧化矽層 矽層 純鋁 玻璃層 水氣及雜質(zhì) 氧化鋁 金球與鋁墊的銲接模式 5 鋁墊SEM側視圖 6 7 L F WIREBOND 8 pad lead Freeairballiscapturedinthechamfer 9 Freeairballiscapturedinthechamfer pad lead 10 Freeairballiscapturedinthechamfer pad lead 11 Freeairballiscapturedinthechamfer pad lead 12 Freeairballiscapturedinthechamfer pad lead 13 Formationofafirstbond pad lead 14 Formationofafirstbond pad lead 15 Formationofafirstbond pad lead heat PRESSURE UltrasonicVibration 16 Formationofafirstbond pad lead UltraSonicVibration heat PRESSURE 17 Capillaryrisestoloopheightposition pad lead 18 Capillaryrisestoloopheightposition pad lead 19 Capillaryrisestoloopheightposition pad lead 20 Capillaryrisestoloopheightposition pad lead 21 Capillaryrisestoloopheightposition pad lead 22 Formationofaloop pad lead 23 Formationofaloop pad lead 24 pad lead 25 pad lead 26 pad lead 27 pad lead 28 pad lead 29 pad lead 30 pad lead 31 pad lead 32 pad lead 33 pad lead 34 pad lead 35 pad lead 36 pad lead 37 pad lead 38 pad lead 39 pad lead 40 Formationofasecondbond pad lead heat 41 Formationofasecondbond pad lead heat heat 42 pad lead heat heat 43 pad lead heat heat 44 pad lead 45 pad lead 46 pad lead 47 pad lead 48 pad lead 49 pad lead 50 pad lead Disconnectionofthetail 51 pad lead Disconn