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SumikasuperLCPTechnicalSeminar
<contents>
1.Improvementofthewarpage
1-1.Introduction 1
1-2.Theoreticalbackgroundofthewarpageproblem 1
1-3.Experimentalanalysis 2
1-4.Casestudy
boardtoboardconnector(0.5mmpitch) 2
S/ODIMM 3
PGAsocket 4
2.High-speedinjectionmolding
2-1.Introduction 6
2-2.Thin-wallfluidityofLCPandcharacteristicof
injectionmoldingmachine
Experiment 6
Results 7
3.Reductionoftheblisteratsoldering
3-1.Introduction 9
3-2.Retentionofresinattheinsideofinjectionmachine 9
3-3.Temperaturesettingsofinjectionmachine 10
3-4.RelationbetweenretentionofLCPincylinderandblister 12
3-5.Otherpossibilities
Effectofmoisture 13
Draggingtheairintothemelt 14
Unbalancebetweencylindersizeandmoldingvolume 14
3-6.Conclusion 16
PurgingmethodofSumikasuperLCP 17
4.Reductionofthebubbleaftermolding
4-1.Introduction 18
4-2.Comparisonbetween"thebubble"and"theblister" 18
4-3.Reductionofthebubble
Suitableinjectioncondition 18
Suitablecavitydesign 19
5.Improvingtheholestrengthduringinsertingcontactpins
5-1.Introduction 21
5-2.Casestudy 21
1
Improvementofthewarpage
1-1.Introduction
Theliquidcrystallinepolymers(LCPs)arewidelyusedasmanytypesofelectricandelectronicspartsbecauseoftheirsuperioritiesinheatresistance,solderingresistance,high-temperaturestrength,chemicalresistance,thin-wallfluidity,etc.Especially,LCPsexhibitexcellentthin-wallfluidityandmoldabilityamonganyotherengineeringplastics.
However,tomoldtheproductswhichhavemanythin-wallportionsandcomplicated3-DshapeasconnectorsrequiressomehowsbasedonthespecificcharacteristicsoftheLCP.
Inthissection,wewouldliketoconsiderhowtoreducethewarpageofconnectorsmoldedbyLCPs.
1-2.Theoreticalbackgroundofthewapageproblem
Generallyspeaking,meltpolymersincludingLCPsflowtothickerportionsfirstly,thenflowtothinnerportionsbecausethepressure-lossatthinnerportionsisgreaterthanthickerportions.Inalmostcasesoftheconnectordesign,thebottomthicknessisthickerthantheribthickness.Thus,theappearanceofpolymerflowisrepresentedschematicallyasseeninFig.1-1a.ThearrowsinFig.1-1ashowthe“flowpattern”ofpolymerflow.
Fig.1-1LCPfowmodel
Especially,theLCPhasgreatdifferenceofmoldshrinkagebetweenmechanicaldirection(MD)andtransversedirection(TD).Asaresult,thethinnerportion("ribportion")willshrinkmorethanthethickerportion("bottomportion"),andthen,thewarpageexpressedinFig.1-1bwilloccur.
Inourunderstanding,thecauseofwarpageseeninLCPmoldingscanbeexpressedasstatedaboveatalltimes.Inotherwords,itisreasonabletothinkthatthewarpageofLCPmoldingsiscontrollablebychangingits“flowpattern”.
Therearethreepossibilitiestochangetheflowpattern.Thefirstandmostimportantstepistoequalizethethickness.Becauseofsomerestrictions,forexampleproductdesign,thisstepmaybedifficulttorealize.Allthesame,thisisthemostimportantpointtoreducethewarpage.
Nextwayistoinstallsomethinportionsatthickerportion(seeFig.1-2a).FlowpatternwillbeequalizedasshowninFig.1-2abyinstallingsuchthinportions("depressions")atbottomportion.
Thelastmethod(Fig.1-2b)istomovethegatepositiontothinnerportion(inthisfigure,ribportion).
Anyway,thewarpagewillreducegraduallybyusingaboveprocedures.
Fig.1-2Methodstochangetheflowpattern
1-3.Experimentalanalysys
Wehaveinvestigatedabovetheorybyusingmodelmoldwhichisabletochangethedepthofdepressions.Fig.1-3showsourmodelmoldusedinthisinvestigation.Thedepthofdepressionwaschangedfrom0mmto0.8mm(1/2ofbottomthickness).ResultsareshowninFig.1-4.
Fig.1-3SchematicviewofthemodelmoldFig.1-4Resultofwarpagechangeusingvarious
LCPs
ThewarpagereducedwithincreasingthedepressiondepthevenifanygradeofLCPwasused.Atthesametime,theflowpatternhadtochanged.Infact,itwasprovedbyobservationofshort-shotsamplesseeninFig.1-5.
Fig.1-5Photoofshort-shotsamples
1-4.Casestudy
1-4-1.Boardtoboardconnector(0.5mmpitch)
Fig.1-6showsschematicviewof0.5mmpitchboardtoboard(b/b)connector.Thisconnectorhadawarpageofabout10/100atoriginaldesign.Tocontroltheflowpattern,depressionswereinstalledatsidewallsasseeninFig.1-7,thenthewarpagereducedunder5/100.
Fig.1-6Schematicviewofb/bconnector
Fig.1-7Installingdepressions
1-4-2.S/ODIMM
Fig.1-9showsS/ODIMMdesignedaveragethicknessas0.03mm.Inthiscase,3typesofwarpagewereobserved.
mode1:warpageoflongitudinalderection
mode2:twisting
mode3:tumblingarmstotheinside
Fig.1-9SchematicviewofS/ODIMM
Itwasfoundthattheflowpatternwasnotequalbetweentopandbottom,topflowwasslowerthanbottomflow.Thereasonforthisisthatthethicknessoftopisthinnerthanbottom.Inthiscase,theflowpatternatthearm(oppositside)isshownasarrowsinFig.1-10,thenthearm(oppositside)warpstotopdirection,andthismoldingshowsmode2warpage.
Werecomendedequlizingthethicknessbetweentopandbottom,thewarpagesofmode1and2reducedlessthan10/100(seeFig.1-11).
Fig.1-10Flowpatternanalysis1Fig.1-11Ideaforsolution1
Themoldinghadstillwarpageof6~7/100.Thereasonofthiswarpagewastheunbalanceflowofbothtopandbottomplanes.Fig.1-12showstheflowpatternattopportion.Werecommendedinstallingprotrusionportionatfrontsideofbothtopandbottomplanes(seeFig.1-13).Thenthewarpagewascompletelyreduced.
Fig.1-14showsthechangeofflowpatternbyusingshort-shotsamples.
Fig.1-12Flowpatternanalysis2Fig.1-13Ideaforsolution2
1-4-3.PGAsocket
Fig.1-14showstheconventional2gatessystemforPGAsocket.Inthiscase,thewarpagewillbeunavoidable,especiallythegatesideinordertotheinequalityoftheflowpatternateachsideasseeninthefigure.The4gatessystemfromcenterportionshowninFig.1-15istheoneofthebestwaytosolveit.Thissystem,ofcourse,stillhasachanceofoccuringthewarpageatthegripportion(seeFig.1-16a)),however,itcanbeimprovedbyinstallingthesuitabledepressionslikethesamemannerdescribedabovesections(seeFig.1-16b)).
Fig.1-14Theconventional2gatesystemforPGAsocket
Fig.1-15The4gatessystemfromcenterportion
Fig.1-16IdeaforimprovingthewarpageforPGAsocket
2
High-speedinjectionmolding
2-1.Introduction
Recentlyyears,manycustomersarestronglyrequestingthematerialswhichareusedforlighter,smaller,andthinnnerproductsthanusualproducts.Thoseproductshavingthinportionslessthan0.2mm,however,aresometimesdifficulttomold,evenifourimprovedmaterialsareused.Inthosecases,itisunavoidablethatthethin-wallfluiditydependsonthecharacteristicofinjectionmoldingmachines.Thepurposeofthissectionistoinvestigatetherelationbetweenthin-wallfluidityofLCPandrise-upcharacteristicofinjectionmoldingmachines.
2-2.Thin-wallfluidityofLCPandcharacteristicofinjecionmoldingmachine
1)Experiment
The4cavitiestoolingshowninFig.2-1(cavitythickness:0.2mmt)wasusedforthisstudywithSumikasuperE6008(GF40%)asLCP.InjectionmoldingmachineswereusedshowninTable2-1andmoldtemperaturewas130degreeC.Themoldingtemperatureofeachinjectionmachinewas360degreeC.andmeasuredbyinfraredradiationthermometer(IT-240S:HoribaLtd.,Japan)at0.86oftheradiationratebeforeeachexperiment.DetailesofmeasuringofthemoldingtemperaturearewrittenatSection3-3.
Actualwavesofinjectionspeedandpressurewererecordedforeachinjectionconditionandtheflowlengthof0.2mmtcavitiesweremeasuredatthesametime.TheschematicwaveisshowninFig.2-2.
Fig.2-14cavitiesmodeltoolingFig.2-2Schematicwaveofthisstudy
Table2-1Thelistofinjectionmoldingmachinesofthisstudy
2)Results
Fig.2-3showstherelationbetweeninjectiontimeandflowlength.Incaseofopen-loopinjectionmachinesasAorB,flowlengthsdevelopedatendencytoincreasewithdecreasingofinjectiontime,however,injectiontimehasnotdecreaseunder0.10second.Incontrast,injectionmachineChasarrivedunder0.10secondofinjectiontimeeasierthanAandB,thenflowlengthhasgreatlyimproved.
Fig.2-3Relationbetweeninjectiontimeandflowlength
Thereasonwhythesedifferentcharacteristicswereobservedcanbeconsideredthedifferenceofrise-upcharacteristicofinjectionmachines.Thatistosay,comparedwiththerise-upcharacteristicofpressure,injectionmachineCismostrapidthanBandCshowninFig.2-4,sincetheservo-valveofclosed-loopsystemshowsquickerperformancethantheproportionalcontrolledvalveofopen-loopsystem.ItisclearofcomparingthevelocitycharacteristicsshowninFig.2-5.
Fig.2-4PressurewaveFig.2-5Velocitywave
Fig.2-6showsrelationbetweenmaximumvelocityandflowlengthforvariousinjectionmoldingmachinesincludingA,B,andC.Closed-loopmachinesshowbettermoldabilitythanopen-loopmachines.Itisreasonabletosupposethattheclosed-loopinjectionmachinesareprofitableforthin-wallmoldingsusingLCPs.
Fig.2-6Relationbetweenmaximumvelocityandflowlength
forvariousinjectionmoldingmachines
3
Reductionoftheblisteratsoldering
3-1.Introduction
LiquidCrystallinePolymer(LCP),"SumikasuperLCP",isoneofthebestheat-resistantpolymers.Ithasveryhighdecompositiontemperature(over500degreeC),andgoodthermalstability.ThesepropertiesserveforelectricandelectronicspurposesrequiringtoholdatIRreflowsolderingtemperature(~260degreeC).
However,ithasbeenshowninsomecasesthattheblisterproblemoccursatthesurfaceoftheproductsaftermoldingorafterIRreflowprocess.
ItisthoughtthattheLCPblisterproblemsoccurwhenthegasbleedingfromtheLCPresinatmoldingdissolveintotheproduct,furthermore,whenitexpandwithheatofIRreflowprocess.ThesurfaceofproductgetsblistersbecausethesurfaceissoftenbytheheatofIRreflowprocess.
ThegasquantityofSumikasuperLCPsarecontrolledatlowerlevelcomparedwithotherengineeringplasticsorotherLCPs.However,ifSumikasuperLCPisusedatexceedingitsthermallimit,theincreaseofgas,blisters,andthedeteriorationofmechanicalpropertiesofLCPwillbeobserved.
Inthissection,wewouldliketoexplainhowtoreducetheblisterproblems.
3-2.Theretentionofresinattheinsideofinjectionmachine
TheapparentviscosityofLCPstronglydependsonbothtemperatureandshearrate,inaddition,itsdependenceisstrongerthangeneralcrystallineandamorphousplastics.Becausetheapparentviscositybecomesverylowundertheproperinjectionconditions,theproductshavingthethin-wallportions(0.3mmtorless)iseasilymolded.
However,longtermrunningofmoldinggenerallycausestheretentionofresinatdead-spacesofinjectionmachineandthisresiduecausessomedeteriorations,forexample,thecontaminationofblackspots,theincreaseofgas,andthereductionofsolderingresistancetemperature(includingtheblister).
Especially,theLCPeasilyremainsatdead-spacesofinjectionmachinebecauseofitslowviscosity.Fromsimilarreason,thepurgingofpreviousresinissomewhatdifficultthangeneralplastics.
1)Experiment
Usingcleanscrewandcylinder,theblackcolorgradeofSumikasuperLCPwasmoldedupto200shots.Afterthat,thenaturalcolorgradewasmoldedupto400shots,thenscrewandcylinderwerebrokenuptoanalyzetheresiduaryconditionoftheblackgrade.
2)Conclusions
a)Theopen-typenozzleshouldbeusedforSumikasuperLCP.
Theshut-offtypenozzleisnotsuitable(theshut-offvalveanditssurroundingportioncausestheresiduewhichwillchangetothecauseofblack-spotsandtheblister).
b)Theinternaldiameterofthenozzleshouldbe4~5mmφ(thestandardsize,ca.8mmφisnotsuitableforSumikasuperLCP).
Fig.3-1Situationofretentionresinatnozzle,screw,andcylinder
(Therecommendabledesignofnozzleisalsodrawninthebottomofthisfigure)
3-3.Temperaturesettingsofinjectionmachine
~Differencebetweensettingvalueandrealresintemperature~
Oneofthemostimportantreasonsforvariousmoldinginferiorityisthedifferencebetweensettingtemperatureofinjectionmachineandactualresintemperature.Especially,moderninjectionmachineshavedigitalindicatorsofnozzleandcylindertemperatures,andtheoperatoreasilyhastheillusionthatthevalueappearedontheindicatorisequaltotheactualresintemperature.
However,theindicatorvalueoftendifferedfromtheactualresintemperatureinalmostmachinesthatwemeasured.
1)Measurementprocedureofresintemperature
Themeasurementofresintemperatureisusuallydonebystickingthepin-typeprobe(thermocouple)intotheroundballofpurgedresin.Incaseoftheresinhavingthemoldingtemperatureover300degreeC,however,thetemperaturereductionoftheresinballbytheradiationofheatisnotabletoignore.Thusitisdifficulttomeasuretheresintemperatureprecisely.
Itisappropriatetoemploythenon-touchmeasurementimmediatelyafterdrippingfromthenozzle.
apparatus:Infraredradiationthermometer(IT-240S:HoribaLtd.)
spotdiameter:1.2mmφ
Thesettingofradiationrateisveryimportantfortheinfraredradiationthermometer.Wehaveascertainedthatreasonablevalueofradiationrateformanykindsofplasticsis0.86bymeasuringattheproductionfactoryofresinpellets.
resinsusedforascertainment:
PP(non-filler:naturalcolor)
ABS(GFfilled:naturalcolor,black)
PES(non-filler,GFfilled:naturalcolor,white)
PEEK(GFfilled:naturalcolor,black)
LCP(GFfilled:naturalcolor,black,white)
2)Result
TheresultisshowninTable3-1.Almostcasesshowthattheactualresintemperaturegreatlydifferfromthesettingtemperature.
Table3-1Resultoftemperaturemeasurement
No
Injectionmachine
Injectionrate
Temperature
Molding
Settingtemp.
Actualtemperature(deg.C)1)
(cm3/sec)
controlsystem
material
(deg.C)
Metering2)
Purging3)
1
Verticaltype
(Acompany)
27
ON-OFFtype
PES3601GL30
(GF30%)
380
400~407
(+20~+25)
400~440
(+20~+60)
2
ditto
27
PID
ditto
380
375~380
(-5~0)
400
(+20)
3
Verticaltype
(Bcompany)
89
ditto
ditto
370
395~400
(+25~+30)
407
(+37)
4
Horizontaltype-1
(Bcompany)
114
ditto
PES3601GL20
(GF20%)
380
380~385
(0~+5)
360~364
(-20~-16)
5
ditto
114
ditto
PBTGF30%
270
275~280
(+5~+10)
270
(0)
6
Horizontaltype-2
(Bcompany)
42
ditto
LCP-R
(GF40%)
408
4)
375~390
(-18~-33)
1)UsingIT-240infraredemissionthermometer(HoribaLtd.:spotsize1.2mmφ,emissionrate0.86)
2)Measuredatdrawingstrandfromnozzleduringpurgingprocess(measuringpoint:1mmfromnozzletip)
3)Measuredatthesamemannerasaboveexceptforsettingwithinjectionspeed10%
4)Impossibletomeasurebecauseofunstablemetering
Thereasonwhytheactualresintemperaturedifferfromthesettingtemperatureisthoughtthatthepositionoftheprobe(thermocouple)tocontrolthenozzleheaterisnotsuitableasshowninFig.3-2.
Fig.3-2Comparisonofthermocouplepositioninvarioustypesofinjectionmachine
3-4.RelationbetweenretentionofLCPincylinderandblister
Asmentionedabove,thedeteriorationofresinmayhappenwhentheactualresintemperatureishigherthanthemostsuitableone.Thisdeteriorationmaycausetheblister,whichmayleadretentionincylinder.
Itwasfoundthatthereisstrongdependencebetweenblisterandmolding(actualresin)temperatureortheretentiontimeofresinincylinder.
1)Testmethods
Sample:E6807L
Moldingmachine:PS-40E5ASE(NisseiPlasticIndustrialCo.,LTD)
Thetransfomationsandblisteroftestpieceswereobservedafterimmesingthemintothesolderingbathsetat210and250degreeCeachfor60sec.Thetestpieceshavebeenmoldedwithvariousconditionsof:
-moldingtemperature
-retentiontime
Alsotestpiecesmoldedwithconditionsof:
-differentdecompressiondegree
-lowpressure/lowspeed
2)Results
TheresultisshowninTable3-2.Neithertransformationnorblisterwereobservedwhenthethicknessofthetestpieceswasthin(0.5mmt).Meanwhile,transformationandblisterwereobservedatthicktestpiece(0.8mmt),anditstendencydependedonthemoldingconditions.
Itwasascertainedthattheblisteroccurredinsolderingtemperatureat250degreeCwhentheresinwasretainedincylinderfor15minutes.Alsotheblisterappearedinsolderingat210degreeCwhentheresinwasretainedandmoldedat380-400degreeC.
Changeofdecompressiondegreewasnoinfluenceonsolderingresistanceinthistime.
Asaresultoftheabovetest,themoldingtemperatureandtheretentiontimecanbeconsideredasmaincauseofblister.
Unfortunately,thecolorchangeoftestpieceisquitesmallevenifitismoldedafterretainincylinderat380degreeC(incaseof400degreeC,thecolorchangecanberecognizedsomewhateasily).
Thus,thepurgingprocedureisinevitablewhentheresinmayberetainedinthecylinder.Regardingthehotrunnersystem,thesituationwillbemoreseverethanabovementioned.
Ifdecompressiondegreeistoohigh,theairmaybetakenintonozzlefromnozzletouchportion.Thisairmaybecontainedtomoldingsandtheblistermayoccurinsolderingtest.
Table3-2Resultofretentiontest
Standardconditions:decompressiondegree2mm
V=50%,P=30%,cycletime=20sec
Lowpressure/lowspeed:V=30%,P=15%
"○"showsthatneitherchangeinformnorblisterwerefound.
3-5.Otherpossibilities
3-5-1.Theeffectofmoisture
SumikasuperLCPsindicateextremelylowwaterabsorption(0.02%)comparedwithgeneralplastics.However,themoistureintheaircondensesonthesurfacesofresinpellets.ThemoisturecausestheblisterorthedeteriorationoftheLCP.Themoistureneedtoberemovedbydryingbeforemolding.
recommendableconditionofdrying:
130degreeC,3hrandmore
Itisoftenfoundthatthehopperdryerisnothotenoughinspiteoftheindicatorofthedryershowinghightemperature(forexample130degreeC).Thereis2pointsforthecauseofthistrouble;
a)Thehotairisnotabletocirculatebecausethefilterofthedryerisstuffed.
-Inthiscase,whenyoumeasurethepellettemperature,itindicateslowtemperature(forexample40degreeC).
b)Thepelletsretainintheairservicelinebetweenhopperdryerandhopperoftheinjectionmachine,andthosepelletsmixwithnewerpellets.
-Ifthepelletsoncedriedbyheatarecooled,thenthemoistureintheaircondensesonthesurfaceofpelletagain.Therefore,thosecooledpelletsmustberemovedbeforemolding.
Fig.3-3Schematicviewofhopperdryerandservicelineofpellet
3-5-2.Draggingtheairintothemelt
Insomecases,draggedairintothemeltcausestheblister(theoxidationofpolymerwilloccurandcolorchangeorblackspotswillbeoftenobservedinthiscase:pleaserefersection4also).Thereasonsoftheairdraggedintothemeltareasfollows;
a)Toolowbackpressure
LCPneednothighbackpressure,however,toolowbackpressurecausesinsufficientremovaloftheairdraggedfromhopper.
b)Toohighdecompressiondegreeofscrewonmeteringprocess
Theairisdraggedintothemeltfromnozzletouchportion.
c)Toohighscrewrotationonmeteringprocess(over200rpm)
Thiscausesinsufficientremovaloftheairdraggedfromhoppersimilarlywitha).
Fig.3-4Schematicviewofcylinder
3-5-3.Unbalancebetweencylindersizeandmoldingvolume
Usingtoolargeinjectionmachineagainstmoldingvolume,measuringlengthbecomestooshort.Thentheretentiontimeincylinderbecomestoolong.Inaddition,excessiveshearingpowermaybeaddedtotheresinatthescrewprovidingzoneorthecompressingzonebecauseofhighenoughpowerofsuchlargeinjectionmachine.Insuchsituations,thedeteriorationofresineasilyoccur.
1)Testmethod
Using2injectionmachineshavingdifferentscrewdiametersdescribedTable3-3,thetestpiecesweremolded,andmeasuredthesolderingresistance.
Table3-3Resultofthesolderingtestusing2injectionmachineshavingdifferentscrewdiameter
2)Result
Fig.3-5showstherelationshipbetweenthemeteringfor1shotandthemax.meteringrange.Ifthemeteringfor1shotistooshortcomparedwithmax.meteringrange,theretentiontimeofpolymerinsidethecylinderbecometoolong,anditcausesthedeteriorationofpolymer.
Fig.3-5Therelationshipbetweenthemeteringfor1shotandthemax.meteringrange
SincealmostmoldingsmoldedbyLCPissmall,thesizeofsuitablemoldingmachineisasfollows;
strengthoftighteningmold:50-70Tons
insidediameterofcylinder:24-27mmφ
Forsmallerproducts:
strengthoftighteningmold:15Tons
insidediameterofcylinder:17mmφ
3-6.Conclusion
3-6-1.Moldingconditionsrelated
a.Dryresinforover3hrsat130degreeCandmore
b.Purgetheformerresincompletely(pleasereferthefollowingpageanddisplaythisnoticebesideeachinjectionmachine.)
-Sincepreviousresinmighthavebeenretainedinthemoldingmachineandturnedintogel,whichishardtoberemovedbypurging,cleaningofcylinder,nozzle,andscrewisavailable.
c.Placetheactualresintemperatureunder380degreeC
-Itisnecessarytomeasuretheactualresintemperaturebeforesettingthemoldingtemperature.
3-6-2.Equipmentsrelated
a.Checktheactualtemperatureofpelletsinhopperdryerandovenbythermometer.
b.Checktemperaturecontrollers,thermocouples(thermo-probeforcontroller),andheaters.
-Insomecases,controllersorthermocouplesareuncontrolablebytheirdamages.
PurgingMethodofSUMIKASUPERLCP
<Recommendablepurgingmaterials>
1)
PurgingReagentProduct ZCleanS11 (ChissoCorp.:JAPAN)
AmteCleanEx (MatsushitaAmtech:JAPAN)
2)
HDPE(HighDensityPolyEthylene)
3)
Regroundmaterialofthesamegrade(ex.SUMIKASUPERE6807L)
notice:Anyofabovematerialscanbeusedforpurgingmaterial,however,pleasedonotuseanyothermaterialsforthispurpose.
<Purgingprocess>
Procedure
Temperaturesetting
1)Endofmolding
Runoutofallprecedingpelletinthehopperandcylinder
sameasmolding
(Ex.360-365-330-290deg.C)
2)Feedingof
purgingmaterial
Startthepurgingwiththepurgingmaterial(ca.200g)
sameasabove
3)Decreasingsetting
temperature
Changethesettingtemp.at-20to-30deg.Cofmoldingtemp.duringpurging
(Ex.330-335-300-270deg.C)
notice:Donotstoppurging
4)Continuingthe
purging
Runoutofallpurgingmaterial
sameasabove
5)Increasingsetting
temperature
After4),stopthepurging,andchangethesettingtemp.atmoldingtemp.again
sameasmolding
(Ex.360-365-330-290deg.C)
6)Resumingofmolding
Assoonasarrivingatmoldingtemp.,feedthepellet,purgeatleast5shots,andresumethemolding
sameasabove
notice:
-Thispurgingmethodshouldbeexecuteonceaweekpreferably,oratleastonceatwoweeks.
-Pleasestoptheinjectionmachineaftertheabovestep4)iscompleted.
Startingprocedure:1)Setthetemp.assameas3).
2)Assoonasreachingthemoldingtemp.,thenfeedthepurgingmaterialinthehopper.
3)Followthesamestepfrom3).
4
Reductionofthebubbleaftermolding
4-1.Introduction
"Theblister"onthesurfaceofthemoldingsisrarelyobserved"aftermolding"formoldeditemsusingtheLCP.Andsuchmoldingsscarecelycauseany"theblisteraftersoldering".Sinceitoftenseemslike"theblisteraftersoldering",itisconfusedthat"theblisteraftermolding"iscausedbythesamereasonas"theblisteraftersoldering".
Toclarifythedifferencebetweenbothofthem,"theblisteraftermolding"isdefinedas"thebubble"and"theblisteraftersoldering"issimplydefinedas"theblister"inthisnote.
Inthissection,wewillbeginbycomprering"thebubble"and"theblister".
4-2.Comparisonbetween"thebubble"and"theblister"
Table4-1showsthecomparisonbetween"thebubble"and"theblister".Fromthistable,itisclearthattheseareeasilyseparatedbycarefullobservationof"theblisteringtrouble".Thesecircumstantialevidencessuggestthatthecauseof"thebubble"ismainlythedraggingtheairduringmolding.
Table4-1Comparisonbetween"thebubble"and"theblister"*
Item
thebubble
theblister
aftermolding
yes
rare
aftersoldering
rare
yes
arisingspot
fixed
random
thedecompositionofmaterial(withoutregardtocauses)
rare
yes
thedependenceofmoldingcondition
temperature
no
yes
speed
yes
alittle
pressure
alittle
no
thedependenceoftoolingdesign
cavitydesign
yes
rare
airvent
yes
alittle
*:theorderoffrequencyisyes>alittle>rare>no
4-3.Reductionofthebubble
Itisnecessarytoconsiderthefittingboththesuitablemoldingconditionandthesuitabletoolingdesignforreducingthedraggingtheairinthecavity.
(1)Suitableinjectioncondition
Asdescribedat3-5-2,draggingtheairintothemeltwillcauseboththebubbleandtheblister.Inadditiontothedescriptionat3-5-2,thefollowingprocedureismoreeffectivetoreducethebubble.
Toremovetheairinthesprueandtherunnersmoothly,theinjectionspeedshouldbesetatlower(ca.20~50mm/sec)duringthepolymerpassingthroughthegate,andafterthattheinjectionspeedshouldbechangedtomorehigherifnecessary(seeFig.4-1).Asdescribedatsection2,thecurrentproductshavingthinnerwallthickness(<0.2mm)needhigherinjectionspeed.However,itisoftendifficulttoremovewholeairinnot
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