CQI17 Soldering System Assessment 焊接系統(tǒng)評估

SpecialProcess:SolderingSystemAssessment,,,

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FacilityName:,,,

Address,,,

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PhoneNumber,,Type(s)ofSolderingatthisFacility:,

FaxNumber,,ProcessTableA-PASTEPRINT印刷闕如榕,ProcessTableK-SELECTIVESOLDER選擇焊接

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NumberofSolderingEmployeesatthisFacility:,,ProcessTableB-INSPECTION檢查許雪敏,ProcessTableL-AUTOIRONSOLDERING自動焊接

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CaptiveSolderingOrganization(Y/N),,ProcessTableC-SURFACEMOUNT表面貼裝王榮都,ProcessTableM-NANUALIRONSOLDERING手工焊接闕如榕

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CommercialSolderingOrganization(Y/N),,ProcessTableD-REFLOW回流王榮都,ProcessTableN-LASER&SOFTBEAM激光焊接

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DateofAssessment:,,ProcessTableE-GLUEDISPENSE點膠,ProcessTableO-INDUCTION整合歸納

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DateofPreviousAssessment:,,ProcessTableF-FLUX助焊劑劉志明,ProcessTableP-COAT&TEST涂覆李秀玉

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,,ProcessTableG-PRE-HEAT預(yù)熱劉志明,ProcessTableQ-PCBSEPERATIONP板分割李秀玉

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,,ProcessTableH-WAVE波峰焊接劉志明,ProcessTableR-INCIRCUITTESTINGICT李秀玉

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,,ProcessTableI-FOUNTAIN選擇焊接,ProcessTableS-RE-WORK重工闕如榕

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,,ProcessTableJ-DIPSOLDERING浸焊,

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CurrentQualityCertification(s),,,

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DateofRe-assessment(ifnecessary):,,,

PersonnelContacted:,,,

Name,Title,Phone,Email

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Auditors/Assessors,,,

Name,Company,Phone,Email

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"Numberof""NotSatisfactory""Findings",,,

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"Numberof""NeedsImmediateAction""Findings",,,

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"Numberof""Fail""Findings