印刷電路板流程介紹

2023\10\25陳志剛修訂印刷電路板流程介紹(Pattern)教育訓(xùn)練教材流程圖PCBMfg.FLOWCHARTUPDATED:2023/06顧客(CUSTOMER)工程製前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)內(nèi)層乾膜(INNERLAYERIMAGE)預(yù)疊板及疊板(LAY-UP)通孔電鍍(P.T.H.)液態(tài)防焊(LIQUIDS/M)外觀檢查(VISUALINSPECTION)成型(FINALSHAPING)業(yè)務(wù)(SALESDEPARTMENT)生產(chǎn)管理(P&MCONTROL)蝕銅(I/LETCHING)鑽孔(PTHDRILLING)壓合(LAMINATION)外層乾膜(OUTERLAYERIMAGE)二次銅及錫鉛電鍍(PATTERNPLATING)蝕銅(O/LETCHING)檢查(INSPECTION)

噴錫(HOTAIRLEVELING)電測(cè)(ELECTRICALTEST)出貨前檢查(OQC)包裝出貨(PACKING&SHIPPING)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)顯影(DEVELOPIG)

蝕銅(ETCHING)去膜(STRIPPING)黑化處理(BLACKOXIDE)

烘烤(BAKING)預(yù)疊板及疊板(LAY-UP)壓合(LAMINATION)後處理(POSTTREATMENT)

曝光(EXPOSURE)

壓膜(LAMINATION)二次銅電鍍(PATTERNPLATING)錫鉛電鍍(T/LPLATING)去膜(STRIPPING)蝕銅(ETCHING)剝錫鉛(T/LSTRIPPING)

塗佈印刷(S/MCOATING)預(yù)乾燥(PRE-CURE)

曝光(EXPOSURE)顯影(DEVELOPING)後烘烤(POSTCURE)多層板內(nèi)層流程(INNERLAYERPRODUCT)MLB全板電鍍(PANELPLATING)銅面防氧化處理(OSP(EntekCu106A)外層製作(OUTER-LAYER)TENTINGPROCESS鍍金手指(G/FPLATING)鍍化學(xué)鎳金(E-lessNi/Au)ForO.S.P.選擇性鍍鎳鍍金(SELECTIVEGOLD)印文字(SCREENLEGEND)

網(wǎng)版製作(STENCIL)

圖面(DRAWING)工作底片(WORKINGA/W)製作規(guī)範(fàn)(RUNCARD)程式帶(PROGRAM)鑽孔,成型機(jī)(D.N.C.)

底片(MASTERA/W)磁片,磁帶(DISK,M/T)藍(lán)圖(DRAWING)資料傳送(MODEM,FTP)

AOI檢查(AOIINSPECTION)除膠渣(DESMER)

通孔電鍍(E-LESSCU)DOUBLE

SIDE前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)全方面鍍鎳金(S/GPLATING)雷射鑽孔(LASER

ABLATION)BlindedViaP2(1)前製程治工具製作流程顧客CUSTOMER裁板LAMINATESHEAR業(yè)務(wù)SALESDEP.生產(chǎn)管理P&MCONTROLMASTERA/W底片

DISK,M/T磁片磁帶藍(lán)圖DRAWING資料傳送MODEM,FTP網(wǎng)版製作STENCIL

DRAWING圖面RUNCARD製作規(guī)範(fàn)PROGRAM程式鑽孔,成型機(jī)D.N.C.工程製前PRE-PRODUCTIONDEP.工作底片WORKINGA/WP3(2)多層板內(nèi)層製作流程曝光EXPOSURE

濕膜ROLLERCOATER前處理PRELIMINARYTREATMENT去膜STRIPPING

蝕銅ETCHING顯影DEVELOPING黑化（棕化）處理

BLACKOXIDE烘烤BAKINGLAY-UP預(yù)疊板及疊板後處理

POSTTREATMENT壓合LAMINATION內(nèi)層濕膜INNERLAYERIMAGE預(yù)疊板及疊板LAY-UP蝕銅I/LETCHING鑽孔DRILLING壓合LAMINATION多層板內(nèi)層流程

INNERLAYERPRODUCTMLBAOI檢查AOIINSPECTION裁板LAMINATESHEARDOUBLE

SIDE雷射鑽孔LASERABLATIONBlindedViaP4(3)外層製作流程通孔電鍍P.T.H.鑽孔DRILLING外層乾膜OUTERLAYERIMAGE二次銅及錫鉛電鍍PATTERNPLATING檢查

INSPECTION

前處理

PRELIMINARYTREATMENT二次銅電鍍PATTERNPLATING蝕銅

ETCHING全板電鍍PANELPLATING外層製作OUTER-LAYERO/LETCHING蝕銅TENTINGPROCESSDESMER除膠渣E-LESSCU通孔電鍍

前處理PRELIMINARYTREATMENT剝錫鉛

T/LSTRIPPING去膜STRIPPING

壓膜LAMINATION錫鉛電鍍T/LPLATING曝光EXPOSUREP5液態(tài)防焊LIQUIDS/M

外觀檢查VISUALINSPECTION

成型FINALSHAPING檢查

INSPECTION

電測(cè)ELECTRICALTEST出貨前檢查OQC包裝出貨PACKING&SHIPPING塗佈印刷

S/MCOATING前處理PRELIMINARY

TREATMENT曝光EXPOSUREDEVELOPING顯影POSTCURE後烘烤預(yù)乾燥PRE-CURE噴錫HOTAIRLEVELING銅面防氧化處理OSP/EntekHOTAIRLEVELING

G/FPLATING鍍金手指鍍化學(xué)鎳金E-lessNi/AuForO.S.P.印文字SCREENLEGEND選擇性鍍鎳鍍金SELECTIVEGOLD化學(xué)銀ImmersionSilver(4)外觀及成型製作流程P6經(jīng)典多層板製作流程-MLB1.內(nèi)層THINCORE2.內(nèi)層線路製作(濕膜)P7經(jīng)典多層板製作流程-MLB4.內(nèi)層線路製作(顯影)3.內(nèi)層線路製作(曝光)P8經(jīng)典多層板製作流程-MLB5.內(nèi)層線路製作(蝕刻)6.內(nèi)層線路製作(去膜)P9經(jīng)典多層板製作流程-MLB7.疊板8.壓合LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6P10經(jīng)典多層板製作流程-MLB11.外層線路壓膜12.外層線路曝光P11經(jīng)典多層板製作流程-MLB13.外層線路製作(顯影)14.鍍二次銅及錫鉛P12經(jīng)典多層板製作流程-MLB15.去乾膜16.蝕銅(鹼性蝕刻液)P13經(jīng)典多層板製作流程-MLB17.剝錫鉛18.防焊(綠漆)製作P14經(jīng)典多層板製作流程-MLB15.浸金(噴錫……)製作P15乾膜/濕膜製作流程基板壓膜/涂布?jí)耗?涂布後曝光顯影蝕銅去膜P16經(jīng)典之多層板疊板及壓合結(jié)構(gòu)...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋁板疊合用之鋁板80-100層疊合壓合機(jī)之蓋板壓合機(jī)之蓋板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋁板疊合用之鋁板P171.下料裁板(PanelSize)

COPPERFOILEpoxyGlassPhotoResist2.內(nèi)層板壓乾膜/涂濕膜(光阻劑)

P183.曝光

4.曝光後

Artwork(底片)Artwork(底片)PhotoResist光源P195.內(nèi)層板顯影

PhotoResist6.酸性蝕刻(Power/Ground或Signal)

PhotoResistP208.黑化/棕化(OxideCoating)

7.去乾膜(StripResist)

P219.疊板

Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)P2210.壓合(Lamination)

11.鑽孔(P.T.H.或盲孔Via)

(Drill&Deburr)

墊木板鋁板P2312.鍍通孔及一次電鍍

13.外層壓膜(乾膜Tenting)PhotoResistP2414.外層曝光(patternplating)

15.曝光後(patternplating)

P2516.外層顯影17.線路鍍銅及錫鉛P2618.去膜19.蝕銅(鹼性蝕刻)P2720.剝錫鉛21.噴塗(液狀綠漆)

P2822.防焊曝光23.綠漆顯影光源S/MA/WP2924.印文字25.噴錫(浸金……)R105GulTech94V-0R105GulTech94V-0P30雙面板構(gòu)造雙面板(2層板)