ecs0ecs h110aio intel1g獨(dú)顯主板技術(shù)規(guī)格書

送：■臺(tái)式產(chǎn)品中 ■行業(yè)臺(tái)式產(chǎn)品中 ■客戶服務(wù)中 ■供應(yīng)品質(zhì)管理 擬制：認(rèn)證工程師： 文件序號(hào) 日期產(chǎn)品種類：主料品代號(hào) 型號(hào)及版本：ECSH110-AIO H1101G（920M）獨(dú)顯AIO主評(píng)測(cè)工程師：供應(yīng)廠商：制造廠商/生產(chǎn)廠商：2、貴司產(chǎn)品變更，必須向提出申請(qǐng)，待批準(zhǔn)后方可交付：新產(chǎn)品引主板使用后I/O□廠商自帶擋片，型 備注：如果使用廠商自帶擋片，則需同時(shí)在下面的“附件”編號(hào)1I/O片無2主板BIOSBIOS（BIOS應(yīng)有影響EMI的選項(xiàng)）智能驅(qū)動(dòng)光盤對(duì)應(yīng)驅(qū)動(dòng)光盤路徑（按操作系統(tǒng)分類1、EMI&WHQL結(jié)果輻射騷擾BB六類非平衡五類非平衡1.2部件適用的同方整機(jī)機(jī)型、部件的信CCC整機(jī)產(chǎn)品同方CCC報(bào)告號(hào)同方計(jì)算機(jī)30M-1GEMI1IN網(wǎng)口個(gè)數(shù)：11G-6GEMI號(hào)□百兆傳告2（PCB材*GY(SHEN3*4*1G5*orCorp.3、有害物鉛鎘六價(jià) 多溴二苯主板▲○○○○○：表示該有害物質(zhì)在部件所有均質(zhì)材料中的含量均在GB/T26572-2011規(guī)定的▲：表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出GB/T26572-×：表示該有害物質(zhì)至少在部件的某一均質(zhì)材料中的含量超出GB/T26572-規(guī)定的限量要求，且也不符合歐盟RoHS指令（包括其豁免條款注1：新廠家引入要求提供環(huán)保并加蓋公章注2：新部件引入要填寫“有害物質(zhì)或元素的名稱及含量標(biāo)識(shí)”表，并提供相注3：部件變更（有料件變更時(shí)）要求填寫“有害物質(zhì)或元素的名稱及含量標(biāo)44臺(tái)式主板節(jié)能和能效指（主板可裝配CPU類別可為多2能報(bào)告中每類的最高配

主板新品引入按照B配置：新主板+雙核最高主頻CPU+920M+4G內(nèi)存 LINUX三種操作系統(tǒng)主板型號(hào) ；制造商 BWIN7在空閑狀態(tài)下：一級(jí)≤31.0W;二級(jí)≤45.0W; 主板可裝配CPU雙 型號(hào) 主頻：-_3.5_GHz制造商B類 WIN10在空閑狀態(tài)下：一級(jí)≤31.0W;二級(jí)≤45.0W; 主板可裝配B類 LINUX操作系統(tǒng)在空閑狀態(tài)下：一級(jí)≤31.0W;二級(jí) 三級(jí)主頻 GHz制造商 主板可裝配雙 型號(hào)□雙核GHz制造商：B評(píng)測(cè)結(jié)果:■臺(tái)式及一體機(jī)顯卡節(jié)能和能效輔助 DR=2002 16獨(dú)立顯示單元（GPU）附加功能功耗因子：46kWh( 6方+企業(yè)自己共同出具（第必須是CNAS；企業(yè)自己出具報(bào)定型檢驗(yàn)報(bào)告模板參考TFPC/DD-N-08《方電腦產(chǎn)品定型檢驗(yàn)和周期檢驗(yàn)規(guī)范》第1.5版本附錄《產(chǎn)品定型周期檢驗(yàn)報(bào)告》的模板。6.1（GB/T9813-1P23電源（除電源適配器456P789幅射騷擾應(yīng)符合GB9254-2008且檢測(cè)值低于B級(jí)標(biāo)準(zhǔn)線4有I/O卡、鍵盤、鼠標(biāo)、顯示器、LCD電路、含LCDP符合GB9254-2008且低于B5dB(μV騷擾應(yīng)符合GB9254-2008低于B級(jí)標(biāo)準(zhǔn)線4dB(μV)。P諧波電流應(yīng)符合GB抗擾度應(yīng)符合GB/T機(jī)箱、I/O擾分浪涌（沖擊(運(yùn)行burnintest版本PPPPP落P應(yīng)符合GB/T26572-2011GB/T26125-2011、P應(yīng)符合GB28380-2012。所配0.2946m(11.6P應(yīng)符合GB28380-2012。所配GB20943-2007HJ/T313-2006P1：2：部件的定型檢驗(yàn)報(bào)告參考選取整機(jī)定型檢驗(yàn)報(bào)告模板的相關(guān)部分出具。注3：判定格式：通過—P；不通過—F；不適用—N。4：5：所有部件：除CPU，軟件、虛擬物料及輔料以外的其它所有部件均需定型檢6：本技術(shù)規(guī)格書僅適用實(shí)物物料，CPU一 技術(shù)規(guī)ProcessorINSKYLAKE-HSocketLGAChipsetINPCBPCBPCBPCBModelPCBVRDVRMIC.ISL95858HRZ-QFNAXGDFN3Main Dual2133TotalMAX2ECCYICName&ICSUPERBX..LQFPICName&ICCG..QFNYICName&2.1(5.1viaAMPVGAICF/W066(R)..QFN32POnboardOnboardUSBICName&BIOSICSPIROM.64M.W25Q64FVSSIG.WINBONDICSPIROM.64M.MX25L6433FM2I-08G.ICSPITotalUSB2PCSConnectorTotalUSB4PCSConnector2OnboardPCI-EPCI-EPCI-EMiniPCIEMiniPCIEM.2M.2Rear AudioFrontMonoFront2PCS(TouchFrontWIFI/BT/LANCaseThermalHI-TOP/MOSTRAIDWakePowerYACPIRTCYNOnboardYNPS/2YMotherboardMainComponentChipsetList（total SOCSYSCHIP ICPCH.SKYLAKE-HH110D1..FCBGAIN1151Processors:INSKYLAKE-HProcessorsMemorytype:DDR4Supportmax□√A:B:C:（4）支持CPU最大功率（6）SupportUSB:Support6USB2.0/3.0(USB2.0Conn*2pcs;AUDIO(U34，AMP1)□√A:B:C:LANOnBoard □√A:B:C:SUPERI/O □√A:B:C: ICGPU.N16V-GMR1-S-A2.(BUY- □√A:B:C:BIOS □√A:□√B:√C: □√A:B:C:DISY SU1□√A:B:C: □√A:□√B:□√C:CLOCKCHIP A:B:C: □√A:□√□√C: □√A:□√B: X2□√A:□√B: X3□√A:□√B: □√A:□√B:ImportantelectroniccomponentLIST（total：20_CPU_H/(QC3,QC4,QC5)MOSFETDUALN-CH.SM7340EHKPC-TRG..OHM.DFN5X68P...LEAD-.SINOPOWERMOSFETDUAL□√A:□√B:□√C:OHM.DFN5X68P.....LEAD-MOSFETDUALN-Vgs=20V.Id=18A/38A.Rds(on)=3.5mOHM.PG-TISON8-4.....LEAD- NAA:B:C: NA)A:B:C: QC1,QC2MOSFETDUALN-CH.SM7340EHKPC-TRG..OHM.DFN5X68P...LEAD-□√A:□√B:□√C:MOSFETDUALOHM.DFN5X68P.....LEAD-MOSFETDUALN-Vgs=20V.Id=18A/38A.Rds(on)=3.5mOHM.PG-TISON8-4.....LEAD- QC6MOSFETDUALN-CH.SM7340EHKPC-OHM.DFN5X68P...LEAD-.SINOPOWER□√A:□√B:□√C:MOSFETDUALOHM.DFN5X68P.....LEAD-MOSFETDUALN-Vgs=20V.Id=18A/38A.Rds(on)=3.5mOHM.PG-TISON8-4.....LEAD-MOSFET_SB1(,QD5H2Vgs=20V.Id=50A.Rds(on)=7mOHM.KPAK.....LEAD-MOSFETN-CH.PK516BA..Vds=30V,Vgs=20V.Id=51A.Rds(on)=7mOHM.POWERDFN5X68P.....LEAD-.NIKO-MOSFETN-CH.QM3106M6..Vds=30V,Vgs=20V.Id=56A.Rds(on)=8.2mOHM.PRPAK5X68P.....LEAD-□√A:□√B:NIKO-□√C:MOSFET_SB2QD5L2)MOSFETN-CH.SM4364NAKPC-TRG..Vds=30V,Vgs=20V.Id=60A.Rds(on)=5.7mOHM.KPAK.....LEAD-.SINOPOWERMOSFETN-CH.PK618BA..Vds=30V,Vgs=20V.Id=59A.Rds(on)=5.5mOHM.POWERDFN5X68P.....LEAD-.NIKO-SEMMOSFETN-CH.QM3110M6..Vds=30V,Vgs=20V.Id=81A.Rds(on)=4.9mOHM.PRPAK5X68P.....LEAD-□√A:□√B:NIKO-□√C:(EC12,EC18)E/COperatingTemperatureRange:-55℃toESR:30mΩ(at□√A:□√B:□√C:□√D(EC10,EC11,EC14,EC15)E/COperatingTemperatureRange:-55℃toESR:8.0mΩ(at□√A:□√B:□√C: NA)A:B:C:ECAP_MEM_2 N/A)A:B:C:ECAP_M.2 OperatingTemperatureRange:--55℃toESR:2.38Ω(at120Hz);0.28Ω(at□√A:□√B:□√C: N/AA:B:C:(EC34,EC35OperatingTemperatureRange:--40℃□√A:□√B:□√C:ESR:0.310Ω(at NAA:B:C: POWER□√A:□√B:□√C:MAG POWER□√A:□√B:□√C:MAGJUMPERSANDCONNECTORSLIST(total:31CPUSOCKET □√A:□√B:□√C:(ERSOCKET.MEMORYCARD3IN1..19P□√A:√B:C:2DDR4SODIMMSO-DIMM2:SOCKET.S.ODIMMDDR4..260PSMD.P0.5mmH9.2mm.15u.BLACKSMD.P0.5mmH5.2mm.15u.□√A:□√B:□√C:(NGFF1,M1NGFF1:SLOT.NGFFM.2..67P2R90DSMD.H3.2.BLACK□√A:□√B:□√C:PCIE_1X N/AA:B:C: N/AA:B:C:()□√A:□√B:HI-□√C: CONN.D-TYPEMTIN..9P2R□√A:□√B:HI-□√C:CONN.D-TYPEFM□√A: □√B:□√C:HI-LPTConnector A:B:C:(IN1,HDMIOUT1)CONN...19P90D□√A:CO-□√B:□√C:HI- CONN.LVDS..40P1R90D□√A:□√B:C: MARK:CONSER/□√A:□√B:HI-□√C: USB3_0)USB3_1,USB3_2:CONN.USB3.0..9PUSB3_0:CONN.USB(3.0)DUALPORT..18P90D□√A:□√B:□√C:HI- MARK:JACK□√A:□√B:□√C:()MARK:RUIYE/JACK□√A:□√B: N/A)A:B:C:(CPU_FAN1HEADER.BH..4*190D□√A:JOINT□√B:□√C: A:B:C: □√A:□√B:□√C: A:B:C: N/AA:B:C:KB_MSHeader N/A)A:B:C: A:B:C:Front F_PANELEADER.BH..15*190D□√A:□√B:JOINTC:TouchHeader HEADER.BH..5*190D□√A:□√B:JOINTC: WEB_MICDMIC1:HEADER.BH..5*190DSMDWEB_MIC:HEADER.BH..9*190DSMD□√A:□√B:JOINTC:(CLR_CMOSHEADER...3*1□√A:□√B:□√C: N/AA:B:C:(SPEAKER1HEADER.BH..4*190