芯源配置和報價specification of ks-c3004d for pr tsmc spin3hp2cp

AutomaticDeveloSystemConfiguration&Specification

forPRDevelo

ForTSMC

Ver. -C300-4D

SystemModel:KS-C300-4DProcessWafer:300mm

ProposedbyKINGSEMICo.,

SystemConfiguration&Specification:

KS-C300-4DAutomaticDeveloSystemConfiguration&Specification

1. ProcessWafer:

Substrate: ?300mm,wafer

Material: Silicon,Glass

2．Load-port 4Units(HirataEFEMprovidedbyTSMC)

Type: Load-port,byFouporCassette

Sensor: ReflexTransducer

WaferSensor: TheOppositeTypePhotoelectricTransducerWaferDelivery: WafertoWafer

WithRFIDFunction

3.WaferTransfer

WaferDelivery: AutomaticDeliverybyRobotRobot(A): ProcessStationRobot(PSR)1Set

RobotType: TwoArms,VacuumSuctiontoWaferRobotAxle: 4Axles(R1,R2,Z,T)

WaferSensor: DigitalVacuumTransducerTransducer： ReflexTransducer

Fingermaterial: CeramicFingerSuckerMaterial:Fluororubber

Robot(B): CassetteStationRobot(CSR)1Set

(IncludedinEfem,needESDfunction)

DeveloChamber 4Chambers(Followingdescriptionfor1Chamber)

CentrifugeSpeed

Max.Speed: 5000rpmAccelerationRange: 20,000rpm/sMin.Adjust: 1rpm

SpeedAccuracy: ±1rpm

CHUCK

ContactwithWafer: SmallAreaContact(ApronType)ChuckingMethod： VacuumSuction

ChuckVacuumSensor: DigitalVacuumPressureTransducer

Material: PPS

CUP

ty: 1setsperchamber

Material: PP.Gas-LiquidSeparatedEmission

DispenseNozzle,Arm1:

ArmMovementDirection: HorizontalreciprocatingmovementArmControl: ElectricMotorProgramControl

Nozzlety: 1puddlenozzleforPRDeveloper,1/4inch

1HnozzlelikeforPRDeveloper

RinseNozzle,Arm2:

ArmMovementDirection: HorizontalreciprocatingmovementArmControl: ElectricMotorProgramControlDIWNozzlety: 1nozzleforDIW

SupplyPipeSize: 1/4inch

BSR: 2Sets

WaferBacksideN2Protection:1Set,AnnularNozzle

WithAutomaticDamper

5. HP 3Sets(Followingdescriptionfor1Set)

ControlMethod: AirCylinderControl

GradualRange: 0~25mm

TemperatureRange: 50~180°CBottomTemperatureUniformity:

50~120°C ±0.75°

120.1~180°C ±1.0°C

HotteSurfaceMaterial: AluminumhardanodizingContactGap: 0.1mm

ContactGapMaterial： Vespel

PillarCapMaterial: SUS304+Vespel

PillarCapShape: Hemisphere

Withexhaustfunction withindependentdigitalflowgaugeWithShutter

CPE(Chillte&EdgeCentering) 2Sets(Followingdescriptionfor1Set)

Chillte

ControlMethod: AirCylinderControl

GradualRange: 0~15mm

TemperatureRange: 18~28°C

Min.TemperatureAdjust: 0.1°CTemperatureUniformity: 18~28°C±0.2°C

TemperatureControlMethod: ProportionalIntegralAlgorithm

2-SectionAlarm: Temperature2-SectionMonitoringColdteSurfaceMaterial: Aluminumhardanodizing

ContactGap: 0.1mm

ContactGapMaterial： Vespel

PillarCapMaterial: SUS304+Vespel

PillarCapShape: Hemisphere

6.2EdgeCentering

ControlMethod: AirCylinderControl

ContactMaterial: PPS

AlignAccuracy: ≤±0.2mm

7. SystemControl:

Controller: IndustrialComputer

OperationScreen: 17”TouchScreen

OperationSystem: Windows

Interface: GraphicalInterfaceCommunicationMode：EthernetNetworkSignalBeacon: 3Colors

Monitorscreen: 17”Screen

ChemicalSupplySysteminMainTool

DeveloperSupplyThermalControl:2sets

ThermalTemperatureRange:20~28°CThermalTemperatureAccuracy:±0.5°CSupplyMethod: Facility

ty: 4setsintotal

2Sets(withautoswitchfunction)for1&2chambers2sets(withautoswitchfunction)for3&4chambers

VelocityControl: Digitalflowcontrollerfordeveloper(TokyoKeisobrand)

FlowRate: 150ml/Min~1,500ml/Min

RemnantsMonitoring: PhotoelectricTypeLiquidLevelSensor

DIWSupply

SupplyMethod: Facilitysupplydirectly,withoutN2

VelocityControl: DigitalflowcontrollerforDIW

FlowRate: 150ml/Min~1,500ml/Min

FloattypeflowmeterforBSRandN2blowdry.

FacilitySystem

CDA:

Pressure: ≥0.5Mpa

FlowRate: ≥120L/min

Connection: 3/8”ButtJointsty: 3Set

VAC

Pressure: ≤-75KPa

FlowRate: ≥30L/min

Connection: 3/8”ButtJointsty: 7Sets

PN2(forprocessuse)

Pressure: ≥0.4Mpa

FlowRate: ≥120L/min

Connection: 3/8”ButtJointsty: 3Set

P.C.WforCPE 1Set

P.C.Win: 0.15—0.3MPa

P.C.Wout: 0MPa

Flowrate： 20L/min

Connection: 3/8”ButtJoints

9.5P.C.WforThermalcontroller: 2Sets

P.C.Win: 0.15—0.3MPa

P.C.Wout: 0MPa

Flowrate： 20L/minConnection: 3/8”ButtJoints

D.I.W 3Set

Conductivity: 1～10μS／cm

Pressure: 0.1～0.4MPa

Connection: 3/8”ButtJoints

Exhaust

Exhaust: 7Sets,2.8m3/min

Pressure: -350Pa～-450Pa

Connection: ?100mmPipe

Drain:

2300mm

ResidueDrain: DirectlyDrain

Connection:： 1inchPipe

ConnectionPosition: BacksideandBelow

Main-toolElectricPower： 208Volt,3-Phase,4-wire

SystemDimensionandWeight

Dimension: 2300mm(W)x3100mm(D)x2850mm(H)

Weight: 5500Kg

SystemFootprint&Layout

3100mm

2-3SDC3

2-1SDC1

1-1

LP1

2-4SDC4

2-2SDC2