LED照明行業(yè)常用詞匯英文翻譯

1、LED照明常用詞匯中英文對(duì)照（一）backplane背板Bandgapvoltagereference帶隙電壓參考benchtopsupply工作臺(tái)電源BlockDiagram方塊圖5BodePlot波特圖Bootstrap自舉BottomFETBottomFETbucketcapcitor桶形電容chassis機(jī)架Combi-senseCombi-senseconstantcurrentsource恒流源CoreSataration鐵芯飽和crossoverfrequency交叉頻率currentripple紋波電流CyclebyCycle逐周期cycleskipping周期跳步DeadTi

2、me死區(qū)時(shí)間DIETemperature核心溫度Disable非使能，無(wú)效，禁用，關(guān)斷dominantpole主極點(diǎn)Enable使能，有效，啟用ESDRatingESD額定值EvaluationBoard評(píng)估板Exceedingthespecificationsbelowmayresultinpermanentdamagetothedevice,ordevicemalfunction.OperationoutsideoftheparametersspecifiedintheElectricalCharacteristicssectionisnotimplied.超過(guò)下面的規(guī)格使用可能引起永久的

3、設(shè)備損害或設(shè)備故障。建議不要工作在電特性表規(guī)定的參數(shù)范圍以外。Faillingedge下降沿figureofmerit品質(zhì)因數(shù)floatchargevoltage浮充電壓flybackpowerstage反馳式功率級(jí)forwardvoltagedrop前向壓降free-running自由運(yùn)行Freewheeldiode續(xù)流二極管Fullload滿(mǎn)負(fù)載33gatedrive柵極驅(qū)動(dòng)gatedrivestage柵極驅(qū)動(dòng)級(jí)gerberplotGerber圖groundplane接地層Henry電感單位：亨利HumanBodyModel人體模式Hysteresis滯回inrushcurrent涌入電流

4、Inverting反相jittery抖動(dòng)Junction結(jié)點(diǎn)Kelvinconnection開(kāi)爾文連接LeadFrame引腳框架LeadFree無(wú)鉛level-shift電平移動(dòng)Lineregulation電源調(diào)整率loadregulation負(fù)載調(diào)整率LotNumber批號(hào)LowDropout低壓差Miller密勒53node節(jié)點(diǎn)Non-Inverting非反相novel新穎的offstate關(guān)斷狀態(tài)Operatingsupplyvoltage電源工作電壓outdrivestage輸出驅(qū)動(dòng)級(jí)OutofPhase異相PartNumber產(chǎn)品型號(hào)passtransistorpasstransis

5、torP-channelMOSFETP溝道MOSFETPhasemargin相位裕度PhaseNode開(kāi)關(guān)節(jié)點(diǎn)portableelectronics便攜式電子設(shè)備powerdown掉電PowerGood電源正常PowerGroud功率地PowerSaveMode節(jié)電模式Powerup上電pulldown下拉pullup上拉PulsebyPulse逐脈沖(PulsebyPulse)pushpullconverter推挽轉(zhuǎn)換器rampdown斜降rampup斜升redundantdiode冗余二極管resistivedivider電阻分壓器ringing振鈴ripplecurrent紋波電流ris

6、ingedge上升沿senseresistor檢測(cè)電阻SequencedPowerSupplys序列電源shoot-through直通，同時(shí)導(dǎo)通strayinductances.雜散電感sub-circuit子電路substrate基板Telecom電信ThermalInformation熱性能信息thermalslug散熱片Threshold閾值timingresistor振蕩電阻TopFETTopFETTrace線(xiàn)路，走線(xiàn)，引線(xiàn)Transferfunction傳遞函數(shù)TripPoint跳變點(diǎn)turnsratio匝數(shù)比，二Np/Ns。（初級(jí)匝數(shù)/次級(jí)匝數(shù)）UnderVoltageLockOu

7、t（UVLO）欠壓鎖定VoltageReference電壓參考voltage-secondproduct伏秒積zero-polefrequencycompensation零極點(diǎn)頻率補(bǔ)償beatfrequency拍頻oneshots單擊電路scaling縮放ESR等效串聯(lián)電阻PageGround地電位trimmedbandgap平衡帶隙dropoutvoltage壓差largebulkcapacitance大容量電容circuitbreaker斷路器chargepump電荷泵overshoot過(guò)沖LED照明常用詞匯中英文對(duì)照（二）1）元件設(shè)備三繞組變壓器：three-columntransfor

8、merThrClnTrans雙繞組變壓器：double-columntransformerDblClmnTrans電容器：Capacitor并聯(lián)電容器：shuntcapacitor電抗器：Reactor母線(xiàn)：Busbar輸電線(xiàn)：TransmissionLine發(fā)電廠：powerplant斷路器：Breaker刀閘（隔離開(kāi)關(guān)）：Isolator分接頭：tap電動(dòng)機(jī)：motor2）狀態(tài)參數(shù)有功：activepower無(wú)功：reactivepower電流：current容量：capacity電壓：voltage檔位：tapposition有功損耗：reactiveloss無(wú)功損耗：activelos

9、s功率因數(shù)：power-factor功率：power功角：power-angle電壓等級(jí)：voltagegrade空載損耗：no-loadloss鐵損：ironloss銅損：copperloss空載電流：no-loadcurrent阻抗：impedance正序阻抗：positivesequenceimpedance負(fù)序阻抗：negativesequenceimpedance零序阻抗：zerosequenceimpedance電阻：resistor電抗：reactance電導(dǎo)：conductance電納：susceptance無(wú)功負(fù)載：reactiveload或者QLoad有功負(fù)載:active

10、loadPLoad遙測(cè)：YC（telemetering）遙信：YX勵(lì)磁電流（轉(zhuǎn)子電流）：magnetizingcurrent定子：stator功角：power-angle上限:upperlimit下限：lowerlimit并歹的：apposable高壓:highvoltage彳氐壓：lowvoltage中壓：middlevoltage電力系統(tǒng)powersystem發(fā)電機(jī)generator勵(lì)磁excitation勵(lì)磁器excitor電壓voltage電流current母線(xiàn)bus變壓器transformer升壓變壓器step-uptransformer高壓側(cè)highside輸電系統(tǒng)powertra

11、nsmissionsystem輸電線(xiàn)transmissionline固定串聯(lián)電容補(bǔ)償fixedseriescapacitorcompensation穩(wěn)定stability電壓穩(wěn)定voltagestability功角穩(wěn)定anglestability暫態(tài)穩(wěn)定transientstability電廠powerplant能量輸送powertransfer交流AC裝機(jī)容量installedcapacity電網(wǎng)powersystem落點(diǎn)droppoint開(kāi)關(guān)站switchstation雙回同桿并架double-circuitlinesonthesametower變電站transformersubstati

12、on補(bǔ)償度degreeofcompensation高抗highvoltageshuntreactor無(wú)功補(bǔ)償reactivepowercompensation故障fault調(diào)節(jié)regulation裕度magin三相故障threephasefault故障切除時(shí)間faultclearingtime極限切除時(shí)間criticalclearingtime切機(jī)generatortriping高頂值highlimitedvalue強(qiáng)行勵(lì)磁reinforcedexcitation線(xiàn)路補(bǔ)償器LDC(linedropcompensation)機(jī)端generatorterminal靜態(tài)static(state)動(dòng)態(tài)

13、dynamic(state)單機(jī)無(wú)窮大系統(tǒng)onemachine-infinitybussystem機(jī)端電壓控制AVR電抗reactance電阻resistance功角powerangle有功(功率)activepower無(wú)功(功率)reactivepower功率因數(shù)powerfactor無(wú)功電流reactivecurrent下降特性droopcharacteristics斜率slope額定rating變比ratio參考值referencevalue電壓互感器PT分接頭tap下降率drooprate仿真分析simulationanalysis傳遞函數(shù)transferfunction框圖block

14、diagram受端receive-side裕度margin同步synchronization失去同步lossofsynchronization阻尼damping搖擺swing保護(hù)斷路器circuitbreaker電阻：resistance電抗：reactance阻抗：impedance電導(dǎo)：conductance電納：susceptance導(dǎo)納：admittance電感：inductance電容:capacitance印制電路printedcircuit印制線(xiàn)路printedwiring印制板printedboard印制板電路printedcircuitboard印制線(xiàn)路板printedwir

15、ingboard印制元件printedcomponent印制接點(diǎn)printedcontact印制板裝配printedboardassembly板board剛性印制板rigidprintedboard撓性印制電路flexibleprintedcircuit撓性印制線(xiàn)路flexibleprintedwiring齊平印制板flushprintedboard金屬芯印制板metalcoreprintedboard金屬基印制板metalbaseprintedboard多重布線(xiàn)印制板mulit-wiringprintedboard塑電路板moldedcircuitboard散線(xiàn)印制板discretewiri

16、ngboard微線(xiàn)印制板microwireboard積層印制板buile-upprintedboard表面層合電路板surfacelaminarcircuit埋入凸塊連印制板B2itprintedboard載芯片板chiponboard埋電阻板buriedresistanceboard母板motherboard子板daughterboard背板backplane裸板bareboard鍵盤(pán)板夾心板copper-invar-copperboard動(dòng)態(tài)撓性板dynamicflexboard靜態(tài)撓性板staticflexboard可斷拼板break-awayplanel電纜cable撓性扁平電纜fle

17、xibleflatcable(FFC)薄膜開(kāi)關(guān)membraneswitch混合電路hybridcircuit厚膜thickfilm厚膜電路thickfilmcircuit薄膜thinfilm薄膜混合電路thinfilmhybridcircuit互連interconnection導(dǎo)線(xiàn)conductortraceline齊平導(dǎo)線(xiàn)flushconductor傳輸線(xiàn)transmissionline跨交crossover板邊插頭edge-boardcontact增強(qiáng)板stiffener基底substrate基板面realestate導(dǎo)線(xiàn)面conductorside元件面componentside焊接面s

18、olderside導(dǎo)電圖形conductivepattern非導(dǎo)電圖形non-conductivepattern基材basematerial層壓板laminate覆金屬箔基材metal-cladbadematerial覆銅箔層壓板copper-cladlaminate(CCL)復(fù)合層壓板compositelaminate薄層壓板thinlaminate基體材料basismaterial預(yù)浸材料prepreg粘結(jié)片bondingsheet預(yù)浸粘結(jié)片preimpregnatedbondingsheer環(huán)氧玻璃基板e(cuò)poxyglasssubstrate預(yù)制內(nèi)層覆箔板masslaminationpan

19、el內(nèi)層芯板corematerial粘結(jié)層bondinglayer粘結(jié)膜filmadhesive無(wú)支撐膠粘劑膜unsupportedadhesivefilm覆蓋層coverlayer(coverlay)增強(qiáng)板材stiffenermaterial銅箔面copper-cladsurface去銅箔面foilremovalsurface層壓板面uncladlaminatesurface基膜面basefilmsurface膠粘劑面adhesivefaec原始光潔面platefinish粗面mattfinish剪切板cuttosizepanel超薄型層壓板ultrathinlaminateA階樹(shù)月旨A-s

20、tageresinB階樹(shù)脂B-stageresinC階樹(shù)月旨C-stageresin環(huán)氧樹(shù)旨epoxyresin酚醛樹(shù)旨phenolicresin聚酯樹(shù)旨polyesterresin聚酰亞胺樹(shù)旨polyimideresin雙馬來(lái)酰亞胺三嗪樹(shù)旨bismaleimide-triazineresin丙烯酸樹(shù)旨acrylicresin三聚氰胺甲醛樹(shù)旨melamineformaldehyderesin多官能環(huán)氧樹(shù)旨polyfunctionalepoxyresin溴化環(huán)氧樹(shù)旨brominatedepoxyresin環(huán)氧酚醛epoxynovolac氟樹(shù)脂fluroresin硅樹(shù)脂siliconeresin硅

21、烷silane聚合物polymer無(wú)定形聚合物amorphouspolymer結(jié)晶現(xiàn)象crystallinepolamer雙晶現(xiàn)象dimorphism共聚物copolymer合成樹(shù)脂synthetic熱固性樹(shù)脂thermosettingresinPage熱塑性樹(shù)脂thermoplasticresin感光性樹(shù)脂photosensitiveresin環(huán)氧值epoxyvalue雙氰胺dicyandiamide粘結(jié)劑binder膠粘劑adesive固化劑curingagent阻燃劑flameretardant遮光劑opaquer增塑劑plasticizers不飽和聚酯unsatuiatedpolyes

22、ter聚酯薄膜polyester聚酰亞胺薄膜polyimidefilm(PI)聚四氟乙烯polytetrafluoetylene(PTFE)增強(qiáng)材料reinforcingmaterial折痕crease云織waviness魚(yú)眼fisheye毛圈長(zhǎng)featherlength厚薄段mark裂縫split捻度twistofyarn浸潤(rùn)劑含量sizecontent浸潤(rùn)劑殘留量sizeresidue處理劑含量finishlevel偶聯(lián)劑couplintagent斷裂長(zhǎng)breakinglength吸水高度heightofcapillaryrise濕強(qiáng)度保留率wetstrengthretention白度wh

23、itenness導(dǎo)電箔conductivefoil銅箔copperfoil壓延銅箔rolledcopperfoil光面shinyside粗糙面matteside處理面treatedside防銹處理stainproofing雙面處理銅箔doubletreatedfoil模擬simulation邏輯模擬logicsimulation電路模擬circitsimulation時(shí)序模擬timingsimulation模塊化modularization設(shè)計(jì)原點(diǎn)designorigin優(yōu)化（設(shè)計(jì)）optimization（design）供設(shè)計(jì)優(yōu)化坐標(biāo)軸predominantaxis表格原點(diǎn)tableorig

24、in元件安置componentpositioning比例因子scalingfactor掃描填充scanfilling矩形填充rectanglefilling填充域regionfilling實(shí)體設(shè)計(jì)physicaldesign邏輯設(shè)計(jì)logicdesign邏輯電路logiccircuit層次設(shè)計(jì)hierarchicaldesign自頂向下設(shè)計(jì)top-downdesign自底向上設(shè)計(jì)bottom-updesign費(fèi)用矩陣costmetrix元件密度componentdensity自由度degreesfreedom出度outgoingdegree入度incomingdegree曼哈頓距離manhattondistance歐幾里德距離euclideandistance網(wǎng)絡(luò)network陣列array段segment邏輯logic邏輯設(shè)計(jì)自動(dòng)化logicdesignautomation分線(xiàn)separatedtime分層separatedlayer定順序definitesequence導(dǎo)線(xiàn)（通道）conduction（track）導(dǎo)線(xiàn)（體）寬