pcb最常用術(shù)語

1、A/W (artwork) 底片Ablation 燒溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蝕accelerated test 加速試驗(yàn)acceleration 速化反應(yīng)accelerator 加速劑acceptable 允收activator 活化液active work in process 實(shí)際在制品adhesion 附著力adhesive method 黏著法air inclusion 氣泡air knife 風(fēng)刀amor

2、phous change 不定形的改變amount 總量amylnitrite 硝基戊烷analyzer 分析儀anneal 回火annular ring 環(huán)狀墊圈;孔環(huán)anode slime (sludge) 陽極泥anodizing 陽極處理AOI ( automatic optical inspection ) 自動(dòng):光學(xué)檢測(cè)applicable documents 引用之文件AQL sampling 允收水準(zhǔn)抽樣aqueous photoresist 液態(tài)光阻aspect ratio 縱橫比(厚寬比)As received 到貨時(shí)    

3、0;                          back lighting 背光back-up 墊板banked work in process 預(yù)留在制品base material 基材baseline performance 基準(zhǔn)績(jī)效batch 批beta backscattering 貝他射線照射法beveling 切斜邊;斜邊bia

4、xial deformation 二方向之變形black-oxide 黑化blank controller 空白對(duì)照組blank panel 空板blanking 挖空blip 彈開blister 氣泡;起泡blistering 氣泡blow hole 吹孔board-thickness error 板厚錯(cuò)誤bonding plies 黏結(jié)層bow ; bowing 板彎break out 從平環(huán)內(nèi)破出bridging 搭橋;橋接BTO (Build To Order) 接單生產(chǎn)burning 燒焦burr 毛邊(毛頭)      &

5、#160;                           camcorder 一體型攝錄放機(jī)carbide 碳化物carlson pin 定位梢carrier 載運(yùn)劑catalyzing 催化catholic sputtering 陰極濺射法caul plate 隔板;鋼板calibration system requirement

6、s 校驗(yàn)系統(tǒng)之各種要求center beam method 中心光束法central projection 集中式投射線certification 認(rèn)證chamfer 倒角(金手指)chamfering 切斜邊;倒角characteristic impedance 特性阻抗charge transfer overpotential 電量傳遞過電壓chase 網(wǎng)框checkboard 棋盤chelator 蟹和劑chemical bond 化學(xué)鍵chemical vapor deposition 化學(xué)蒸著鍍circumferential void 圓周性之孔破clad metal 包夾金屬cle

7、an room 無塵室clearance 間隙coat 鍍外表coating error 防焊覆蓋錯(cuò)誤coefficient of thermal expansion (CTE) 熱澎脹系數(shù)cold solder joint 冷焊點(diǎn)cold-weld 金屬粉末冷焊color 顏色color error 顏色錯(cuò)誤compensation 補(bǔ)償competitive performance 競(jìng)爭(zhēng)力績(jī)效complex salt 錯(cuò)化物complexor 錯(cuò)化物component hole 零件孔component side 零件面concentric 同心conformance 密貼性consume

8、r products 消費(fèi)性產(chǎn)品contact resistance 接觸電阻continuous performance 連續(xù)發(fā)揮效能contract service 協(xié)力廠controlled split 均裂式conventional flow 亂流方式conventional tensile test 傳統(tǒng)張力測(cè)試法conversion coating 轉(zhuǎn)化層convex 突出coordinate list 數(shù)據(jù)清單copper claded laminates (CCL) 銅箔基板copper exposure 線路露銅copper mirror 鏡銅copper pad 銅箔圓配c

9、opper residue (copper splash) 銅渣c(diǎn)orrosion rate numbering 腐蝕速率計(jì)數(shù)系統(tǒng)corrosion resistance 抗蝕性coulombs law 庫倫定律countersink 喇叭孔coupon 試樣coupon location 試樣點(diǎn)covering power 遮蓋力CPU 中央處理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交聯(lián)聚合cross talk 呼應(yīng)作用crosslinking 交聯(lián)crystal collection 結(jié)晶收集curing 聚合體current efficiency

10、電流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 學(xué)習(xí)循環(huán)cycle-time reduction 交期縮短                    date code 周期deburring 去毛頭dedicated 專用型degradation 退變delamination 分層dent / pin hole 凹陷/ 針孔department o

11、f defense 國防部designation 字碼簡(jiǎn)示法de-smear 除膠渣developing 顯影dewetting 縮錫dewetting time 縮錫時(shí)間dimension error 外形尺寸錯(cuò)誤dielectric constant 介質(zhì)常數(shù)difficulty 困難度difunctional 雙功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸與公差dirty hole 孔內(nèi)異物discolor hole 孔黑;孔灰;氧化discolor

12、ation 變色disposable eyelet method 消耗性鉚釘法distortion factor 尺寸變形函數(shù)double side 雙面板downtime 停機(jī)時(shí)間drill 鉆孔drill bit 鉆頭drill facet 鉆尖切萷面drill pointer 鉆尖重(研)磨機(jī)drilled blank board 已鉆孔之裸板drilling 鉆孔dry film 干膜ductility 延展性               

13、;                  economy of scale 經(jīng)濟(jì)規(guī)模edge spacing 板邊空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 電測(cè)electrical testing 電測(cè);測(cè)試electrochemical machine ECM 電化學(xué)加工法electrochemical reactor 電化學(xué)反應(yīng)器e

14、lectroforming 電鑄electroless plate 化學(xué)銅electroless-deposition 無電鍍electropolishing 電解拋光electrorefining 電解精煉electrowinning 電解萃取elliptical set 橢圓形embrittlement 脆性entitlement performance 可達(dá)成績(jī)效entrapment 電鍍夾雜物epoxy 環(huán)氧樹酯equipotential 電位線error data file 異常情形etch rate 蝕銅速率etchants 蝕刻液etchback 回蝕evaluation pro

15、gram 評(píng)估用程序exposure 曝光external pin method 外部插梢法eyelet hole 鉚釘孔Eyeletting 鉚眼                                  fabric 網(wǎng)布failure 故障fast res

16、ponse 快速響應(yīng)fault 瑕庛;缺陷fiber exposure 纖維顯露fiber protrusion 纖維突出fiducial mark 光學(xué)點(diǎn),基準(zhǔn)記號(hào)filler 填充料film 底片filtration 過濾finished board 成品fixing 固著fixture 電測(cè)夾具(治具)flaking off 粹離flammability rating 燃性等級(jí)flare 喇叭形孔flat cable 并排電纜feedback loop 回饋循環(huán)first-in-first-out (FIFO) 先進(jìn)先出flexible manufacturing system (FMS

17、) 彈性制造系統(tǒng)flux 助焊劑foil distortion 銅層變形fold 空泡foreign include 異物foreign material 基材內(nèi)異物free radical chain polymerization 自由基連鎖聚合fully additive 加成法fully annealed type 徹底回火軔化之類形function 函數(shù)fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼         

18、                galvanized 加法尼化制程gap 鉆尖分開gauge length 有效長(zhǎng)度gel time 膠化時(shí)間general resist ink 一般阻劑油墨general 通論general industrial 一般性(電子)工業(yè)級(jí)geometrical levelling 幾何平整glass transition temperature (Tg) 玻璃態(tài)轉(zhuǎn)換溫度Gold 金gold finger 金手指go

19、ld plating 鍍金golden board 標(biāo)準(zhǔn)板gouges 刷磨凹溝gouging 挖破grain boundary 金屬晶體之四邊green 綠色grip 夾頭ground plane 接地層ground plane clearance 接地空環(huán)                  hackers 駭客HAL ( hot air leveling ) 噴錫haloing 白邊;白圈hardener 硬化劑hardn

20、ess 硬度hepa filter 空氣濾清器high performance industrial 高性能(電子)工業(yè)級(jí)high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高溫延展性銅箔h(huán)igh temperature epoxy (HTE) 高溫樹酯hit 擊hole counter 數(shù)孔機(jī)hole diameter 孔徑hole diameter error 孔徑錯(cuò)誤hole location 孔位hole number 孔數(shù)hole wall quality 孔壁品質(zhì)hook 外弧hot

21、dip 熱浸法hull cell 哈氏槽hybrid 混成集成電路hydrogen bonding 氫鍵hydrolysis 水解hydrometallurgy 濕法冶金法                       image analysis system 影像分析系統(tǒng)image transfer 影像轉(zhuǎn)移immersion gold 浸金(化鎳金)immersion pl

22、ating 浸鍍法impedance 阻抗infrared reflow 紅外線重熔inhibitor 熱聚合抑制劑injection mold 射模ink 油墨innerlayer & outlayer 內(nèi)外層insulation resistance 絕緣電阻intended position 應(yīng)該在的位置intensifier 增強(qiáng)器intensity 強(qiáng)度inter molecular exchange 交互改變interconnection 互相連通ionic contaminants 離子性污染物ionic contamination testing 離子污染試驗(yàn)IPA 異

23、丙醇5I : inspiration (啟蒙)identification 確認(rèn)計(jì)劃目標(biāo)implementation 改善方案information 數(shù)據(jù)internalization 制度化invisible inventory 無形的庫存                   knife edges 刀緣Knoop 努普(硬度單位)kraft paper 牛皮紙    

24、60;                          返回頂部laminar flow 層流laminate 基層板laminating 壓合lamination 壓合laminator 壓膜機(jī)land 焊墊lay back 刃角磨損lay up 組合疊板layout 布線;布局lead screw 牽引螺絲leakage 漏電learning

25、 curve 學(xué)習(xí)曲線legend 文字標(biāo)記leveling 平整levelling additive 平整劑levelling power 平整力life support 維系生命limiting current 極限電流line space 線距l(xiāng)ine width 線寬linear variable differential transformer(LVDL) 線性可變差動(dòng):轉(zhuǎn)換器liquid 液狀(態(tài))liquid crystal resins 液晶樹脂liquid photoimageable solder resist ink 液態(tài)感光防焊油墨liquid photoresist

26、ink 液態(tài)光阻劑油墨lot size 批量lower carrier 底部承載板                         mechanical plating 機(jī)祴鍍法machine scrub 刷磨清潔法macrothrowing power 巨分布力margin 鉆頭刃帶market share 市場(chǎng)占有率marking error 文字錯(cuò)誤m

27、asked leveling 儰裝平整mass lamination 大型壓板mass transfer 質(zhì)量傳送效應(yīng)mass transfer overpotential 質(zhì)量傳遞過電壓mass transportation 質(zhì)傳master drawing 主圖;藍(lán)圖material use factor 材料使用率mealing 泡點(diǎn);白點(diǎn)memory 記憶裝置meniscograph solderability measurement 新月型焊錫效果microetch 微蝕microetching 微蝕microfocus 微焦距microfocus system 微焦距系統(tǒng)micro

28、profile 微表面microsectioning 微切片法microthrowing power 微分布力migration 遷移mini-tensile tester 迷你拉力測(cè)試儀mis hole location 孔位錯(cuò)誤misregistration 焊錫面與零件面對(duì)位偏差misregsitration 對(duì)不準(zhǔn)moisture and insulation resistance test 濕氣與絕緣電阻試驗(yàn)molded circuit board (MCB) 模制電路板monoethanal amine 單乙醇氨monohydrate state 水化物monomer 單分子膜;單

29、體mouse bite 鋸齒;蝕刻缺口msec 毫秒muffle furnace 高溫焚火爐multichip 超大IC型(多芯片模塊)mylar 保護(hù)膜                                     nail h

30、ead 釘頭NC drill 數(shù)字鉆孔機(jī)negative etchback 反回蝕negative film 負(fù)片negative rake angle 負(fù)摳耙角network 回路;網(wǎng)絡(luò)neutralization 中和nick 缺口nickel 鎳nodule 銅瘤;瘤粒no flow resin 不流樹脂noise 噪聲nominal 標(biāo)示nominal dimension 標(biāo)定長(zhǎng)度nominal gel time 標(biāo)示膠性時(shí)間nominal resin content 標(biāo)示膠含量nominal resin flow 標(biāo)示膠流量nominal scaled flow thickness

31、標(biāo)示比例流量厚度   OA equip 辦公室自動(dòng):化設(shè)備obsolescence factor 報(bào)廢因素OEM 原設(shè)備制造商offset-list 補(bǔ)償數(shù)據(jù)清單ohmmeter 歐姆計(jì)open 斷路open circuits 斷路open short testing 斷短路測(cè)試opening 開口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀殺雞overlap 鉆尖重疊overlay entry 蓋板overpotential 過電壓oxidation 氧化oxide treatment 黑化

32、處理oxided cytochrome 氧化性之細(xì)包色素oxygen evolution 氧氣發(fā)生反應(yīng)                    packed bed 充填床式pad 錫墊;圓配pad copper exposure pad露銅panel 小型板面;母板panel plating 一次銅電鍍parasitic 寄生的part no. 料號(hào)pattern plating 二次銅電鍍PCB ( pr

33、int circuit board ) 印刷電路板pcs 片peel strength 抗撕強(qiáng)度peeling off 剝離(剝落)performance specification 性能規(guī)范permittivity 透電率perspectives on experience 經(jīng)驗(yàn)透視PET 聚酯photodiode detector 發(fā)光二極管偵測(cè)器photo initiator 感光啟始劑photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蝕測(cè)定儀pink ring 粉紅圈pit 凹點(diǎn)pitch 腳距pl

34、anar 平面plating 電鍍plating exposure 下鍍層露出plug gauge 插規(guī)plug hole 孔塞PNL (panel) 排板polar-polar interaction 極性之間的吸力polyester 聚酯類polyglycols 聚乙二醇polyimide 聚亞醯氨poor bevelling 磨邊加工引起突起,剝離poor drill 孔形不良poor HAL 噴錫不良poor marking 字體不良poor pad 錫墊不良poor printed 印刷偏差poor solderability 焊錫性不良poor touch-up 補(bǔ)線不良posit

35、ion control system 位置控制系統(tǒng)positive rake angle 正摳耙角power curve model 幕次曲線模式practice 工藝慣例preferred 良好premature tearing 提前撕裂prepolymer 預(yù)聚合物prepreg 膠片pre-process ( front-end) 制前press 壓床press cycle 壓合周期primary current distribution 一次電流分布primary 主要product lifetimes 生命周期product process 制程promoter 促進(jìn)劑protoca

36、l 初步資料prussic acid 普魯士酸PTF-based process 厚膜糊法PTH (plating though hole) 導(dǎo)通孔pull away 拉開pumice 浮石粉pumice scrub 噴砂清潔法pyrometallurgy 火燒法冶煉                        QC ( quality control) 品管QFP

37、 (quad flat pack ) 扁方型封裝體qualification inspection 資格審查檢驗(yàn)qualification testing 資格檢定quality classification 品質(zhì)等級(jí)quantitative 計(jì)量式測(cè)試                          rack 掛架radiometer 能量劑r

38、ake angle 摳耙角RAM Random Access Memory 隨機(jī)存取內(nèi)存real time 關(guān)鍵時(shí)刻recessed trace process 凹槽線路法recovery tank 回收槽reduction 還原re-eninforcement 強(qiáng)化refraction 折光率reinforcement style 補(bǔ)強(qiáng)材料的型式register mark 對(duì)位用標(biāo)記registration hole 對(duì)位孔registration pattern 長(zhǎng)方形銅地REJ ( reject ) 退貨;拒收rejectable 拒收release agent 脫模劑relief an

39、gle 浮離角remark 備注repair 修理resin content 樹脂含量(膠含量)resin flow 膠流量resin flow percentage 樹脂流量之百分率resin recession 樹脂下陷resin smear 膠渣resist strippers 剝干膜劑resistor network 排列電阻resolution 解像度return on assets 資產(chǎn)報(bào)酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋轉(zhuǎn)圓柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routi

40、ng bit 銑刀runout 偏轉(zhuǎn)                                     S/L on hole 孔內(nèi)沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder ma

41、sk) 防焊S/M error 防焊種類錯(cuò)誤S/M on hole 孔內(nèi)綠漆salt spray test 鹽水噴霧試驗(yàn)sampling size 抽樣數(shù)scope 范圍scored 刻痕scoring 樞槽;刮線scrap 廢框scratches 刮傷screen printing 網(wǎng)版印刷scum 透明殘膜sealing 封孔處理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 鋼隔板sequential lamination 漸成式壓法serrated edges 毛邊shatter 破碎short 短路s

42、hunt 分路silane treatment 硅烷處理silicone coupling agent 硅烷偶合劑silk screen 文字印刷simulator 仿真器single axis 單軸sizing 底片之伸縮補(bǔ)償skip 漏印skip printing 跳印;漏印sliver 絲條slot 開槽slotting 開槽SMD ( surface mount device ) 表面黏著組件smear 膠渣SMT ( surface mount technology )表面黏著技術(shù)sodium carbonate monohydrate 結(jié)晶水碳酸鈉soft tooling 軟性工具

43、solder 焊錫; 錫鉛solder bridge 錫橋solder bump 錫突solder float 漂錫solder mask adhesion 綠漆附著力solder on G/F 金手指沾錫solder on trace 線路沾錫solder plug 錫塞solder side 焊錫面solderability 焊錫性solid carbide 實(shí)質(zhì)碳化物spacing 間距spacing nonenough 間距不足SPC ( Statistical Process Control ) 統(tǒng)計(jì)生管specification 規(guī)范special considerations 特

44、別考慮spin coating 旋轉(zhuǎn)涂布spindle 鉆軸spiral contractometer 螺旋收縮儀spot face 銑靶spray coating 噴涂Squeegee 刮刀stacking structure 疊板結(jié)構(gòu)stamping 沖壓standard hydraulic lamination標(biāo)準(zhǔn)液壓法standardizing 標(biāo)準(zhǔn)化starvation 缺膠step tablet 格片數(shù)stock option 認(rèn)股選擇權(quán)strain 應(yīng)度strength 強(qiáng)度stressmeter 應(yīng)力計(jì)subtractive 減除法surface convex 表面突起surf

45、ace examination 表面檢查surface insulation resistance (SIR) 表面絕緣電阻surface mount 表面黏著方式surface roughness 表面粗慥度surges 突波switch circuit 開關(guān)線路                          tab 金手指tack free

46、 不黏taped hole gauge 錐形孔規(guī)target hole 靶孔task force 任務(wù)編組tensile strength 抗拉強(qiáng)度tensile stress 張性應(yīng)力tent 浮蓋terms and definitions 術(shù)語與定義termination load 抗匹配負(fù)載test circuit 測(cè)試線路test method 試驗(yàn)方法test point 測(cè)試點(diǎn)thermal shock 熱震蕩試驗(yàn)thermal stress 熱應(yīng)力試驗(yàn)thermistor 熱電感應(yīng)式thermo cycling 熱循環(huán)試驗(yàn)theoretical cycle time 理論性周期時(shí)

47、間thickness 厚度time to market 上市時(shí)機(jī)thickness distribution 厚度分布thief 補(bǔ)助陰極thin core 薄基板;內(nèi)層板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之負(fù)載total quality program 全面的品質(zhì)計(jì)劃toughness 堅(jiān)度trace error 線路錯(cuò)誤trace nick & pin hole 線路缺口及針孔trace peeling 線路剝離trace pin-hole 線路針孔trace surface roughness 線路表面粗糙tarnish and oxide res