VALOR基本操作步驟

1、2022/3/51VALOR基本操作指南基本操作指南LDC SIM Layout周先進(jìn)/黃亞坽2022/3/52VALOR基本操作指南基本操作指南請(qǐng)選擇學(xué)習(xí)內(nèi)容請(qǐng)選擇學(xué)習(xí)內(nèi)容2022/3/53操作前準(zhǔn)備操作前準(zhǔn)備一、首先連接server,獲得license.具體操作如下：1.在我的電腦單擊右鍵出現(xiàn)如下界面2.單擊連線網(wǎng)路磁蝶機(jī)2022/3/543.進(jìn)入此界面後此處可任意選這一個(gè)盤符此處輸入8enterprise注意：如果server改變，上述也需相應(yīng)改變。單擊2022/3/554.進(jìn)入此界面後輸入帳號(hào)：administrator輸入密碼ling!21967注意：如果此前有連

2、接的，直接在 我的電腦雙擊相應(yīng)盤符，輸入密碼就OK。2022/3/565.進(jìn)入此界面就表示連接成功。2022/3/57EXPORT ODB+ DATA1.打開需要check的board file2.單擊fileexportodb+如沒有，需要安裝。安裝程序上述server器F:.genesis下。暫時(shí)只介紹一種方法2022/3/583.直至出現(xiàn)此界面，一般默認(rèn)設(shè)置。Boradfile path輸出檔案path輸出檔案名稱只勾選此項(xiàng)單擊此項(xiàng)2022/3/59單擊出現(xiàn)如下對(duì)話框舊零件選擇place bound新零件選assembly主要是方便下面做dfm check勾選則刪除生成的.out檔案其余

3、設(shè)置默認(rèn)4.單擊此項(xiàng)2022/3/5105.單擊此項(xiàng)2022/3/5116.直至出現(xiàn)此信息，表示完成。單擊此處返回2022/3/512OPEN AND SHORT CHECK2022/3/5131.進(jìn)入valor輸入ID:valor輸入PSSWORD:valor小寫2022/3/5142.出現(xiàn)此界面表示成功進(jìn)入2022/3/5153.依次選擇：檔案匯入ODB+2022/3/516一般選jobdb表示數(shù)據(jù)存放在自己電腦上。選擇上述生成ODB文檔路徑為此文件命名4.單擊OK注意文件名不能用大寫字母2022/3/5175. 找到此文檔並雙擊2022/3/5186.雙擊此文檔2022/3/5197.雙

4、擊此文檔8.打開後再雙擊PCB文檔2022/3/5209.進(jìn)入此工作界面(僅介紹常用工具）相關(guān)層面單擊鼠標(biāo)右鍵上下左右移動(dòng)視圖快捷鍵放大縮小快捷鍵page upPage down10. 單擊Netlist分析2022/3/52111.出現(xiàn)此界面單擊compare2022/3/522Open兩個(gè)Short一個(gè)單擊可分別打開2022/3/523單擊short出現(xiàn)選這net tdogx2出現(xiàn)單擊分析2022/3/524tdojx2tdi5535tdojx2tdi5535上述兩根net短路，在valor中編號(hào)為net00396對(duì)應(yīng)各層面對(duì)應(yīng)各層面同時(shí)可結(jié)合page up page down等快捷鍵20

5、22/3/525單擊brolen出現(xiàn)選這net gnd出現(xiàn)單擊分析2022/3/526Net gnd 開路對(duì)應(yīng)valor中，open的net編號(hào)為00001 net00002此為boardfile對(duì)應(yīng)坐標(biāo)，單位inch。單擊此處可查更多信息2022/3/527總結(jié)：open or short check 基本操作步驟已經(jīng)介紹完，但還需大家平時(shí)多加練習(xí)和操作。Open or short情況比較多，比較復(fù)雜，但又非常重要，大家分析時(shí)，一般要結(jié)合boradfile仔細(xì)分析，一一排除。找到其根本原因，將其徹底根治掉。注意：可按F1鍵獲得幫助信息。單擊此處返回2022/3/528DFM CHECK202

6、2/3/529接上述介紹第20頁(yè)2022/3/530依次選擇78654321服務(wù)器盤符此部操作的目的，主要對(duì)valor裡的零件進(jìn)行細(xì)分類。方便後面做check。2022/3/531開始做DFM CHECK依次選擇123451768接 2接 22022/3/5321312任選一個(gè)111092022/3/533分別出現(xiàn)分別出現(xiàn)此處統(tǒng)一選foxconn需檢查就勾選細(xì)項(xiàng)設(shè)定(一般默認(rèn)具體信息請(qǐng)按F1)一般帶一般帶 是需要重點(diǎn)注意的項(xiàng)目是需要重點(diǎn)注意的項(xiàng)目2022/3/534Assembly Analysis - Partial ListComponent Analysis1.Comp Pitch (S

7、ummary) 2.Comp Height (Summary) 3.Comp Rotation (Summary) 4.Comp Spacing (Spacing) 5.Comp to Toeprint (Spacing) 6.Other Side Area Keepout (Spacing) 7.Other Side Pins Keepout (Spacing) 8.Rout Spacing (Low Comp) (Rout) 9.Rout Spacing (High Comp) (Rout) 10.SMT Component To Conveyed Edge (Primary) (Rout

8、) 11.SMT Component To Conveyed Edge (Secondary) (Rout) 12.Component to Conveyed Edge (Rout) 13.Comp Touch Silkscreen (Silkscreen) 14.Comp. to Reference Designator (Silkscreen)15.Comp. Without Reference Designator (Silkscreen) 16.Carrier Wall Spacing (Comp ) 17.Carrier Wall Spacing (Wall) (Carrier Wa

9、ll Spacing) 18.PTH to Carrier Wall (Carrier Wall Holes) 19.NPTH To Carrier Wall (Carrier Wall Holes) 20.Via to Carrier Wall (Carrier Wall Holes) 21.Label to Component (Label) 22.Comp to Gold Fingers (Gold Fingers) 1.零件的Pitch(兩Pin的間距)-可不看2.零件的高度-可不看3.零件的旋轉(zhuǎn)角度-可不看4.零件的間距-重要嚴(yán)格遵守我們的DFM Rule5.零件與其他零件Pin的間

10、距-重要嚴(yán)格遵守我們的的DFM Rule6. 另一面零件限制區(qū)與零件距離)-可不看7.另一面零件限制區(qū)與Pin距離)-可不看8.矮零件與板邊的距離-可不看9.高零件與板邊的距離-可不看10.SMT零件到夾板邊的距離(TOP side)-重要11.SMT零件到夾板邊的距離(Bottom side)-重要12.零件到夾板邊的距離-重要13.零件到夾板邊的距離-重要14.零件到文字面的距離-可不看15.沒有零件編號(hào)的零件-可不看16.零件到載具內(nèi)零件的距離-可不看17.零件到載具內(nèi)零件的距離-可不看18.PTH孔到載具的距離-可不看19. NPTH孔到載具的距離-可不看20. Via孔到載具的距離-

11、可不看21.Label到零件的距離-可不看22.零件到金手指的距離-重要2022/3/53523.Component To Mounting Hole (Primary) (Hole Spacing) 24.Component To Mounting Hole (Secondary) (Hole Spacing) 25.Component To Tooling Hole (Primary) (Hole Spacing) 26.Component To Tooling Hole (Secondary) (Hole Spacing) 27.Hole Under Component (Hole Sp

12、acing) 28.Uncapped Via Under Component (Hole Spacing) 29.Wave Solder Component Orientation (Orientation) 30.Component Relative Orientation (Orientation) 31.Component Uncommon Orientation (Orientation) 32.No Orientation Indication (Orient Indication) 33.No Square Pad on THMT pin #1 (Orient Indication

13、) 34.Chip Corner Protection Missing (Guarded Comps ) 35.Chip Edge Protection Missing (Guarded Comps ) 36.Comp. Outside Keepin Area (Keepin/Keepout)37.Comp.Within Keepout Area (Keepin/Keepout)38.Comp. Exceed Max Height (Height Restriction)39.Comp. Under Min Height (Height Restriction) 23.TOP零件到螺絲孔的距離

14、-重要24.Bottom零件到螺絲孔的距離-重要25.Top零件到Tooling Hole的距離-重要26.Bottom零件到Tooling Hole的距離-重要27.零件下的Hole-重要28.零件下面沒蓋Marsk的Via-重要29.過(guò)錫爐的零件方向-可不看30.相關(guān)零件的方向-重要31.相關(guān)零件的非正常方向-重要32.非極性零件的方向(可能缺少Pin 1標(biāo)識(shí))-重要33.DIP零件的第1 Pin不是方形的-重要34.Chip零件的角沒有加保護(hù)-可不看35.Chip零件的邊沒有加保護(hù)-可不看36.零件沒在Keepin區(qū)域-重要37.零件在Keepout區(qū)域-重要38.零件超過(guò)最大高度限制區(qū)

15、-重要39.零件超過(guò)最低限制區(qū)-重要2022/3/536Testpoints Analysis1.Toeprint Testpoints (Review) 2.Via Testpoints (Review) 3.Nets Without Testpoints (Review) 4.Nets With Multiple Testpoints (Review) 5.Testpoint Wrong Shape (Review)6.Testpoint to Toeprint (Spacing)7.Testpoint to Testpoint (Spacing) 8.Testpoint To Cappe

16、d Via (Spacing) 9.Testpoint To Uncapped Via (Spacing) 10.Testpoint to Exposed Copper (Spacing) 11.Testpoint to Unexposed Copper (Spacing)12.Testpoint to NPTH (Drill) 13.Testpoint To THMT Toeprint (Drill) 14.Testpoint to Rout (Rout) 15.Testpoint To Component (Component) 16.Testpoint Under Component (

17、Component) 17.Testpoint To Component Angle (Component) 18.Testpoint To SM (Solder Mask) 19.Capped Testpoint Vias (Via Capping) 20.Via Capped On Both Sides (Via Capping) 21.Uncapped Non-Testpoint Vias (Via Capping) 22.Testpoint to Conveyed Edge (Rout)23.Testpoints Outside Keepin Area (Keepin/Keepout)

18、24.Testpoints Within Keepout Area (Keepin/Keepout)1.Padstack測(cè)試點(diǎn)分析2.Via測(cè)試點(diǎn)分析3.沒有加測(cè)試點(diǎn)的Net4.有多個(gè)測(cè)試點(diǎn)的Net5.測(cè)試點(diǎn)的錯(cuò)誤Shape-可不看6.測(cè)試點(diǎn)到Pin的間距7.測(cè)試點(diǎn)到測(cè)試點(diǎn)的間距8 .測(cè)試點(diǎn)到蓋Mask Via的距離9.測(cè)試點(diǎn)到未蓋Mask Via的距離10.測(cè)試點(diǎn)到裸露銅箔的距離11.測(cè)試點(diǎn)到蓋Mask Shape的距離12.測(cè)試點(diǎn)到NPTH Drill距離13.測(cè)試點(diǎn)到 PTH Drill的距離14.測(cè)試點(diǎn)到板邊的距離15.測(cè)試點(diǎn)到零件的距離16.零件下的測(cè)試點(diǎn)17.測(cè)試點(diǎn)與零件的角度18

19、.測(cè)試點(diǎn)到Solder mask的距離19.蓋Mask的測(cè)試點(diǎn)20.兩邊都蓋Mask的Via21.未蓋Mask的非測(cè)試點(diǎn)22.測(cè)試點(diǎn)到夾板邊的距離23.Keepin區(qū)域以外的測(cè)試點(diǎn)24.Keepout區(qū)域以內(nèi)的測(cè)試點(diǎn)2022/3/537Fabrication Analysis - Partial ListSignal Layers Checks1.Toeprint to Toeprint (Spacing)2.SMD to SMD (Spacing)3.Via to Via (Spacing)4.PTH to PTH (Spacing)5.SMD to Via (Spacing)6.SMD t

20、o TH (Spacing)7.Via to TH (Spacing)8.Pad to Pad (Spacing)9.Pad to Circuit (Spacing)10.Circuit to Circuit (Spacing)11.Text to Text (Spacing)12.Spacing Length (Spacing)13.Same Net Spacing (Spacing)14.CAD Short (Spacing)15.CAD Self Spacing (Spacing)16.NPTH Registration (Drill)17.Exposed to Exposed (Spa

21、cing)18.Covered to Covered (Spacing)19.Exposed to Covered(Spacing)20.Shaved Lines (Size)21.Text Fields (Size)22.Shaved Arcs (Size)23.Etch Outside Keepin Area (Keepin/Keepout)24.Etch Within Keepout Area (Keepin/Keepout)25.Trace Within Keepout Area (Keepin/Keepout)26.Via Within Keepout Area (Keepin/Ke

22、epout)1.Pin到Pin的間距2.SMD Pad到SMD Pad的間距3.Via到Via的間距4.PTH到PTH的間距5.SMD Pad到Via的間距6.SMD到Through hole的間距7.Via到Through hole的間距8.Pad到Pad的間距9.Pad到線路的間距10.Trace到Trace的間距11.文字到文字間距(有電氣特性的)12.平行線的長(zhǎng)度檢查13.相同Net name的間距14.短路分析15.不同層面上相同Net的間距16.None-PTH的drill中心與Pad中心偏移分析17.相鄰裸露區(qū)域的間距18.相鄰蓋Mask的線或銅箔間距19.裸露區(qū)域和蓋Mask的線或銅箔間距20.被非電氣特性的孔線等刮到的Cline21.文字區(qū)域-可不看22.被非電氣特性的孔線等刮到的圓弧23.Keepin區(qū)域外的蝕刻24.Keepout區(qū)域內(nèi)的蝕刻25.Keepout區(qū)域內(nèi)的Trace26.Keepout區(qū)域內(nèi)的Via2022/3/538Silk Screen Checks1.SM Clearance (SM Clearance)2.SMD Clearance (SMD Clearance)3.PTH Pads Clearance (Pad Clearance)4.Via Pads Clearance (Pad Clearance)5.NPTH Pa