國際學(xué)術(shù)會議海報模板16-academic conference poster model

1、. .0.00.40.5012Hardness (GPa)Indentation depth / Film thickness 1-mil PI, Oliver and Pharr 9-mil PI, Oliver and Pharr Glass, Oliver and PharrThe International Conference on Microelectronics and Plasma TechnologyInkjet printing of conductive Ag lines and their electrical and mechanical chara

2、cterizationD Jun L, Je H Oh*Department of Mechanical Engineering, HHHHK University, KO.IntroductionInkjet printing of conductive Ag lines and their electrical and mechanical characterizationObjective & Experiment VariablesSubstrate& Sintering Temp.& Line ThicknessExperimental DetailsResi

3、stivity& Modulus& HardnessSubstrateExp.No.SinteringTemp. (oC)The number of overprints (N) Polyimide(1-mil PI)(9-mil PI)& Slide Glass11501When N = 1,Thickness= 1 m22001320024200352501Surface Treatment: PE-CVDResistance R ( )Inkjet PrintingTop ViewInkjet ProcessSubstrateInkInkjet HeadDryin

4、g /SinteringAg Nanoparticle ColloidsDirect PatterningElectrical& Mechanical PropertiesWidth:100 mLength:10 mmPrintedElectronicsInductorCapacitorResultsConclusionResultsSectional Area (A)Resistivity (cm)Sintering (1hr)LRANanoindentation150 oC200 oC250 oCGlassDuring the Cooling Down after Sinterin

5、gPICompression stressTensile stressffiirEEE22111500 nm500 nm500 nm50 mccAhtssAhtffiireEeEEE)(2)(2211111scfccciirEAEAtAtAEE22)1 (211222D Graph 181-mil PI 9-mil PIGlassY Data01020304050N = 1N = 2N = 32D Graph 161-mil PI 9-mil PIGlassY Data010203040N = 1N = 2N = 32D Graph 171-mil PI 9-mil PIGlassY Data

6、020406080100150 oC200 oC250 oC2D Graph 151-mil PI 9-mil PIGlassY Data020406080150 oC200 oC250 oCResistance ( )Resistance ( )Resistivity (cm)Resistivity (cm)(a)(b)(c)(d)02004006008001000120005101520253035404550 1-mil PI 9-mil PI GlassLoad (mN)Indentation depth (nm)Electrical Resistance (a) and Resist

7、ivity (b) When N = 1;Electrical Properties (c, d) at Equal Sintering Temp. 200 oCTypical Load-Indentation Depth Curves of Inkjet-printed Ag Films When N = 1 and Sintering Temp. 200 oCv Oliver-Pharr Modelv Modified King Modelv Bec Modelv Classical Hardness21thkHHHHsfscAPH v Korsunsky Model0.00.10.20.

8、30.40.5020406080100E (GPa)Indentation depth / Film thickness 1-mil PI, Oliver and Pharr 9-mil PI, Oliver and Pharr Glass, Oliver and Pharr Glass, Modified King Glass - Bec et al.0.00.40.5020406080100E (GPa)Indentation depth / Film thickness 1-mil PI, Oliver and Pharr 9-mil PI, Oliver and Ph

9、arr Glass, Oliver and Pharr Glass, Modified King Glass, Bec et al.0.00.40.5020406080100E (GPa)Indentation depth / Film thickness 1-mil PI, Oliver and Pharr 9-mil PI, Oliver and Pharr Glass, Olivere and Pharr Glass, Modified King Glass, Bec et al.Youngs Modulus of Inkjet-printed Ag Films on

10、Different Substrates as a Function of the Normalized Indentation Depth at the Different Sintering Temp.(a) 150 oC(b) 200 oC(c) 250 oC0.00.40.5012Hardness (GPa)Indentation depth / Film thickness 1-mil PI, Oliver and Pharr 9-mil PI, Oliver and Pharr Glass, Oliver and Pharr0.00.40.501

11、2345Hardness (GPa)Indentation depth / Film thickness 1-mil PI, Oliver and Pharr 9-mil PI, Oliver and Pharr Glass, Oliver and PharrHardness of Inkjet-printed Ag Films on Different Substrates as a Function of the Normalized Indentation Depth at the Different Sintering Temp.(a) 150 oC(b) 200 oC(c) 250

12、oCSintering temperature (oC)150200250Hardness (GPa)0.00.51.01.52.02.53.0E (GPa)01020304050601-mil PI, Hardness9-mil PI, HardnessGlass, HardnessGlass, ModulusThe number of overprints (N)123Hardness (GPa)0.00.51.01.52.02.53.0E (GPa)01020304050601-mil PI, Hardness9-mil PI, HardnessGlass, HardnessGlass,

13、 ModulusHardness and Youngs Modulus of Ag Films on Different Substratesv The electrical resistivity of printed Ag line was evaluated by measuring the resistance and cross-sectional area.v Due to the CTE difference between the Ag lines and the substrate, the Ag lines on PI and glass have compressive and tensile residual stress, thus resulting in lower electrical resistivity of Ag lines on PIv The elastic modulus and hardness of printed Ag films was obtained by nanoindentation test. The properties of substrate are related to the measured mechan