PCB專業(yè)英譯術(shù)語匯集

PCB專業(yè)英譯術(shù)語匯集IntroductionPrintedCircuitBoard(PCB)isafundamentalcomponentinelectronicdevices.UnderstandingtheterminologiesrelatedtoPCBiscrucialforprofessionalsinthisfield.ThisdocumentmstocompileacomprehensivelistofPCBterminologiestranslatedintoEnglish.ItservesasausefulreferenceforprofessionalsandenthusiastsinvolvedinPCBdesign,manufacturing,andassembly.1.PCBDesignTerms1.1SchematicDesignComponent:元器件Symbol:元件符號Footprint:封裝Net:網(wǎng)絡(luò)Connector:連接器Trace:線路Pad:引腳Via:通孔DecouplingCapacitor:旁路電容1.2PCBLayoutDesignCopperLayer:銅層Silkscreen:排字SolderMask:焊盤阻焊層ViaPad:通孔墊層DrillHole:鉆孔KeepoutArea:禁止區(qū)域ComponentPlacement:元件布局Routing:路由Rat’sNest:老鼠窩Plane:平面1.3DesignRulesClearance:清晰度MinimumTraceWidth:最小線寬MinimumClearance:最小間距2.PCBFabricationTerms2.1SubstrateFR-4:FR-4FlexPCB:柔性PCBRigid-FlexPCB:剛?cè)峤Y(jié)合板2.2LayerStackupSingle-sidedPCB:單面板Double-sidedPCB:雙面板MultilayerPCB:多層板HighDensityInterconnect(HDI)PCB:高密度互連板2.3CopperPlatingElectrolessCopperPlating:無電解銅SelectivePlating:選擇性電鍍ViaPlugging:通孔封堵EdgePlating:邊緣電鍍2.4EtchingEtchant:蝕刻劑EtchingMachine:蝕刻機(jī)LPISoldermask:液相焊盤阻焊3.PCBAssemblyTerms3.1SurfaceMountTechnology(SMT)SolderPaste:焊膏Stencil:膜PickandPlaceMachine:投料機(jī)ReflowOven:回流爐3.2Through-holeTechnology(THT)Through-holeComponent:插件WaveSoldering:波峰焊Thru-holeReflow:插件熱風(fēng)爐3.3TestingandInspectionFlyingProbeTest:飛針測試In-circuitTest(ICT):板級測試AutomatedOpticalInspection(AOI):自動光學(xué)檢查ConclusionThisdocumentprovidedacomprehensivecollectionofPCBterminologiestranslatedintoEnglish,includingtermsrelatedtoPCBdesign,fabrication,andassembly.Expandingone’sknowledgeoftheseterminologiesisessentialint