IPC-A-610國際標(biāo)準(zhǔn)中英文對照(doc 17)

1、IPC-A-6610國際標(biāo)標(biāo)準(zhǔn)中英文對對照4.6.2 HHeat ssink-CContacct散熱片接觸觸片arget-CClass 1,2,33目標(biāo)等級1,2,33 Compoonent and hheatsiink arre in full contaact wiith thhe mountinng surrface. 組件和散熱片與與安裝表面完完全接觸 Hardwware mmeets speciified attacchmentt requuiremeents.部件滿足規(guī)定的的接觸要求。Figure圖圖4-641. Heatt sinkk散熱片Acceptaable-CClass 1

2、,2,33可接受的 等級1,22,3 Compoonent not fflush. 組件不平齊 Minimmum 755% conntact with mountting ssurfacce. 至少有75%與與安裝表面接接觸 Hardwware mmeets mountting ttorquee requuiremeents iif specifiied.如果有規(guī)定，部部件滿足安裝裝的轉(zhuǎn)距要求求Figure圖圖4-65 1. Gap 2. Heeat siink間隙 散熱片 Defectt-Classs 1,22,3缺點(diǎn)等級1,2,33 Compoonent is noot in contaa

3、ct wiith moountinng surrface. 組件沒有接觸到到安裝表面 Hardwware iis looose annd cann be mmoved.部件松弛可以移移動。Figure圖圖4-661. Heatt sinkk 2. Gapp散熱片 間隙5.1 Oriientattion方向5.1.1 OOrienttationn-Horiizontaal方向水平Target-Classs 1,2,3目標(biāo)等級1，2，3Componnents are ccenterred beetweenn theiir lannds. 組件位于焊盤中中央Componnent mmarkinngs

4、 arre disscerniible.組件標(biāo)識清晰可可見Nonpollarizeed commponennts arre oriientedd so tthat markinggs alll readd the same way (left-to-riightor top-to-boottom).Figure圖圖5-1 無極極性組件的方方向應(yīng)使其標(biāo)標(biāo)識都能按同同樣方式進(jìn)行行辨識（從左到右或從從上到下）Acceptaable-CClass 1,2,33可接受的等等級1，2，3Polariized aand muultileead coomponeents aare orrienteedcorr

5、ecttly.有極性和多引腳腳的組件應(yīng)按按正確方向安安裝。When hhand fformedd and hand-inserrted, polarrizatiionsymbolss are disceerniblle.當(dāng)手工成型及手手插件時(shí)，極極性符號可以以辨識。All coomponeents aare ass speccifiedd and termiinate to Figurre圖 5-2 coorrectt landds.所有組件都符合合規(guī)定并連接接到正確的焊焊盤上。Nonpollarizeed commponennts doo not need to bee orieented

6、so thhat maarkinggs alll readd the same way(lleft-tto rigght orr top to-boottom).無極性的組件不不需要按同樣樣的方向，只只要標(biāo)識可按按相同方向辨辨識即可（從從左到右或從從上到下）.5.1.1 OOrienttationn-Horiizontaal(connt.)方向水平（續(xù)續(xù)）Defect-Classs 1,2,3缺點(diǎn)等級11，2，3Componnent iis nott as sspeciffied (Wrongg partt). 組件不符合規(guī)定定（組件錯誤誤）Componnent nnot moountedd

7、in ccorrecct holles. 組件沒有安裝在在正確的孔中中。Polariized ccomponnent mmounteed bacckwardds. 有極性組件件安裝方向相相反。Multilleadedd compponentt not oriennted ccorrecctly. Figuree圖 5-3 多引腳組件件的安裝方向向不正確。5.1.2 OOrienttationn-Verttical方向垂直Target-Classs 1,2,3目標(biāo)等級 1，2，3Nonpollarizeed commponennt marrkingss readd fromm the top d

8、own.無極性組件的標(biāo)標(biāo)識可以從上上至下辨識Polariized mmarkinngs arre loccated on toop.極性標(biāo)識位于頂頂部.Figure圖圖 5-4 Accepttable-Classs 1,2,3可接受的等等級 1，2，3Polariized ppart iis mouunted with a lonng groound llead.極性組件安裝時(shí)時(shí)有長的接地地引腳Polariized mmarkinng hiddden.極性標(biāo)識被隱藏藏起來Nonpollarizeed commponennt marrkingss readd fromm botttom too

9、top.無極性組件標(biāo)識識可以從底至至上辨識。Figure圖圖 5-5Defect-Classs 1,2,3缺點(diǎn)等級 1，2，3Polariized ccomponnent iis mouunted backwwards.極性組件安裝反反向。Figure圖圖 5-65.2 Mouuntingg 安裝5.2.1 MMountiing-Hoorizonntal-AAxial Leadeed-Suppporteed Holles安裝水平軸向引腳腳有支撐孔孔Target-Classs 1,2,3目標(biāo)等級1，2，3The enntire body lengtth of the ccomponnent ii

10、s incontactt withh the boardd surfface.整個(gè)組件本體長長度與線路板板表面完全接接觸Componnents requiired tto be mountted offf thee boarrd aree ,at leastt 1.5mmm0.0059 innfromm the boardd surfface; e.g., highh heatt disssipatiing.需要離開線路板板表面安裝的的組件至少要要離開線路板板Figure圖圖 5-7 平面1.5mmm（0.0599 in），如如高散熱器件件. Figure圖圖 5-85.2.1 MMounti

11、ing-Hoorizonntal-AAxial Leadeed-Suppporteed Holles(coont.)安裝水平軸對稱引引腳有支撐孔孔Acceptaable-CClass 1,2可接受的等等級1，2，3The maaximumm spacce bettween the ccomponnent aand thheboard ssurfacce doees nott viollate tthe reequireementss for lead prrotrussion(ssee 5.2.7)oor commponennt heiight(HH). Figure圖圖 5-9 (H) is

12、 aa userr-deteermineed dimmensioon.)組件與線路板平平面之間的最最大間距不應(yīng)應(yīng)違反引腳突突出（見5.2.7）或或組件高度（H）的要求。 （高度（H）是由使用者決定的尺寸）Processs Indiicatorr-Classs 3程序指示等等級3The faarthesst disstancee betwween tthe coomponeent boody annd thee boarrd(D) is laarger than 0.7mmm0.0228 in. 組件本體與線路路板之間的最最大的距離（D）超過0.7mm（0.028 in）。Defect-Clas

13、ss 1,2,3缺點(diǎn)等級1，2，3Componnents requiired tto be mountted abbove tthe booard ssurfacce aree lesss thann 1.5mmm0.0059 inn 要求離開開線路板表面面安裝的組件件與線路板的的距離小于11.5mm（0.0599 in）.5.2.2 MMountiing-Hoorizonntal-AAxial Leadeed-Unssupporrted HHoles安裝水平軸向引腳腳無支撐的的孔Target-Classs 1,2,3目標(biāo)等級1.2.33The enntire body lengtth of

14、the ccomponnent iis in contactt withh the boardd surfface.整個(gè)組件本體長長度與線路板板表面完全接接觸.Componnents requiired tto be mountted offf thee boarrd areeat miniimum 11.5mm0.0599 in from the boarddFigure圖圖 5-100 surrface ;e.g. ,higgh heaat disssipatting.1.No Pllatingg in bbarrell 需需要離開線路路板表面安裝裝的組件至少少要離開線路路板平孔壁上沒有電

15、鍍鍍 面1.5mmm（0.0599 in），如如高散熱器件件. Componeents rrequirred too be mmounteed offf the boardd are proviided wwith llead fforms at thhe boaard suurfacee or oother mechaanicall suppport tto preevent liftiing off soldder laand.需要離開線路板板安裝的組件件在線路板表表面利用引腳腳形狀或其它它機(jī)械支撐來來防止焊盤的的翹起。 Figure圖圖 5-111 Fiigure圖圖 5-122Lead

16、 foorms 引腳形狀Defect-Classs 1,2,3缺點(diǎn)等級1，2，3Componnents requiired tto be mountted offf thee boarrd aree not proovidedd withh leadd formms at the bboard surfaace or otheer mecchaniccal suupportt to pprevennt liffting of solder land.Figure圖圖 5-133 需要要離開面板安安裝的組件在在線路板表面面未利用引腳腳的形狀或其其它機(jī)械支撐撐來防止焊盤盤翹起surfacce Co

17、mmponennts reequireed to be moountedd abovve thee boarrd aree lesss thann 1.5mmm0.0059 inn.要求離開線路板板表面安裝的的組件與線路路板的距離小小于1.5mmm（0.0599 in）Figure圖圖 5-1445.2.3 MMountiing-Hoorizonntal-RRadiall Leadded安裝水平徑向引腳腳Target-Classs 1,2,3目標(biāo)等級1，2，3The coomponeent boody iss in fflat ccontacct witth the bboards surrf

18、ace.組件本體與線路路板表面平貼貼接觸 Bondiing maateriaal is preseent, iif reqquiredd .Seee4.4.若需要，則可存存在粘貼的物物質(zhì)，見4.4Figure圖圖 5-155Acceptaable-CClass 1,2,33可接受的等等級1，2，3Componnent iin conntact with boardd on aat leaast onne side aand/orr surfface.組件與線路板至至少有一邊和和/或面接觸。Note: WWhen ddocumeented on ann apprroved assemmbly d

19、rawingg, a ccomponnent mmay bee eithher siide moounteddor end mountted. TThe siide orr surfface oof thee bodyy, or atleast oone pooint oof anyy irreegularrly coonfiguuredcomponeent(suuch ass certtain ppockettbook capaccitorss), neeedsFigure圖圖 5-166 to bbe in full contaact wiith thhe priinted boardd.

20、 Thee bodyy should to bee bondded orr otheerwisee retaained to thhe boaard too prevvent ddamagee whenn vibrrationn and shockk forcces arre appplied.注意： 在被認(rèn)認(rèn)可的組裝圖圖中，一個(gè)組組件既可能是是面安裝也可可能是邊沿安安裝。組件體體的表面或側(cè)側(cè)面，或不規(guī)規(guī)則形狀組件件的至少一點(diǎn)點(diǎn)（如某種袖袖珍電容），需需要與印刷線線路板完全接接觸。組件本本體應(yīng)粘貼或或保持在線路路板上以防止止在震動或撞撞擊時(shí)損壞。Defect-Classs 1,2,3缺點(diǎn)等級1

21、，2，3Unbondded coomponeent boody noot in contaact wiithmountinng surrface.未粘貼的組件本本體沒有和安安裝表面接觸觸。Bondinng matteriall not preseent iff requuired.在有要求時(shí)，卻卻沒有粘貼物物質(zhì)。Figure圖圖 5-177.2.4 Moountinng-Verrticall-Axiaal Leaaded-SSupporrted HHoles安裝垂直軸向引腳腳有支撐的的孔Target-Classs 1,2,3目標(biāo)等級1，2，3The heeight of thhe commpo

22、nennt boddy aboove thhe lannd,(H)is 00.4mm0.0166 intto1.5mmm 0.059 iin.組件本體距離焊焊盤的高度，（H）為0.4mm（0.016in） 到 1.5m（0.059inn）之間。The coomponeent boody iss perppendiccular to thhe boaard. 組件本體與線路路板垂直Figure圖圖 5-188 The ooveralll heiight ddoes nnot exxceed the hheightt speccifiedd. 總的高度未超過過規(guī)定的高度度.Acceptaable-CClass 1,2,33可接受的等等級1，2，3The coomponeent heeight abovee the boardd,(H)iis nott outsidee the rangee giveen in Tablee 5-1.組件