薄膜電子物理

1、 Thin Film ElectronicTechnologyProfessor Hu Ming1Chapter 1. Preface 1.1 About the course “Thin Film Electronic Technology” 1.2 About the textbook 1.3 Historical Perspective 1.4 Review of Materials Science 1.5 Thin Film Applications21.1 About the course “Thin Film Electronic Technology” 本課程為電子科學(xué)與技術(shù)系本

2、科生專業(yè) 必修課。 32 學(xué)時, 2 學(xué)分 教材: 1. Materials Science of Thin Films Deposition and Structure (Second Edition) - Milton Ohring , ACADEMIC PRESS, 2002 2Microsystem Technology W. Menz, J. Mohr, O. Paul, WILEY-VCH, 2001 3. 薄膜物理與技術(shù) 楊邦朝, 電子科技大學(xué)出版社 3 “ 薄膜電子技術(shù) ” 是電子科學(xué)與技術(shù)專業(yè)本科生專業(yè)必修課，是天津大學(xué)教學(xué)改革項目中的重點(diǎn)建設(shè)課程。 本課程的開設(shè)是為了使學(xué)生

3、認(rèn)識和了解薄膜電子技術(shù)是 21 世紀(jì)電子信息領(lǐng)域中最重要的學(xué)科與技術(shù)之一，是微電子與固體電子技術(shù)的基礎(chǔ)，是實現(xiàn)現(xiàn)代信息系統(tǒng)、大規(guī)模集成電路以及新型功能元器件集成化、微小型化的必不可少的重要技術(shù)之一。4 通過本課程的學(xué)習(xí)，使學(xué)生了解薄膜電子技術(shù)在現(xiàn)代電子信息領(lǐng)域中的重要作用、發(fā)展意義和前景趨勢。系統(tǒng)掌握各種功能電子薄膜的先進(jìn)制備技術(shù)、薄膜的生長與結(jié)構(gòu)理論、薄膜的表面與界面性能、薄膜的檢測與性能表征以及在微納電子技術(shù)中的應(yīng)用等方面的知識 , 為其從事電子信息相關(guān)領(lǐng)域特別是固體電子學(xué)與微電子學(xué)領(lǐng)域的理論研究與工程技術(shù)工作打下堅實的基礎(chǔ)。 本課程也可作為其他相關(guān)專業(yè)如電子信息、材料、應(yīng)用物理、光電子等

4、專業(yè)學(xué)生的選修課。 Index51.2.1 Textbook Description Hardcover: 800 pages; Dimensions (in inches): 1.259.256.50 Publisher: Academic Press; 2nd edition ( October 15,2001 ) ISBN: 0125249756 Sales Rank : 271,1351.2 About the textbook Materials Science of Thin Films Deposition and Structure 61.2.2 Preface (2nd ed

5、ition) Technological progress and scientific advances often proceed with different time constants. While the former is often shorter than the latter, they nevertheless march forward in a coupled rhythm. This is perhaps nowhere better illustrated than in thin-film science and technology. And that is

6、why even though much of the subject matter of this book has been dramatically updated, its spirit has remained that of the first edition of The Materials Science of Thin Films, which appeared a decade ago. 7 Documenting and interpreting the remarkable technological progress of the intervening years

7、in terms of the underlying, largely unchanging physical and chemical sciences remains an invariant feature of this revised edition. Thin-film microelectronics and optoelectronics industries are among the strongest technological drivers of our economy, a fact manifested by the explosive growth in com

8、munications, and information processing, storage, and display applications.8 Included among its pages is an information and knowledge base intended for the same interdisciplinaryand varied audience served by the first edition, namely,1. Science and engineering students in advanced undergraduate or f

9、irst-year graduate level courses on thin films2. Participants in industrial in-house courses or short courses offered by professional societies3. Mature scientists and engineers switching career directions who require an overview of the field9 Readers should be reasonably conversant with introductor

10、y college chemistry and physics and possess a passive cultural familiarity with topics commonly treated in undergraduate physical chemistry and modern physics courses. Short of this, a good course in materials science and engineering will do. Such courses traditionally focus on bulk solids, typicall

11、y utilizing metals, semiconductors, ceramics, and polymers, taken singly or collectively as illustrative vehicles to convey principles. The same spirit is adopted in this book, except that thin solid films are the vehicle. Of the tetrahedron of processing-structure-properties-performance interaction

12、s, the multifaceted processing-structure concerns are the ones this bookprimarily focuses on.10 Within this context, I have attempted to weave threads of commonality among seemingly different materials, processes, and structures, as well as draw distinctions when they exhibit outwardly similar behav

13、ior. In particular, parallels and contrasts between films and bulkmaterials are themes of recurring discussions. An optional introductory review chapter on standard topics in materials science establishes a foundation for subsequent chapters. Following a second chapter devoted to vacuum science and

14、technology, the remaining text is broadly organized into three sections. Chapters 3, 4, 5, and 6 deal primarily with the principles and practices of film deposition from the vapor phase by physical and chemical methods.11 The increasing importance of plasmas and ion beams in recent years to deposit,

15、 etch, and modify films, is reflected in the content of the middle two of these chapters. Film structure is the subject of Chapters 7, 8, and 9. These three chapters track the events that start with the condensation of atomic clusters on a bare substrate, continue with film growth due to additional

16、deposition, and end with fully developed polycrystalline, single-crystal (epitaxial), or amorphous films and coatings. Thin films are structurally and chemically characterized by the assorted electron and scanning probe microscopies as well as surface analytical techniques that are described in Chap

17、ter 10. Index12 Thin-film technology is simultaneously one of the oldest arts and one of the newest sciences. Consider the ancient craft of gold beating, which has been practiced continuously for at least four millenia. Golds great malleability enables it to be hammered into leaf of extraordinary th

18、inness while its beauty and resistance to chemical degradation have earmarked its use for durable ornamentation and protection purposes. 1.3 Historical Perspective 13 Today, gold leaf can be machine-beaten to 0.1 micron and to 0.05 micron when beaten by a skilled craftsman Thin-film technologies rel

19、ated to gold beating, but probably not as old, are mercury and fire gilding. Used to decorate copper or bronze statuary, the cold mercury process involved carefully smoothing and polishing the metal surface, after which mercury was rubbed into it. Some copper dissolved in the mercury, forming a very

20、 thin amalgam film that left the surface shiny and smooth .14 The history of gold beating and gilding is replete with experimentation and process development in diverse parts of the ancient world. Practitioners were concerned with the purity and cost of the gold, surface preparation, the uniformity

21、of the applied films, adhesion to the substrate, reactions between and among the gold, mercury, copper, bronze (copper-tin), etc., process safety, color, optical appearance, durability of the final coating, and competitive coating technologies. As we shall see in the ensuing pages, modern thin-film

22、technology addresses these same generic issues, albeit with a great compression of time. And although science is now in the ascendancy, there is still much room for art. Index15 A cursory examination of the vast body of solid substances reveals what outwardly appears to be an endless multitude of ex

23、ternal forms and structures possessing a bewildering variety of properties. The branch of study known as Materials Science evolved in part to classify those features that are common among the structure and properties of different materials in a manner somewhat reminiscent of chemical or biological c

24、lassification schemes. This dramatically reduces the apparent variety. 1.4 Review of Materials Science 16 From this perspective, it turns out that solids can be classified as belonging typically to one of only four different categories (metallic, ionic, covalent,van der Waals) depending on the natur

25、e of the electronicstructure and resulting interatomic bonding forces. Another scheme based on engineering use would again arguably limit materials to four chief classes, namely,metals, semiconductors, polymers, and ceramics. Similar divisions occur with respect to structure of solids. Solids are ei

26、ther internally crystalline or noncrystalline. Those that are crystalline can be further subdivided according to one of 14 different geometric arrays or lattices depending on the placement of the atoms. 17 It is, of course, easier to recognize that property differences exist than to understand why t

27、hey exist. Nevertheless, much progress has been made in this subject as a result of the research of the past century. Basically, the richness in the diversity of materials properties occurs because countless combinations of the admixture of chemical compositions, bonding types, crystal structures, a

28、nd morphologies either occur naturally or can be synthesized.181.5 Thin-Film Applications 1.5.1 Applications in semiconductor devices and VLSI 1. Thin-film deposition processes for solid-state device fabrication are needed in many steps in the fabrication process sequence. The number of deposition s

29、teps in the fabrication sequence of integrated circuits is expected to increase with the advent of more complex circuits, as shown in Table 2. Less complex devices, such as those introduced a decade ago, typically NMOS and CMOS integrated circuits, have required only three deposition steps for inorg

30、anic film deposition, whereas more advanced devices such as high-performance VLSI silicon integrated circuits, now require 8 to 11 deposition steps. 19202. It is important that compatible deposition processes are selected that do not interfere with the structures already built into the device. The p

31、rocess integration, which has to consider thermal effects, chemical and metallurgical compatibility as well as functional requirements and limitations, is a major consideration in successful process selection.213. In a device fabrication process sequence, one frequently has to deposit films on a non

32、planar surface. The deposited film should be uniform across all structural details of the substrate topography. For example, in VLSI structures, contact holes with micron or submicron dimensions should be uniformly coated with metal films not only inside the small contact cavities, but also on their

33、 vertical walls. This is referred to as step coverage or conformality.22An important requirement for high-density VLSI devices is planarization of the substrate topography after film deposition. This is necessary in multilevel device fabrication processes where subsequent photolithographic pattern d

34、efinition of very small geometries is required, or where deposited material step coverage is essential. 234.Complex high-density integrated circuits face increased limitations in interconnecting the numerous components on a chip. Optical interconnection schemes are under development which can reduce

35、 this problem considerably. This trend will lead to new technologies combining optoelectronic device technology with the existing semiconductor process technologies. Thin-film deposition techniques will most likely play an important role for the fabrication of these interconnections.245. Three-dimen

36、sional integrated structures consisting of 3 to 5 layers with active components are under development in various laboratories. These structures are likely to require highly sophisticated deposition technologies and equipment. Considerable interest exists to enhance the survivability of integrated ci

37、rcuits in hostile environments, such as high-energy radiation, high operating temperatures, and polluted atmospheres. The development of protective layers and more resistant device structures will require new thin-film materials and deposition processes.256. The current trends in deposition technolo

38、gy for the fabrication of semiconductor devices are characterized by: A shift to larger substrate sizes Automation in substrate handling and process controls Reduction in particle and metal contamination Improvements in equipment reliability and ease of service and maintenance Lower process temperat

39、ures Improvements in film uniformity Reduced in-process damage (due to high voltage, radiation, particle bombardment, electrostatics, etc.)261.5.2 Electronic Components The fabrication of electronic components,especially solid-state devices and microelectronic integrated circuits, have undoubtedly f

40、ound the widest and most demanding applications for thin film depositions. These films typically consist of semiconductor materials, dielectric and insulating materials, and metal or refractory metal silicide conductors.27 1.5.3 Electronic Displays Electronic displays are used for interfacing electr

41、onic equipment with human operators. Different components and device structures are required, such as: Light-emitting diodes (LEDs)Liquid-crystal displaysElectroluminescent displaysPlasma and fluorescent displaysElectrochromic displays The fabrication of these displays requires conductive films, tra

42、nsparent and conductive films, luminescent or fluorescent films as well as dielectricand insulating layers.281.5.4 Optical CoatingsOptical coatings are applied for antireflection purposes, as interference filters on solar panels, as plate glass infrared solar reflectors, and for laser optics In the fabrication of filter optics, thin films with refractive index gradients are deposited on preforms from which the optical fibers are drawn. These coatings re