內(nèi)容參考lcd共享cell feol introduction

1、Cell FEOL Introduction朱 健Cell FEOL2008/05/07AgendaPI站簡介Rubbing站簡介Seal段簡介ODF段簡介CELL introductionCFTFTSorterNormal CST轉(zhuǎn)Wire CST & 良率配對FEOLPI膜、配向、涂膠、滴液晶、壓合、固化切割裂片點燈測試貼偏光片BEOLUnpackerLOT2點燈測試包裝出貨拆箱、清洗Cell Process切割磨邊/清洗貼偏光片外觀檢查Auto ClaveBEOLbehind Engineer of LCDCFTFT上下基板貼合UV固化加熱完全固化FEOLFront Engineer o

2、f LCD封框膠印刷點液晶Vac. & Anneal導電膠印刷Rubbing后清洗Rubbing處理PI前清洗配向?qū)有纬杉訜峁袒疞ight on 1PI站Rubbing站Seal段ODF段Light on 2PI Line Glass Flow Print an even layer of PI film on the substrate of TFT or CF, then make it into solid by heating.PI Line Pre PI Cleaner Dry cleanerWet cleanerDrying & Cooling CJHyper MixBrush u

3、nitE- UVCP UnitIR UnitAir KnifeMSControl Item:CleannessContact angle10去除基板上異物 (Organic or Inorganic)等污染，避免發(fā)生PI Pin HolePI Line E UV unitccHHoooO3oooooO3coCO2HoH2OPI Line CJ Unit introduction基板表面氣泡破裂時，發(fā)生衝擊波，使微粒子於基板上離去CDAPump 高壓DI waterCDAPumpCDAPumpPI Line Air knife Unit653mmAir pressure:0.150.2kg/cm

4、225Why the Air knife is gradient?If the Air knife is upright with the glass substrate ,there will be some water hangover in the corner of glass at the end.HEPAIonizing目的提供液晶分子在Cell內(nèi)所需的配向及預傾角基材液晶分子配向膜膜厚及膜厚均勻性PI Line-PI CoatingAPR版膜厚控制靜電Mura control製程要求 :製程control :PI前後製程關連性：SubstratePI Line PI coater

5、示意圖FilterInk supplySubstrateAPR PlateDoctor roller/bladePrint RollerAnilox RollerDispenserPI film流 品 方 向PI ink needleA-ROLLERP-ROLLER(APR PLATE) SUBSTRATEDOCTOR BLADE涂布流向Pressure control DISTANCE P-A NIP1 DISTANCE P-S NIP2PI Line PI CoaterPI Line PI Pre-bake制程目的：使配向液溶劑揮發(fā)，均勻成膜,避免突沸氣泡2列2段Hotplate基板基板表

6、面溫度的均勻性氮氣Purge的方向與均勻性，排氣問題Support pin mura膜收縮情形Pre cureProximity pinLift pinPI Line PI inspection目視檢查部 自動檢查部 Map &Review UnitCCD孔洞板氣墊光線CCD 可判定的defect: PI film shift Particle size Mura Scratch Pin holePI Line PI inspectionPI inspection CCD 掃描部CCDOvenchamber3 chamberrack/per chamberSpace concernRotate

7、 stage,2 pcs /per transferCoolingchamberrackIR typePI Line PI main cure製程目的：將已經(jīng)上完PI膜且檢查OK的玻璃基板進行高溫製程，使得基板上的PI膜進行反應，以便於進行配向工程的進行。 PI Line PI main cureMain cure烤成部Proximity pinCooling 部Rubbing Line - Glass FlowRubbing Line - USC introduction USC采用類似吸塵器的原理，利用超聲波使空氣 形成強風激起Glass表面Particle，同時另外 一邊則把Partic

8、le吸走。USC為Dry Cleaning,不需要乾燥程序。一“吹” 二“吸”絨布滾筒玻璃基板移動方向移動方向TFT元件 or CF畫素經(jīng) Rubbing 後之配向膜玻璃基板液晶分子Rubbing Line Rubbing 示意 Rubbing StageRubbing Line UNITRoller Rotator(Roller 旋轉(zhuǎn)機構)2. Rubbing Stage(Rubbing 工作臺)3. Soft X-ray(軟X射線 )4. Electrometer(靜電量測器 )5. Roller Set(Roller更換架 )Basic Theory of RubbingRubbing

9、前PI ConformationBasic Theory of RubbingRubbing InspectionMethodVapor InspectionInspection ItemRubbing UniformityRubbing MuraRubbing Line Main Component SteamLightSubstrateODF (One Drop Fill) introduceODF line Process FlowSealant DispensingLC DispensingAssembly & PressUV ExposureSeal main CureCutting

10、 ProcessD.I.WaterShowerSeal group - ARCCJ+MSAir KnifeBrush-WashingMS.PowerSupplyFFURobotAir KnifeConveyorWet ProcessorConveyorMovement of substrates利用DIW,高壓水洗,高壓空氣混合水洗,超音波共振水洗將基板表面臟污及毛屑, Particle清洗干凈。再利用風刀裝置將基板上的水氣去除后以利后續(xù)組立作業(yè)。ConveyorConveyorSeal group - VA Oven 設備構成制程目的：利用真空環(huán)境下，通過IR照射基板表面，通過輻射對基板進行

11、加熱干 燥，使基板干燥，防止產(chǎn)品產(chǎn)生水汽殘留，。制程原理：利用真空加熱方式,去除殘留于PI film之水氣受渡部爐體部冷卻部BPC & ARC 比較Panel flowPanel flowBPCARCQ：兩段設備不同配置有何考量？Cleaner UnitEfficiency Brush針對 35m 以上的ParticleUS / CJ / BJ針對 23 m 以上ParticleMS / HPMJ針對 12 m 以下ParticleSeal group - Seal/Au DispenserFlow制程目的：Seal：粘結上下基板，并且將液晶封閉在固定區(qū)域AU：導通CF& TFT基板制程目的與

12、原理：使用Laser制御涂布時的Gap,并利用高精度之壓力控制閥將高黏度之Seal&AU穩(wěn)定且精確的涂布于玻璃基板上 Seal Dispenser1Seal Dispenser2Au Dispenser1Au Dispenser2Au Dispenser3Seal Dispenser4AlignmentStage 1Alignment Stage 3Seal Dispenser3Au RobotSeal RobotAlignmentStage 1Seal group - Seal dispenserMainSealLoopSealxyStage movementDummySealSeal in

13、gredient: (1) sealant: main agent of seal (2) Si ball : certain height, spacer functionglassGlass ballSeal composition:UV seal + thermal seal Seal group -影響涂布量的主要因素sealsubstrategapsyringeO-ringN gas2Gap可調(diào)範圍越小,則Gap控制也就越精確且在工作范圍內(nèi)，gap越大，膠寬越大壓力越大,涂布量越大Nozzle直徑越大涂布量越大NozzleV基板移動速度越小涂布量越大Seal 粘度越小涂布量越大真空S

14、ack-back ValveSyringe塗布Valve TableNozzleSeal group - Dispenser Head and Syringe斷面積檢測Camera 分別位於 Head 1,4,5Petty Camera 線幅檢測Alignment Camera 1Syringe基版流動與 CCD Camera關係原理：採用2 scan方式做檢查 CCD Camera視野為75mm共有8個,因此 1scan=75mm8600mm , 2scan=1200mm CCD camera75mmSeal group - Seal InspectionLCase1 短線檢出Case2線幅

15、異常檢出WLCase3位置偏移檢出Seal Insp.主要功能：ODF Group LC DropperAu&Seal DispenserLC Dispenser照明燈俱IonizerDP UnitBalanceStageColumnMain unit:Dispensing UnitMeasuring UnitDriving UnitUtility UnitOperation Unit主要功能：精密的控制液晶滴下量及液晶滴下位置，在TFT基板上完成點液晶的動作。ODF Group LC DropperHousing 安裝位置Bottle安裝位置Pump聯(lián)接處放大圖Head位置放大圖Bottle

16、放大圖Nozzle-Pump聯(lián)接處Tube-Pump聯(lián)接處安裝前安裝後ODF Group LC DropperBalanceElectronic AntiVibration PadMeasuring Robot ArmMeasuring CupAuto-DoorFunction: Measuring the dispensing volumeAdjusting the dispensing volumeParameter:Max. Weighing Rang: 60 gRepeatability: 0.03 mgStable Time: 510 secVolume密度重量mgODF Group

17、 LC DropperBubbleG. MuraDrop MuraLC Quantity vs PS HeightLC Pattern vs seal distanceSealant PassGap MuraParticle, Seal起終點,LC quantity/PS densityPI surface/LC contaminationLC AmountCell GapBubbleG-MuraODF MarginODF Group Auto feedback functionPSH量測BC每Chip測一點HOSTBCOPI選擇模式:模式1:每個Chip根據(jù)對應PSH計算液晶滴下量模式2:每

18、個Chip根據(jù)所有PSH的平均值來計算滴下量目前我們使用第一種模式每個Chip的總的液晶滴下量,單位ug.數(shù)據(jù)包含最大值和平均值.目前使用最大值調(diào)用BRM公式,計算每個Chip的液晶滴下量ODF in line數(shù)據(jù)傳送ODF in line數(shù)據(jù)傳松根據(jù)每個Chip總的滴下量和點數(shù),自動計算每點液晶量實際滴下自動調(diào)整motor位置,達到所需液晶滴下量ODF Group VA Chamber制程原理：真空對位機是在真空環(huán)境中，利用ESC吸附基板，通過高精度CCD自動對位系統(tǒng)將TFT和CF基板精確壓合，并完成UV假固定。RobotTOARobotASTOARobotASBFBFVAVAVAVAODF Group VA ChamberY軸方向CAMX軸方向CAMY軸方向CAMX軸方向CAMCAM工作原理(2)： Y軸方向CAM可以控制Stage在Y軸方向做動，X