微流控芯片簡(jiǎn)介

1、會(huì)計(jì)學(xué)1微流控芯片簡(jiǎn)介微流控芯片簡(jiǎn)介2Lab on a chip!3452021-12-667Nannan Ye,a Jianhua Qin,*a Weiwei Shi,a Xin Liua and Bingcheng Lin*a Lab Chip, 2007,7, 1696-1704a 8R.H. Liu, J.N. Yang, T. Lenigk, J. Bonanno, P. Grodzinski, Anal. Chem.76 (2004) 1824.幾千元幾十萬(wàn)元9進(jìn)樣器芯片檢測(cè)器101112重力驅(qū)動(dòng):利用液體自重完成進(jìn)樣13離心力驅(qū)動(dòng)Centrifugal Microfluidics

2、 PlatformAnal. Chem. 2002, 74, 5569-557514Anal. Chem.2002, 74,1565-15711516171819質(zhì)譜顯微成像20212223242526Photolithograph procedures for making glass template. (a) Spine coating of photoresist, (b) covered with photo mask, (c) exposure, (d) developing, (e) etching, and (f) removal of photoresist. 適合硅、玻璃、

3、石英等材料，與傳統(tǒng)的半導(dǎo)體工業(yè)的方法一致。 分為濕法和干法兩種，干法的分辨率較濕法高，相應(yīng)的制造成本也高。Analyst, 2004, 129, 305308芯片制作與修飾27Process overview for mass manufacturing of plastic microfluidic systems 適合聚合物材料。 大批量生產(chǎn)時(shí)成本低。Anal. Chem., 2002, 74, 78A-86A28微結(jié)構(gòu)的形成Schematic representation of the fabrication method involving hotembossing of thermo

4、plastic polymer pellets and thermal bonding. 適合熱塑性聚合物。Applied Physics Letters, 2002, 80, 3614-361629微結(jié)構(gòu)的形成Anal. Chem., 1997, 69, 2035 -2042 汶顥芯片科技汶顥芯片科技30現(xiàn)代科學(xué)儀器，2001，4，8-121熱鍵合31芯片的封裝現(xiàn)代科學(xué)儀器，2001，4，8-122陽(yáng)極鍵合32芯片的封裝Anal. Chem. 2004, 76, 5597-5602汶顥芯片科技汶顥芯片科技33Schematic illustration of sealing and conn

5、ection method. The top and bottom plates are pressed by a screw and holders.Anal. Chem. 2002, 74, 1724-172834芯片的封裝 coating of channel walls with something, e.g. octadecylsilanes, to create stationary phasesAnal. Chem. 2002, 74, 784-789Anal. Chem. 2003, 75, 64A-69A汶顥芯片科技汶顥芯片科技35 Schematic diagram of

6、streptavidin-conjugated alkaline phosphatase bound to a supported lipid b i l a y e r c o n t a i n i n g biotinylated lipids.Anal. Chem. 2002, 74, 379-38536表面修飾Langmuir 2003, 19, 1624-163137表面修飾Analyst 2004, 129, 284-28738表面修飾3940414243442021-12-64546進(jìn)樣器芯片檢測(cè)器4748Schematic representation of the fabrication method involving hotembossing of thermoplastic polymer pellets and thermal bonding. 適合熱塑性聚合物。Appl